WO2000058761A1 - Film multicouche antireflechissant, composant optique, et systeme reduisant l'exposition a des projections - Google Patents
Film multicouche antireflechissant, composant optique, et systeme reduisant l'exposition a des projections Download PDFInfo
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- WO2000058761A1 WO2000058761A1 PCT/JP2000/001950 JP0001950W WO0058761A1 WO 2000058761 A1 WO2000058761 A1 WO 2000058761A1 JP 0001950 W JP0001950 W JP 0001950W WO 0058761 A1 WO0058761 A1 WO 0058761A1
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- index layer
- refractive index
- optical
- fluoride
- layer
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70566—Polarisation control
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/113—Anti-reflection coatings using inorganic layer materials only
- G02B1/115—Multilayers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70241—Optical aspects of refractive lens systems, i.e. comprising only refractive elements
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
- G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0276—Photolithographic processes using an anti-reflective coating
Definitions
- the present invention relates to a multilayer antireflection film, an optical member, and a reduction projection exposure apparatus, and more particularly, to a multilayer antireflection film for oblique incidence, which is effective for s-polarized light having a wavelength of 250 nm or less, such as excimer laser light.
- the present invention relates to an optical member including the multilayer antireflection film, and a reduction projection exposure apparatus including the optical member.
- lasers such as excimer lasers have been developed as light sources of ultraviolet light, and lasers are being used in optical devices utilizing ultraviolet light.
- the optical members used in the optical systems of these devices be usable for obliquely incident light, and the antireflection film of the optical member is obliquely incident. It is required to have an anti-reflection effect on the emitted light.
- Excimer laser light is generally linearly polarized light, and whether it enters the optical member as p-polarized light or s-polarized light depends on the arrangement of the optical member in the optical system. In other words, when the electric field vector of the wave of the incident light oscillates parallel to the incident surface of the optical member, it becomes p-polarized light, and when it oscillates perpendicular to the incident surface of the optical member. Becomes S-polarized light.
- the angle of incidence is the angle between the surface normal of the substrate and the incident light.
- the present invention has been made in view of the above-mentioned problems of the prior art, and has an excellent antireflection effect on s-polarized light having a wavelength of 250 nm or less, such as excimer laser light.
- An object of the present invention is to provide a multilayer antireflection film for oblique incidence, an optical member, and a reduced projection exposure apparatus that are effective in improving performance such as image performance.
- the present inventors have conducted intensive studies to achieve the above object, and as a result, have found that a multilayer anti-reflection film provided with a specific laminate, an optical member provided with the anti-reflection film, and a reduced projection provided with the optical member
- the inventors have found that the above problems can be solved by an exposure apparatus, and have completed the present invention.
- the multilayer antireflection film of the present invention is the multilayer antireflection film of the present invention.
- optical member of the present invention is optically identical to optical member of the present invention.
- a substrate capable of transmitting s-polarized light having a specific wavelength of 250 nm or less disposed on the substrate, at least one low refractive index layer and at least one And a high-refractive-index layer alternately laminated with the low-refractive-index layer. At least one of the outermost layers of the laminate on the side opposite to the substrate is a low-refractive-index layer.
- An exposure light source a photomask on which a pattern original image is formed, an irradiation optical system for irradiating the photomask with light output from the light source, and projecting a pattern image output from the photomask onto a photosensitive substrate
- An irradiation optical system for irradiating the photomask with light output from the light source, and projecting a pattern image output from the photomask onto a photosensitive substrate
- a projection optical system and an alignment system for aligning the photomask and the photosensitive substrate.
- At least one of the optical members constituting the light source, the illumination optical system, and the projection optical system is a substrate capable of transmitting s-polarized light having a specific wavelength of 250 nm or less, and is disposed on the substrate.
- a multilayer antireflection film laminate at least one low refractive index layer and at least one high refractive index layer are alternately laminated, and at least one of the outermost layers is a low refractive index layer.
