WO2002003777A1 - Procede de production de plantes, dispositif de culture et panneau electroluminescent - Google Patents
Procede de production de plantes, dispositif de culture et panneau electroluminescent Download PDFInfo
- Publication number
- WO2002003777A1 WO2002003777A1 PCT/JP2001/003010 JP0103010W WO0203777A1 WO 2002003777 A1 WO2002003777 A1 WO 2002003777A1 JP 0103010 W JP0103010 W JP 0103010W WO 0203777 A1 WO0203777 A1 WO 0203777A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conveyor
- tray
- plant
- light
- light emitting
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 18
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 24
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 9
- 239000003566 sealing material Substances 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 28
- 238000004519 manufacturing process Methods 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 17
- 229920003002 synthetic resin Polymers 0.000 claims description 17
- 239000000057 synthetic resin Substances 0.000 claims description 17
- 239000006071 cream Substances 0.000 claims description 11
- 239000002274 desiccant Substances 0.000 claims description 11
- 238000005192 partition Methods 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 239000007789 gas Substances 0.000 claims description 6
- 229940123973 Oxygen scavenger Drugs 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000032258 transport Effects 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 238000003306 harvesting Methods 0.000 abstract description 17
- 241000196324 Embryophyta Species 0.000 description 82
- 230000007246 mechanism Effects 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 230000009471 action Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 239000000498 cooling water Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000012010 growth Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000003507 refrigerant Substances 0.000 description 4
- 235000013311 vegetables Nutrition 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 235000015097 nutrients Nutrition 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 241000208822 Lactuca Species 0.000 description 2
- 235000003228 Lactuca sativa Nutrition 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920006328 Styrofoam Polymers 0.000 description 2
- 238000009395 breeding Methods 0.000 description 2
- 230000001488 breeding effect Effects 0.000 description 2
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 2
- 238000012364 cultivation method Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000009331 sowing Methods 0.000 description 2
- 239000008261 styrofoam Substances 0.000 description 2
- 235000001674 Agaricus brunnescens Nutrition 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910001361 White metal Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000003450 growing effect Effects 0.000 description 1
- 208000037824 growth disorder Diseases 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 239000003501 hydroponics Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000243 photosynthetic effect Effects 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 230000008635 plant growth Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000004590 silicone sealant Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000010969 white metal Substances 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
- A01G7/00—Botany in general
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
- A01G31/00—Soilless cultivation, e.g. hydroponics
- A01G31/02—Special apparatus therefor
- A01G31/04—Hydroponic culture on conveyors
- A01G31/042—Hydroponic culture on conveyors with containers travelling on a belt or the like, or conveyed by chains
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
- A01G7/00—Botany in general
- A01G7/04—Electric or magnetic or acoustic treatment of plants for promoting growth
- A01G7/045—Electric or magnetic or acoustic treatment of plants for promoting growth with electric lighting
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
- A01G9/00—Cultivation in receptacles, forcing-frames or greenhouses; Edging for beds, lawn or the like
- A01G9/24—Devices or systems for heating, ventilating, regulating temperature, illuminating, or watering, in greenhouses, forcing-frames, or the like
- A01G9/249—Lighting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P60/00—Technologies relating to agriculture, livestock or agroalimentary industries
- Y02P60/14—Measures for saving energy, e.g. in green houses
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P60/00—Technologies relating to agriculture, livestock or agroalimentary industries
- Y02P60/20—Reduction of greenhouse gas [GHG] emissions in agriculture, e.g. CO2
- Y02P60/21—Dinitrogen oxide [N2O], e.g. using aquaponics, hydroponics or efficiency measures
Definitions
- the present invention relates to a plant production method (cultivation method), a cultivation apparatus, and a light-emitting panel used for the same.
- seedlings planted in trays are transported on a conveyor while a culture solution containing water and nutrients is supplied through a water supply pipe, and at the same time, artificial light (or natural light in some cases) is irradiated.
- the present invention relates to a production method, a cultivation apparatus, and a luminescent panel suitable as a luminescence source of the cultivation apparatus, so to speak, as a factory.
- plants include vegetables and fruits as well as mushrooms. Background art
- Japanese Unexamined Patent Publication No. Hei 6-246456 a large number of trays are suspended on a chain conveyor, the building is driven to circulate, and a worker supplies a tray with plant seedlings to the conveyor.
- a three-dimensional bench for plant cultivation in which the growing process is automatically performed just by harvesting the plant tray.
- Japanese Patent Application Laid-Open No. Hei 10-1036790 describes a fixed shelf frame, a cultivation container that is removably mounted on the shelf frame, and a light emitting device provided above each container.
- a cultivation shelf equipped with a light source such as an eave is proposed.
- 2000-1106757 discloses a conveyor provided in a plurality of stages vertically and a feeding mechanism provided movably up and down on the entrance side and the exit side of these conveyors, respectively. And a plant cultivation device equipped with a take-out mechanism.
- the three-dimensional bench type plant cultivation apparatus has a complicated driving mechanism and a complicated supporting method.
- the tray containers are arranged at relatively large intervals according to the size of the plants when they grew up, the necessary space for the plants when they are seeds or seedlings Space, which is wasted space. As a result, the length of the water supply pipe becomes longer, and the distance between the light sources is increased, so that the irradiation efficiency is reduced.
- a panel with a large number of light emitting diodes As a lighting fixture for plant cultivation, because the wavelength of emitted light is relatively uniform and the calorific value is relatively small.
- LEDs light emitting diodes
- Such a light-emitting panel is configured by creating a circuit pattern on a substrate such as aluminum, arranging a large number of LEDs on the circuit pattern, and sealing the LEDs with a transparent synthetic resin or the like.
- a reflector is interposed between the LED and the substrate to increase the amount of light.
- An object of the present invention is to eliminate the useless space of the conventional plant cultivation apparatus and improve a lighting effect. Further, it is a technical object of the present invention to provide a light-emitting panel which consumes less power and generates less heat and has high durability. A further object of the present invention is to provide a light emitting unit for a light emitting panel which has a large amount of light and can be easily manufactured. Disclosure of the invention
- a tray contains a culture solution for immersing a root of a plant to be cultivated, and an upper part of each plant strain is held on the upper surface of the tray.
- the plant cultivation apparatus of the present invention includes: a conveyer for conveying a plant to be cultivated; and a lighting device disposed along the conveyor above the conveyor, and the lighting device is arranged from an upstream side to a downstream side of the conveyor. It is characterized in that it is arranged so as to gradually move away from the conveyor toward.
- a second aspect of the plant cultivation apparatus of the present invention is a tray for holding a culture solution for immersing the root of a plant to be cultivated and holding a plant strain, and transporting the tray.
- a third aspect of the plant cultivation apparatus of the present invention includes a tray that holds a culture solution for immersing the roots of a plant to be cultivated and holds a plant strain, a conveyor that conveys the tray, and a conveyor that conveys the tray.
- Lighting fixtures located above the conveyor, supply and take-out upper and lower conveyors located away from the upstream or downstream end of the conveyor, and partition walls interposed between the conveyors And a delivery bar reciprocally movable in the direction of extension of the conveyor so as to transfer trays between the conveyor and the upper and lower conveyors, wherein the partition wall has an opening through which the delivery bar enters and exits in the direction of extension of the conveyor. It is characterized by having.
- a door for closing an opening of a partition wall is attached to a tip of the delivery bar.
- the inner surface of the partition and the inner surface of the door have a reflecting surface for reflecting light of the lighting fixture.
- a fourth aspect of the plant cultivation apparatus of the present invention includes a tray that holds a culture solution that spreads the roots of a plant to be cultivated and holds a plant strain, a conveyor that conveys the tray, and a conveyor that conveys the tray. And a lighting device disposed above, wherein the culture solution is at 10 to 20 ° C., and the tray is made of aluminum or an alloy thereof.
- the seedlings of the plants conveyed on the conveyor grow while being illuminated by lighting fixtures arranged above the conveyor, and move to the downstream side. Becomes tall.
- the lighting fixtures are sequentially arranged away from the conveyor from the upstream side to the downstream side, so that the lighting fixtures are connected to both the short upstream side and the tall downstream side. Irradiation can be performed from a position close to the plant, with the distance between the upper ends of the plant seedlings not changing much. Therefore, the lighting efficiency is high and the light from the lighting equipment is used without waste.
- the first embodiment of the device of the present invention is suitable for such a production method.
- the upper part of the plant strain is held on the upper surface of the tray with a funnel-shaped holder. For this reason, lettuce and other leaves are not spread, and are collected upward. Therefore, even if the distance between adjacent plants is reduced, the leaves of the plants do not become entangled. In addition, the leaves of the plant face upward, so that they can be sufficiently irradiated with light from the lighting equipment. Therefore, a single tray can accommodate many plant strains, and can efficiently illuminate many plants with light from a lighting fixture. When the leaves of the plant are put together with a funnel-shaped holder, the height of the plant increases.
- the second aspect of the cultivation method described above can be efficiently implemented.
- the partition wall is provided between the conveyor and the upper and lower conveyors, the light of the lighting fixture illuminating the plants on the conveyor does not spread to the outside. Also, temperature control becomes easier.
- the transfer of trays between the conveyor and the upper and lower conveyors can be performed by passing through the opening.
- a reflective surface that reflects the light of the lighting equipment is provided on the inner surface of the partition and door.
- the tray can be transferred between the upper and lower arms and the transfer bar without interfering with the door and the fingers. Can be.
- the opening and closing of the door and the forward and backward movement of the door are linked, so that the driving mechanism and the control mechanism are simplified.
- the temperature of the culture solution is suitable, and growth disorders such as plant growth can be prevented.
- a light-emitting panel includes: a light-emitting unit including a base, a circuit board provided on the base, and a plurality of lamps arranged and fixed on a circuit pattern of the circuit board; A light-transmitting cover that is disposed with a space therebetween, and a sealing material that is interposed between the base and the cover and that keeps the space airtight to the outside. It is characterized by being glued and fixed on the circuit board with a conductive adhesive
- a frame is interposed between a base and a cover, the periphery of the frame is filled with the sealing material, and the space is filled with an inert dry gas.
