WO2001033582A1 - Ensemble bobines planes a plusieurs couches et procede de fabrication dudit ensemble - Google Patents

Ensemble bobines planes a plusieurs couches et procede de fabrication dudit ensemble Download PDF

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Publication number
WO2001033582A1
WO2001033582A1 PCT/EP2000/010056 EP0010056W WO0133582A1 WO 2001033582 A1 WO2001033582 A1 WO 2001033582A1 EP 0010056 W EP0010056 W EP 0010056W WO 0133582 A1 WO0133582 A1 WO 0133582A1
Authority
WO
WIPO (PCT)
Prior art keywords
planar coil
coil arrangement
surface substrate
conductor structures
conductor
Prior art date
Application number
PCT/EP2000/010056
Other languages
German (de)
English (en)
Inventor
Martin SCHÜTTLER
Original Assignee
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. filed Critical Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Priority to EP00972747A priority Critical patent/EP1226592A1/fr
Publication of WO2001033582A1 publication Critical patent/WO2001033582A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/003—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2847—Sheets; Strips
    • H01F2027/2861—Coil formed by folding a blank
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors

Definitions

  • the invention relates to a planar coil arrangement with at least two, on a dielectric, flexibly formed surface substrate next to each other, on the same top of the surface substrate, made of electrically conductive material conductor structures which can be positioned vertically one above the other by means of folding the surface substrate and are electrically connected to one another.
  • Planar coil arrangements of the type mentioned above are inductively acting electrical components which are used in particular in the field of telecommunications for the purpose of inductive coupling as transmission coils. Basically, however, planar coil arrangements are used in electronic circuits wherever little space is available and an inductive effect is required, such as in wristwatches, medical implants, intelligent credit cards, in consumer electronics, in listening devices, to name just a few other areas of application.
  • planar coils In addition to known wound wire coils, which are manufactured in a precision engineering manner and, due to their structure, cannot be less than a macroscopic minimum size, the above-mentioned planar coils, which are produced by means of photolithographic, milling or screen printing processes, are preferably used. Planar coils are generally characterized by an electrically insulating surface substrate, on which, preferably arranged in a spiral or circular manner, a conductor structure is applied which, depending on the design, has little or no electrical or electrical resistance has more coil windings with any chosen conductor thickness.
  • a problem with planar coils is their electrical contact, especially since the inner end of the conductor structure applied in a single layer to the flat substrate has to be led out of its coil center without short-circuiting the existing coil windings.
  • the line contact is typically led out of the coil center via a second metallization level, the line structure on the surface substrate being covered by an electrically insulating layer, via which the electrical contact line, starting from the coil center, runs.
  • the latter case is often associated with sources of error due to poor soldering quality, which is why the use of soldering points with such, in part microscopic, electronic inductive components should be avoided.
  • the dimensioning with regard to the electrical requirements for planar coils is free to choose, with always between a few coil windings with wide conductor tracks, which is associated with a low electrical resistance and a low inductance, and high number of windings with narrow conductor tracks, which with a high electrical resistance and a high inductance.
  • planar coil arrangement can be found in Japanese publication JP 6325948, in which a plurality of spiral-shaped conductor structures arranged next to one another are applied to a polyamide film substrate, which can be arranged one above the other after appropriate folding of the carrier substrate, wherein they are in the folded state of the carrier substrate result in a multilayer planar coil arrangement.
  • the carrier substrate is folded in such a way that two conductor structures applied adjacent to the carrier substrate are folded onto one another.
  • the conductor structures are covered with at least one electrical insulation layer, the necessity for mutual electrical contacting of the folded-up electrical conductor structures being provided by additional contact areas provided with the conductor structures in a different metallization level, which must be brought into line during the folding.
  • the known coil arrangement therefore has at least two metallization levels and, when folding, a precise position adjustment of the contact surfaces to be brought into contact is required.
  • the invention is based on the object of specifying a planar coil arrangement and a method for producing one, the planar coil being simplified in terms of its structure and considerably reducing its production costs.
  • the new manufacturing process should make it possible to integrate To obtain planar coils with a high number of windings with low qualitative demands on the flexible surface substrate.
  • claim 12 is a method according to the invention for producing a planar coil arrangement.
  • Advantageous developments of the invention are the subject matter of the subclaims and the entire description and the exemplary embodiments illustrated in the drawings.
