WO1998008190A1 - Carte a puce a bobine d'induction et son procede de fabrication - Google Patents

Carte a puce a bobine d'induction et son procede de fabrication Download PDF

Info

Publication number
WO1998008190A1
WO1998008190A1 PCT/DE1997/001709 DE9701709W WO9808190A1 WO 1998008190 A1 WO1998008190 A1 WO 1998008190A1 DE 9701709 W DE9701709 W DE 9701709W WO 9808190 A1 WO9808190 A1 WO 9808190A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip card
conductor track
card according
passive components
induction coil
Prior art date
Application number
PCT/DE1997/001709
Other languages
German (de)
English (en)
Inventor
Manfred Fries
Josef Kirschbauer
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1998008190A1 publication Critical patent/WO1998008190A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar

Definitions

  • Chip card with an induction coil and process for its manufacture
  • the invention relates to a chip card with a card base body and with at least one semiconductor component, an induction coil for data and energy exchange and at least one further passive component.
  • the invention further relates to a method for producing such a chip card.
  • contactless chip cards In addition to chip cards with a contact field consisting of six to eight electrical contact surfaces, via which a connection for data and energy transmission is established by means of a card reader, so-called contactless chip cards are also known.
  • An induction coil is provided in the chip card, with which the transmission is carried out without contact.
  • the induction coil is part of an oscillating circuit in which a capacitor and an ohmic resistor are located as further passive components.
  • Surface-mounted capacitors are used as capacitors for the exact frequency tuning of the resonant circuit. In many cases they have such a height that these contactless chip cards are designed to be relatively thick. It is therefore not possible to adhere to the external dimensions of the chip card specified in a corresponding ISO standard, which fixes the card height to a maximum of 0.84 mm.
  • the invention is based on the object of creating a chip card of the type mentioned at the outset which is particularly flat and which can be produced using a simple method.
  • the object is achieved in that all passive components of the resonant circuit, ie induction coil and at least one Capacitor and a resistor can be produced together in a single process in the form of two-dimensional interconnect structures directly on the card base.
  • This has the advantage that it is no longer necessary to assemble discrete passive components, which moreover makes storage unnecessary, speeds up the production process and the
  • the passive components are thus all formed as geometric structures next to one another in one plane. They practically do not add up in height, so that the chip card as a whole is hardly thicker than the basic card body.
  • the corresponding ISO standard can therefore be easily complied with.
  • These conductor track structures are preferably produced by printing an electrically conductive material or an insert etching technique on a metal layer.
  • the structures can thus be generated quickly on the one hand and on the other hand with the required precision in a single layer or level.
  • the ohmic resistance is in the form of a conductor track section with a reduced cross-sectional area, preferably a constriction of the width. In this way, the resistance value can be determined in a particularly simple manner by the geometry of the conductor track.
  • the induction coil is formed by a spiral-shaped conductor track.
  • This conductor track can be arranged along the edges of the card with a sufficiently large inner diameter.
  • the beginning and the end of the spiral are provided with contacting areas in order to enable an easy to establish connection to the semiconductor component.
  • the capacitor is formed by two spaced apart and electrically insulated conductor tracks. They can be designed as one or two blmdwmditch the induction coil.
  • the capacitor area can be increased in that the opposite conductor tracks additionally have fingers or teeth which mesh with one another or mesh with one another.
  • the semiconductor device is preferably arranged on a chip carrier, which is also referred to as a module, which has electrical connections for contacting the passive components.
  • These connections are expediently designed as webs which lead b s to the contact surfaces of the passive components.
  • a particularly simple assembly is made possible in that the webs are designed as bridges for the electrically insulated bridging of conductor track sections. This also has the advantage that the geometry and the course of the conductor tracks for the passive components can largely take place without a rear view of the contact points.
  • the bridges prefferably have an electrically insulating layer on the side facing the conductor track sections to be bridged and to be electrically conductive on the opposite side, and for the associated contact areas to be designed as plated-through holes. Common materials and techniques can thus be used for production and assembly.
