Classifications

• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
  • G06F1/16—Constructional details or arrangements
  • G06F1/20—Cooling means
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
  • G06F1/16—Constructional details or arrangements
  • G06F1/20—Cooling means
  • G06F1/203—Cooling means for portable computers, e.g. for laptops
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
  • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

• Cooling device for central microprocessor of portable computer
• the invention relates to a heat dissipation device for a central microprocessor, and is particularly directed to a portable computer that is tending to be lighter, thinner and shorter with a high space utilization ratio, and can improve the central microprocessor chip (hereinafter (Microprocessor)
• Microprocessor A heat dissipation device for the central microprocessor of a portable computer.
• the present invention also designs a heat sink and a heat sink for the heat sink, which can expand the heat sink area and have a better heat sink effect.
• the aluminum heat sink and cooling fan with high thermal efficiency and large thickness are usually used
• the heat dissipation device is composed to cool the microprocessor, and even if it is barely feasible, not only the thickness of the entire host needs to match the sudden increase, but also the cooling fan will be hindered by the keyboard above, and it will not be able to directly draw outside cold air for cooling the radiator and
• the microprocessor can only use natural heat dissipation methods such as a heat-dissipating aluminum plate or heat pipe without heat-dissipating fans and a small heat-dissipating area, which results in poor heat-dissipating performance.
• the current heat sink used in the heat sink of the computer's central microprocessor has a poor heat dissipation effect.
• the reason is that the heat sink area of the heat sink itself is insufficient, and the heat sink area formed by only a few fins is still It is not enough, so even if a set of cooling fans is added, the effect of the cooling area is not enough.
• FIG. 1 is a three-dimensional exploded schematic view of a known microprocessor heat sink, which is mainly composed of a heat sink 2 fixed above the microprocessor 11 and then using a plurality of fixing bolts 5 to lock the heat sink along the screw holes of the fan 3
• the convection groove 23 formed between the two fins 22 of the sheet 2 may be sufficient.
• the known heat dissipation device of the microprocessor 11 that when the computer mainframe starts to operate, the temperature inside the casing of the computer is definitely higher than the temperature outside the casing. Therefore, whether the fan 3 adopts a cooling method of exhaust air or air supply, the microprocessing The device 11 operates under a high temperature state, and its heat dissipation effect will be greatly reduced.
• the heat dissipation effect of the microprocessor 11 is not ideal, and the normal service life of the microprocessor 11 is damaged. Therefore, the known microprocessor heat sink cannot effectively and quickly reduce the high temperature emitted by the microprocessor.
• a main object of the present invention is to provide a heat dissipation device for a central processing unit of a portable computer with higher heat dissipation efficiency.
• a solution of the present invention is to install a motherboard with a microprocessor, a radiator, and a cooling fan in an upside-down manner in the host, so that the cooling fan can be adjacent to the host.
• the preset air inlet of the bottom case according to which the microprocessor can not only use a heat sink and a cooling fan with high heat dissipation efficiency, but also be able to smoothly take external air from the bottom directly without being hindered by the keyboard above. Cooling and cooling can improve the overall cooling efficiency of the central microprocessor.
• Another object of the present invention is to provide an improved structure of a heat sink for the above heat sink, which can be used as another solution to solve the above-mentioned main object of the present invention, which is mainly by increasing the heat dissipation area in the heat sink, The heat dissipation effect is increased, and the high temperature can be quickly discharged by changing the position of the suction fan.
• the heat dissipation method is to introduce the air outside the main body casing or direct the temperature of the microprocessor out of the casing, so that the high and low temperature difference can quickly reduce the temperature of the microprocessor, improve the cooling effect of the microprocessor, and ensure the use of related components. life.
• Another object of the present invention is to provide an improved structure of the above-mentioned heat dissipation device, which is mainly extended by the total length of the heat sink and is sleeved with a wind box that can transmit airflow to the main body casing, and directly introduces air outside the casing or The high temperature of the microprocessor is pulled out of the housing of the host, so that the high temperature of the microprocessor can be quickly discharged and reduced.
• the heat dissipation device of this structure can change the position where the suction fan is provided on the main body casing.
