WO2002015284A1 - Cellule solaire et son procede de fabrication - Google Patents
Cellule solaire et son procede de fabrication Download PDFInfo
- Publication number
- WO2002015284A1 WO2002015284A1 PCT/JP2001/006830 JP0106830W WO0215284A1 WO 2002015284 A1 WO2002015284 A1 WO 2002015284A1 JP 0106830 W JP0106830 W JP 0106830W WO 0215284 A1 WO0215284 A1 WO 0215284A1
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- WO
- WIPO (PCT)
- Prior art keywords
- solar cell
- single crystal
- silicon single
- crystal wafer
- wafer
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims description 58
- 239000013078 crystal Substances 0.000 claims abstract description 101
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 95
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 95
- 239000010703 silicon Substances 0.000 claims abstract description 95
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 65
- 239000001301 oxygen Substances 0.000 claims abstract description 65
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 65
- 239000002019 doping agent Substances 0.000 claims description 20
- 235000012431 wafers Nutrition 0.000 description 65
- 238000010438 heat treatment Methods 0.000 description 27
- 238000006243 chemical reaction Methods 0.000 description 20
- 239000002244 precipitate Substances 0.000 description 19
- 239000000758 substrate Substances 0.000 description 18
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 11
- 229910052796 boron Inorganic materials 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 125000004429 atom Chemical group 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 230000007423 decrease Effects 0.000 description 9
- 238000001556 precipitation Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 239000000969 carrier Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 238000001782 photodegradation Methods 0.000 description 4
- 238000005215 recombination Methods 0.000 description 4
- 230000006798 recombination Effects 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 241000652704 Balta Species 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000005247 gettering Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002926 oxygen Chemical class 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000004857 zone melting Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/028—Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a method for manufacturing a solar cell using a silicon single crystal wafer useful as a material for a solar cell, and to a solar cell.
- the characteristics of the solar cell will be described based on the substrate materials constituting the solar cell.
- solar cells When solar cells are classified based on their substrate materials, they can be broadly divided into three types: silicon crystal-based solar cells, amorphous silicon-based solar cells, and compound semiconductor-based solar cells.
- silicon crystal solar cells include “single crystal solar cells” and “polycrystalline solar cells”.
- the solar cell with the highest conversion efficiency, which is the most important characteristic of a solar cell is a “compound semiconductor solar cell”, whose conversion efficiency reaches nearly 25%.
- compound semiconductor-based solar cells are extremely difficult to produce compound semiconductors as their material, and there is a problem with the widespread use of solar cell substrates in terms of manufacturing cost, which limits their use. ing.
- a method for manufacturing a general silicon single crystal solar cell will be briefly described.
- a Czochralski method hereinafter sometimes referred to as CZ method or Czochralski method
- a floating zone melting method hereinafter referred to as FZ method or Floating zone method.
- the wafer is subjected to diffusion treatment of impurities (dopant) to form a pn junction on one side of the wafer, electrodes are attached to both sides, and finally, light energy loss due to light reflection on the sunlight incident side surface
- a solar cell is completed by attaching an anti-reflection film to reduce the amount of solar cells.
- the value of the substrate lifetime (hereinafter sometimes referred to as Lifetime, LT), which is one of its characteristics, is 10. If it is not longer than ⁇ s, it cannot be used as a solar cell substrate.Furthermore, in order to obtain a solar cell with high conversion efficiency, the substrate lifetime is preferably required to be 200 ⁇ s or more. ing.
- the conductivity type of ⁇ -type wafers used as solar cells is ⁇ -type, and boron is usually added as a dopant to ⁇ -type ⁇ -type wafers.
- the single crystal rod used as the material for the wafer is manufactured by the CZ method (including the magnetic field applied CZ method (hereinafter sometimes referred to as MCZ method)) or the FZ method.
- the present applicant has proposed in an earlier application to use Ga (gallium) instead of B (boron) as a p-type dopant (PCT / 00 / 0 2 850).
- Ga gallium
- B boron
- PCT / 00 / 0 2 850 a p-type dopant
- the present invention has been made in view of such a problem, and when a solar cell is manufactured using a CZ silicon single crystal wafer, a CZ silicon single crystal wafer that does not decrease the lifetime is provided.
- An object of the present invention is to obtain a photovoltaic cell having a small variation in characteristics by using.
- the present invention relates to a method for manufacturing a solar cell from a CZ silicon single crystal wafer, wherein the silicon single crystal wafer has an initial interstitial oxygen concentration of 15 ppma or less. This is a method for manufacturing a solar battery cell using a CZ silicon single crystal wafer.
