WO2021115005A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2021115005A1
WO2021115005A1 PCT/CN2020/128054 CN2020128054W WO2021115005A1 WO 2021115005 A1 WO2021115005 A1 WO 2021115005A1 CN 2020128054 W CN2020128054 W CN 2020128054W WO 2021115005 A1 WO2021115005 A1 WO 2021115005A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
electronic device
air outlet
housing
air
Prior art date
Application number
PCT/CN2020/128054
Other languages
English (en)
French (fr)
Inventor
杨庆志
杨峻
黄华
Original Assignee
荣耀终端有限公司
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Filing date
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Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Publication of WO2021115005A1 publication Critical patent/WO2021115005A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures

Definitions

  • This application relates to the field of electronic technology, and in particular to an electronic device.
  • the processor of the existing electronic device is installed on the internal motherboard, and generates high heat quickly when it is running to generate functions. As the speed and processing capacity increase, the heat is generated more quickly, so the electronic device needs to quickly dissipate heat.
  • the current heat dissipation effect of electronic equipment is poor and needs to be improved. Therefore, how to improve the heat dissipation technology is a problem that needs to be solved currently.
  • the purpose of this application is to provide an electronic device that can improve the heat dissipation effect.
  • This application provides an electronic device, including: a display end and a system end, the system end including:
  • the housing including the cavity
  • the heat dissipation component is accommodated in the cavity;
  • the heat dissipation component includes a body, a heat sink, and an axial fan; the body is connected to the cavity, and the heat sink and the axial fan are both connected to the body ;
  • the housing is provided with an air outlet, and the air outlet direction of the air outlet is consistent with the thickness direction of the system end.
  • the axial flow fan pushes the air to flow in the thickness direction of the system end, and the air outlet direction of the air outlet on the shell is consistent with the thickness direction of the system end, so the axial flow fan pushes the air to the air outlet Flow in the direction and discharge through the air outlet. Not only the exhaust efficiency is high, but also the wind flow is large, which improves the heat dissipation effect of the electronic equipment.
  • the position of the air outlet corresponds to the heat dissipation component.
  • the air outlet is arranged corresponding to the heat dissipation component, the air outlet distance can be shortened, and the hot air inside the housing can be quickly discharged through the air outlet.
  • an air inlet is provided on the housing, and the air inlet direction of the air inlet is consistent with the thickness direction of the system end.
  • the air outlet and the air inlet are consistent with the thickness direction of the system end, the air outlet and the air inlet can be arranged diagonally, which prolongs the time of air inside the housing and improves the heat dissipation efficiency.
  • the housing includes a first housing and a second housing that are arranged oppositely;
  • the air outlet is provided in the first housing
  • the air inlet is arranged on the second housing.
  • the air outlet and the air inlet are located on the two oppositely arranged shells on the shell, and are not arranged on the left and right sides of the shell, not only the air outlet is not easily blocked, but also does not occupy the design space of other components.
  • the air inlet includes a plurality of air inlets
  • the air outlet includes a plurality of air outlets
  • the heat dissipation assembly includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged along a length direction or a width direction of the system end, and a heat dissipation channel is formed between adjacent heat dissipation fins.
  • the arrangement of the heat dissipation channel can facilitate the circulation of air.
  • the hot air inside the housing flows to the axial fan through the heat dissipation channel, and the hot air is pushed to flow toward the air outlet by the axial fan, and finally discharged through the air outlet.
  • a plurality of the heat sinks are arranged to form a middle accommodating space, and the axial flow fan is arranged in the middle accommodating space.
  • the middle accommodating space formed by multiple radiating fins is equivalent to the frame and can accommodate the axial fan. Therefore, placing the axial fan in the middle accommodating space can not only better take away the heat of the radiator fins, but also reduce the volume of the heat sink assembly , Which is conducive to the lightness and thinness of the whole electronic equipment.
  • the heat dissipating assembly further includes a driving component, and the driving component is connected to the body;
  • the driving component includes a driving shaft, which is connected to the axial flow fan and is used to drive the axial flow fan to rotate.
  • the axial flow fan is driven to rotate through the setting of the drive shaft, which has the advantages of simple structure and convenient use.
  • the axial flow fan includes a hub and blades, and the blades are connected to a peripheral side of the hub;
  • the drive shaft is connected to the hub.
  • the blade is fixedly connected with the hub, and the hub is driven to rotate through the drive shaft, thereby driving the blade to rotate, which has the advantage of simple structure.
  • the position of the air outlet corresponds to the blades, and the blades push air to flow in the same direction as the axis of the axial flow fan, which enables the air to be discharged from the air outlet at the shortest distance, further improving the heat dissipation efficiency.
  • the driving component further includes a main body, and the main body is detachably connected to the main body;
  • the drive shaft is connected to the main body part.
  • a charging wire is connected to the driving component, and the charging wire includes a plurality of wires;
  • a plurality of the wires are respectively placed in each of the heat dissipation channels.
  • the wires are distributed in the heat dissipation channel to avoid the space occupied by the wires, thereby reducing the volume of the heat dissipation component.
  • a circuit board is further included, and the heat dissipation component is arranged on one or both sides of the circuit board.
  • the heat dissipation component is arranged on the side of the circuit board, which can facilitate heat dissipation of the circuit board and has high heat dissipation efficiency.
  • the number of the heat dissipation components is two, and the two heat dissipation components are arranged on both sides of the circuit board along the length direction of the system end.
  • the arrangement of the two heat dissipation components can improve the heat dissipation performance of the electronic device, reduce the system problems of the electronic device, and improve the user experience.
  • a keyboard is further included, and the heat dissipation component is arranged on one side of the keyboard.
  • the keyboard is arranged on the side close to the user, which is convenient for the user to operate the keyboard. At the same time, the heat dissipation component is far away from the user to prevent the hot air discharged from the air outlet from directly blowing on the user, which improves the user experience.
  • the electronic device is a notebook computer.
  • the electronic device provided by this application includes a display end and a system end.
  • the system end includes a heat dissipation component and a housing with a cavity, and the heat dissipation component is accommodated in the cavity; wherein the heat dissipation component includes a body, a heat sink, and an axial fan , And the axial flow fan pushes the air to flow in the same direction as the axis of the axial flow fan.