- a desiccant and / or an oxygen scavenger is contained in the vessel.
- the lamp further comprises a reflector having a concave surface, a light emitting element attached to the reflector, an electrode, a bonding wire connecting the light emitting element and the electrode, and a light-transmitting synthetic resin encapsulating them. And a sealing material made of the same. Further, the conductive adhesive heats and cures the solder cream.
- the light emitting unit of the present invention includes a circuit board having a circuit pattern, and a number of lamps arranged thereon and fixed with a conductive adhesive, and the lamps include a reflector and The light emitting element, the bonding wire, and the electrode are sealed with a transparent sealing material in advance.
- a transparent sealing material in advance.
- the base may also serve as a circuit board.
- the light-emitting panel of the present invention uses a light-emitting element as a light source, it consumes less power than a conventional light source such as a fluorescent lamp. In addition, because the calorific value is small, the power consumption of the cooling equipment is small. Further, by selecting a light emitting element having a specific wavelength, a light emitting panel suitable for the purpose can be formed.
- the light emitting unit including the light emitting element is housed in a space between the base and the light-transmitting cover, and the space is hermetically sealed by a sealing material, so that moisture does not enter from the outside. Therefore, the light emitting element is less deteriorated by moisture and has high durability.
- the lamp includes a reflector having a concave surface, a light emitting element attached to the reflector, an electrode, a bonding wire connecting the light emitting element and the electrode, and a light-transmitting synthetic resin encapsulating them.
- a light-emitting element is provided, a large amount of light is emitted to the front due to light reflected from the light emitting element.
- the light emitting element, the electrode, and the bonding wire are integrated with the sealing material, it is easy to handle a large number of lamps, and the light emitting panel can be efficiently manufactured by automatic mounting or the like.
- the conductive adhesive is obtained by heating and curing solder cream
- a large number of lamps are fixed to the circuit board at once by simply placing a large number of lamps on the circuit board and then heating the whole. be able to.
- the light-emitting unit of the present invention uses a lamp in which a reflector, a light-emitting element, a bonding wire and an electrode are sealed in advance with a transparent sealing material, so that a large number of lamps can be easily handled.
- the circuit board is lightweight and easy to manufacture.
- the base also serves as a circuit board, the number of components is reduced, and the manufacturing is further facilitated.
- FIG. 1 is a schematic side sectional view showing an embodiment of the cultivation apparatus of the present invention
- FIG. 2 is a side view showing the entire cultivation apparatus.
- FIG. 3 is a plan view of the cultivation apparatus.
- FIG. 4A and FIG. 4B are a partially cutaway perspective view and a cross-sectional view of a main part showing an embodiment of the tray of the cultivation apparatus.
- FIG. 5 is a perspective view showing an embodiment of the delivery mechanism of the cultivation apparatus of the present invention.
- FIGS. 6 and 7 are process diagrams sequentially showing the operation of the delivery mechanism.
- FIG. 8 is a schematic sectional view showing an embodiment of a delivery mechanism on the harvesting conveyor side.
- FIG. 9A is a perspective view showing an embodiment of a lighting fixture according to the present invention, and FIG. 9B is a sectional view of a main part of the lighting fixture.
- FIG. 9A is a perspective view showing an embodiment of a lighting fixture according to the present invention
- FIG. 9B is a sectional view of a main part of the lighting fixture.
- FIG. 10 is a partially cutaway perspective view showing the entirety of another embodiment of the light emitting panel of the present invention.
- FIG. 11A is a sectional view of a principal part showing another embodiment of the light emitting panel of the present invention
- FIG. 11B is a sectional view of a principal part of a light emitting unit used for the panel.
- FIG. 12A is a sectional view of a main part showing a method for manufacturing the light emitting unit
- FIG. 12B is a plan view of the main part.
- FIGS. 13A, 13B, 13C and 13D are schematic process diagrams illustrating a method for manufacturing a light emitting panel of the present invention.
- 14A, 14B and 14C are schematic process diagrams showing another embodiment of the method for manufacturing a light emitting panel of the present invention.
- FIG. 15 is a cross-sectional view showing another embodiment of the lamp according to the present invention.
- FIGS. 16A, B, C, D, and E are enlarged cross-sectional views each showing an embodiment of the light emitting element of the lighting fixture.
- FIG. 17 is an electric circuit diagram showing an embodiment of the control circuit of the light emitting panel.
- FIGS. 18A, 18B and 18C are electric circuit diagrams showing another embodiment of the control circuit of the light emitting panel.
- FIG. 19 is a perspective view showing one embodiment of a display panel using the light emitting panel of the present invention.
- FIG. 20 is a perspective view showing an embodiment of a cultivation shelf using the light emitting panel of the present invention. It is.
- FIG. 21 is a sectional view showing another embodiment of the light emitting panel of the present invention.
- FIG. 22 is a sectional view showing another embodiment of the light emitting panel of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION
- Cultivation equipment A shown in FIGS. 2 and 3 is composed of multi-stage conveyor devices 2, 2,... Assembled in the building 1, and lighting fixtures 3 arranged between the conveyor devices 2 of each stage.
- piping for cooling water that cools the lighting equipment 3 water supply equipment for supplying culture solution for hydroponic cultivation to the tray 5 placed on the conveyor device 2, and drainage equipment that drains water from trays, etc.
- Ancillary facilities are also provided.
- the configuration of the remarkable conveyor device 2 is substantially the same, and it is possible to remarkably cultivate the same plant or cultivate a different plant for each tier.
- the building 1 has, for example, a height of 1 Om, a length of 12 m, and a frontage of about 1 Om, and a heat insulation wall of about 1 Ocm is used for an outer wall.
- the size and height of the building can be freely changed according to the type of plant to be grown.
- reflection walls 8 for reflecting the light of the lighting fixture 3.
- the reflecting wall 8 may be provided so as to surround the conveyor device 2 as shown in FIG.
- a heat insulating material may be used as the reflection wall 8.
- White styrofoam walls for example, perform both functions.
- a metal foil that easily reflects light such as an aluminum foil, may be attached to the inner surface of the reflecting wall 8.
- a work room 10 for workers 9 to put the tray 5 on the planting conveyor 6 and to harvest trays from the harvesting conveyor 7.
- a conveyor device 2 is disposed at an upper stage of, for example, about 10 stages.
- the central part of the work room 10 is a sowing area 10a for planting seeds on the tray 5, and a part close to the planting contest 6 is a breeding area 10b for growing seeds into seedlings.
- a nearby site is a harvester 10c for harvesting plants by loading and unloading trays.
- the conveyor devices 2 at each stage are arranged at two places on the left and right of the building 1 so as to support a position slightly inward from the left and right ends of the long tray 5. Further, a plurality of rails 11 for supporting the tray 5 so as to slide it are provided near the left and right ends and between the conveyor devices 2. As shown in FIGS.
- the lighting fixture 3 is extended so as to be planar near the lower surface of the conveyor device 2 and is lower at the upstream side of the conveyor device 2 and higher at the downstream side. It irradiates the tray 5 of the conveyor device 2 one stage below.
- the lighting equipment 3 is provided at an angle because the height of the plant to be cultivated is short in the early stage of growth, so that the lighting equipment 3 and the plant can be brought close to each other to enhance the lighting effect. is there
- the lighting equipment 3 is not provided on the lower surface of the lowermost conveyor, and the lighting equipment for irradiating the tray 5 of the uppermost conveyor device 2 is provided near the ceiling.
- the lighting equipment 3 may be a fluorescent light, an electric light, or the like, but is preferably a light emitting diode (LED) that emits light of a wavelength (color) appropriate for plant cultivation.
- LED light emitting diode
- select an appropriate combination according to the type of plant such as 2/3 of each light emitting panel as red light emitting diodes and 1/3 as blue light emitting diodes. do it.
- the brightness of the entire light-emitting panel is preferably, for example, about 200 to 300 lux, but it is sufficient to set an appropriate illuminance depending on the plant, and it is also possible to control the brightness over time.
- Reference numeral 13 in FIG. 2 denotes a fan that circulates air in the building 1, and is provided with an air conditioner for controlling temperature, humidity, and CO 2 . If it is desired to change the growth environment of the plant in the middle of the conveyor device 2, a partition such as a transparent synthetic resin sheet may be provided. It is also preferable to provide sensors that detect gas concentration, temperature, humidity, etc., and to automatically control various environmental elements while constantly monitoring them. Next, the conveyor device 2 will be described with reference to FIGS.
- Each of the conveyor devices 2 arranged on the left and right can be constituted by one belt conveyor.
- the belt conveyor has a drive drum 14 rotatably provided at the end, a number of idler rollers 15 provided rotatably in the middle, a belt 16 circulating around them, and a drive drum 14 It is composed of a motor that rotates the motor (see reference symbol M in Fig. 5).
- the drive drums 14 of the left and right conveyor devices 2 are connected by a drive shaft (see reference numeral 17 in FIG. 5).
- a circulating conduction element such as a chain conveyor may be used instead of the belt conveyor.
- a plurality of conveyors may be connected from the planting conveyor 6 to the harvesting conveyor 7, in which case the conveying speed can be changed for each conveyor.
- the planting conveyor 6 supports the endless chain 21 with four sprockets 20 arranged at the upper and lower ends, that is, the chain conveyor is arranged vertically. It has a form.
- a receiving member 22 for supporting the tray 5 is provided with pitches corresponding to the upper and lower steps of the conveyor device 2.
- the receiving device 22 has a horizontal portion 23 extending forward, and an L-shaped portion extending downward from its distal end and further returning from its lower end, as shown in FIG. And fingers 24.
- a hook 24 protruding upward is provided at the tip of the finger 24.
- the tune 21 is circulated by a motor (not shown) so that the front side rises and the rear side descends.