- FIGS.1A and 1B are cross-sectional schematic views each showing an example of the multilayer antireflection film of the present invention formed on a substrate when the total number of low-refractive-index layers and high-refractive-index layers is an odd number and an even number, respectively.
- FIG. 1A is cross-sectional schematic views each showing an example of the multilayer antireflection film of the present invention formed on a substrate when the total number of low-refractive-index layers and high-refractive-index layers is an odd number and an even number, respectively.
- FIG. 2 is a schematic configuration diagram showing an example of the reduction projection exposure apparatus of the present invention.
- FIG. 3 is a schematic configuration diagram showing an example of a projection optical system using the optical member of the present invention.
- FIG. 4 is a graph showing the relationship between the reflectance and the incident angle for s-polarized light having a wavelength of 193 nm, obtained for the multilayer antireflection film of Example 1.
- FIG. 5 is a graph showing the relationship between the reflectance and the incident angle for s-polarized light having a wavelength of 193 mn, obtained for the multilayer antireflection film of Example 2.
- FIG. 6 is a graph showing the relationship between the reflectance and the incident angle for -s polarized light having a wavelength of 193 nm obtained for the multilayer antireflection film of Example 3.
- FIG. 7 is a graph showing the relationship between the reflectance and the incident angle for s-polarized light having a wavelength of 193 nm obtained for the multilayer antireflection film of Example 4.
- FIG. 8 is a graph showing the relationship between the reflectance and the incident angle for s-polarized light having a wavelength of 193 nm, obtained for the multilayer antireflection film of Example 5.
- FIG. 1A and 1B are schematic cross-sectional views each showing an example of the multilayer antireflection film of the present invention formed on a substrate, and FIG. 1A shows a low refractive index layer constituting the antireflection film and FIG.
- the total number (N) of the high refractive index layers is an odd number, and FIG. 1B is an even number.
- the multilayer antireflection film 10 of the present invention the low-refractive-index layers 12 and the high-refractive-index layers 13 are alternately laminated on the substrate 11 so that the side farthest from the substrate 11 becomes the low-refractive-index layer 12. Layer (alternate layers), and if the number of layers (N) is an odd number as shown in FIG.
- the low refractive index layer 12 is formed, and the number of layers (N) is an even number as shown in FIG. 1B
- the high refractive index layers 13 are arranged so as to be adjacent to the substrate 11, respectively.
- the low refractive index layer is a layer having a lower refractive index than the substrate
- the high refractive index layer is a layer having a higher refractive index than the substrate.
- the number of the low refractive index layers and the number (N H ) of the high refractive index layers have a relationship represented by the following equation.
- the low refractive index layer according to the present invention is made of magnesium fluoride, aluminum fluoride, sodium fluoride, lithium fluoride, calcium fluoride, barium fluoride, strontium fluoride, cryolite. It is preferable to include at least one compound selected from the group consisting of thiolite and silicon oxide.
- the form may be a mixture or a composite compound.
- a mixture of sodium fluoride and aluminum fluoride may be used, and sodium hexafluoroaluminate (Na 3 A form such as AlF 6 ) may be used.
- the material of each layer may be the same or different, but the optical thickness of each low refractive index layer (! ⁇ ) That is, the product of the physical thickness of the layer and the refractive index is substantially the same.
- the high refractive index layer comprises at least one selected from the group consisting of neodymium fluoride, lanthanum fluoride, gadolinium fluoride, dysprosium fluoride, yttrium fluoride, lead fluoride, aluminum oxide and hafnium oxide.
- Species Preferably, it contains a compound.
- the high refractive index layer contains two or more compounds, the form may be a mixture or a composite compound.
- the high refractive index layer contains lanthanum fluoride and neodymium fluoride, a mixture thereof may be used.
- the material of each layer may be the same or different, but the optical thickness of each high refractive index layer (n H d H That is, the product of the physical thickness of the layer and the refractive index shows substantially the same value as each other.
- the laminate according to the present invention has substantially the same optical film thickness (n H d H ) as the substantially same optical film thickness (i.e., the plurality of low refractive index layers 12 having ivy).