  • the axial flow fan Since the axial flow fan is installed in the cavity, the axial flow fan pushes the air to flow in the thickness direction of the system end; at the same time, the air outlet on the shell
  • the wind direction is consistent with the thickness direction of the system end, so the direction in which the axial flow fan pushes the air flow is the same as the direction of the air outlet, which is convenient for the axial flow fan to push the air to the direction of the air outlet and discharge it through the air outlet.
  • the exhaust efficiency is high, but also the wind flow is large, which improves the heat dissipation effect of the electronic equipment.
  • FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the application.
  • FIG. 2 is an exploded view of a housing of an electronic device provided by an embodiment of the application
  • FIG. 3 is an internal structure diagram of an electronic device provided by an embodiment of the application.
  • FIG. 4 is a main cross-sectional view of a partial structure of an electronic device provided by an embodiment of the application.
  • FIG. 5 is a schematic structural diagram of a heat dissipation component of an electronic device provided by an embodiment of the application.
  • Fig. 6 is a bottom view of an electronic device provided by an embodiment of the application.
  • FIG. 7 is an exploded view of a heat dissipation component of an electronic device provided by an embodiment of the application.
  • FIG. 8 is a schematic structural diagram of a driving component of an electronic device provided by an embodiment of the application.
  • FIG. 9 is a schematic structural diagram of a charging cable of an electronic device provided by an embodiment of the application.
  • FIG. 10 is a top view of a heat dissipation component of an electronic device provided by an embodiment of the application.
  • an embodiment of the present application provides an electronic device 100, which may be a notebook computer or other electronic products.
  • the electronic device 100 may include a display terminal 20 and a system terminal 10.
  • the display terminal 20 may be connected to the system terminal 10 through a shaft 30.
  • the display terminal 20 includes a display screen for displaying the video output from the system terminal 10.
  • the signal is converted into an image.
  • the system end 10 includes a housing 1, and the housing 1 is used for accommodating and installing components of the system end 10.
  • the heat dissipation of existing electronic equipment is divided into passive heat dissipation and active heat dissipation.
  • Passive heat dissipation is fan-free heat dissipation.
  • the heat conduction and heat radiation are used for natural heat dissipation.
  • the whole machine does not need to be designed with special air inlet and outlet for heat dissipation, but the power consumption of the whole machine needs to be controlled, and the performance of the whole machine will not be very good. , Affect the user experience.
  • Active heat dissipation uses heat pipes to conduct heat from high power consumption devices to the heat sink, and the heat dissipation fan blows the heat sink to dissipate the heat.
  • a centrifugal fan is used as a cooling fan, and the air is taken out from the side of the electronic device under the action of the centrifugal fan, so an air outlet is provided on the side of the electronic device.
  • a light for adding cool effects is usually provided on the side of the electronic device, and the setting of the air outlet will affect the design space of such a light, for example.
  • opening and closing operations on the display end, or other operations may also block the air outlet and affect the heat dissipation effect of the electronic device.
  • the housing 1 includes a cavity 11, and the system end 10 also includes a heat dissipation assembly 2.
  • the heat dissipation assembly 2 is accommodated in the cavity 11.
  • the heat dissipation assembly 2 is mainly arranged to improve the heat dissipation of the electronic device 100. Performance, reduce system problems of the electronic device 100, and improve user experience.
  • the system end 10 may also include a circuit board 3, a keyboard 4, and a touchpad 5.
  • the housing 1 may also be provided with a mounting portion 14.
  • the keyboard 4 is mounted on the mounting portion 14, and the circuit board 3 is accommodated in In the cavity 11, the touch panel 5 is connected to the housing 1, which will be described in detail below.
  • the heat dissipation assembly 2 includes a body 21, a heat sink 22 and an axial fan 23.
  • the body 21 is connected to the cavity 11, and the heat sink 22 and the axial fan 23 are both connected to the body 21.
  • the sheet 22 is integrally formed with the main body 21 to facilitate the processing of the heat dissipation assembly 2.
  • the axial flow fan 23 pushes the air to flow in the same direction as the axis of the axial flow fan 23. Since the axial flow fan 23 is installed in the cavity 11, the axial flow fan 23 pushes the air in the thickness direction of the system end 10 (H) Flow, so that the direction of the wind can be roughly perpendicular to the use plane of the electronic device 100.
  • the housing 1 is provided with an air outlet 121, and the air outlet direction of the air outlet 121 is consistent with the thickness direction (H) of the system end 10.
  • the air outlet direction of the air outlet 121 on the housing 1 is the same as the direction in which the axial fan 23 pushes the air to flow, the axial fan 23 pushes the air to flow in the direction of the air outlet 121 and is discharged through the air outlet 121, so the air output can be shortened Distance to improve exhaust efficiency. Since the axial fan 23 is arranged in the cavity 11, driven by the low speed of the axial fan 23, the hot air inside the cavity 11 can also be quickly discharged, and the air flow speed can also be increased. It runs at a rotating speed, so it has the advantage of low noise and can improve user experience.
  • the air outlet direction of the air outlet 121 on the housing 1 is the same as the direction in which the axial fan 23 pushes the air flow, there is no need to provide an air outlet on the side of the electronic device 100, which alleviates the problem that the side air is easily blocked. , It will not occupy the design space of other components, and a light for adding cool effects can be provided on the side of the electronic device, which provides convenient conditions for the miniaturization of the electronic device.
  • the position of the air outlet 121 corresponds to the heat dissipation assembly 2, so the air outlet distance can be shortened, and the hot air inside the housing 1 can be discharged through the air outlet 121 more quickly. Good heat dissipation effect.
  • the housing 1 is provided with an air inlet 131, and the air inlet direction of the air inlet 131 is consistent with the thickness direction (H) of the system end 10, so the air inlet 131 is not easily blocked , The air intake effect is good.
  • the setting of the air inlet 131 will not occupy the design space of other components, which provides convenient conditions for the miniaturization of the electronic device.