- the initial interstitial oxygen concentration is 15 ppma or less (JEIDA: Japan Electronics Industry Development Association Standard)
- oxygen precipitation hardly occurs due to the heat treatment for manufacturing the solar cell. It is possible to obtain a photovoltaic cell in which the life time is prevented from being reduced by the MD, and it is possible to produce a favorable photovoltaic cell with little variation in characteristics.
- the CZ silicon single crystal wafer is preferably a p-type silicon single crystal wafer using Ga as a dopant.
- the concentration of Ga is preferably 3 ⁇ 10 15 to 5 ⁇ 10 17 atoms / cm 3 .
- the solar cell manufactured by the method of the present invention is, for example, a solar cell manufactured using a CZ silicon single crystal wafer and having an interstitial oxygen concentration of 15% in the CZ silicon single crystal wafer. It is a solar cell characterized by being below ppma.
- the solar cell of the present invention is a solar cell manufactured using a CZ silicon single crystal wafer, wherein the BMD density in the CZ silicon single crystal wafer is 5 ⁇ 10 V cm 3 or less. It is a solar cell.
- the BMD density in the CZ silicon single crystal wafer is 5 ⁇ 10 8 Zcm 3 or less, it is possible to prevent a sharp decrease in the lifetime and increase the conversion efficiency of the solar cell. It is possible to provide solar cells that maintain the standard and have little variation in characteristics.
- the concentration of G a is preferably 3 ⁇ 10 15 to 5 ⁇ 10 17 atoms / cm 3 .
- the concentration of Ga is 3 ⁇ 10 15 atoms / cm 3 or more, it is possible to suppress the power consumption due to the increase in the internal resistance of the solar cell and the decrease in the conversion efficiency. If it is 5 ⁇ 10 1 T atomsZ cni 3 or less, it is possible to prevent a so-called Auger recombination phenomenon in which minority carriers are captured by Ga atoms and the lifetime is reduced.
- a solar cell with less variation in characteristics can be obtained, and a highly efficient and low-cost solar cell can be obtained. Can be. BRIEF DESCRIPTION OF THE FIGURES
- Figure 1 is a diagram showing the relationship between resistivity and lifetime for three types of Ga-doped silicon single crystal wafers with different oxygen concentrations.
- FIG. 2 is a diagram showing the relationship between the BMD density and the lifetime in a silicon single crystal wafer.
- the present inventors have referred to crystal defects such as interstitial oxygen contained in CZ silicon single crystal wafers from which the solar cell was fabricated and oxygen precipitates in the wafer plasma (hereinafter referred to as BMDs (Bulk Micro Defects). ) Power
- BMDs Bulk Micro Defects
- FIG. 1 is a graph showing the relationship between the resistivity, that is, the Ga doping amount, and the life time of three types of Ga-doped silicon single crystal wafers having different oxygen concentrations. As shown in Fig. 1, even with the same doping amount of Ga, it can be seen that the lifetime decreases as the oxygen concentration increases with the ⁇ Aha.
- BMD such as minute oxygen precipitates may be generated in the silicon single crystal wafer of the solar cell.
- BMD is one of the advantages of CZ silicon single crystal wafer because it functions as a gettering site that captures harmful heavy metal contaminants and the like in semiconductor device fabrication processes such as LSI.
- FIG. 2 shows the relationship between BMD density and lifetime in silicon single crystal wafers.
- the density was sharply reduced. Therefore, as for CZ silicon single crystal wafers used to manufacture solar cells, longer lifetimes are better in terms of conversion efficiency, so that BMD after solar cell formation can be achieved. It is expected that it is preferable to reduce the density and to make the density 5 X 10 s / cin 3 or less.
- the interstitial oxygen in the silicon single crystal silicon wafer used to make the solar cell can be converted into solar cells either as interstitial oxygen itself or as minute oxygen precipitates. It was clarified that this would affect the cell lifetime.
- the present invention can be completed as a result of studying various conditions based on such a basic idea.
- the oxygen concentration range of the present invention can be easily adjusted to the above range by means such as adjusting the number of rotations of the crucible, increasing the flow rate of the introduced gas, lowering the atmospheric pressure, controlling the temperature distribution of the silicon melt, and convection.
- the oxygen concentration when the oxygen concentration is raised at an oxygen concentration of about 10 ppma or lower, the oxygen concentration can be reduced to about 7 ppma according to the so-called MCZ method in which the magnetic field is applied and pulled up.
- a solar cell is formed by mainly performing a pn junction forming step, an electrode forming step, and an antireflection film forming step.