- the laminate has a sum of optical thicknesses of adjacent low refractive index layers 12 and high refractive index layers 13, that is, It has an optical periodic structure in which the period lengths (nd) are all substantially the same, where the refractive index of the low refractive index layer and the refractive index of the high refractive index layer are various, and n H and the physical film thickness are respectively:
- optical histological cycle length (nd) is the following formula:
- optical period length (nd) is:
- nd is less than the lower limit, the low reflection angle range tends to be on the low angle side, and if nd exceeds the upper limit, the low reflection angle region tends to be on the high angle side.
- ⁇ is outside the above range, a large number of layers are required to obtain the antireflection effect, and as a result, the absorption loss and scattering loss of light by the antireflection film tend to increase.
- the limit angle at which the antireflection effect can be obtained tends to be small (about 45 °), and if ⁇ exceeds the upper limit, a large number of layers is required to obtain the antireflection effect. As a result, the absorption loss and scattering loss of light by the antireflection film tend to increase. Note that ⁇
- the reflectance when s-polarized light having a wavelength of 250 nm or less is incident at any incident angle of 65 ° to 85 ° is preferably 1.0% or less, and 0.5% or less. % Is more preferable.
- the multilayer antireflection film of the present invention has a sufficient antireflection effect on s-polarized light even if it is composed of only the low refractive index layer 12 and the high refractive index layer 13 as shown in FIGS. 1A and 1B. If necessary, the non-existent layer that does not reduce the antireflection effect with respect to the central design wavelength (person) of the light source to be used and the incident angle of light, that is, the optical film thickness (nd) is 0.6 persons. nd ⁇ 0.7 people.
- the optical thickness (nd) of the absent layer is shown. This is because the optical thickness (nd) depends on the refractive index of the layer and the incident light. This is because it depends on the angle. Assuming that the refractive index of the layer with respect to human light is n ⁇ and the incident angle of light is 0, the optical thickness (nd) of the layer is given by the following formula:
- the durability (such as moisture resistance) of the multilayer antireflection film tends to be improved without reducing the antireflection effect. If the compatibility between the low-refractive-index layer and the high-refractive-index layer or the compatibility between the layer and the substrate is insufficient, disposing them between them prevents deterioration of the interface and peeling of the layer. Tend to be.
- the position where the absence layer is disposed is between the low-refractive-index layer 12 and the high-refractive-index layer 13, between the substrate 11 and the layer 12 or 13 in contact with the substrate 11, or on the farthest side from the substrate.
- the material of the non-existing layer includes silicon oxide (SiO 2 ), magnesium fluoride (MgF 2 ), calcium fluoride (CaF 2 ), barium fluoride (BaF 2 ), strontium fluoride (SrF 2 ), neodymium fluoride (NdF 3 ), lanthanum fluoride (LaF 3 ), gadolinium fluoride (GdF 3 ), disposable fluoride (DyF 3 ), yttrium fluoride (YF 3 ), aluminum oxide two ⁇ arm (A1 2 0 3), oxide Hough two ⁇ beam (HF0 2), and the like.
- the multilayer anti-reflection film of the present invention having the above-described laminated structure is formed from the above-mentioned materials by using a physical film forming method such as a conventionally known vacuum deposition method, a sputtering method, or an ion plating method;
- a physical film forming method such as a conventionally known vacuum deposition method, a sputtering method, or an ion plating method;
- Optical member with excellent anti-reflection effect against 250 nm s-polarized light by forming a film on the substrate of optical member such as lens, prism and plate by chemical film forming method such as Can be obtained.
- a multilayer antireflection film having the following laminated structure is given.
- the low refractive index layer is a magnesium fluoride (MgF 2 ) layer
- the high refractive index layer is a lanthanum fluoride (LaF 3 ) layer.
- the design center wavelength (human) is 193 nm
- the refractive indices of air, fluorite, MgF 2 and LaF 3 are 1.00, 1.50, 1.42 and 1.69, respectively.