  • the location of the air inlet 131 can be as close as possible to the high power consumption components (such as circuit board 3, central processing unit and graphics card, etc.) inside the housing 1. After the air enters the housing 1, the high power consumption can also be removed. Part of the heat is taken away, and then discharged through the air outlet 121. Also, since the air inlet direction of the air inlet 131 and the air outlet direction of the air outlet 121 are consistent with the thickness direction (H) of the system end 10, the air outlet 121 and the air inlet 131 can be arranged diagonally, extending the air in the housing 1. Internal time to improve heat dissipation efficiency.
  • the housing 1 may include a first housing 12 and a second housing 13, the first housing 12 and the second housing 13 are opposed to each other, and the first housing An air outlet 121 is provided on the body 12 for exhaust air, and an air inlet 131 is provided on the second housing 13 for air intake.
  • the first shell 12 is equivalent to the upper shell of the shell 1
  • the second shell 13 is equivalent to the lower shell of the shell 1. Therefore, the air enters the inside of the shell 1 through the air inlet 131 of the lower shell, and it is opposite to the shell 1.
  • the internal parts are cooled, and then the hot air inside the casing 1 is discharged through the air outlet 121 of the upper casing.
  • the air outlet 121 may include a plurality of air outlet holes 121a, and the air inlet 131 may include a plurality of air inlet holes 131a. Since the diameters of the air outlet holes 121a and the air inlet holes 131a are relatively small, it is possible to prevent impurities from entering the inside of the housing 1. .
  • a bracket can be placed under the second housing 13 in the embodiment of the present application, so that a gap is formed between the second housing 13 and the workbench for placing electronic equipment, which can facilitate the air entering through the air inlet 131a and then through the air outlet 121a is discharged.
  • the heat dissipation assembly 2 may include a plurality of heat dissipation fins 22, and the plurality of heat dissipation fins 22 are arranged along the length direction (L) or the width direction (W) of the system end 10.
  • a heat dissipation channel 221 is formed between adjacent heat sinks 22.
  • a plurality of radiating fins 22 are arranged along the length direction (L) of the system end 10 for description, wherein a heat dissipation channel 221 is formed between any adjacent radiating fins 22 to facilitate the circulation of air.
  • the hot air inside the housing 1 flows to the axial fan 23 through the heat dissipation channel 221, and the axial fan 23 pushes the hot air to flow toward the air outlet 121, and is finally discharged through the air outlet 121.
  • a plurality of heat sinks 22 are arranged to form a middle accommodating space 24, and an axial fan 23 is disposed in the middle accommodating space 24.
  • the middle accommodating space 24 is equivalent to the frame of the axial flow fan 23, so arranging the axial flow fan 23 in the middle accommodating space 24 not only can better take away the heat of the heat sink 22, but also can reduce the volume of the heat dissipation assembly 2. It is conducive to the lightness and thinness of the whole electronic device 100.
  • the heat dissipation assembly 2 may further include a driving component 25, which is connected to the main body 21 (that is, the axial fan 23 is connected to the main body 21 through the driving component 25), and drives
  • the component 25 includes a drive shaft 252, which is connected to the axial flow fan 23, and the axial flow fan 23 is driven to rotate through the setting of the drive shaft 252, which has the advantages of simple structure and convenient use.
  • a motor can be used to drive the drive shaft 252 of the drive component 25 to rotate.
  • the drive component 25 can also be driven in other ways, which is not limited herein.
  • the axial fan 23 may include a hub 231 and blades 232, the blades 232 are connected to the peripheral side of the hub 231, and the drive shaft 252 is connected to the hub 231.
  • the blade 232 is fixedly connected with the hub 231, and the hub 231 is driven to rotate through the drive shaft 252, and then the blade 232 is driven to rotate by the rotation of the hub 231, which has the advantage of simple structure.
  • the position of the air outlet 121a corresponds to the blade 232, and the blade 232 pushes the air to flow in the same direction as the axis of the axial fan 23 (that is, the blade 232 pushes the air to flow upward), so the air outlet 121a and the blade 232 Correspondingly, the air can be discharged from the air outlet 121a in the shortest distance, and the heat dissipation efficiency can be further improved.
  • the driving component 25 may further include a main body 251, which may have a substantially disc-shaped structure, which is detachably connected to the main body 21 of the heat dissipation assembly 2, and the driving shaft 252 is connected to one side of the main body 251. Since the main body 251 is detachably connected to the main body 21, when the heat dissipation assembly 2 is damaged or other problems occur, it is convenient to disassemble the driving component 25. Among them, the main body 251 can be provided with a fixed leg 253 on the peripheral side, and the fixed leg 253 is provided with a first fixing hole 253a. Accordingly, the main body 21 is provided with a second fixing hole 211.
  • the driving component 25 When the driving component 25 is mounted on the main body 21, the first The fixing holes 253a and the second fixing holes 211 are correspondingly arranged, and the first locking member passes through the first fixing holes 253a and the second fixing holes 211 in sequence, and the driving part 25 is installed on the body 21 to avoid the driving part 25 from shaking during operation .
  • the driving part 25 may further include a charging wire 26, and the charging wire 26 is used to charge the driving part 25 so that the driving part 25 drives the axial fan 23 to rotate.
  • the driving part 25 can be configured as a motor.
  • the charging wire 26 includes a plurality of wires 261, a gap 262 exists between adjacent wires 261, and the plurality of wires 261 are respectively placed in each heat dissipation channel 221. After the heat dissipation assembly 2 is assembled, the wires 261 are distributed in the heat dissipation channel 221 to prevent the wires 261 from occupying space, thereby reducing the volume of the heat dissipation assembly 2.
  • a heat dissipation component 2 is provided on one or both sides of the circuit board 3.
  • the heat dissipating component 2 is arranged on the side of the circuit board 3 to facilitate heat dissipation of the circuit board 3 to prevent the electronic device 100 from overheating.
  • the embodiment of the present application takes two heat dissipation components 2 as an example for description.
  • the two heat dissipation components 2 are arranged on both sides of the circuit board 3 along the length direction (L) of the system end 10.
  • the arrangement of the two heat dissipation components 2 can improve the electronic
  • the heat dissipation performance of the device 100 reduces system problems of the electronic device 100 and improves user experience. It can be understood that, according to actual heat dissipation requirements, three or more heat dissipation components 2 may also be provided, which is not further limited herein.
  • the electronic device may also include a keyboard 4, and the heat dissipation component 2 is arranged on one side of the keyboard 4.