- FIG. 4A shows a preferred embodiment of the tray 5.
- the tray 5 is made of a square pipe made of aluminum or aluminum alloy, and has both ends closed by a lid 5a or the like. Openings 26 for plant cultivation are formed on the upper surface at intervals of about 50 to 30 Omm.
- FIG. 4B since the culture solution 27 is stored in the tray 5, the tray 5 is in a liquid-tight state.
- a supply port 5b for pouring the culture solution is opened at the upper surface at one end of the tray 5, and a pipe 5G for discharging the culture solution is provided at the bottom at the other end so as to penetrate the bottom surface. Have been.
- the height of the upper end of the pipe 5c determines the liquid level of the culture solution, and the culture solution exceeding the height is discharged from the pipe 5c.
- the culture solution 27 is usually cooled to about 10 to 20 ° C, more preferably to about 15 to 16 ° C. Since the tray 5 is made of aluminum or aluminum alloy, the surrounding air can be cooled.
- the opening 26 of the tray 5 is circular, and a funnel-shaped holder 30 is mounted therein.
- a downwardly projecting rib 5d is provided, and the openings 26 are arranged in a staggered manner so as to avoid the rib 5d.
- the holder 30 includes a cylindrical base 31 inserted into the opening 26, and a conical holder 33 extending above the base 31.
- the holding portion 33 may have a cylindrical shape or a rectangular tube shape.
- the entire tray 5 can be integrally formed of synthetic resin or the like.
- a synthetic resin sheet is manufactured by hot press molding to form the shape of the holding portion 33 and the bottomed base 31, trimming the periphery of the bent step portion 32, and punching the bottom of the base 31. be able to.
- the holding part 3 3 is not transparent so as to transmit the light of the lighting fixture 3. Preferably, it is translucent.
- the planting conveyor 6 is arranged so as not to interfere with the conveyor 2 for conveyance. Therefore, as shown in FIG. 5, a delivery mechanism 40 for delivering the tray 5 is provided between the two.
- the delivery mechanism 40 is a combination of a delivery bar 41 that moves back and forth and a vertical movement of the planting conveyor 6.
- the delivery bar 41 is, for example, a flat plate or a pipe, and has a hook 42 at its tip end for stably holding the tray 5 upward.
- the delivery bar 41 is supported movably back and forth by guides 43, and is driven back and forth by a rack tooth row 44 provided on the lower surface and a pinion 45 driven by a motor M2.
- the transfer bar 4 1 can stably transfer the long tray 5 left and right
- a plurality of units for example, about two or three units, are provided in parallel on the left and right.
- the pinion 45 driving each delivery bar 41 is rotationally driven so as to be tuned by the respective motor M2, and thereby can operate in synchronization.
- the reflection wall 8 is provided between the planting conveyor 6 and the conveyor device 2 for conveyance. Therefore, an opening 50 or a window for passing the delivery bar 41 is formed in the reflection wall 8.
- a door 51 for closing the opening 50 is attached to the tip of the delivery bar 41.
- the door 51 can also be made of white styrofoam similar to the reflective wall 8, or an aluminum foil adhered to the inner surface.
- the receiving tool 22 of the planting conveyor 6 and the delivery bar 41 can be shifted to the left and right. Therefore, the delivery bar 41 is normally moved forward (to the left).
- the receiver 22 is stopped at a position above the opening 50 of the reflection wall 8 so as not to interfere with the door 51.
- the delivery bar 41 is moved toward the planting conveyor 6, and the hook 42 is positioned behind the tray 5 (step S1).
- step S1 drive the planting conveyor 6 Lower the holder 22 and lightly place the tray 5 on the delivery bar 41 (step S2).
- the transfer bar 41 is retracted, and the tray 5 is held by the hook 42 (step S3).
- the receiving tool 22 is lowered somewhat, and the delivery bar 41 is advanced again (step S 4).
- the receiver 22 is raised to a position where it does not interfere with the door 51 (step S5). Further, the delivery bar 41 is retracted, and the tray 5 is placed on the conveyor device 5. After that, the delivery bar 41 is advanced again, and the opening 50 of the reflection wall 8 is closed by the door 51.
- the opening 50 can be automatically opened and closed without providing a separate drive source. Further, by closing the opening 50, the reflecting action and the heat insulating action of the reflecting wall 8 can be further ensured.
- the upper end of the door 51 may be hingedly connected to the reflective wall 8, and the door 51 may be opened and closed by a separate drive source such as a motor or an air cylinder.
- the receiving member 22 may simply be provided with an upward projection for hooking the tray 5 at the end of the horizontal portion 23, and the receiving member 22 may be lowered to place the tray 5 on the transfer bar 41. After you put it on, you can just escape to the lower side.
- the trays 5 may be transferred to the corresponding conveyors simultaneously from the receivers 42 of each stage of the planting conveyor 6, or the trays may be sequentially transferred one by one. In the empty planting conveyor 6, the worker 9 in Fig. 2 loads the tray 5 with the next seedlings.
- the above-described delivery bar 41 may itself move up and down with respect to the chain. In that case, there is no need to lower the front side of the planting conveyor somewhat. Also, the transfer from the transfer bar 4 to the conveyor 2 for transport is smooth.
- the harvesting conveyor 7 shown in FIG. 8 can also adopt substantially the same equipment as the planting conveyor 6, except that the circulation direction and the order of operation are reversed. However, when lowering the tray 5 from the conveyor device 2, the leaves of the plant may be entangled with the leaves of the next tray, so that the tray 5 does not slip on the transfer bar 41.
- a step 53 for hooking the tray 5 is provided near the tip of the delivery bar 41.
- the tray 5 lowered by the harvesting conveyor 7 is lowered by the worker to the harvest area 10c of the work room, and only the plants are harvested from the tray 5.
- the empty tray 5 will be used to sow again in the sowing area 10a.
- the tray 5 usually contains only water, nutrients, a water retention material for absorbing and retaining them, and seeds. That is, it is cultivated by hydroponics. However, you can put the soil and plant seeds in the soil. Seedlings may be planted from the beginning. Next, a preferred embodiment in the case where a light emitting diode is adopted as the lighting fixture 3 will be described.
- the base plate of the light emitting panel P on which a large number of light emitting diodes are mounted is a metal plate having a high thermal conductivity such as aluminum, and a cooling water is provided on the back side of the light emitting panel P.
- the pipes 56 through which the air passes are provided in close contact.
- a plate material having high thermal conductivity such as ceramics may be used.
- the pipe 56 is a square pipe
- the stud bolt 57 protrudes from the back of the light-emitting panel P
- the mounting is made by bending the metal plate 58 and the nut 59. 5 6 is fixed. It is preferable to use such a square pipe because thermal conductivity is increased.
- the light-emitting panel P in FIG. 9B includes a base plate 60 made of aluminum or the like, a frame member 61 formed of an aluminum square pipe disposed on the lower surface thereof, and a cover 62 and a frame material 6 provided on the lower surface side. 1 and a filler 63 such as a silicone resin to be filled in the outer periphery.
- a board (circuit board) 65 on which lamps 64 having light emitting elements such as light emitting diodes are arranged is arranged.
- the inside of the frame member 61 is filled with a desiccant 66, and the space N between the base plate 60 and the cover 62 is filled with an inert gas such as dry nitrogen gas.
- an inert gas such as dry nitrogen gas.
- dry air may be used.
- the space N may be set in a vacuum state of, for example, about 0 to 0.3 ata. In that case, deterioration due to oxygen and moisture is reduced, and heat conduction due to convection from the force bar 62 is also reduced.
- a sealing material such as butyl putty 67 is interposed between the frame material 61 and the base plate 60 and between the frame material 61 and the cover 62, and the silicone resin filler 6 described above is used. Together with 3, the airtightness in the space N is maintained.
- the light-emitting panel P is provided at an angle. Then, the cooling water is circulated by the piping 56 on the back surface of the light emitting panel P. Since the piping 56 is also inclined, the cooling water circulation action is improved.
- the light-emitting panel P may be provided in a step shape, and a pipe may be provided in a step shape on the back surface side.
- dry air of about ⁇ 40 ° C. to ⁇ 80 ° C. may be sent to the pipe 51 or the duct to cool the lighting fixture 3 directly or through a cooling plate or the like. The air whose temperature has risen after cooling the lighting equipment 3 may be collected as it is in a duct, or may be discharged indoors.
- a light source such as a light emitting diode is surrounded by a box of heat insulating material, and the inside of the box is dried.
- the light may be guided from the light source to the lower surface of the conveyor (above the tray) by an optical fiber.
- the light source can be cooled to a sufficiently low temperature and dew condensation can be prevented, so that the light source can be protected.
- the natural light of the outside such as the sun may be guided to the lower surface of the conveyor in the building by an optical fiber.
- the light-emitting panel P basically consists of the substrate 65
- the size of the substrate 65 of the light emitting unit 69 may be substantially the same as that of the base plate 60.
- the base plate 60 may also serve as the substrate 65 (see FIG. 22).
- Such a light-emitting panel P is, for example, connected to a terminal of a circuit pattern to a control circuit controlled by a computer, and by causing the lamps 64 of a large number of light-emitting units 69 to emit light in sequence, a message for transmitting a predetermined message Used as a board.
- red, green, and violet light-emitting diodes Using red, green, and violet light-emitting diodes, a color image can be displayed.
- a light-emitting panel has a higher light amount than a conventional light-emitting panel, and thus has a higher message effect. Furthermore, since the manufacturing is simple, the cost is low even when used for a large light-emitting panel of several tens of centimeters to about 5 meters.
- the type of the light emitting element used in the present invention is not particularly limited, a light emitting diode is usually used. When used for plant cultivation, red light having a peak wavelength of 600 nm, which has high utilization efficiency even in photosynthetic reactions of plants and is preferred.
- the circuit pattern 70 can be formed by a wiring pattern for connecting the light emitting elements in series or in parallel, or a matrix wiring pattern described later. However, wiring may be performed by connecting wires separately.