  • a planar coil arrangement with at least two, on a dielectric, flexibly designed surface substrate next to one another, on the same upper side of the surface substrate, conductor structures consisting of electrically conductive material, which can be positioned vertically one above the other by means of folding the surface substrate and are electrically connected to one another, are further developed in this way that the surface substrate provides a transition region between the conductor structures arranged next to one another, in which the surface substrate is folded in such a way that the conductor structures are separated from one another by a single layer of the surface substrate.
  • a transition region between the conductor structures applied to the surface substrate which are preferably themselves electrically connected to one another via the transition region, creates the possibility of folding the surface substrate in such a way that the top of the surface substrate, on which a conductor structure is arranged, after the folding of the The underside of the surface substrate is covered and is therefore not brought into direct contact with the surface of another conductor structure, as is the case with the prior art.
  • the individual conductor structures overlap one another in such a way that they are each oriented identically to the flat substrate. If, for example, spiral-shaped conductor structures in the form of turns are involved, the sense of winding, which has the conductor structure turns individually arranged next to one another on the flat substrate, is also retained in the stacked arrangement. Above all, this simplifies the design of the entire conductor structure before it is applied to the flat substrate within a single processing step.
  • the surface substrate which, as in the prior art, consists of a foil-like dielectric, has circular surface structures, on each of which the spiral-shaped electrical conductor structures are applied.
  • the conductor structures can be chosen to be of any size in terms of their line thickness, and virtually any number of spiral turns, depending on the desired inductance, can be applied to the individual surface areas of the surface substrate.
  • the individual annular surface areas are each connected to the adjacent annular surface area via at least one transition area, the transition area being web-shaped and having a web width which is preferably selected to be smaller than the diameter of the individual annular surface areas.
  • the conductor end is applied to a bridge-like section of the surface substrate, which in the folded state of the planar coil arrangement can be bent out of the coil center in such a way that the conductor end can come into direct contact with a contact surface which is applied at a corresponding point on the surface substrate.
  • the coil arrangement is electrically contacted without the use of a large number of soldering points or the use of electrically insulated conductor tracks.
  • the bridge also serves as a mechanical lock that holds the bobbins folded together, as long as they are not glued or potted for mutual fixation.
  • the planar coil according to the invention is produced with a single metallization step, which completely deposits the conductor structure, which is linearly formed in a conductor path, on the surface substrate.
  • the surface substrate provided with transition regions, it is folded together, preferably by folding twice along two fold edges running perpendicular to one another, such that the regions to which the further structures are applied lie directly one above the other, each separated by a position of the surface substrate.
  • the conductor strip deposited on the flat substrate is preferably provided with an insulation layer at those points which correspond to the transition regions and correspond to the contact surfaces provided for the electrical contacting.
  • the method is characterized by its simplicity and differs essentially from known methods in that only a single metallization step is required to create a multilayer planar coil arrangement.
  • Fig. 5 side view of a multilayer planar coil.
  • FIG. 1 shows the top view of a flat substrate F, which is made up of a thin-film dielectric, for example a polymer film.
  • the flat substrate F is composed essentially of four circularly shaped regions 1, 2, 3 and 4, which are each connected to one another via transition regions 5, 6 and 7.
  • the annular area 1 of the flat substrate F provides a web-like extension 8 which is slightly larger than the other transition areas and which, as will be explained below, serves as a connection area.
  • an integrally formed conductor track 9 consisting of electrically conductive material is applied, which is formed on each annular area 1, 2, 3, 4 of the Surface substrate F adopts concentrically formed conductor structures which are each electrically connected to one another in the transition regions 5, 6, 7 by corresponding connecting lines.
  • the ring-shaped coil body S1 is provided with a web-like area 10 which extends into the interior of the ring-shaped area 1 and on which the conductor end 11 ends with a corresponding contact surface 12.
  • a connection contact 13 is provided in the connection area 8 of the flat substrate F, to which the contact surface 12, as will be shown below, is brought into intimate contact by appropriately bending the web-shaped area 10.
  • the conductor structures applied in the individual coil formers S1 to S4 have concentric circular shapes, the geometrical arrangement of which, when the one-piece cable is flooded, enables a current flow which is oriented identically for each coil form S1 to S4.