  • the heat dissipation component 2 is far away from the user to prevent the hot air discharged from the air outlet 121 from directly blowing on the user, which improves the user experience.
  • the electronic device may also include a touchpad 5.
  • the touchpad 5 may be arranged on the housing 1 between the two air outlets 121, or may be arranged on the keyboard 4 on the housing on the side away from the heat dissipation assembly 2. 1, can be set according to the needs of users.
  • the shell 1 of the embodiment of the present application can be made into a shell of unequal thickness, and the shell on the side of the heat dissipation component 2 can be made thick, which can facilitate the placement of the heat dissipation component 2 and also can set the components inside the shell On the side of the heat dissipation component 2, the shell on the side of the keyboard 4 can be made thin, which is beneficial to the overall lightness and thinness of the electronic device 100.
  • the housing 1 can gradually become thinner from the side of the heat dissipation assembly 2 to the side of the keyboard 4, or a step can be provided between the housing on the side of the heat dissipation assembly 2 and the housing on the side of the keyboard 4, so that The electronic device 100 as a whole becomes thin and light.
  • the main body 21 may also be provided with a third fixing hole 212, the main body 21 through the third fixing hole 212 through the second locking member, the main body 21 is fixed on the lower shell of the housing 1, due to the heat dissipation assembly 2 During the heat dissipation process, the axial fan 23 will run at a high speed, so the heat dissipation assembly 2 is fixed by the second locking member, which can prevent the heat dissipation assembly 2 from shaking.
  • the electronic device 100 provided by the embodiment of the present application includes a housing 1 and a heat dissipation assembly 2 arranged inside the housing 1.
  • the heat dissipation assembly 2 includes a body 21, a heat sink 22, and an axial fan 23, wherein the shaft
  • the flow fan 23 pushes the air to flow in the same direction as the axis of the axial flow fan 23. Since the axial flow fan 23 is installed in the cavity 11, the axial flow fan 23 pushes the air to flow in the thickness direction (H) of the system end 10.
  • the direction of the wind can be approximately perpendicular to the use plane of the electronic device 100.
  • the air outlet direction of the air outlet 121 provided on the housing 1 is consistent with the thickness direction (H) of the system end 10, the axial fan 23 pushes the air to flow in the direction of the air outlet 121 and is discharged through the air outlet 121. Since the air outlet direction of the air outlet 121 is consistent with the thickness direction, there is no need to provide an air outlet on the side of the electronic device 100, which alleviates the problem that the side air outlet is easily blocked, and the heat dissipation effect is good. The arrangement of the air outlet 121 also does not occupy the design space of other components, which provides convenient conditions for miniaturization of the electronic device.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种电子设备（100），例如笔记本电脑等。电子设备（100）包括显示端（20）和系统端（10），系统端（10）包括壳体（1）和散热组件（2），壳体（1）设置有用于容纳散热组件（2）的腔体（11），散热组件（2）包括本体（21）、散热片（22）和轴流风扇（23），其中，散热片（22）和轴流风扇（23）与本体（21）连接，本体（21）与腔体（11）连接；壳体（1）上还设置有出风口（121），出风口（121）的出风方向与系统端（10）的厚度方向一致。由于轴流风扇（23）能够推动空气以轴流风扇（23）的轴相同的方向流动，因此便于轴流风扇（23）推动空气向出风口（121）的方向流动，提升了电子设备（100）的散热效果。