• a main board is installed in the host, a microprocessor socket is provided on the main board for the microprocessor to insert, and the micro processing A radiator and a cooling fan are sequentially installed on the device;
• main board is fixed inside the host upside down, so that the microprocessor, the radiator and the cooling fan are inverted on the bottom of the main board, so that the cooling fan can abut the preset air intake of the corresponding place of the main chassis. Holes to facilitate direct extraction of outside air for rapid heat dissipation from the heat sink and microprocessor.
• a keyboard composed of a bottom plate, a circuit board, and a plurality of keys is additionally provided on the top of the computer host, and the inverted host board is fixed together with the circuit board of the keyboard at the same place.
• a liquid crystal display screen is disposed on the top of the computer host, and the inverted motherboard is fixed at the bottom of the liquid crystal display screen.
• the bottom case of the computer main body may be formed with a protruding portion having an air inlet hole according to a protruding degree of the bottom case of the computer main body relative to the cooling fan.
• the bottom case of the computer main body is a flat plate surface.
• the structure of the heat sink of the heat sink of the portable computer central microprocessor of the present invention is that two corresponding sides of the heat sink are set as open faces, and the open face on either side can be set by a fan. While the remaining four sides are set as closed surfaces, wherein the contact seat which is in contact with the heating element is provided with a plurality of fins along its vertical direction, and the two fins form a concave and convex opposite, and the two fins between the concave and convex are Convection tank with proper clearance for high temperature flow.
• one or more heat sink holes penetrating into the convection groove may be provided at appropriate positions on the top surface of the heat sink. In the future, the high temperature exhausting the heat sink will not be discharged from the heat sink by the heat sink holes.
• one or more heat sinks passing through the convection tank may be provided at appropriate positions on the top surface of the heat sink. In the future, the high temperature of the heat sink will not be discharged from the heat sink to disperse the heat sink.
• the fans can also be placed on the two open surfaces of the heat sink at the same time, and the fan forms a heat-moving line that enters and discharges air.
• one or more heat sink holes penetrating into the convection tank and one or more heat sink holes penetrating into the convection tank may also be provided at appropriate positions on the top surface of the heat sink.
• the heat sink immediately ejects the higher temperature out of the heat sink.
• the structure of the heat sink of the present invention can also be used in place of a known heat sink in other electronic heat sinks.
• An improved structure of the heat sink of the portable microprocessor central microprocessor of the present invention is to appropriately extend the length of the heat sink of the microprocessor to the vicinity of the housing of the host, and use a funnel-shaped bellows to fan the fan. It is erected in it to directly extract the air outside the main body casing or exhaust the high temperature inside the casing to reduce the high temperature generated by the microprocessor itself due to high and low temperature. It includes:
• a heat sink of the present invention is placed above a microprocessor, wherein two corresponding sides are open, and the remaining faces are closed.
• a plurality of fins are provided along the vertical direction of the contact seat, and two fins A proper gap is left between the films for a pair of flow grooves;
• a fan which is a heat sink that can be drawn or sucked
• An air box is a pipe body capable of transmitting airflow.
• One of the open ports is an external air port and a supply port is provided in the air port.
• Fan placement slot for fan placement the other end is the inner air vent, which is sleeved with one end of the heat sink, and a positioning baffle is extended above and below the outer air outlet, and a plurality of openings are provided at appropriate positions on the board.
• the positioning screw hole is connected by first fixing the heat sink to the microprocessor, then pressing the fan from the outer air outlet of the bellows into the fan placement slot, and then attaching the bellows air outlet to one end of the heat sink. Finally, the outer air outlet of the bellows and the positioning holes of the upper and lower positioning baffles are aligned with the fan opening and the fixing screw of the main body casing, and then the two are locked and fastened by the fixing bolts.
• the fins provided in the heat sink may also be provided only on the vertical surface of the microprocessor, and the processed part becomes a hollow airflow channel.
• a bellows can also be directly punched on the host casing to make it integrally formed with the host casing.
• FIG. 1 is a perspective exploded view of a conventional microprocessor heat sink.
• FIG. 2 is a bottom exploded perspective view of an embodiment of a heat sink of the present invention.
• FIG. 3 is a schematic sectional side view of a heat sink according to an embodiment of the present invention.
• FIG. 4 is a schematic sectional side view of another embodiment of a heat sink according to the present invention.
• FIG. 5 is a schematic perspective view of a heat sink of the present invention.
• FIG. 6 is a schematic perspective view of an embodiment in which a heat sink and a fan are combined according to the present invention.
• FIG. 7 is a schematic diagram of a heat dissipation effect of the present invention.