- a pn junction is usually formed by introducing an n- type impurity into the surface of a p-type silicon single crystal wafer, and the impurities are introduced by gas diffusion, solid-phase diffusion, or ion implantation. Is used, the number 1 Heat treatment is performed at a temperature of from 100 ° C. to 1000 ° C. or higher.
- the electrode forming step is a step of forming a metal to be an electrode by a vapor deposition method, a plating method, a printing method, or the like, and a heat treatment of about several hundred degrees Celsius is applied.
- a deposited film is formed by a CVD (chemical vapor deposition) method, a PVD (.physical vapor deposition) method, or the like. Some heat treatment is possible.
- oxygen precipitates In order for oxygen precipitates to be formed by heat treatment of a silicon single crystal wafer, oxygen must be supersaturated at the heat treatment temperature, and nuclei (precipitation nuclei) where precipitates are formed.
- nuclei precipitation nuclei
- Precipitation nuclei are also present in as-grown silicon wafers, but are also formed when supersaturated oxygen is turned into minute oxygen precipitates by heat treatment at a temperature of about 65 to 900 ° C.
- a heat treatment at a temperature of 900 to 110 ° C. is required.
- Heat treatment at 900 ° C or lower requires a very long time to grow due to slow diffusion of oxygen, and large oxygen precipitates are unlikely to form.At temperatures exceeding 110 ° C, precipitate nuclei are formed. Is dissolved and disappears, so that no precipitate is formed.
- the BMD density can be extremely reduced if the heat treatment for forming solar cells using CZ silicon single crystal wafers is all over 110 ° C, but as described above.
- a low-temperature process of 100 ° C. or less is mainly used.
- heat treatment is performed at a temperature at which at least minute oxygen precipitates serving as precipitation nuclei are formed. Therefore, the generation of such precipitation nuclei causes a reduction in the lifetime.
- the size of the oxygen precipitate becomes large and the life time is greatly reduced.
- the effect of preventing a reduction in the lifetime due to the solar cell having the BMD density of 5 ⁇ 10 8 Zcm 3 or less according to the present invention is further enhanced and more effective.
- the measurement of the BMD density after the solar cell is formed can be measured by the optical precipitate profiler (OPP) method or by opening the wafer and selectively etching the cleavage plane.
- OPP optical precipitate profiler
- the heat treatment may be performed at 100 ° C. for 16 hours to grow the oxygen precipitate to a detectable size, and then the measurement may be performed.
- Ga is used as a P-type dopant of silicon single crystal wafer, and 3 ⁇ 10 15 to 5 ⁇ 10 17 atoms / cm 3 (resistivity of 5 ⁇ 10 17 atoms / cm 3 ) (0.1 ⁇ ⁇ cm). If the Ga concentration is less than 3 ⁇ 10 15 atoms / cm 3 , the resistivity of the wafer becomes unnecessarily high, power is consumed by the internal resistance of the solar cell, and the conversion efficiency decreases. There is. Also, when the Ga concentration is higher than 5 ⁇ 10 17 atoms / cm 3 , the resistivity of the wafer is extremely reduced, and the lifetime of a minority carrier is reduced due to Auger recombination inside the wafer. Because it may
- the seed crystal may be brought into contact with the silicon melt and pulled up while rotating.
- the addition of Ga to the melt in the rutupo involves growing a silicon crystal to which a high concentration of Ga has been added in advance, and then adding a doping agent produced by crushing the high-concentration Ga-doped silicon crystal. By adding an appropriate amount to the silicon melt by calculation, an accurate amount of Ga can be doped.
- a silicon single crystal (Ga-doped, dopant concentration of about 1 ⁇ 10 16 atoms / cm 3 ) having an initial interstitial oxygen concentration of about 14 ppma was pulled up by the ordinary CZ method (Example 1).
- the initial oxygen concentration was about 10 ppma (B-doped, dopant concentration about 1 X 10 1 eatomsZcm 3 ) and about 8 ppma (G-doped, dopant concentration about 1 X 1
- a silicon single crystal of 0 16 atomsZcm 3 ) was pulled up (Examples 2 and 3).
- the lifetimes of the wafers of Examples 1 to 3 both showed a good value of 500 ⁇ sec or more before and after the heat treatment, and no reduction in the lifetime was observed by the heat treatment. Further, the BMD density was 1 ⁇ 10 8 / cm 3 or less.