Description

电子设备
本申请要求于2019年12月12日提交中国专利局、申请号为201911278194.0、发明名称为“电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子技术领域，尤其涉及一种电子设备。
背景技术
现有的电子设备的处理器设置在内部的主机板上，在运转产生功能时会迅速产生高热，随着速度与处理能力的提升，产热也更加快速，因此需要对电子设备快速散热。当前电子设备的散热效果差，需要提升，因此散热技术如何提升是目前需要解决的问题。
申请内容
本申请的目的在于提供了一种电子设备，能够提升散热效果。
本申请提供了一种电子设备，包括：显示端和系统端，所述系统端包括：
壳体，包括腔体；
散热组件，容纳于所述腔体；所述散热组件包括本体、散热片和轴流风扇；所述本体连接于所述腔体，所述散热片和所述轴流风扇均连接于所述本体；
所述壳体上设置有出风口，所述出风口的出风方向与所述系统端的厚度方向一致。
由于轴流风扇安装在腔体中，因此轴流风扇推动空气以系统端的厚度方向流动，同时壳体上的出风口的出风方向与系统端的厚度方向一致，因此轴流风扇推动空气向出风口方向流动，通过出风口排出。不仅排风效率高，而且风流大，提升了电子设备的散热效果。
在一种可能的实现方式中，所述出风口的位置对应于所述散热组件。
由于出风口与散热组件对应设置，因此能够缩短出风距离，快速的将壳体内部的热空气通过出风口排出。
在一种可能的实现方式中，所述壳体上设置有进风口，所述进风口的进风方向与所述系统端的厚度方向一致。
由于出风口和进风口均与系统端的厚度方向一致，因此出风和进风能够形成对角设置，延长空气在壳体内部的时间，提高散热效率。
在一种可能的实现方式中，所述壳体包括相对设置的第一壳体和第二壳体；
所述出风口设置于所述第一壳体；
所述进风口设置于所述第二壳体。
出风口和进风口位于壳体上相对设置的两个壳体上，均不设置在壳体的左右两侧，不仅出风口不容易被阻挡，而且不会占据其他部件的设计空间。
在一种可能的实现方式中，所述进风口包括多个进风孔，所述出风口包括多个出风孔。
由于进风孔和出风孔的直径比较小，因此能够防止杂质进入壳体内部。
在一种可能的实现方式中，所述散热组件包括多个所述散热片，多个所述散热片沿所述系统端的长度方向或宽度方向排列，相邻的散热片之间形成散热通道。
散热通道的设置能够方便空气的流通，壳体内部的热空气通过散热通道流向轴流风扇，并通过轴流风扇推动热空气向出风口方向流动，最终通过出风口排出。
在一种可能的实现方式中，多个所述散热片排列形成中部容纳空间，所述轴流风扇设置于所述中部容纳空间。
多个散热片形成的中部容纳空间相当于框架，能够容纳轴流风扇，因此将轴流风扇设置于中部容纳空间，不仅能够更好的带走散热片的热量，而且 能够减小散热组件的体积，有利于电子设备整机轻薄化。
在一种可能的实现方式中，所述散热组件还包括驱动部件，所述驱动部件连接于所述本体；
所述驱动部件包括驱动轴，所述驱动轴与所述轴流风扇连接，用于驱动所述轴流风扇转动。
通过驱动轴的设置驱动轴流风扇转动，具有结构简单，使用方便的优点。
在一种可能的实现方式中，所述轴流风扇包括轮毂和叶片，所述叶片连接于所述轮毂的周侧；
所述驱动轴连接于所述轮毂。
叶片与轮毂固定连接，通过驱动轴驱动轮毂转动，进而带动叶片转动，具有结构简单的优点。
在一种可能的实现方式中，出风孔的位置与叶片对应，叶片推动空气以轴流风扇的轴相同的方向流动，能够使空气以最短的距离从出风孔排出，进一步地提高散热效率。
在一种可能的实现方式中，所述驱动部件还包括主体部，所述主体部可拆卸地连接于所述本体；
所述驱动轴连接于所述主体部。
由于主体部与本体可拆卸的连接，因此当散热组件损坏或出现其他问题的时候，方便驱动部件的拆卸。
在一种可能的实现方式中，所述驱动部件连接有充电线，所述充电线包括多根导线；
多根所述导线分别放置于各所述散热通道。
散热组件组装完成后，导线分布于散热通道中，避免导线占用空间，从而减小散热组件的体积。
在一种可能的实现方式中，还包括电路板，所述散热组件设置于所述电路板的一侧或两侧。
散热组件设置在电路板的侧部，能够便于对电路板进行散热，且散热效率高。
在一种可能的实现方式中，所述散热组件的数量是两个，沿所述系统端的长度方向，两个所述散热组件设置于所述电路板的两侧。
两个散热组件的设置能够提高电子设备的散热性能，降低电子设备的系统问题，提升用户体验。
在一种可能的实现方式中，还包括键盘，所述散热组件设置于所述键盘的一侧。
键盘设置于靠近使用者的一侧，方便使用者操作键盘，同时散热组件远离使用者，避免出风口排出的热风直接吹到使用者，改善了用户体验。
在一种可能的实现方式中，所述电子设备为笔记本电脑。
本申请提供的技术方案可以达到以下有益效果：
本申请所提供的电子设备包括显示端和系统端，所述系统端包括散热组件和带有腔体的壳体，且散热组件容纳于腔体；其中散热组件包括本体、散热片和轴流风扇，且轴流风扇推动空气以轴流风扇的轴相同的方向流动，由于轴流风扇安装在腔体中，因此轴流风扇推动空气以系统端的厚度方向流动；同时壳体上的出风口的出风方向与系统端的厚度方向一致，因此轴流风扇推动空气流动的方向与出风口的出风方向相同，便于轴流风扇推动空气向出风口方向流动，并通过出风口排出。不仅排风效率高，而且风流大，提升了电子设备的散热效果。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性的，并不能限制本申请。
附图说明
图1为本申请实施例提供的电子设备的结构示意图；
图2为本申请实施例提供的电子设备的壳体的爆炸图；
图3为本申请实施例提供的电子设备的内部结构图；
图4为本申请实施例提供的电子设备的局部结构的主剖视图；
图5为本申请实施例提供的电子设备的散热组件的结构示意图；
图6为本申请实施例提供的电子设备的仰视图；
图7为本申请实施例提供的电子设备的散热组件的爆炸图；
图8为本申请实施例提供的电子设备的驱动部件的结构示意图；
图9为本申请实施例提供的电子设备的充电线的结构示意图；
图10为本申请实施例提供的电子设备的散热组件的俯视图。
附图标记：
100-电子设备；
10-系统端；
1-壳体；
11-腔体；
12-第一壳体；
121-出风口；
121a-出风孔；
13-第二壳体；
131-进风口；
131a-进风孔；
14-安装部；
2-散热组件；
21-本体；
211-第二固定孔；
212-第三固定孔；
22-散热片；