- Ri optical film thickness (n H d H) are the same for each high refractive index layer (LaF 3 layers).
- ni A n H d H 2 0.323. Therefore, the optical period length (nd) is 0.646 mm.
- the ratio ⁇ of the optical film thickness of the high refractive index layer to the optical period length is 0.500.
- the low refractive index layer is an aluminum fluoride (A1F 3 ) layer
- the high refractive index layer is a neodymium fluoride (NdF 3 ) layer.
- the design center wavelength ( ⁇ ) is 193 nm.
- the refractive indexes of air, quartz glass, A1F 3 and NdF 3 are 1.00, 1.55, 1.39 and 1.72, respectively.
- the same optical film thickness of each low refractive index layer (A1F 3-layer), an optical film thickness of each high refractive index layer (NdF 3 layer) (n H d H) are identical.
- the optical period length (nd) is 0.635.
- the ratio ⁇ of the optical film thickness of the high refractive index layer to the optical period length is 0.328.
- a multilayer antireflection film having the following laminated structure.
- the optical film thickness (nd) as an absent layer is 0.650 on the low refractive index layer (A1F three layers) disposed farthest from the substrate (quartz glass). Except that Der Ru silicon oxide (Si0 2) layer is disposed is the same as in the second embodiment.
- a multilayer antireflection film having the following laminated structure.
- the low refractive index layer is a sodium hexafluoroaluminate (Na 3 AlF 6 ) layer
- the high refractive index layer is a lanthanum fluoride (LaF 3 ) layer.
- the design center wavelength (input) is 193 nm
- the refractive indexes of air, fluorite, Na 3 AlF 6 and LaF 3 are 1.00, 1.50, 1.35 and 1.69, respectively.
- the optical film thickness of each low refractive index layer (Na 3 AlF 6 layer) is the same, and the optical film thickness (n H d H ) of each high refractive index layer (LaF 3 layer) is the same.
- the optical period length (nd) is 0.658 mm.
- the ratio ⁇ of the optical film thickness of the high refractive index layer to the optical period length is 0.529.
- a multilayer antireflection film having the following laminated structure.
- the low refractive index layer is a magnesium fluoride (MgF 2 ) layer
- the high refractive index layer is a lanthanum fluoride (LaF 3 ) layer.
- the design center wavelength (input) is 193 nm
- the refractive indices of air, fluorite, MgF 2 and LaF 3 are 1.00, 1.52, 1.45 and 1.72, respectively.
- the optical film thickness () of each low refractive index layer (Na 3 AlF 6 layer) is the same, and the optical film thickness (n H d H ) of each high refractive index layer (LaF 3 layer) is the same. It is.
- the optical period length (nd) is 0.664.
- the ratio ⁇ of the optical film thickness of the high refractive index layer to the optical period length is 0.578.
- each of the low-refractive-index layers and each of the high-refractive-index layers are each formed of the same compound.
- durability, compatibility between the substrate and the film, etc. Of course, different materials may be used depending on the characteristics.
- multilayer antireflection film of the present invention is also applicable to shorter wavelength ultraviolet light in the F 2 laser beam or the like having excimer one laser light not only possess a wavelength of 157nm with a wavelength of 193nm .
- FIG. 2 is a schematic diagram showing the overall configuration of a reduction projection exposure apparatus having a catadioptric optical system.
- the Z axis is set parallel to the optical axis AX of the projection optical system 208
- the X axis is set parallel to the plane of FIG. 2 in the plane perpendicular to the optical axis AX
- the Y axis is set perpendicular to the plane of FIG. I have.
- the reduction projection exposure apparatus shown in FIG. 2 includes a light source 201 for supplying illumination light having a wavelength of 250 nm or less.
- the light source 201 monitors a front mirror (semi-transmissive) and a rear mirror for resonance, a wavelength selecting element (diffraction grating, prism, etalon, etc.) for narrowing a wavelength band, and monitors an absolute value of an oscillation wavelength.
- the light source 201 is filled with a mixed gas such as a rare gas halide or the like.