• FIG. 8 is a schematic perspective view of another embodiment of a heat sink of the present invention.
• FIG. 9 is a schematic perspective view of another embodiment of a heat sink of the present invention.
• FIG. 10 is an exploded perspective view of the heat sink of the present invention.
• FIG. 11 is a schematic perspective view of a heat sink of the present invention.
• Fig. 12 is a side view of the heat sink of the present invention.
• FIG. 13 is a top view of a heat sink of the present invention.
• FIG. 14 is a schematic exploded perspective view of another embodiment of a heat sink of the present invention.
• FIG. 15 is a schematic exploded perspective view of another embodiment of a heat sink of the present invention.
• 1 host, 10—bottom plate, 100—air inlet, 101—projection, 102—pad, 11—microprocessor, 12—keyboard, 120—bottom plate, 121—circuit board, 122—button , 13_ Motherboard, 14—LCD display screen, 2—Heat sink (radiator), 21—Contact base, 22—Fin, 23—Convection tank, 3—Fan, 4—Air box, 41—Outer air outlet, 42 —Inner air outlet, 43—Fan placement slot, 44—Positioning plate, 45—Positioning screw Holes, 5—fixing bolts, 6—host housing, 61—fixing screw holes, 62—fan ports, 63—wind boxes.
• FIG. 2 and FIG. 3 are related reference drawings of Embodiment 1 of a heat dissipation device for a central microprocessor of a portable computer according to the present invention.
• the portable computer main body 1 is provided on its top surface with metal.
• the keyboard 12 composed of the bottom plate 120, the circuit board 121 and the plurality of keys 122 or the touch-sensitive liquid crystal display screen 14 shown in FIG. 3, and the interior is mainly provided with an all-in-one board assembly (all in one).
• the printed circuit board of the main board 13 is provided with at least a microprocessor socket 21 for a microprocessor 11 to be inserted thereon, and an aluminum extrusion type is successively installed on the surface of the microprocessor 11 Radiator 2 and cooling fan 3.
• the motherboard 13 on which the microprocessor 11, the radiator 2 and the cooling fan 3 are mounted is installed in the host 1 in an upside-down manner relative to the motherboard of a known portable computer.
• the cooling fan 3 can be adjacent to the air inlet hole 100 preset by the bottom case 10 of the host 1, and the bottom case 10 at the air inlet hole 100 can present a flat plate surface, or as shown in the figures With the increase of the cooling fan 3, a protruding portion 101 is formed as a partial protrusion according to the actual situation, so that the other parts of the bottom case 10 can be relatively retracted and lifted up against the main board 13 to reduce space occupation.
• a pad 102 is provided in a balanced manner, which is slightly larger than the height of the protruding portion 101 so that the host 1 can be placed stably and allows the air inlet hole 100 to breathe.
• the pad 102 can be provided separately or as shown in the figure.
• the microprocessor 11 adopts the same high-efficiency thermal method as that of a general desktop personal computer central processor, that is, an aluminum extruded radiator 2 and a cooling fan 3, not only can the radiator 2 have most cooling fins It has a larger heat dissipation area for sufficient contact with the air, and can use the cooling fan 3 to increase the frequency of air hitting the radiator 2. It is especially important that the cooling fan 33 is provided by the motherboard 13 It is upside down, so it can easily and directly suck the outside air from the air inlet 100 of the bottom case 10 for the cooling radiator 2 and the microprocessor 11 without being obstructed by the upper keyboard 12, so its heat dissipation effect will be more well-known.
• the cooling method of the computer is better.
• the motherboard 13 and the circuit board 121 of the keyboard 12 can share the keyboard bottom plate 120, that is, the motherboard 13 and the keyboard circuit board 121 are both disposed on the shared bottom plate 120, so that the internal space of the host 1 can be used as More efficient and streamlined configuration arrangement; or as shown in FIG. 4, the motherboard 13 is directly installed in the liquid crystal
• the bottom of the display screen 14 can also effectively simplify the space utilization and assembly process.
• FIG. 5 is a schematic perspective view of a heat sink of the present invention.
• the heat sink 2 mainly includes a contact base 21, and a plurality of fish-bone fins 22 are arranged on the contact base 21, and two fins 22 A convection groove 23 forming a convection space.