221-散热通道；
23-轴流风扇；
231-轮毂；
232-叶片；
24-中部容纳空间；
25-驱动部件；
251-主体部；
252-驱动轴；
253-固定支脚；
253a-第一固定孔；
26-充电线；
261-导线；
262-间隙；
3-电路板；
4-键盘；
5-触摸板；
20-显示端；
30-转轴。
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本申请的实施例，并与说明书一起用于解释本申请的原理。
具体实施方式
为了更好的理解本申请的技术方案，下面结合附图对本申请实施例进行详细描述。
在本申请实施例中使用的术语是仅仅出于描述特定实施例的目的，而非旨在限制本申请。在本申请实施例和所附权利要求书中所使用的单数形式的“一种”、“所述”和“该”也旨在包括多数形式，除非上下文清楚地表示其他含义。
应当理解，本文中使用的术语“和/或”仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系。
需要注意的是，本申请实施例所描述的“上”、“下”、“左”、“右”等方位词是以附图所示的角度来进行描述的，不应理解为对本申请实施例的限定。此外，在上下文中，还需要理解的是，当提到一个元件连接在另一个 元件“上”或者“下”时，其不仅能够直接连接在另一个元件“上”或者“下”，也可以通过中间元件间接连接在另一个元件“上”或者“下”。
在一种具体实施例中，下面通过具体的实施例并结合附图对本申请做进一步的详细描述。
如图1所示，本申请实施例提供了一种电子设备100，该电子设备100可以是笔记本电脑或其他电子产品。以笔记本电脑为例，电子设备100可以包括显示端20和系统端10，显示端20可以与系统端10通过转轴30连接，其中，显示端20包括显示屏，用于将系统端10输出的视频信号转化为图像。其中，系统端10包括壳体1，壳体1用于容纳和安装系统端10的零部件。
目前，现有的电子设备的散热分为被动散热和主动散热。被动散热也就是无风扇散热，利用热传导和热辐射进行自然散热，整机不需要有散热专用的进风口和出风口的设计，但整机的功耗需要控制，整机的性能不会很好，影响用户体验。主动散热是利用热管将高功耗器件的热量导到散热片上，散热风扇通过吹散热片从而将热量散出。通常散热风扇采用离心风扇，在离心风扇的作用下，将气体从电子设备的侧面带出，因此在电子设备的侧面设置有出风口。对于一些主要功能为游戏的电子设备，通常在电子设备的侧面设置有用于增加酷炫效果的灯，而出风口的设置会影响例如这种灯的设计空间。而且在使用过程中，对显示端进行打开和闭合的操作，或者其他的操作也会对出风口造成遮挡，影响电子设备的散热效果。如图1至图3所示，壳体1包括腔体11，系统端10还包括散热组件2，该散热组件2容纳于腔体11，散热组件2的设置主要是为了提高电子设备100的散热性能，降低电子设备100的系统问题，提升用户体验。
如图2和图3所示，系统端10还可以包括电路板3、键盘4和触摸板5，壳体1还可以设置有安装部14，键盘4安装于安装部14，电路板3容纳于腔体11内，触摸板5与壳体1连接，下文会具体描述。
如图4和图5所示，散热组件2包括本体21、散热片22和轴流风扇23，本体 21连接于腔体11，散热片22和轴流风扇23均连接于本体21，其中，散热片22与本体21一体成型，方便散热组件2的加工。
其中，轴流风扇23推动空气以与轴流风扇23的轴相同的方向流动，由于轴流风扇23安装在腔体11中，因此轴流风扇23推动空气以系统端10的厚度方向(H)流动，这样能够使出风方向可以大致地垂直于电子设备100的使用平面。
如图2所示，壳体1上设置有出风口121，出风口121的出风方向与系统端10的厚度方向(H)一致。
由于壳体1上的出风口121的出风方向与轴流风扇23推动空气流动的方向相同，使轴流风扇23推动空气向出风口121方向流动并通过出风口121排出，因此能够缩短出风距离，提高排风效率。由于轴流风扇23设置在腔体11中，在轴流风扇23低转速的带动下，也能够将腔体11内部的热空气快速排出，还能够提升风流速度，又由于轴流风扇23可以低转速运行，因此具有噪音小的优点，能够提升用户体验。
另外，由于壳体1上的出风口121的出风方向与轴流风扇23推动空气流动的方向相同，可以不用在电子设备100的侧面设置出风口，缓解了侧部出风易被阻挡的问题，也不会占据其他部件的设计空间，可以在电子设备的侧面设置有用于增加酷炫效果的灯，为电子设备小型化提供了便利条件。
参照图2，在一种具体的实现方式中，出风口121的位置对应于散热组件2设置，因此能够缩短出风距离，能够更快的将壳体1内部的热空气通过出风口121排出，散热效果好。
参照图6，在一种具体的实现方式中，壳体1上设置有进风口131，进风口131的进风方向与系统端10的厚度方向(H)一致，因此进风口131不容易被阻挡，进风效果好。进风口131的设置也不会占据其他部件的设计空间，为电子设备的小型化提供了便利条件。
参照图2和图6，进风口131的位置可以尽量靠近壳体1内部高功耗器件(例 如电路板3、中央处理器和显卡等)，空气进入壳体1后也能将高功耗的部分热量带走，然后通过出风口121排出。又由于进风口131的进风方向和出风口121的出风方向均与系统端10的厚度方向(H)一致，因此出风口121和进风口131能够形成对角设置，延长空气在壳体1内部的时间，提高散热效率。
参照图4和图6，在一种具体的实施方式中，壳体1可以包括第一壳体12和第二壳体13，第一壳体12和第二壳体13相对设置，第一壳体12上设置有出风口121，用于排风，第二壳体13上设置有进风口131，用于进风。第一壳体12相当于壳体1的上壳体，第二壳体13相当于壳体1的下壳体，因此空气通过下壳体的进风口131进入壳体1内部，对壳体1内部的零件进行降温，然后壳体1内部的热空气通过上壳体的出风口121排出。
其中，出风口121可以包括多个出风孔121a，进风口131可以包括多个进风孔131a，由于出风孔121a和进风孔131a的直径比较小，因此能够防止杂质进入壳体1内部。
本申请实施例的第二壳体13下方可以放置支架，使第二壳体13与用于放置电子设备的工作台之间形成间隙，能够方便空气从进风孔131a进入，再通过出风孔121a排出。
参照图4和图5，在一种具体的实现方式中，散热组件2可以包括多个散热片22，多个散热片22沿系统端10的长度方向(L)或宽度方向(W)排列，相邻的散热片22之间形成散热通道221。
本申请实施例以多个散热片22沿系统端10的长度方向(L)排列进行说明，其中，任意相邻的散热片22之间形成散热通道221，能够方便空气的流通。壳体1内部的热空气通过散热通道221流向轴流风扇23，并通过轴流风扇23推动热空气向出风口121方向流动，最终通过出风口121排出。
参照图5，在一种具体的实现方式中，多个散热片22排列形成中部容纳空间24，轴流风扇23设置于中部容纳空间24。中部容纳空间24相当于轴流风扇23的框架，因此将轴流风扇23设置于中部容纳空间24，不仅能够更好的带走 散热片22的热量，而且能够减小散热组件2的体积，有利于电子设备100整机轻薄化。
参照图7和图8，在一种具体的实现方式中，散热组件2还可以包括驱动部件25，驱动部件25连接于本体21(即轴流风扇23通过驱动部件25与本体21连接)，驱动部件25包括驱动轴252，驱动轴252与轴流风扇23连接，通过驱动轴252的设置驱动轴流风扇23转动，具有结构简单，使用方便的优点。