  • the bridges are designed as glass-epoxy supports with a copper structure on one side.
  • the bridges are designed as webs of a metallic lead frame with lacquer insulation on one side.
  • the connection frame can also have further webs and fingers with which further connections of the chip are connected.
  • the plane of the drawing corresponds to a surface of a basic card body (ticking) which is glued to a further layer to form an operational chip card.
  • the area shown comprises a module 1 which carries a semiconductor chip (not shown).
  • the module can be designed as a metal leadframe carrier (leadframe carrier) or as a glass epoxy carrier.
  • a recess 40 of the chip card is inserted and glued to the surface.
  • Passive components are printed on the surface of the basic card body by two-dimensional geometric structures of a metallically conductive material, for example aluminum, or by an Emlagen-Etz technique.
  • the passive components are two capacitors 2, 2 'and a resistor 3 in the immediate vicinity of the module 1 and an induction coil 4, which is only shown in the neighboring area of the module 1.
  • the coil 4 also runs along the outer circumference of the card body.
  • the induction coil 4 is used for the contactless transmission of data and energy from an external laser (not shown) to the semiconductor chip on the module 1.
  • the capacitors 2, 2 ', resistor 3 and induction coil 4 form an oscillating circuit connected to the semiconductor module 1.
  • One capacitor 2 is formed by two parallel, spaced conductor track sections 20, 21, each of which has a plurality of mutually perpendicular ones have spaced fingers.
  • the fingers 14 form two comb-like structures with the conductor track sections 20, 21, the fingers 14 of one structure engaging in the interstices of the other structure.
  • the capacitance is formed in the manner of a multilayer plate capacitor by the opposing fingers 14.
  • Resistor 3 is formed in that a conductor track section is provided with a cross-sectional extension or constriction 30 over a predetermined length.
  • the resistance 3 is defined by the cross section of the conductor track.
  • the coil 4 consists of a spiral-shaped conductor track section, the two end sections with flat contacting areas 10, 11 lying in the vicinity of the module 1 in the figure. Cutouts 41 of the coil conductor track are also shown in the figure.
  • the other capacitor 2 'of this circuit example is formed by two blind walls 42 of the coil 4.
  • the windings 42 represent extensions of the coil ends at the contacting areas 10, 11. They run parallel and at a predetermined distance from one another over a predetermined length along the conductor track sections of the coil 4.
  • the capacitor 2 and the resistor 3 are connected to an end section of the coil 4 adjacent to the coil contact region 10 by means of T-shaped branches 22 and 31 of the relevant conductor track sections.
  • the other connection of the capacitor 2 is formed by a flat contact area 12.
  • the other connection of the resistor 3 has a flat contact area 13.
  • All contacting areas 10 to 13 of the passive components 1, 2, 3 are in the same way as the conductor track sections as two-dimensional structures directly on the card base body. produced together with the conductor track sections. They are connected to module 1 in an electrically conductive manner via connecting webs 5, 6, 7.
  • the connecting webs 5, 6, 7 are molded in one piece with the carrier material of the module 1. Accordingly, they have an electrically insulating metallic lead frame carrier or a glass epoxy carrier, depending on the carrier material of module 1. Furthermore, they have an electrically conductive layer which runs on the side of the electrically insulating carrier facing away from the conductor track sections.
  • the electrically conductive layers of the connecting webs 5 to 7 are provided with plated-through holes via the contact areas 10 to 13 on the card body side, so that when the module 1 is assembled, an electrically conductive connection can be produced in a simple manner by soldering or with electrically conductive adhesive .
  • the connecting webs 5 and 7 are designed as bridges 8, 9 for electrically insulating bridging of conductor track sections of the capacitor 2 and the coil 4, respectively. Both the contacting area 12 of the capacitor 2 and the contacting area 11 of the coil 4 are connected to the module 1 via the web 5, the connections of the capacitor 2 and the coil 4 being connected to one another by the electrically conductive layer of the web 5 common connection point.
  • a connecting web or a bridge can be provided with a plurality of metal layers which are electrically insulated from one another, so that contact areas on the chip card side which are not to be brought together to form a common connecting point can also be connected to the module 1 with a web or a bridge.
  • the two connecting webs 5 and 6 form a common electrically insulating carrier layer, on which, at a distance from one another, an electrically conductive layer leads on the one hand to the contacting area 10 and on the other hand to the contacting areas 12 and 11.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