• a plurality of fish-bone fins 22 are provided along the vertical direction of the contact base 21, and the two fins 22 are A pair of flow grooves 23 are formed in a concave-convex shape, and an appropriate gap is left between the concave-convex portions.
• This structure has a large heat dissipation area, which greatly improves the heat dissipation efficiency. In terms of heat dissipation area, it is much larger than the known heat dissipation area and can conduct high temperature more quickly.
• FIGS. 6 and 7 are three-dimensional schematic diagrams of the third embodiment of the heat sink and the fan tower of the present invention and the heat dissipation effect of the heat sink of the present invention.
• the fan 3 is particularly fixed to an open side of the heat sink 2 by a plurality of fixing screws 5. Therefore, the heat generated when the fan 3 is connected below the heat sink 2 When the body (microprocessor) 1 1 starts to generate high temperature, its high temperature will be quickly transmitted to the contact seat 21 of the heat sink 2. Due to the greatly increased heat dissipation area, the high temperature generated by the heating body 11 will conduct more smoothly.
• the high temperature generated by the heating element 11 will be conducted by the contact seat 21 of the heat sink 2 to the fish-bone-shaped fins 22, and immediately dissipate between the convection grooves 23, and then the fan 3 will put the convection grooves 23 inside.
• the high temperature quickly and smoothly pumps out the discrete heat sink 2.
• Fans 3 can also be installed on the two open surfaces of the heat sink 2 at the same time.
• the fans 3 are in the form of an air inlet and a row of air, so that the high-temperature air flow in the heat sink 2 can flow more smoothly, and a better heat dissipation effect can be obtained.
• the present invention rapidly conducts the high temperature of the heating element 11 through a large heat radiation area, so as to facilitate the continuous high temperature conduction.
• FIG. 8 is a schematic perspective view of a preferred embodiment 4 of a heat sink of the present invention. It is mainly to open more than one heat dissipation hole 114 penetrating into the convection groove 23 at an appropriate position on the top surface of the heat sink 2. The higher temperature is immediately discharged out of the heat sink 2.
• FIG. 9 is a schematic diagram of a preferred embodiment 5 of a heat sink of the present invention. It is mainly to provide more than one heat sink 115 penetrating into the convection groove 23 at an appropriate position on the top surface of the heat sink 2. High temperature Drain the heat sink immediately.
• heat dissipation holes 114 and the heat dissipation grooves 115 can also be provided on the top surface of the heat sink 1 at the same time to improve the heat dissipation effect.
• the present invention increases the heat dissipation area of the heat sink itself, and changes the direction and position of the fan that assists heat dissipation, so that high temperature can be quickly and smoothly discharged. Therefore, the present invention has completely eliminated the disadvantages of the known heat sinks, such as insufficient heat dissipation area and poor heat dissipation effect.
• FIG. 10 is an exploded perspective view of another heat sink of a microprocessor according to the present invention.
• the heat sink mainly includes a heat sink 2, a fan 3, and a wind box 4.
• a heat sink 2 is a heat-dissipating material, which is placed above the microprocessor 11, and two corresponding sides thereof are open. The other four sides are closed, and a plurality of fins 22 are provided along the vertical direction of the contact seat 21, and a proper gap is provided between the two fins 22 as a pair of flow grooves 23.
• a fan 3 is a heat sink that can be drawn or sucked.
• An air box 4 is a pipe body capable of transmitting airflow.
• One of the open ports is an external air port 41, and a fan placing slot 43 for the fan 3 is disposed in the air port, and the other end is an internal air port 42.
• the port In order to be sleeved with one end of the heat sink 2, a positioning baffle 44 extends above and below the outer air outlet 41, and a positioning screw hole 45 is provided at each position of the plate.
• FIG. 11 is a schematic perspective view of the above-mentioned microprocessor heat sink of the present invention.
• the special structure of the present invention can be found in the figure.
• the length of the heat sink 2 is appropriately extended to enable it to communicate with the wind box 4. Socketing allows the heat sink 2 not only to maintain the heat dissipation function but also to serve as a heat dissipation duct, so the high temperature generated by the microprocessor 11 will be quickly and directly discharged from the host housing 6 by the device.
• the overall heat dissipation area is further enlarged, and the heat dissipation effect of the heat sink 2 is better.
• FIGS. 12 and 13 Please refer to FIGS. 12 and 13 for the side view and the top view of the microprocessor heat sink of the present invention. From the illustration, the entire heat dissipation area of the heat sink 2 is greatly increased, but the overall height is not increased or decreased. A big breakthrough, and the size design of fan 3 also breaks away from the limitation range that microprocessor 1 must have, making fan 3 The range of size and power design is wider.