在一种具体的实施方式中，可以利用电机驱动该驱动部件25的驱动轴252转动，当然，也可以通过其他方式驱动上述驱动部件25，在此不作限定。
在一种具体的实施方式中，轴流风扇23可以包括轮毂231和叶片232，叶片232连接于轮毂231的周侧，驱动轴252连接于轮毂231。叶片232与轮毂231固定连接，通过驱动轴252驱动轮毂231转动，进而通过轮毂231的转动带动叶片232转动，具有结构简单的优点。其中，参考图2，出风孔121a的位置与叶片232对应，叶片232推动空气以轴流风扇23的轴相同的方向流动(即叶片232推动空气向上流动)，因此出风孔121a与叶片232对应，能够使空气以最短的距离从出风孔121a排出，进一步地提高散热效率。
驱动部件25还可以包括主体部251，主体部251可以是大致圆盘状的结构，其可拆卸地连接于散热组件2的本体21，驱动轴252连接于主体部251的一侧。由于主体部251与本体21可拆卸地连接，因此，当散热组件2损坏或出现其他问题的时候，方便驱动部件25的拆卸。其中，主体部251周侧可以设置有固定支脚253，固定支脚253设置有第一固定孔253a，相应地，本体21设置第二固定孔211，当驱动部件25安装于本体21上时，第一固定孔253a和第二固定孔211对应设置，第一锁紧件依次穿过第一固定孔253a和第二固定孔211，将驱动部件25安装在本体21上，避免驱动部件25在运行时晃动。
参照图7和图9，驱动部件25还可以包括充电线26，充电线26用于给驱动部件25充电，从而使驱动部件25驱动轴流风扇23转动。一般情况下，驱动部件25可以设置为电机。
充电线26包括多根导线261，相邻的导线261之间存在间隙262，且多根导线261分别放置于各散热通道221。散热组件2组装完成后，导线261分布于散热通道221中，避免导线261占用空间，从而减小散热组件2的体积。
参照图3，为了合理的利用空间，电路板3的一侧或两侧设置有散热组件2。散热组件2设置在电路板3的侧部，能够便于对电路板3进行散热，以防止电子设备100过热。
本申请实施例以散热组件2设置两个为例进行说明，两个散热组件2设置于电路板3沿系统端10的长度方向(L)的两侧，两个散热组件2的设置能够提高电子设备100的散热性能，降低电子设备100的系统问题，提升用户体验。可以理解的是，根据实际的散热需求，散热部件2还可以设置三个或更多个，在此不作进一步限定。
上文已述及，电子设备还可以包括键盘4，散热组件2设置于键盘4的一侧，本实施例中，键盘4设置于沿系统端10的宽度方向(W)的一侧使用时，键盘4靠近使用者，以方便操作使用者操作键盘4。散热组件2远离使用者，避免出风口121排出的热风直接吹到使用者，改善了用户体验。
上文已述及，电子设备还可以包括触摸板5，触摸板5可以设置在两个出风口121之间的壳体1上，也可以设置在键盘4上远离散热组件2一侧的壳体1上，可根据使用者的需求而设定。
本申请实施例的壳体1可以做成不等厚的壳体，位于散热组件2一侧的壳体可做厚，能够方便散热组件2的放置，同时还可以将壳体1内部的器件设置在散热组件2的一侧，位于键盘4一侧的壳体可以做薄，因此有利于电子设备100的整体轻薄化。
其中，壳体1可以从散热组件2的一侧到键盘4的一侧逐渐变薄，也可以在位于散热组件2一侧的壳体与位于键盘4一侧的壳体之间设置台阶，使电子设备100整体变得轻薄。
参照图10，本体21上还可以设置有第三固定孔212，本体21通过第二锁紧 件穿过第三固定孔212，将本体21固定在壳体1的下壳体上，由于散热组件2在散热的过程，轴流风扇23会高速运转，因此通过第二锁紧件将散热组件2固定，能够避免散热组件2晃动。
综上所述，本申请实施例提供的电子设备100，包括壳体1和设置于壳体1内部的散热组件2，散热组件2包括本体21、散热片22和轴流风扇23，其中，轴流风扇23推动空气以与轴流风扇23的轴相同的方向流动，由于轴流风扇23安装在腔体11中，因此轴流风扇23推动空气以系统端10的厚度方向(H)流动，这样能够使出风方向可以大致地垂直于电子设备100的使用平面。又由于壳体1上设置的出风口121的出风方向与系统端10的厚度方向(H)一致，因此轴流风扇23推动空气向出风口121方向流动，通过出风口121排出。由于出风口121的出风方向与厚度方向一致，可以不用在电子设备100的侧面设置出风口，缓解了侧部出风易被阻挡的问题，散热效果好。出风口121的设置也不会占据其他部件的设计空间，为电子设备的小型化提供了便利条件。
以上所述仅为本申请的优选实施例而已，并不用于限制本申请，对于本领域的技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (15)

  1. 一种电子设备(100)，包括：显示端(20)和系统端(10)，其特征在于，所述系统端(10)包括：
    壳体(1)，包括腔体(11)；
    散热组件(2)，容纳于所述腔体(11)；所述散热组件(2)包括本体(21)、散热片(22)和轴流风扇(23)；所述本体(21)连接于所述腔体(11)，所述散热片(22)和所述轴流风扇(23)均连接于所述本体(21)；
    所述壳体(1)上设置有出风口(121)，所述出风口(121)的出风方向与所述系统端(10)的厚度方向(H)一致。
  2. 根据权利要求1所述的电子设备(100)，其特征在于，所述出风口(121)的位置对应于所述散热组件(2)。
  3. 根据权利要求1所述的电子设备(100)，其特征在于，所述壳体(1)上设置有进风口(131)，所述进风口(131)的进风方向与所述系统端(10)的厚度方向(H)一致。
  4. 根据权利要求3所述的电子设备(100)，其特征在于，所述壳体(1)包括相对设置的第一壳体(12)和第二壳体(13)；
    所述出风口(121)设置于所述第一壳体(12)；
    所述进风口(131)设置于所述第二壳体(13)。
  5. 根据权利要求3或4所述的电子设备(100)，其特征在于，所述进风口(131)包括多个进风孔(131a)，所述出风口(121)包括多个出风孔(121a)。
  6. 根据权利要求1所述的电子设备(100)，其特征在于，所述散热组件(2)包括多个所述散热片(22)，多个所述散热片(22)沿所述系统端(10)的长度方向(L)或宽度方向(W)排列，相邻的散热片(22)之间形成散热通道(221)。
  7. 根据权利要求6所述的电子设备(100)，其特征在于，多个所述散热片(22)排列形成中部容纳空间(24)，所述轴流风扇(23)设置于所述中部容纳空间(24)。
  8. 根据权利要求6所述的电子设备(100)，其特征在于，所述散热组件(2)还包括驱动部件(25)，所述驱动部件(25)连接于所述本体(21)；
    所述驱动部件(25)包括驱动轴(252)，所述驱动轴(252)与所述轴流风扇(23)连接，用于驱动所述轴流风扇(23)转动。
  9. 根据权利要求8所述的电子设备(100)，其特征在于，所述轴流风扇(23)包括轮毂(231)和叶片(232)，所述叶片(232)连接于所述轮毂(231)的周侧；
    所述驱动轴(252)连接于所述轮毂(231)。
  10. 根据权利要求8所述的电子设备(100)，其特征在于，所述驱动部件(25)还包括主体部(251)，所述主体部(251)可拆卸地连接于所述本体(21)；