L'invention concerne une carte à puce sans contact et son procédé de fabrication, la carte à puce présentant une puce à semi-conducteur, une bobine d'induction (4) formée d'un tronçon de piste conductrice s'étendant en spirale, et au moins un autre composant passif. Conformément à l'invention, tous les composants passifs, c'est-à-dire la bobine d'induction (4), le condensateur (2, 2') et la résistance (3) sont fabriqués ensemble, en une seule opération, sous forme de structures bidimensionnelles, directement sur le corps de base de la carte, par exemple par impression ou suivant une technique de revêtement-attaque. Les composants passifs sont définis par la disposition et la forme géométrique des tronçons de pistes conductrices. Un module (1) portant la puce à semi-conducteur présente des nervures de pontage (5, 6, ..., 9) permettant de réaliser les connexions aux composants.
PCT/DE1997/001709 1996-08-22 1997-08-11 Carte a puce a bobine d'induction et son procede de fabrication WO1998008190A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1996133923 DE19633923A1 (de) 1996-08-22 1996-08-22 Chipkarte mit einer Induktionsspule und Verfahren zu ihrer Herstellung
DE19633923.5 1996-08-22

Publications (1)

Publication Number Publication Date
WO1998008190A1 true WO1998008190A1 (fr) 1998-02-26

Family

ID=7803384

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1997/001709 WO1998008190A1 (fr) 1996-08-22 1997-08-11 Carte a puce a bobine d'induction et son procede de fabrication

Country Status (2)

Country Link
DE (1) DE19633923A1 (fr)
WO (1) WO1998008190A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002150245A (ja) * 2000-10-19 2002-05-24 Samsung Sds Co Ltd Ｉｃカード用のｉｃモジュールと、それを使用するｉｃカード
US7830324B2 (en) 2005-06-27 2010-11-09 Oberthur Technologies Electronic entity having a magnetic antenna
US8157179B2 (en) 2005-07-07 2012-04-17 Oberthur Technologies Document having an integrated contactless resonator electronic device
US8378911B2 (en) 2005-05-25 2013-02-19 Oberthur Technologies Electronic entity with magnetic antenna
US8698690B2 (en) 2005-05-25 2014-04-15 Oberthur Technologies Electronic entity with magnetic antenna

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2787609B1 (fr) * 1998-12-21 2001-02-09 Gemplus Card Int Procede de fabrication de carte a puce sans contact
JP2002533915A (ja) 1998-12-22 2002-10-08 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ チップと完全に包囲された接続手段と、を有するデータ保持器
DE10056148A1 (de) 2000-11-13 2002-05-23 Infineon Technologies Ag Kontaktloser Datenträger
US6693541B2 (en) * 2001-07-19 2004-02-17 3M Innovative Properties Co RFID tag with bridge circuit assembly and methods of use
JP2006121046A (ja) 2004-09-24 2006-05-11 Meiko:Kk 回路基板
US7926728B2 (en) 2007-10-31 2011-04-19 Infineon Technologies Ag Integrated circuit device including a contactless integrated circuit inlay
DE102008039445B4 (de) * 2008-08-25 2019-04-25 Ses Rfid Solutions Gmbh Zwischenprodukt für ein kartenförmiges Raumgebilde zur Ausbildung eines Transponders und Verfahren zur Herstellung desselben
WO2012156392A1 (fr) * 2011-05-17 2012-11-22 Gemalto Sa Condensateur filaire notamment pour circuit radiofrequence et dispositif le comportant
EP2624670A1 (fr) * 2012-01-31 2013-08-07 Gemalto SA Condensateur filaire notamment pour circuit radiofréquence et dispositif le comportant
DE102018009580A1 (de) 2018-12-05 2020-06-10 Giesecke+Devrient Mobile Security Gmbh Belastbares Chipmodul

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4021705A (en) * 1975-03-24 1977-05-03 Lichtblau G J Resonant tag circuits having one or more fusible links
FR2371053A1 (fr) * 1976-11-11 1978-06-09 Junghans Gmbh Geb Agencement de condensateurs
FR2568082A1 (fr) * 1984-07-23 1986-01-24 Constr Telephoniques Procede pour la realisation de zones de dissipation thermique.
US5523749A (en) * 1991-04-03 1996-06-04 Integrated Silicon Design Pty. Ltd. Identification system for simultaneously interrogated labels
US5541399A (en) * 1994-09-30 1996-07-30 Palomar Technologies Corporation RF transponder with resonant crossover antenna coil