- the wiring between the substrates 65 is connected to each other, and then is routed out of the light emitting unit A through a corner or the like, and is sealed with a sealant described later.
- the light-emitting panel P shown in Fig. 11A is made of a metal with high thermal conductivity, such as aluminum.
- a base plate 60 made of a plate and a glass plate cover 62 arranged at an interval H so as to face the base plate 60 are provided. Each of the base plate 60 and the cover 62 has a rectangular shape, and a frame member 61 is interposed between the two.
- the frame member 61 is, for example, a metal thin plate that is bent into a C-shaped cross section or a rectangular cross section to form a square pipe, and has a joint 68 between its ends inside.
- the inside of the frame material 61 is filled with a desiccant 66.
- An oxygen scavenger may be filled together with the desiccant.
- the frame material 61 may be made of synthetic resin.
- the space N between the base plate 60 and the cover 62 in FIG. 11A is filled with a dry gas such as dry air.
- the periphery of the frame material 61 is filled with a sealing material 63 such as a silicone sealant to seal the space N between the base plate 60 and the cover 62.
- the method of filling the space N with dry air is, for example, only to assemble the base plate 60, the frame material 61 containing the desiccant 66, the cover 62, and the like in the drying chamber.
- dry air is naturally formed by the action of the desiccant 66 through the joints 68.
- an inert gas such as nitrogen
- the inside gas may be removed from one side and nitrogen may be filled from the other side.
- the frame material 61 and the base plate 60 or the cover 62 may be temporarily attached with, for example, a double-sided tape or the like, and then filled with the sealing material 63 to integrate the whole.
- the sizes of the base plate 60 and the cover 62 are not particularly limited, and various sizes from about 10 cm on a side to about 5 m on one side may be used. However, from the viewpoint of ease of assembling and transportation, and efficiency, it is preferable that each side is about 50 cm to 2 m, particularly about 1 m. Also, a rectangular or band-shaped thing may be used.
- the thickness of the base plate 60 is preferably about 0.3 to 3 mm.
- the thickness of the cover 62 is preferably about 1 to 5 mm.
- the distance H between the base plate 60 and the cover 62 depends on the size of the panel, and is preferably about 3 to 20 mm, more preferably about 5 to 10 mm.
- the radiating fins may be attached to the base plate 60 of the light-emitting panel P in FIG. 11A, as indicated by an image line indicated by reference numeral 104.
- the fins 104 can be manufactured, for example, by bending a metal sheet having high thermal conductivity, such as aluminum, into a C shape. It is preferable to send air to the fins 35 with a blower or the like.
- a light emitting unit 69 in which a large number of lamps 64 are arranged on the surface of a substrate 65 made of an aluminum thin plate or the like is arranged.
- the substrate 65 is tightly fixed to the base plate 60 by brazing or the like so as to be made of high thermal conductivity. As shown in FIGS.
- the light emitting unit 69 is provided with an insulating layer 65a made of an inorganic material or an organic material on a substrate 65, on which a copper circuit pattern 7 is formed. 0 is provided, solder cream (solder paste) 11 is applied to a predetermined position thereon, and a lamp 64 is attached. Instead of the aluminum substrate 65, another metal substrate can be used.
- the insulating layer 65 a is provided on the entire substrate 1. However, it may be provided only at the portion of the circuit pattern 8.
- the circuit pattern 70 can be formed by, for example, plating the entire copper and removing unnecessary portions by etching.
- the solder cream 71 can be applied efficiently by forming and printing a plate.
- the substrate can be made of an insulating material such as a synthetic resin plate. In that case, the insulating layer 65a is unnecessary.
- the lamp 6 4 is formed by pressing a thin copper plate into a dish shape, and the concave surface 7 2 is coated with aluminum.
- the reflector 7 3 is mounted on the concave surface 7 2 of the reflector 7 3. 4, an electrode plate 7 5 arranged at the same level as the reflection plate 7 3, a bonding wire 7 6 connecting the LED 7 4 and the electrode plate 7 5, and the whole of them.
- an encapsulant 77 such as an epoxy resin.
- the annular projection 78 during the progressive forming by pressing remains on the reflector 73.
- the lower end of the annular projection 78 may be left in a flat plate shape to serve as the bottom of the lamp 64. Further, the electrode plate 75 and the reflection plate 73 of another light emitting unit may be left connected to the electrode plate 75 via the bottom surface thereof, and may be separated after sealing with the sealing material 77.
- the sealing material 77 is formed of a transparent synthetic resin, particularly a thermosetting resin such as an epoxy resin.
- the upper surface 77a at the center of the sealing material 77 facing the light emitting diode (LED) 74 has a spherical shape. For this reason, the transparent sealing material 77 acts as a lens, and the light amount increases.
- the reflection plate 73 and the electrode plate 75 may be integrally formed of an insulating material such as a single synthetic resin plate. In such a case, a copper plate or the like penetrating the upper and lower surfaces is inserted into each part. In addition, a through hole may be provided in each portion in advance, and a conductive material may be embedded in the portion, or may be plated, or may be combined to form an electrical conduction path.
- Solder cream 71 is a well-known thing such as solder fine powder dissolved in a solvent to form a cream.
- the solvent flies by heating, the solder dissolves with heat, and the reflection plate 73 and the electrode plate 75 are formed. It is filled between the circuit patterns 70 and cures as the temperature decreases. At that time, the lamp 64 is firmly joined to the substrate 65.
- a conductive adhesive other than solder cream may be used.
- 13A to 13D show another manufacturing method of the lamp 64 and the light emitting panel P. First, a base material 80 of a long sheet made of a metal having high conductivity and heat conductivity such as a copper plate is pressed to form an array of regions 81 in which lamps are to be formed. .
- a perforation hole 82 like a perforation of a photographic film is formed. Thereby, the feeding accuracy is increased.
- horizontal slits 83 are formed at predetermined intervals to facilitate press working between the slits 83.
- an annular projection 78 whose inner surface is a concave surface 72 is formed.
- Reference numeral 75a is a portion to be the above-mentioned electrode plate.
- Reference numeral 84a denotes a region to be removed later by the etching process, and reference numeral 84b denotes a region left at that time.
- the concave surface 72 is plated with a white metal such as nickel or aluminum to provide a mirror surface that reflects light.
- a light emitting diode 74 is provided on the bottom surface of the concave surface 72, and an electrode 75 is provided in the region 75a.
- a bonding wire 76 is connected between the light emitting diode 74 and the electrode 75.
- the reflection plate 73 is electrically connected so as to be an electrode of the light emitting diode 74.
- a sealing material 7 7 is formed. Further, masking is performed on the back side to remove the above-mentioned region 84a of the copper plate.
- the light emitting diode 74 side and the electrode plate 5 side are cut off, and the area 81 of the unit constituting each lamp is cut off, so that the lamp 81 is obtained.
- the long sheet may be cut off from the long sheet one by one in an appropriate step in advance.
- the individual lamps 64 After the individual lamps 64 have been obtained, they are mounted on predetermined circuit positions of a base plate 60 also serving as a circuit board as shown in FIG. 13D by a mounter, and the reflection plate 73 and the electrode plate 75 are mounted as described above. It is directly joined to the circuit using a solder cream technique.
- the insulating layer and the circuit pattern are formed on the base plate 60 made of an aluminum plate or the like.
- the process of assembling the light emitting diodes 74 and the electrode plates 75 and passing the bonding wires 76 requires high precision.
- the individual lamps 84 when the reflecting plate 73 and the electrode plate 75 are joined to the circuit of the base plate 60, not so high precision is required. Therefore, it can be directly mounted on a large base plate 60 of about 1 m square. In that case, there is no need to provide a separate circuit board, so that the circuit can be manufactured efficiently (see Fig. 2).
- FIGS. 16A to 16F show an embodiment of a light emitting device using a light emitting diode mounted on the lower surface of the light emitting panel P.
- a light-emitting diode 74 fixed to a metal substrate 65 such as aluminum, and a transparent heat-resistant material such as epoxy resin is mounted on it so that it rises in a hemispherical or convex lens shape.
- a sealing material 77 made of a synthetic resin having high performance is provided. Further, in this embodiment, the second convex lens layer 79 and the third convex lens layer 79 are provided in two steps on the sealing material 77.
- Reference numeral 75 denotes an electrode plate
- reference numeral 76 denotes a bonding wire (electrode wire)
- reference numeral 85 denotes a ring-shaped dam member provided to prevent the flow of the sealing material 77 from spreading outward.
- the sealing material 77 of the lamp 64 is raised in the shape of a convex lens, the light emitted from the light emitting diode 74 is not diffused and is emitted straight at substantially right angles to the substrate 65. Also, the second convex lens layer 79 and the third convex lens layer 79 converge light, and irradiate the plant with strong light.
- the lamp 64 in FIG. 16b has a concave surface (recess) 72 having a depth of about 0.9 mm on a substrate 65, and the inner surface thereof is a mirror surface for reflecting light.
- the upper surface of the sealing material 77 filled in the concave surface 72 is raised in a convex lens shape.
- the bottom surface 86 of the concave surface 72 is flat for providing the electrode plate 75, and the side surface 87 is curved in the shape of a concave mirror.
- the light emitted from the light emitting diode # 4 is reflected on the inner surface and is converged to some extent, and further converged and radiated by the convex lens function of the sealing material 77.
- the lamp 64 shown in FIG. 16C is a combination of the three-layer convex lens structure shown in FIG. 16A and the inner reflecting mirror structure shown in FIG. 16B, and both functions are simultaneously achieved.
- FIG. 16d has substantially the same structure as that of FIG. 16c. However, the difference is that the concave surface 72 is somewhat shallower, the electrode plate 75 is provided on the surface of the substrate 65, and the sealing material 77 has a larger spread than the concave surface 72 so as to cover the electrode plate 75. This also has substantially the same operation and effect as those of FIG. 16c, and the connection of the bonding wire 76 is easy.