  • the text below shows the form in which the four bobbins S1 to S4 arranged in one plane are folded in order to be able to maintain the same current flow in a stack lying one above the other.
  • FIG. 2 shows a cross-sectional representation through the flat substrate F, on which the conductor structure, embodied by a metallization plane M, is applied.
  • a dielectric layer 14 is applied above the metallization level, for example by applying a polymer lacquer. Only at the point at which electrical contact is to take place is the conductor track 9 uncovered by the insulation layer 14. For example, this is the Case in the connection area 8 at the location of the connection contact 13 and in the web-like area 10 in the area of the contact surface 12.
  • FIG. 3a shows the initial situation in which, for example, the adjacent coil formers S3 and S4 are connected to the transition region 7.
  • the bobbin S4 with its connected transition region 7 is folded around the bobbin S3 along the fold line 14 shown in broken lines.
  • the result obtained after folding is shown in Fig. 3b.
  • a subsequent second folding takes place along a folding line 15 which, as can be seen from FIG. 3b, perpendicularly intersects the original folding line 14.
  • the bobbins S3 and S4 are brought into congruence, which can be seen from the illustration according to FIG. 3c.
  • the folding directions of the two folding processes can be seen from FIGS. 3a and 3b using the arrows entered.
  • a multilayer planar arrangement can be obtained from the planar surface substrate, which is processed in the manner described in the context of a single metallization and a corresponding surface insulation, the individual folding steps of which can be seen in FIGS. 4a to d.
  • FIG. 4a shows the initial situation in which the flat substrate F is provided in one plane with the conductor track 9 located thereon.
  • the coil former S4 is in one first folding process along the fold line 14 folded relative to the bobbin S3. After the first folding, the arrangement is shown, as shown in FIG. 4b. After a further folding step along the folding line 15 according to FIG. 4b, the coil former S4 is in register with the coil former S3. It should be noted here that both bobbins face upwards, which means that their sense of winding and the direction of current flow are preserved.
  • both bobbins S3 and S4 are folded relative to the bobbin S2 until they come to cover the bobbin S2.
  • the same way of folding is then carried out with the bobbins S2, S3 and S4 relative to the bobbin S1, so that finally a compact, stacked planar coil arrangement is obtained, as shown in Fig. 4d, left representation.
  • the web-like region 10 is placed from the coil center over the bobbins S1 to S4 lying one above the other and brought into intimate connection with the connection region 13, which can be accomplished, for example, by soldering or a similar joining connection.
  • FIG. 4d right-hand illustration, in which the web-like region 10 encloses all coil bodies and thus also leads to an intimate mechanical connection of the individual coil layers.
  • the composite of the four individual coil bodies shown in the exemplary embodiment can be glued or sealed with a corresponding resin.
  • 5 shows a cross section through the folded multilayer planar coil arrangement, from which the effect and arrangement of the web-like area 10 can be seen, which protrudes from the inside of the coil and connects the coil bodies S1 to S4 lying one above the other.
  • the areas entered in a cap-like manner represent the folded transition areas 5, 6, 7.
  • Multilayer planar coil arrangement with low electrical resistance If, for example, five coil formers with only one winding per coil form are put together, the conductor track structure used being relatively wide, a coil with five windings and a very low electrical resistance is obtained.
  • Multi-layer planar coil arrangement with high inductance If, for example, ten bobbins with 20 windings are combined, the result is a coil with 200 windings, which, based on typical dimensions of the flat substrate materials and conductor structures used, has a total height of only 100 ⁇ m. It is assumed that the total substrate thickness is approximately 10 ⁇ m.
  • Multilayer planar coil arrangement with low internal capacitance By selecting different winding diameters for each individual coil former, the internal capacitance of the coil can be reduced or adjusted so that no winding is congruent with the other.
  • Multilayer planar coil arrangement which is electrically shielded Coils of this type have a complicated layer structure, which consists, for example, of four insulator layers in which three metalization layers are introduced. With these sometimes very complex starting materials one is Realization of electrically shielded multilayer planar coil arrangements possible, with which an electrical decoupling from the environment can be realized. Such coil changes only work with magnetic fields.
  • Multilayer planar coils with an inner diameter of 0 In contrast to the embodiment shown in FIGS. 1 to 5, a coil body 1 is conceivable which has a connection contact in the inside of the coil. In this case, the bridge that creates the electrical connection from outside the coil to the inside of the coil body is implemented in the connection area of the output structure.
  • the bobbins 2 ff. Are folded in such a way that they are located on the underside of the bobbin 1. In this way, the entire circular area within the flat substrate can be filled with line windings, which is associated with an increase in the inductance.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