• FIG. 14 is a three-dimensional exploded schematic view of Embodiment 7 of the microprocessor heat sink according to the present invention.
• the fins 22 provided in the heat sink in the heat sink may also be provided only on the vertical surface of the microprocessor 1.
• the extended part becomes a hollow airflow channel.
• FIG. 15 is an exploded perspective view of Embodiment 8 of the microprocessor heat sink of the present invention.
• an air box 63 can also be directly punched on the host casing 6 so that it is integrally formed with the host casing 6.
• the above-mentioned invention has changed the traditional heat dissipation structure of the microprocessor.
• the importance of the microprocessor in the computer is equivalent to the central view of the human body. Therefore, in order to maintain the normal operation of the microprocessor, it will not be damaged due to overheating. Only the heat dissipation function of its heat dissipation structure can be strengthened.
• the heat dissipation of the microprocessor is completely carried out in a high-temperature housing. Since the computer host emits a lot of high-temperature components during use, no matter how the power of the fan is increased, its operating environment is always at a high temperature. No matter how to draw and supply air, it still belongs to a high temperature cycle, so it still cannot effectively reduce the high temperature of the microprocessor.
• the technical content and methods disclosed by the present invention have completely solved the bottlenecks encountered by known heat sinks, not only increasing the heat dissipation area, but also exhausting the high temperature accumulated around the microprocessor outside the housing or lowering the room temperature outside the housing. Introduce it to effectively lower the temperature.
• the length of the heat sink is extended to the main body casing, and a fan capable of transmitting airflow is used to set the fan therein, the air outside the main body casing is directly extracted or the high temperature exhausted from the casing is reduced by the difference between high and low temperatures. Due to the high temperature generated by the processor itself, the heat dissipation effect is better.
• the heat dissipation device of the central microprocessor of the portable computer of the present invention can also adopt other forms to promote the heat dissipation of the heat dissipation device.
• the keyboard and the LCD screen described in this case may also be removed, and the cold air blown by the fan toward the central processing unit does not have to be blown from the bottom to the top, but may also be blown from the top to the bottom. Or from left to right.
• the orientation of the computer will be fixed, and the direction of the fan blowing will only be able to extract the cold air below to the microprocessor.
• the computer can be arbitrarily arranged.
• the fan can extract cold air from different directions and place it in the central processor to achieve heat dissipation.
• the fan is directly attached to any side of the heat sink and the housing of the host, so that the fan can Straight Connect the cold air outside the main casing to the radiator for the microprocessor to quickly dissipate heat.
• the fan may be disposed on either side of the host casing, so that the cold air of the fan may be directly on the radiator from the outside of the host casing for the microprocessor to quickly dissipate heat.
• the heat sink used in the heat sink can be the heat sink described in Embodiments 2, 3, 4, and 5, and the fan is disposed on the open surface on one side of the heat sink.
• the heat dissipation device described in 6, 7, and 8 may be adopted.
• the heat dissipation device of the central processing unit of the portable computer of the present invention and the heat sink and the heat sink used in the heat dissipation device can effectively increase the heat dissipation area and more easily pull off the high temperature to achieve better heat dissipation effect.
• the radiating fins and heat sinks designed by the present invention can also be used as heat radiating devices of other heating electrical components, and at the same time, they can receive very ideal heat radiating effects.

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• Engineering & Computer Science (AREA)
• Theoretical Computer Science (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Human Computer Interaction (AREA)
• General Engineering & Computer Science (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Cooling Or The Like Of Electrical Apparatus (AREA)

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• 2000
  • 2000-06-09 KR KR1020017015956A patent/KR100561328B1/ko not_active IP Right Cessation
  • 2000-06-09 AU AU52052/00A patent/AU5205200A/en not_active Abandoned
  • 2000-06-09 US US09/926,473 patent/US6570760B1/en not_active Expired - Fee Related
  • 2000-06-09 WO PCT/CN2000/000150 patent/WO2000077601A1/zh active IP Right Grant
  • 2000-06-09 JP JP2001503594A patent/JP2003502749A/ja active Pending
  • 2000-06-09 EP EP00936595A patent/EP1239359A4/de not_active Withdrawn

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