- the lamp 64 in FIG. 16 e is the same as the light emitting device in FIGS. 16 b to 10 d except that the upper surface of the sealing material 77 is flush with the surface of the substrate 65.
- FIG. 17 shows an embodiment of an electric circuit for causing a large number of light emitting elements to emit light.
- Symbols 1, 2, 3 ⁇ are the positive wires, symbols a, b, c, (1 ⁇ denotes the negative wire.
- Positive wires 1, 2, 3 ⁇ and the negative wire a, b, c ⁇ form a matrix circuit 92 that intersects in a grid pattern, and the light-emitting elements la, lb, 1 c ⁇ ⁇ ⁇ , 2 a, 2 b , 2 c « etc. I have.
- a voltage is selectively applied to a predetermined positive line, and a predetermined negative line is grounded.
- a predetermined positive line is selectively applied to a predetermined positive line, and a predetermined negative line is grounded.
- a voltage is selectively applied to a predetermined positive line, and a predetermined negative line is grounded.
- the voltage of the positive electrode it is possible to increase or decrease the illuminance of the light emitting element at a specific portion.
- characters and specific patterns can be displayed.
- the illuminance of a predetermined range of light-emitting elements deteriorates due to humidity or temperature and the illuminance decreases, the illuminance of only those light-emitting elements can be increased to make the overall illuminance uniform.
- sensors using phototransistors that detect illuminance in a specific range are provided at several places, and an arithmetic circuit that provides an appropriate voltage to each positive electrode line based on the output value of those sensors,
- a central processing unit microprocessor
- a feedback control circuit to always obtain uniform illuminance.
- fine control can be performed, such as increasing the illuminance at or near a site where the plant is located.
- a conventionally known series circuit 93 shown in FIG. 18A can be employed. In FIG.
- reference numeral 94 denotes a DC power supply
- 95 denotes a fuse
- 14a denotes a light emitting element such as a light emitting diode.
- Such a series circuit 93 has a short wiring length and a simple printed pattern.
- a parallel circuit 96 as shown in FIG. 18B can be employed. In the case of the parallel circuit 96, even if the conduction of one light emitting element 14a becomes defective, the other light emitting elements are not affected. Also, as shown in Fig.
- control lines 97 are connected to each of the light emitting elements 14a arranged in a matrix, and these control lines are individually turned ON-OFF and illuminance is controlled. It may be. In this case, too, use a microcomputer, etc. Fine control can be performed, such as making the illuminance of the body uniform or changing the illuminance for each block.
- the light-emitting panel P configured as described above is used for plant cultivation, and is used alone or in combination with a display panel 98 such as a brake lamp shown in FIG. 19, for example. Can be adopted.
- Reference numeral 99 denotes a control unit.
- Such a display panel 98 has little deterioration because the lamp 64 is sealed even in an environment with high humidity.
- FIG. 20 shows another method of using the light-emitting panel P for plant cultivation.
- a light-emitting panel P is arranged above each shelf 102 of the stacking shelf 101, and a cultivation tank 103 of a plant to be grown is arranged on each shelf 102. This irradiates the plants with the light of the lamps 64, and in combination with the supply of water and nutrients, temperature control, and the like, promotes the growth of the plants and enables efficient harvesting.
- the room where the stacking shelf 101 in which the cultivation tanks 103 and the like are arranged is installed has high humidity.
- the lamp 64 is sealed between the base plate 60 and the cover 62, and the interior of the lamp 64 is extremely low in humidity with a desiccant 66. Protected. Further, the lamp 64 generates less heat than a conventional fluorescent lamp or the like. However, the lamp 64 generates heat to some extent due to light emission, and heat is accumulated in the light emitting panel P. However, since the heat conduction of the base plate 60 is high, heat is efficiently radiated to the outside from the upper surface side of the light emitting panel P.
- a frame material 61 made of a synthetic resin is used instead of the frame material filled with the desiccant. Therefore base play from cover 6 2 side G There is little heat conduction to the 60 side.
- a pipe 56 for passing a coolant such as cooling water is arranged in close contact with the upper surface of the base plate 60.
- a chlorofluorocarbon-based refrigerant such as chlorofluorocarbon alternative—a refrigerant such as alcohol may be used, and cool air may be passed through the pipe 56 or the duct.
- the substrate 65 be in close contact with the base plate 60, so that the heat generated from the lamps 64 is transferred from the substrate 65 to the base plate 6. It is transmitted to 0, and it is easy to radiate heat. In this way, the heat conduction from the substrate 65 to the base plate 60 is improved, the heat dissipation of the lamps 64 is increased, and a refrigerant pipe 56 is provided to forcibly cool the base plate 60. This makes it possible to more reliably control the temperature of the lamp 64. It is usually preferable that the light emitting element such as a light emitting diode be kept at a temperature as low as possible, thereby increasing the efficiency.
- the refrigerant can be passed through the pipe 56 using the pipe.
- the lamp 64 is directly mounted on the base plate 60.
- the base plate 60 also functions as a substrate.
- the frame member interposed between the base plate 60 and the cover 62 is omitted, and the gap therebetween is simply maintained by the seal member 63.
- even a panel with a side of about 1 m can serve as a substrate for such a base plate 60, and the substrate (or base) and frame material can be omitted.
- the frame member 61 may be provided as in the case of FIG.
- the light emitting element includes various semiconductors having a light emitting property, such as a semiconductor laser, in addition to the light emitting diode.
- a cover made of a glass plate is used on the lower surface side, but a transparent synthetic resin plate such as an acrylic plate, or a laminate of a glass or synthetic resin plate and a synthetic resin film is used.
- a cover such as a body can also be used.
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Environmental Sciences (AREA)
- Biodiversity & Conservation Biology (AREA)
- Botany (AREA)
- Ecology (AREA)
- Forests & Forestry (AREA)
- Cultivation Of Plants (AREA)
- Cultivation Receptacles Or Flower-Pots, Or Pots For Seedlings (AREA)
- Hydroponics (AREA)
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01917851A EP1300066A4 (en) | 2000-07-07 | 2001-04-06 | PROCESS FOR PLANT PRODUCTION, PLANT PLANT AND LIGHT PANELS |
CA2417172A CA2417172C (en) | 2000-07-07 | 2001-04-06 | Plant cultivating method, cultivating device, and its lighting device |
US10/332,033 US7049743B2 (en) | 2000-07-07 | 2001-04-06 | Plant cultivating method, cultivating device, and its lighting device |
AU2001244736A AU2001244736A1 (en) | 2000-07-07 | 2001-04-06 | Method of producing plants, plant cultivating device, and light-emitting panel |
KR1020037000180A KR100854295B1 (ko) | 2000-07-07 | 2001-04-06 | 식물의 생산방법, 재배장치 및 발광패널 |
HK04101839A HK1058879A1 (en) | 2000-07-07 | 2004-03-12 | Light-emitting panel |
US11/202,098 US20050268547A1 (en) | 2000-07-07 | 2005-08-12 | Plant cultivating method, cultivating device, and its lighting device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000207334 | 2000-07-07 | ||