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3143915A1 (de) * 1981-11-05 1983-05-11 Brown, Boveri & Cie Ag, 6800 Mannheim Identitaetskarte
GB9313755D0 (en) * 1993-07-02 1993-08-18 Gec Avery Ltd A method of encapsulating components on a printed circuit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4021705A (en) * 1975-03-24 1977-05-03 Lichtblau G J Resonant tag circuits having one or more fusible links
FR2371053A1 (fr) * 1976-11-11 1978-06-09 Junghans Gmbh Geb Agencement de condensateurs
FR2568082A1 (fr) * 1984-07-23 1986-01-24 Constr Telephoniques Procede pour la realisation de zones de dissipation thermique.
US5523749A (en) * 1991-04-03 1996-06-04 Integrated Silicon Design Pty. Ltd. Identification system for simultaneously interrogated labels
US5541399A (en) * 1994-09-30 1996-07-30 Palomar Technologies Corporation RF transponder with resonant crossover antenna coil

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002150245A (ja) * 2000-10-19 2002-05-24 Samsung Sds Co Ltd Ｉｃカード用のｉｃモジュールと、それを使用するｉｃカード
JP4615695B2 (ja) * 2000-10-19 2011-01-19 三星エスディーエス株式会社 Ｉｃカード用のｉｃモジュールと、それを使用するｉｃカード
US8378911B2 (en) 2005-05-25 2013-02-19 Oberthur Technologies Electronic entity with magnetic antenna
US8698690B2 (en) 2005-05-25 2014-04-15 Oberthur Technologies Electronic entity with magnetic antenna
US7830324B2 (en) 2005-06-27 2010-11-09 Oberthur Technologies Electronic entity having a magnetic antenna
US8157179B2 (en) 2005-07-07 2012-04-17 Oberthur Technologies Document having an integrated contactless resonator electronic device

Also Published As

Publication number Publication date
DE19633923A1 (de) 1998-02-26

Similar Documents

Publication Publication Date Title
DE19737294B4 (de) Halbleiterbaustein mit wenigstens einem Kondensatorelement mit parallelen Kondensatorplatten sowie Verfahren zu seiner Herstellung
EP0035093B1 (fr) Empaquetage pour plusieurs pastilles semiconductrices à commutation rapide
WO1998008190A1 (fr) Carte a puce a bobine d'induction et son procede de fabrication
DE3731286A1 (de) Laminierter transformator
DE102005031165A1 (de) Leiterplatte mit dreidimensionalem, spiralförmigen, induktivem Bauelement und Verfahren zur Herstellung davon
DE4119551A1 (de) Verzoegerungsleitungsvorrichtung und verfahren zur herstellung derselben
DE3145039A1 (de) Integrierte halbleiterschaltung
DE4244064C2 (de) Einrichtung für ein Fahrzeug
DE102004041889B4 (de) Halbleitervorrichtung mit gestapelten Halbleiterbauelementen und Verfahren zu deren Herstellung
DE2103064A1 (de) Vorrichtung zur Herstellung von Modulelementen
EP0495540B1 (fr) Plaquette à circuits imprimés à plusieurs niveaux, notamment pour haute fréquence
DE3416107A1 (de) Busleitungsanordnung mit hoher kapazitaet in schichtbauweise
EP3599636A1 (fr) Support de circuit en céramique et unité électronique
DE19750324A1 (de) Schichtweise ausgebildetes elektronisches Bauelement
DE3245272A1 (de) Verfahren zur herstellung miniaturisierter dick- und duennschichtschaltungen
DE3130072A1 (de) Integriertes schaltglied
DE102019117079A1 (de) Verfahren zum herstellen einer hochfrequenzschaltungs-leiterplatte und hochfrequenzschaltungs-leiterplatte
DE3937183A1 (de) Verfahren zu stoerstrahlungsdaempfung an leiterplatten
DE60037717T2 (de) Datenträger mit integriertem schaltkreis und übertragungsspule
DE2611871A1 (de) Elektrische schaltungsbaugruppe in mehrschichtbauweise und verfahren zu deren herstellung
DE4129835A1 (de) Leistungselektroniksubstrat und verfahren zu dessen herstellung
DE10052517B4 (de) Transpondermodul, Identifikationsträger und Verfahren zum Herstellen eines Transpondermoduls
WO2003100718A2 (fr) Support de donnees
DE19953237C2 (de) Mehrschichtige Planarspulenanordnung und Verfahren zur Herstellung einer Planarspulenanordnung
DE10105069C2 (de) Kopplungselement für Dual-Interface-Karte

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): BR CN JP KR MX RU UA US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE

121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: JP

Ref document number: 98510251

Format of ref document f/p: F

122 Ep: pct application non-entry in european phase