    所述驱动轴(252)连接于所述主体部(251)。
  11. 根据权利要求8所述的电子设备(100)，其特征在于，所述驱动部件(25)连接有充电线(26)，所述充电线(26)包括多根导线(261)；
    多根所述导线(261)分别放置于各所述散热通道(221)。
  12. 根据权利要求1所述的电子设备(100)，其特征在于，还包括电路板(3)，所述散热组件(2)设置于所述电路板(3)的一侧或两侧。
  13. 根据权利要求12所述的电子设备(100)，其特征在于，所述散热组件(2)的数量是两个，沿所述系统端(10)的长度方向(L)，两个所述散热组件(2)设置于所述电路板(3)的两侧。
  14. 根据权利要求1所述的电子设备(100)，其特征在于，还包括键盘(4)，所述散热组件(2)设置于所述键盘(4)的一侧。
  15. 根据权利要求1-14任一项所述的电子设备(100)，其特征在于，所 述电子设备(100)为笔记本电脑。
PCT/CN2020/128054 2019-12-12 2020-11-11 电子设备 WO2021115005A1 (zh)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113434021A (zh) * 2021-06-22 2021-09-24 深圳市盈嘉讯实业有限公司 显卡装置及电子设备
CN113784596A (zh) * 2021-09-26 2021-12-10 维沃移动通信有限公司 功能模组及电子设备
CN114485467A (zh) * 2022-01-26 2022-05-13 龙源（北京）风电工程技术有限公司 一种3d激光扫描设备的便携式背包
CN115268603A (zh) * 2022-07-22 2022-11-01 深圳市安卓微科技有限公司 一种迷你电脑主机
WO2024007660A1 (zh) * 2022-07-07 2024-01-11 荣耀终端有限公司 一种笔记本电脑

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113672063A (zh) * 2021-07-28 2021-11-19 荣耀终端有限公司 电子设备
CN113970960B (zh) * 2021-10-18 2022-10-14 荣耀终端有限公司 风扇及电子设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2483754Y (zh) * 2001-02-07 2002-03-27 神基科技股份有限公司 笔记本式电脑散热装置
CN1687598A (zh) * 2004-10-08 2005-10-26 郑文春 用于冷却计算机和电子系统的双向鼓风机
CN102137581A (zh) * 2010-01-21 2011-07-27 技嘉科技股份有限公司 双风扇散热装置
CN104679186A (zh) * 2013-12-02 2015-06-03 鸿富锦精密工业(武汉)有限公司 电子装置壳体
US20160334842A1 (en) * 2015-05-12 2016-11-17 Cooler Master Co., Ltd. Portable electronic device and detachable auxiliary heat-dissipating module thereof
JP2017228594A (ja) * 2016-06-20 2017-12-28 パナソニックＩｐマネジメント株式会社 電子機器
CN209471416U (zh) * 2018-12-29 2019-10-08 比亚迪股份有限公司 一种便携式计算机

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103458653A (zh) * 2012-06-04 2013-12-18 东莞永腾电子制品有限公司 散热装置
CN204129639U (zh) * 2014-10-24 2015-01-28 浪潮电子信息产业股份有限公司 一种高效降低板卡芯片温度的主动式风扇装置
CN206993588U (zh) * 2017-08-08 2018-02-09 安徽中天信息技术有限公司 散热装置及其显示屏
CN207424773U (zh) * 2017-10-20 2018-05-29 合肥惠科金扬科技有限公司 主板结构及主机

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2483754Y (zh) * 2001-02-07 2002-03-27 神基科技股份有限公司 笔记本式电脑散热装置
CN1687598A (zh) * 2004-10-08 2005-10-26 郑文春 用于冷却计算机和电子系统的双向鼓风机
CN102137581A (zh) * 2010-01-21 2011-07-27 技嘉科技股份有限公司 双风扇散热装置
CN104679186A (zh) * 2013-12-02 2015-06-03 鸿富锦精密工业(武汉)有限公司 电子装置壳体
US20160334842A1 (en) * 2015-05-12 2016-11-17 Cooler Master Co., Ltd. Portable electronic device and detachable auxiliary heat-dissipating module thereof
JP2017228594A (ja) * 2016-06-20 2017-12-28 パナソニックＩｐマネジメント株式会社 電子機器
CN209471416U (zh) * 2018-12-29 2019-10-08 比亚迪股份有限公司 一种便携式计算机

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113434021A (zh) * 2021-06-22 2021-09-24 深圳市盈嘉讯实业有限公司 显卡装置及电子设备
CN113434021B (zh) * 2021-06-22 2024-04-05 深圳市盈嘉讯实业有限公司 显卡装置及电子设备
CN113784596A (zh) * 2021-09-26 2021-12-10 维沃移动通信有限公司 功能模组及电子设备
CN113784596B (zh) * 2021-09-26 2024-01-30 维沃移动通信有限公司 功能模组及电子设备
CN114485467A (zh) * 2022-01-26 2022-05-13 龙源（北京）风电工程技术有限公司 一种3d激光扫描设备的便携式背包
CN114485467B (zh) * 2022-01-26 2024-05-28 龙源(北京)新能源工程技术有限公司 一种3d激光扫描设备的便携式背包
WO2024007660A1 (zh) * 2022-07-07 2024-01-11 荣耀终端有限公司 一种笔记本电脑
CN115268603A (zh) * 2022-07-22 2022-11-01 深圳市安卓微科技有限公司 一种迷你电脑主机

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