JP2000-207334 | 2000-07-07 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/202,098 Division US20050268547A1 (en) | 2000-07-07 | 2005-08-12 | Plant cultivating method, cultivating device, and its lighting device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002003777A1 true WO2002003777A1 (fr) | 2002-01-17 |
Family
ID=18704107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2001/003010 WO2002003777A1 (fr) | 2000-07-07 | 2001-04-06 | Procede de production de plantes, dispositif de culture et panneau electroluminescent |
Country Status (8)
Country | Link |
---|---|
US (2) | US7049743B2 (ja) |
EP (1) | EP1300066A4 (ja) |
KR (1) | KR100854295B1 (ja) |
CN (2) | CN1831418A (ja) |
AU (1) | AU2001244736A1 (ja) |
CA (1) | CA2417172C (ja) |
HK (1) | HK1058879A1 (ja) |
WO (1) | WO2002003777A1 (ja) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7058171B2 (en) | 2002-08-06 | 2006-06-06 | Brother Kogyo Kabushiki Kaisha | IP telephone apparatus and IP telephone system |
WO2010147058A1 (ja) * | 2009-06-15 | 2010-12-23 | 昭和電工株式会社 | 植物栽培用の照明装置および植物栽培システム |
JP2011519141A (ja) * | 2008-04-29 | 2011-06-30 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 発光モジュール、ヒートシンク及び照射システム |
WO2011125965A1 (ja) * | 2010-04-06 | 2011-10-13 | 有限会社シマテック | 水耕栽培装置 |
JP2014236724A (ja) * | 2013-06-07 | 2014-12-18 | ダイスコム カンパニー リミテッド | Led集魚灯装置 |
JP2015508636A (ja) * | 2012-01-30 | 2015-03-23 | バーティカル デザインズ リミテッドVertical Designs Ltd. | 自動化された園芸および農業のための方法および装置 |
WO2016125296A1 (ja) * | 2015-02-06 | 2016-08-11 | 不二精工株式会社 | 植物栽培装置 |
JP2017099346A (ja) * | 2015-12-03 | 2017-06-08 | 東京特殊電線株式会社 | 植物栽培用照明装置および植物栽培装置 |
WO2018037577A1 (ja) * | 2016-08-24 | 2018-03-01 | マイクロコーテック株式会社 | 植物工場における植物栽培装置 |
RU2670944C1 (ru) * | 2015-02-06 | 2018-10-25 | Фудзи Сейко Ко., Лтд. | Устройство для выращивания растений |
US20190141923A1 (en) * | 2017-11-10 | 2019-05-16 | James S. RAY, JR. | Apparatus and methods for a hydroponics system with enhanced heat transfer |
US10306841B2 (en) * | 2016-09-01 | 2019-06-04 | Philip Fok | Crop growing structure and method |
IT201900006823A1 (it) * | 2019-05-14 | 2020-11-14 | Nicola Triolone | Dispositivo e metodo di trasformazione di fiori |
CN116326380A (zh) * | 2023-05-12 | 2023-06-27 | 湖南易净环保科技有限公司 | 一种活动式沉水植物种植围栏 |
CN116784233A (zh) * | 2022-03-22 | 2023-09-22 | 利革林农业科技发展有限责任公司 | 一种用于培养马铃薯组织的培养装置 |
Families Citing this family (84)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102415330A (zh) * | 2003-02-05 | 2012-04-18 | 作物培植股份有限公司 | 植物育种 |
US7033060B2 (en) | 2003-05-23 | 2006-04-25 | Gelcore Llc | Method and apparatus for irradiation of plants using light emitting diodes |
DE102004019049B4 (de) * | 2004-04-16 | 2008-10-09 | Universität Duisburg-Essen | Verfahren zur Stimulation des Pfanzenwachstums |
CA2579804C (en) * | 2004-09-16 | 2013-12-10 | Cropdesign N.V. | Root evaluation |
CA2499512A1 (en) * | 2005-03-07 | 2006-09-07 | Terrasphere Systems Llc | Method and apparatus for growing plants |
EP1858316A2 (en) * | 2005-03-07 | 2007-11-28 | Terrasphere Systems LLC | Method and apparatus for growing plants |
US7559173B2 (en) * | 2005-03-07 | 2009-07-14 | Terrasphere Systems Llc | Method and apparatus for growing plants in carousels |
NL1031185C2 (nl) * | 2006-02-17 | 2007-09-03 | Lemnis Lighting Ip Gmbh | Verlichtingsinrichting en verlichtingssysteem voor het bevorderen van plantengroei en werkwijze voor het vervaardigen en bedrijven van een verlichtingsinrichting. |
CN101484992B (zh) * | 2006-07-04 | 2011-03-09 | 皇家飞利浦电子股份有限公司 | 对布置于温室中的半导体基装置进行冷却 |
LT5516B (lt) | 2006-10-17 | 2008-09-25 | Uždaroji akcinė bendrovė "HORTILED" | Žalingų nitratų kiekio augaluose sumažinimo, apšvitinant kietakūnio šviestuvo sukuriamu šviesos srautu, būdas ir įrenginys |
WO2009074602A2 (en) * | 2007-12-10 | 2009-06-18 | Lemnis Lighting Patent Holding B.V. | Led lighting system cooled with aqueous liquid, in particular for greenhouses |
KR100963690B1 (ko) * | 2007-12-28 | 2010-06-15 | 대한민국 | 참외 재배용 광질 제어 조사장치 및 방법 |
CN201149235Y (zh) * | 2008-01-17 | 2008-11-12 | 莫家贤 | 一种新型植物盆景灯 |
JP5314706B2 (ja) | 2008-02-06 | 2013-10-16 | コーニンクレッカ フィリップス エヌ ヴェ | 生物を収納するための容器、ドッキングステーションおよび運搬システム |
WO2009119778A1 (ja) * | 2008-03-26 | 2009-10-01 | Uchiyama Hisakazu | 栽培装置 |
CA2724794C (en) * | 2008-05-22 | 2015-09-08 | Syddansk Universitet | Method and apparatus for using light emitting diodes in a greenhouse setting |
CN102159065A (zh) * | 2008-09-16 | 2011-08-17 | 巴斯夫植物科学有限公司 | 改善的植物育种方法 |
CA2659658A1 (en) * | 2009-03-23 | 2010-09-23 | Terrasphere Systems Llc | Apparatus for growing plants |
WO2010140171A1 (en) * | 2009-06-02 | 2010-12-09 | Asbjorn Elias Torfason | Solid-state plant growth lighting device and a method for cooling same |
KR200462981Y1 (ko) * | 2010-03-23 | 2012-10-18 | 대한민국 | 컨테이너를 이용한 식물 재배 장치 |
WO2011125382A1 (ja) * | 2010-04-09 | 2011-10-13 | シャープ株式会社 | 照明装置、植物栽培装置、および照明装置の冷却方法 |
KR101022025B1 (ko) * | 2010-08-17 | 2011-03-16 | 조장은 | 식물 재배 장치 |
KR101281116B1 (ko) * | 2010-10-25 | 2013-07-02 | (주)창조인프라 | 분리 가능한 엘이디조명 대용 받침대를 구비하는 식물재배장치 |
KR101222036B1 (ko) * | 2010-12-27 | 2013-01-15 | 재단법인 포항산업과학연구원 | 작물 재배 시스템 |
KR101240249B1 (ko) * | 2011-02-17 | 2013-03-07 | 박영환 | 식물재배시스템 |
JP5734055B2 (ja) * | 2011-03-31 | 2015-06-10 | 株式会社椿本チエイン | 植物栽培装置 |
US20150113875A1 (en) * | 2011-12-13 | 2015-04-30 | Matthew Liotta | Apparatus and Method for Optimizing Delivery of Nutrients in a Hydroponics System |
CN103070017B (zh) * | 2013-02-04 | 2015-02-25 | 洛阳佳嘉乐农业产品开发有限公司 | 一种用于食用菌种植悬挂系统的旋转拨料装置 |
CA2907852A1 (en) * | 2013-03-28 | 2014-10-02 | Mitsubishi Chemical Corporation | Plant cultivation facility |
KR101475891B1 (ko) * | 2013-05-31 | 2014-12-23 | 농업회사법인 주식회사 바이오피아 | 수경식물 재배장치 |
CN103814773B (zh) * | 2013-06-08 | 2017-05-31 | 李秋林 | 全自动育苗装置 |
SE537310C2 (sv) | 2013-08-07 | 2015-04-07 | Peter Johansson | Odlingssystem |
CN103704063B (zh) * | 2013-12-17 | 2014-12-17 | 京东方科技集团股份有限公司 | 一种植物生长装置及其控制植物生长的方法 |
MX370298B (es) | 2014-02-10 | 2019-12-09 | Biolumic Ltd | Mejoras en, y relacionadas con, características de control de organismos fotosintéticos. |
US10070594B2 (en) | 2014-02-20 | 2018-09-11 | Affinor Growers Inc. | Method and apparatus for automated vertical horticulture and agriculture |
US10842084B2 (en) | 2014-02-20 | 2020-11-24 | Affinor Growers Inc. | Vertical growing tower for automated horticulture and agriculture |
AU2015230049B2 (en) * | 2014-03-14 | 2018-07-26 | Biolumic Limited | Method to improve crop yield and/or quality |
KR20150119649A (ko) * | 2014-04-16 | 2015-10-26 | 라미숙 | 다층의 순환구조를 가지는 수경재배시스템 |
JP2017529076A (ja) | 2014-09-17 | 2017-10-05 | バイオルミック リミテッド | 種子処理の方法およびその結果として得られる生産物 |
US11129344B2 (en) * | 2015-01-01 | 2021-09-28 | Aravinda Raama Mawendra | Central processing horticulture |
US10094116B2 (en) * | 2015-01-01 | 2018-10-09 | Aravinda Raama Mawendra | Central processing horticulture |
JP6746056B2 (ja) * | 2015-02-13 | 2020-08-26 | 伊東電機株式会社 | 植物栽培装置及び植物栽培システム |
EP3087831A1 (en) * | 2015-04-30 | 2016-11-02 | Oü Click & Grow | A system for indoor plant cultivation |
CN104776367B (zh) * | 2015-05-08 | 2017-12-19 | 深圳市壹鲜生生物科技有限公司 | 一种植物生长灯 |
US10004179B2 (en) * | 2015-09-17 | 2018-06-26 | Boulder Lamp, Inc. | Vertical grow lights with frame mounts |
US10390503B2 (en) * | 2016-01-20 | 2019-08-27 | Stephen A. Dufresne | Automated mobile terrace growing system |
US10390504B2 (en) * | 2016-07-08 | 2019-08-27 | Stephen A. Dufresne | Multilevel mobile gutter system for growing indoor vegetation |
GB2551802B (en) * | 2016-06-30 | 2021-10-13 | Growpura Ltd | A system and method of growing plants in the absence of soil |