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- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Sustainable Development (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Photovoltaic Devices (AREA)
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/344,398 US6830740B2 (en) | 2000-08-15 | 2001-08-08 | Method for producing solar cell and solar cell |
AU2001277718A AU2001277718B2 (en) | 2000-08-15 | 2001-08-08 | Method for manufacturing solar cell and solar cell |
KR1020037002089A KR100870526B1 (ko) | 2000-08-15 | 2001-08-08 | 태양전지셀의 제조방법 및 태양전지셀 |
EP01955600A EP1313150A4 (en) | 2000-08-15 | 2001-08-08 | SOLAR CELL AND MANUFACTURING PROCESS |
AU7771801A AU7771801A (en) | 2000-08-15 | 2001-08-08 | Method for manufacturing solar cell and solar cell |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-246306 | 2000-08-15 | ||
JP2000246306A JP2002057351A (ja) | 2000-08-15 | 2000-08-15 | 太陽電池セルの製造方法および太陽電池セル |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002015284A1 true WO2002015284A1 (fr) | 2002-02-21 |
WO2002015284A8 WO2002015284A8 (fr) | 2002-07-18 |
Family
ID=18736647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2001/006830 WO2002015284A1 (fr) | 2000-08-15 | 2001-08-08 | Cellule solaire et son procede de fabrication |
Country Status (7)
Country | Link |
---|---|
US (1) | US6830740B2 (ja) |
EP (1) | EP1313150A4 (ja) |
JP (1) | JP2002057351A (ja) |
KR (1) | KR100870526B1 (ja) |
AU (2) | AU7771801A (ja) |
TW (1) | TWI295856B (ja) |
WO (1) | WO2002015284A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2016503964A (ja) * | 2012-12-31 | 2016-02-08 | エムイーエムシー・エレクトロニック・マテリアルズ・ソシエタ・ペル・アチオニMEMC Electronic Materials, SpA | インジウムドープシリコンウェハおよびそれを用いた太陽電池セル |
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JP2002076400A (ja) * | 2000-08-30 | 2002-03-15 | Shin Etsu Handotai Co Ltd | 太陽電池セルおよび太陽電池セルの製造方法 |
US7759158B2 (en) * | 2005-03-22 | 2010-07-20 | Applied Materials, Inc. | Scalable photovoltaic cell and solar panel manufacturing with improved wiring |
JP2009515369A (ja) * | 2005-11-07 | 2009-04-09 | アプライド マテリアルズ インコーポレイテッド | 光電池接触部及び配線の形成 |
US20080057220A1 (en) * | 2006-01-31 | 2008-03-06 | Robert Bachrach | Silicon photovoltaic cell junction formed from thin film doping source |
US7749869B2 (en) * | 2008-08-05 | 2010-07-06 | International Business Machines Corporation | Crystalline silicon substrates with improved minority carrier lifetime including a method of annealing and removing SiOx precipitates and getterning sites |
TWI382544B (zh) * | 2008-09-16 | 2013-01-11 | Nexpower Technology Corp | 太陽能光學模組 |
US7858427B2 (en) * | 2009-03-03 | 2010-12-28 | Applied Materials, Inc. | Crystalline silicon solar cells on low purity substrate |
TWI472049B (zh) * | 2009-12-14 | 2015-02-01 | Ind Tech Res Inst | 太陽能電池的製造方法 |
JP5338702B2 (ja) * | 2010-02-12 | 2013-11-13 | 信越化学工業株式会社 | 太陽電池の製造方法 |
US20130089944A1 (en) * | 2010-06-11 | 2013-04-11 | Amtech Systems, Inc. | Solar cell silicon wafer process |
EP2611952B1 (en) | 2010-09-03 | 2021-12-29 | GTAT IP Holding LLC | Method of preparing a silicon single crystal doped with gallium, indium or aluminum |
KR20120047583A (ko) | 2010-11-04 | 2012-05-14 | 삼성전자주식회사 | 태양 전지 및 이의 제조 방법 |
JP5583053B2 (ja) * | 2011-02-28 | 2014-09-03 | グローバルウェーハズ・ジャパン株式会社 | シリコンウェーハの熱処理方法 |
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Also Published As
Publication number | Publication date |
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AU7771801A (en) | 2002-02-25 |
TWI295856B (ja) | 2008-04-11 |
US6830740B2 (en) | 2004-12-14 |
US20030177976A1 (en) | 2003-09-25 |
KR20030027026A (ko) | 2003-04-03 |
KR100870526B1 (ko) | 2008-11-26 |
AU2001277718B2 (en) | 2006-07-06 |
EP1313150A4 (en) | 2006-06-14 |
EP1313150A1 (en) | 2003-05-21 |
JP2002057351A (ja) | 2002-02-22 |
WO2002015284A8 (fr) | 2002-07-18 |
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