Ensemble bobines planes à plusieurs couches possédant au moins deux structures conductrices placées l'une à côté de l'autre sur la même face supérieure d'un substrat plat diélectrique souple et constituées d'une matière électriquement conductrice, lesdites structures conductrices pouvant s'étendre l'une au-dessus de l'autre dans le sens vertical et étant connectées électriquement l'une à l'autre par pliage du substrat plat. La présente invention se caractérise en ce que le substrat plat possède, entre les structures conductrices placées les unes à côté des autres, une zone intermédiaire dans laquelle le substrat plat est plié de manière telle que les structures conductrices sont séparées les unes des autres par une seule couche dudit substrat.
PCT/EP2000/010056 1999-11-04 2000-10-12 Ensemble bobines planes a plusieurs couches et procede de fabrication dudit ensemble WO2001033582A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP00972747A EP1226592A1 (fr) 1999-11-04 2000-10-12 Ensemble bobines planes a plusieurs couches et procede de fabrication dudit ensemble

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1999153237 DE19953237C2 (de) 1999-11-04 1999-11-04 Mehrschichtige Planarspulenanordnung und Verfahren zur Herstellung einer Planarspulenanordnung
DE19953237.0 1999-11-04

Publications (1)

Publication Number Publication Date
WO2001033582A1 true WO2001033582A1 (fr) 2001-05-10

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ID=7927997

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2000/010056 WO2001033582A1 (fr) 1999-11-04 2000-10-12 Ensemble bobines planes a plusieurs couches et procede de fabrication dudit ensemble

Country Status (3)

Country Link
EP (1) EP1226592A1 (fr)
DE (1) DE19953237C2 (fr)
WO (1) WO2001033582A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022177679A1 (fr) * 2021-02-19 2022-08-25 Enphase Energy, Inc. Enroulement de transformateur planaire à pliage continu

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3148192A1 (de) * 1981-12-05 1983-06-09 Robert Bosch Gmbh, 7000 Stuttgart Elektrische spule aus leiterbahnen
JPS58141513A (ja) * 1982-02-17 1983-08-22 Olympus Optical Co Ltd 積層型プリントコイル
US4517540A (en) * 1977-05-13 1985-05-14 Mcdougal John A Spiral windings
JPH06163238A (ja) * 1992-11-20 1994-06-10 Murata Mfg Co Ltd コイル部品
JPH06325948A (ja) * 1993-05-10 1994-11-25 Nippon Signal Co Ltd:The 平面コイル及びそれを用いたトランス
JPH11329872A (ja) * 1998-05-19 1999-11-30 Alps Electric Co Ltd 誘導性素子及びトランス
DE19824113A1 (de) * 1998-05-29 1999-12-02 Thomson Brandt Gmbh Elektrisches Bauteil mit einer Wicklung

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Publication number Priority date Publication date Assignee Title
GB700458A (en) * 1948-10-05 1953-12-02 Harold Vezey Strong Improvements relating to the production of electric windings
DE1056272B (de) * 1955-08-11 1959-04-30 Siemens Ag Elektrische Spule
CH336118A (fr) * 1956-10-05 1959-02-15 Michel Jean Procédé de fabrication d'un enroulement imprimé
GB1180923A (en) * 1966-02-21 1970-02-11 Plessey Co Ltd Improvements relating to Electric Coil Assemblies.
DE19602614A1 (de) * 1996-01-25 1997-07-31 Bosch Gmbh Robert Spule und Verfahren zur Herstellung von Spulen
DE19802473A1 (de) * 1997-07-10 1999-02-11 Melcher Ag Multilayer-Planarinduktivität und Verfahren zum Herstellen einer solchen

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4517540A (en) * 1977-05-13 1985-05-14 Mcdougal John A Spiral windings
DE3148192A1 (de) * 1981-12-05 1983-06-09 Robert Bosch Gmbh, 7000 Stuttgart Elektrische spule aus leiterbahnen
JPS58141513A (ja) * 1982-02-17 1983-08-22 Olympus Optical Co Ltd 積層型プリントコイル
JPH06163238A (ja) * 1992-11-20 1994-06-10 Murata Mfg Co Ltd コイル部品
JPH06325948A (ja) * 1993-05-10 1994-11-25 Nippon Signal Co Ltd:The 平面コイル及びそれを用いたトランス
JPH11329872A (ja) * 1998-05-19 1999-11-30 Alps Electric Co Ltd 誘導性素子及びトランス
DE19824113A1 (de) * 1998-05-29 1999-12-02 Thomson Brandt Gmbh Elektrisches Bauteil mit einer Wicklung

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 007, no. 255 (E - 210) 12 November 1983 (1983-11-12) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 477 (E - 1602) 6 September 1994 (1994-09-06) *
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 02 31 March 1995 (1995-03-31) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 02 29 February 2000 (2000-02-29) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022177679A1 (fr) * 2021-02-19 2022-08-25 Enphase Energy, Inc. Enroulement de transformateur planaire à pliage continu

Also Published As

Publication number Publication date
DE19953237A1 (de) 2001-05-17
EP1226592A1 (fr) 2002-07-31
DE19953237C2 (de) 2003-07-31

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