BR112019003577A2 (pt) | 2016-08-22 | 2019-05-21 | Biolumic Ltd | métodos de tratamento da semente e produtos resultantes |
CN106416990A (zh) * | 2016-09-23 | 2017-02-22 | 福建省农业科学院科技干部培训中心 | 一种工厂化水培蔬菜装置及其工作方法 |
EP3324099A1 (en) * | 2016-11-16 | 2018-05-23 | Heliospectra AB (publ) | Cooled modular lighting arrangement |
US20180132441A1 (en) * | 2016-11-16 | 2018-05-17 | Alvin Harker | Hydroponic conveyor system and method of growing and harvesting crops |
CN106838820A (zh) * | 2016-12-15 | 2017-06-13 | 东莞市中实创半导体照明有限公司 | 一种用于植物生长的反光杯及其应用 |
US11212967B2 (en) | 2017-01-20 | 2022-01-04 | Hgci, Inc. | Light emitting structures |
CA3002985A1 (en) * | 2017-04-27 | 2018-10-27 | Jacob David Counne | Apparatus, system and methods for improved vertical farming |
JOP20190048A1 (ar) * | 2017-06-14 | 2019-03-19 | Grow Solutions Tech Llc | أنظمة وطرق للتعلم الذاتي بحجيرة نمو |
US11071266B2 (en) * | 2017-06-14 | 2021-07-27 | Grow Solutions Tech Llc | Devices, systems, and methods for providing and using one or more pressure valves in an assembly line grow pod |
US11019773B2 (en) * | 2017-06-14 | 2021-06-01 | Grow Solutions Tech Llc | Systems and methods for molecular air control in a grow pod |
EP3664598A4 (en) * | 2017-08-07 | 2021-05-05 | Netled Oy | PROCEDURE AND ARRANGEMENT FOR BREEDING PLANTS ON A MULTI-LAYER PRINCIPLE |
RU2656668C1 (ru) * | 2017-10-04 | 2018-06-06 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Белгородский государственный аграрный университет имени В.Я. Горина" | Конвейерная установка для проращивания гидропонной зелени |
US11483988B2 (en) * | 2017-11-30 | 2022-11-01 | OnePointOne, Inc. | Vertical farming systems and methods |
JP7001488B2 (ja) * | 2018-02-06 | 2022-01-19 | タキロンシーアイ株式会社 | 水耕栽培装置 |
CN112105256B (zh) | 2018-03-21 | 2023-04-14 | Mjnn有限责任公司 | 用于受控环境农业的垂直种植塔输送系统 |
CA3003437C (en) * | 2018-04-30 | 2019-10-01 | Mondi Products Ltd. | Plant cultivator with light |
NL1042881B1 (en) * | 2018-05-25 | 2019-12-02 | Stogger Bv | Lighting device. |
CN108901806B (zh) * | 2018-07-11 | 2020-10-27 | 福建省中科生物股份有限公司 | 一种植物水培装置及植物水培方法 |
WO2020092506A1 (en) | 2018-10-30 | 2020-05-07 | Mjnn Llc | Production facility layout for automated controlled environment agriculture |
CA3184681A1 (en) | 2018-10-30 | 2020-05-07 | Mjnn Llc | Grow tower processing for controlled environment agriculture system |
CN109630970A (zh) * | 2018-12-29 | 2019-04-16 | 江苏彤明高科汽车电器有限公司 | 一种防炫目可拆卸式汽车前照灯 |
CA186505S (en) | 2019-03-06 | 2020-07-08 | Cobotix Mfg Inc | Agricultural and horticultural growing tower |
TWI719451B (zh) * | 2019-04-18 | 2021-02-21 | 邱鈺礎 | 植株槽生產設備及植株槽傳送機構 |
AU2020267770B2 (en) * | 2019-05-09 | 2023-12-21 | 80 Acres Urban Agriculture Inc. | Method and apparatus for high-density indoor farming |
EP3968756A4 (en) | 2019-05-13 | 2023-05-24 | 80 Acres Urban Agriculture Inc. | SYSTEM AND METHOD FOR CONTROLLING INDOOR REMOTE FARMS AND ASSOCIATED USER INTERFACE |
CN110024596A (zh) * | 2019-05-24 | 2019-07-19 | 温州大学新材料与产业技术研究院 | 一种用于生菜大棚的培育结构及其植物灯的制备方法 |
EP4030892A1 (en) | 2019-09-20 | 2022-07-27 | Mjnn Llc | A crop production system for controlled environment agriculture and associated method |
KR20220062545A (ko) | 2019-09-20 | 2022-05-17 | 엠제이엔엔 엘엘씨 | 자동화된 제어 환경 농업을 위한 생산 시설 레이아웃 |
US11570958B2 (en) | 2019-09-20 | 2023-02-07 | Mjnn Llc | Catch mechanism facilitating loading of vertical grow towers onto grow lines in a vertical farm system |
US11506373B2 (en) * | 2019-11-13 | 2022-11-22 | AVID Labs, LLC | Cooled lighting system |
WO2021136929A1 (en) * | 2019-12-30 | 2021-07-08 | Seven Seas Productions Ltd | Hydroponic apparatus |
US10973184B1 (en) * | 2020-09-11 | 2021-04-13 | American Standard Agricultural Products (Asap) | Planter, growth system, and growth block for aeroponic farming |
WO2022092030A1 (ja) * | 2020-10-28 | 2022-05-05 | 三菱ケミカルアクア・ソリューションズ株式会社 | 植物栽培装置及び方法 |
WO2022131982A1 (en) * | 2020-12-18 | 2022-06-23 | Swegreen Ab | Cultivation plant comprising a cultivation room and an adjacent facility exchanging resources |
CN116114510B (zh) * | 2023-04-03 | 2023-11-14 | 泗阳县聚星农业发展有限公司 | 基于多环境模拟的智能感光式绿色蔬菜培育装置 |
CN117716905B (zh) * | 2024-01-23 | 2024-05-14 | 临沂市农业科学院 | 一种用于水稻种植的稻种培育箱 |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6212183U (ja) * | 1985-07-05 | 1987-01-24 | ||
JPH02171125A (ja) * | 1988-12-26 | 1990-07-02 | Sanyo Electric Co Ltd | 植物栽培方法および植物栽培装置 |
JPH0388205U (ja) * | 1989-12-26 | 1991-09-10 | ||
JPH04144621A (ja) * | 1990-10-05 | 1992-05-19 | Yanmar Agricult Equip Co Ltd | 水耕栽培装置 |
JPH06141714A (ja) * | 1992-11-12 | 1994-05-24 | Taiyo Kogyo Kk | 葉菜類の水耕栽培方法 |
JPH0711704U (ja) * | 1993-07-30 | 1995-02-21 | 芳保 富田 | 表示灯 |
JPH081964B2 (ja) * | 1989-01-18 | 1996-01-10 | 株式会社小糸製作所 | 可撓性を有する表示装置 |
US5580156A (en) | 1994-09-27 | 1996-12-03 | Koito Manufacturing Co., Ltd. | Marker apparatus |
JPH09275779A (ja) | 1996-04-17 | 1997-10-28 | Iwasaki Electric Co Ltd | 植物育成方法および育成装置 |
JP2000106757A (ja) * | 1998-08-03 | 2000-04-18 | Cosmo Plant Kk | 植物栽培装置 |
JP2000207933A (ja) * | 1999-01-08 | 2000-07-28 | Mitsubishi Chemicals Corp | 植物栽培用の照明パネル |
JP2001095383A (ja) * | 1999-10-04 | 2001-04-10 | Cosmo Plant Kk | 植物の栽培装置 |
JP2001110216A (ja) * | 1998-03-02 | 2001-04-20 | H E Williams Inc | 発光ダイオードによって励起される燐光体蛍光アッセンブリ |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS48102585A (ja) * | 1972-04-04 | 1973-12-22 | ||
DE3480294D1 (en) * | 1984-11-15 | 1989-11-30 | Japan Traffic Manage Tech Ass | Signal light unit having heat dissipating function |
US4733335A (en) * | 1984-12-28 | 1988-03-22 | Koito Manufacturing Co., Ltd. | Vehicular lamp |
JPS6255028A (ja) * | 1985-09-04 | 1987-03-10 | 三菱電機株式会社 | 植物栽培装置 |
US4935665A (en) * | 1987-12-24 | 1990-06-19 | Mitsubishi Cable Industries Ltd. | Light emitting diode lamp |
JPH0343750U (ja) * | 1989-09-04 | 1991-04-24 | ||
JP3052317B2 (ja) * | 1989-10-25 | 2000-06-12 | 三菱瓦斯化学株式会社 | 脱酸素剤 |
DE4242842C2 (de) * | 1992-02-14 | 1999-11-04 | Sharp Kk | Lichtemittierendes Bauelement zur Oberflächenmontage und Verfahren zu dessen Herstellung |
US5265792A (en) * | 1992-08-20 | 1993-11-30 | Hewlett-Packard Company | Light source and technique for mounting light emitting diodes |
JP2974552B2 (ja) * | 1993-06-14 | 1999-11-10 | 株式会社東芝 | 半導体装置 |
JP3127195B2 (ja) * | 1994-12-06 | 2001-01-22 | シャープ株式会社 | 発光デバイスおよびその製造方法 |
US6712481B2 (en) * | 1995-06-27 | 2004-03-30 | Solid State Opto Limited | Light emitting panel assemblies |
JP3264147B2 (ja) * | 1995-07-18 | 2002-03-11 | 日立電線株式会社 | 半導体装置、半導体装置用インターポーザ及びその製造方法 |
US6045240A (en) * | 1996-06-27 | 2000-04-04 | Relume Corporation | LED lamp assembly with means to conduct heat away from the LEDS |
US5857767A (en) * | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
EP0955497A4 (en) * | 1996-12-20 | 2000-05-03 | Kikkoman Corp | LUMINESCENT TOOL, ITS AUXILIARY ELEMENTS AND METHOD FOR THE PRESERVATION OF BIOLUMINESCENTS, COMPOSITION USED IN THE TOOL AND AUXILIARY ELEMENT |
US6093940A (en) * | 1997-04-14 | 2000-07-25 | Rohm Co., Ltd. | Light-emitting diode chip component and a light-emitting device |
US5962971A (en) * | 1997-08-29 | 1999-10-05 | Chen; Hsing | LED structure with ultraviolet-light emission chip and multilayered resins to generate various colored lights |
US6412971B1 (en) * | 1998-01-02 | 2002-07-02 | General Electric Company | Light source including an array of light emitting semiconductor devices and control method |
DE19829197C2 (de) * | 1998-06-30 | 2002-06-20 | Siemens Ag | Strahlungsaussendendes und/oder -empfangendes Bauelement |
JP2000183407A (ja) * | 1998-12-16 | 2000-06-30 | Rohm Co Ltd | 光半導体装置 |
US6705745B1 (en) * | 1999-06-08 | 2004-03-16 | 911Ep, Inc. | Rotational led reflector |
US6548832B1 (en) * | 1999-06-09 | 2003-04-15 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
US20050057941A1 (en) * | 1999-08-04 | 2005-03-17 | 911Ep, Inc. | 360 Degree pod warning light signal |
US6407411B1 (en) * | 2000-04-13 | 2002-06-18 | General Electric Company | Led lead frame assembly |
JP2001345485A (ja) * | 2000-06-02 | 2001-12-14 | Toyoda Gosei Co Ltd | 発光装置 |
US6345903B1 (en) * | 2000-09-01 | 2002-02-12 | Citizen Electronics Co., Ltd. | Surface-mount type emitting diode and method of manufacturing same |
US7055987B2 (en) * | 2001-09-13 | 2006-06-06 | Lucea Ag | LED-luminous panel and carrier plate |
US6480389B1 (en) * | 2002-01-04 | 2002-11-12 | Opto Tech Corporation | Heat dissipation structure for solid-state light emitting device package |
-
2001
- 2001-04-06 WO PCT/JP2001/003010 patent/WO2002003777A1/ja active Application Filing
- 2001-04-06 KR KR1020037000180A patent/KR100854295B1/ko not_active IP Right Cessation
- 2001-04-06 US US10/332,033 patent/US7049743B2/en not_active Expired - Fee Related
- 2001-04-06 CA CA2417172A patent/CA2417172C/en not_active Expired - Fee Related
- 2001-04-06 EP EP01917851A patent/EP1300066A4/en not_active Withdrawn
- 2001-04-06 CN CNA200610004899XA patent/CN1831418A/zh active Pending
- 2001-04-06 AU AU2001244736A patent/AU2001244736A1/en not_active Abandoned
- 2001-04-06 CN CNB018143490A patent/CN1245586C/zh not_active Expired - Fee Related
-
2004
- 2004-03-12 HK HK04101839A patent/HK1058879A1/xx not_active IP Right Cessation
-
2005
- 2005-08-12 US US11/202,098 patent/US20050268547A1/en not_active Abandoned
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6212183U (ja) * | 1985-07-05 | 1987-01-24 | ||
JPH02171125A (ja) * | 1988-12-26 | 1990-07-02 | Sanyo Electric Co Ltd | 植物栽培方法および植物栽培装置 |
JPH081964B2 (ja) * | 1989-01-18 | 1996-01-10 | 株式会社小糸製作所 | 可撓性を有する表示装置 |
JPH0388205U (ja) * | 1989-12-26 | 1991-09-10 | ||
JPH04144621A (ja) * | 1990-10-05 | 1992-05-19 | Yanmar Agricult Equip Co Ltd | 水耕栽培装置 |
JPH06141714A (ja) * | 1992-11-12 | 1994-05-24 | Taiyo Kogyo Kk | 葉菜類の水耕栽培方法 |
JPH0711704U (ja) * | 1993-07-30 | 1995-02-21 | 芳保 富田 | 表示灯 |
US5580156A (en) | 1994-09-27 | 1996-12-03 | Koito Manufacturing Co., Ltd. | Marker apparatus |
JPH09275779A (ja) | 1996-04-17 | 1997-10-28 | Iwasaki Electric Co Ltd | 植物育成方法および育成装置 |
JP2001110216A (ja) * | 1998-03-02 | 2001-04-20 | H E Williams Inc | 発光ダイオードによって励起される燐光体蛍光アッセンブリ |
JP2000106757A (ja) * | 1998-08-03 | 2000-04-18 | Cosmo Plant Kk | 植物栽培装置 |
JP2000207933A (ja) * | 1999-01-08 | 2000-07-28 | Mitsubishi Chemicals Corp | 植物栽培用の照明パネル |
JP2001095383A (ja) * | 1999-10-04 | 2001-04-10 | Cosmo Plant Kk | 植物の栽培装置 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1300066A4 * |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7058171B2 (en) | 2002-08-06 | 2006-06-06 | Brother Kogyo Kabushiki Kaisha | IP telephone apparatus and IP telephone system |
JP2011519141A (ja) * | 2008-04-29 | 2011-06-30 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 発光モジュール、ヒートシンク及び照射システム |
WO2010147058A1 (ja) * | 2009-06-15 | 2010-12-23 | 昭和電工株式会社 | 植物栽培用の照明装置および植物栽培システム |
JP2010284127A (ja) * | 2009-06-15 | 2010-12-24 | Showa Denko Kk | 植物栽培用の照明装置および植物栽培システム |
WO2011125965A1 (ja) * | 2010-04-06 | 2011-10-13 | 有限会社シマテック | 水耕栽培装置 |
JP2015508636A (ja) * | 2012-01-30 | 2015-03-23 | バーティカル デザインズ リミテッドVertical Designs Ltd. | 自動化された園芸および農業のための方法および装置 |
JP2014236724A (ja) * | 2013-06-07 | 2014-12-18 | ダイスコム カンパニー リミテッド | Led集魚灯装置 |
RU2670944C9 (ru) * | 2015-02-06 | 2018-11-26 | Фудзи Сейко Ко., Лтд. | Устройство для выращивания растений |
WO2016125296A1 (ja) * | 2015-02-06 | 2016-08-11 | 不二精工株式会社 | 植物栽培装置 |
JPWO2016125296A1 (ja) * | 2015-02-06 | 2017-11-09 | 不二精工株式会社 | 植物栽培装置 |
US10912261B2 (en) | 2015-02-06 | 2021-02-09 | Fuji Seiko Co., Ltd. | Plant cultivation device |
RU2670163C1 (ru) * | 2015-02-06 | 2018-10-18 | Фудзи Сейко Ко., Лтд. | Устройство для выращивания растений |
RU2670944C1 (ru) * | 2015-02-06 | 2018-10-25 | Фудзи Сейко Ко., Лтд. | Устройство для выращивания растений |
JP2017099346A (ja) * | 2015-12-03 | 2017-06-08 | 東京特殊電線株式会社 | 植物栽培用照明装置および植物栽培装置 |
WO2018037577A1 (ja) * | 2016-08-24 | 2018-03-01 | マイクロコーテック株式会社 | 植物工場における植物栽培装置 |
JPWO2018037577A1 (ja) * | 2016-08-24 | 2018-08-30 | マイクロコーテック株式会社 | 植物工場における植物栽培装置 |
US10306841B2 (en) * | 2016-09-01 | 2019-06-04 | Philip Fok | Crop growing structure and method |
US20190141923A1 (en) * | 2017-11-10 | 2019-05-16 | James S. RAY, JR. | Apparatus and methods for a hydroponics system with enhanced heat transfer |
US11617316B2 (en) * | 2017-11-10 | 2023-04-04 | James S. Ray | Apparatus and methods for a hydroponics system with enhanced heat transfer |
IT201900006823A1 (it) * | 2019-05-14 | 2020-11-14 | Nicola Triolone | Dispositivo e metodo di trasformazione di fiori |
CN116784233A (zh) * | 2022-03-22 | 2023-09-22 | 利革林农业科技发展有限责任公司 | 一种用于培养马铃薯组织的培养装置 |
CN116326380A (zh) * | 2023-05-12 | 2023-06-27 | 湖南易净环保科技有限公司 | 一种活动式沉水植物种植围栏 |
CN116326380B (zh) * | 2023-05-12 | 2023-11-17 | 湖南易净环保科技有限公司 | 一种活动式沉水植物种植围栏 |
Also Published As
Publication number | Publication date |
---|---|
AU2001244736A1 (en) | 2002-01-21 |
CN1831418A (zh) | 2006-09-13 |
HK1058879A1 (en) | 2004-06-11 |
CN1447646A (zh) | 2003-10-08 |
KR20030036592A (ko) | 2003-05-09 |
EP1300066A1 (en) | 2003-04-09 |
KR100854295B1 (ko) | 2008-08-26 |
CA2417172C (en) | 2010-10-12 |
CA2417172A1 (en) | 2003-01-07 |
EP1300066A4 (en) | 2008-05-21 |
US20050268547A1 (en) | 2005-12-08 |
CN1245586C (zh) | 2006-03-15 |
US7049743B2 (en) | 2006-05-23 |
US20040163308A1 (en) | 2004-08-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2002003777A1 (fr) | Procede de production de plantes, dispositif de culture et panneau electroluminescent | |
JP6556746B2 (ja) | 多くの新規用途を有する自動タワー | |
JP2001095383A (ja) | 植物の栽培装置 | |
US10172296B2 (en) | Method for enhancing the nutritional value in an edible plant part by light, and lighting device therefore | |
JP5338011B2 (ja) | 照明装置を用いた無人植物栽培装置 | |
KR101881368B1 (ko) | 묘목 육성장치 및 그 묘목 육성방법 | |
JP5357863B2 (ja) | 栽培装置 | |
KR101101889B1 (ko) | 식물재배 조명시스템 | |
JP5363985B2 (ja) | 植物発育装置 | |
US10602671B2 (en) | Gas-delivery light fixture and method for making and using | |
CA2529096A1 (en) | Apparatus for producing seedlings and method of producing seedlings | |
JPWO2014064893A1 (ja) | 照明装置および植物栽培装置 | |
JP2017127302A (ja) | 植物生育促進装置、該植物生育促進装置を用いた植物生育促進システム、及び植物生育促進方法 | |
LT5516B (lt) | Žalingų nitratų kiekio augaluose sumažinimo, apšvitinant kietakūnio šviestuvo sukuriamu šviesos srautu, būdas ir įrenginys | |
KR101463982B1 (ko) | Led조명을 구비한 식물재배장치 | |
JP2007274905A (ja) | 照明装置 | |
JP2002272270A (ja) | 植物栽培用グロースボックス | |
JP2000106757A (ja) | 植物栽培装置 | |
JP2022124073A (ja) | 植物栽培装置 | |
JP2021029173A (ja) | 植物栽培装置及び植物製造方法 | |
CN210746245U (zh) | 土培种植设备 | |
WO2024038581A1 (ja) | 植物栽培装置 | |
TWI568347B (zh) | Stereo dynamic plant culture equipment and its cultivation method | |
JPH1014401A (ja) | 屋内植物補光装置 | |
KR20230032838A (ko) | 회전형 식물재배기를 위한 조명 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AL AM AT AU AZ BA BB BG BR BY CA CH CN CR CU CZ DE DK DM EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GH GM KE LS MW SD SL SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2001917851 Country of ref document: EP Ref document number: 10332033 Country of ref document: US Ref document number: 1020037000180 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2417172 Country of ref document: CA |
|
WWE | Wipo information: entry into national phase |
Ref document number: 018143490 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2002508243 Country of ref document: JP |
|
WWP | Wipo information: published in national office |
Ref document number: 2001917851 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1020037000180 Country of ref document: KR |
|
REG | Reference to national code |
Ref country code: DE Ref legal event code: 8642 |