- KrF Kishimare one The (248 nm), ArF excimer one The (193nm), F 2 laser (157 nm) Hitoshigakyo is down.
- the light emitted from the light source 201 uniformly illuminates a photomask 203 on which a predetermined pattern is formed via an illumination optical system 202.
- the illumination optical system 202 includes, for example, a fly-eye lens or an internal reflection type integer gray light to form a surface light source having a predetermined size and shape, and an illumination area size on the photomask 203. It has an optical system such as a field stop for defining the shape and a field stop imaging optical system for projecting an image of the field stop onto a mask.
- the optical path between the light source 201 and the illumination optical system 202 is sealed by a casing 214, and the space from the light source 201 to the optical member closest to the mask in the illumination optical system 202 is the absorption rate of the exposure light. Has been replaced by a low inert gas.
- the photomask 203 is held on a mask stage 205 via a mask holder 204 in parallel with the XY plane.
- a pattern to be transferred is formed on the photomask 203, and a rectangular (slit-shaped) pattern area having a long side along the Y direction and a short side along the X direction in the entire pattern area. Is illuminated.
- the mask stage 205 is two-dimensionally movable along the mask plane (XY plane), and its position coordinates are measured and controlled by an interferometer 207 using a mask moving mirror 206. .
- Wafer 209 is held on wafer stage 211 via wafer holder 210 in parallel with the XY plane. Then, on the wafer 209, a rectangular exposure having a long side along the Y direction and a short side along the X direction so as to optically correspond to the rectangular illumination region on the photomask 203. A pattern image is formed in the area.
- the wafer stage 211 is two-dimensionally movable along the wafer surface (XY plane), and its position coordinates are measured by an interferometer 213 using a wafer moving mirror 212 and the position is controlled. ing.
- the inside of the projection optical system 208 is configured to be kept airtight, and the gas inside the projection optical system 208 is replaced with an inert gas.
- a photomask 203, a mask stage 205, and the like are disposed in a narrow optical path between the illumination optical system 202 and the projection optical system 208, and a casing 215 that hermetically surrounds the photomask 203, the mask stage 205, and the like.
- the inside is filled with inert gas.
- the wafer 209 In the narrow optical path between the projection optical system 208 and the wafer 209, the wafer 209, the wafer stage 211, and the like are arranged. Filled with inert gas such as gas.
- the viewing area (illumination area) on the photomask 203 and the projection area (exposure area) on the wafer 209 defined by the projection optical system 208 are rectangular with short sides along the X direction. . Therefore, while controlling the position of the photomask 203 and the wafer 209 using the drive system and the interferometers (207, 213), the mask stage 205 is moved along the short side direction of the rectangular exposure area and the illumination area, that is, along the X direction. And the wafer stage 211, and thus the photomask 203 and the wafer 209 are synchronously moved (scanned), so that the wafer 209 has a width equal to the long side of the exposure area and scans the wafer 209. The mask pattern is scanned and exposed in an area having a length corresponding to the amount (movement amount).
- the number of optical members constituting the light source, the irradiation optical system and the projection optical system is reduced. At least one is the optical member of the present invention. Also, using the optical member of the present invention having the multilayer anti-reflection film for S-polarized light and the optical member having the multilayer anti-reflection film for p-polarized light together enables optimization of the performance of the apparatus and downsizing. It is more preferable in this respect.
- FIG. 3 is a schematic diagram showing an example of a lens configuration of the projection optical system 208 according to FIG.
- the projection optical system 208 shown in FIG. 3 includes, in order from the reticle R side as the first object, a first lens group G1 having a positive power, a second lens group G2 having a positive power, and a second lens group G2 having a negative power. It has a third lens group G3, a fourth lens group G4 having a positive power, a fifth lens group G5 having a negative power, and a sixth lens group G6 having a positive power. It is almost telecentric on the reticle R side and on the image side (wafer side), and has a reduction ratio. N.A.
- this projection optical system is 0.6, and the projection magnification is 1.
- L45, L46, L63, L65, L666, and L67 are made of calcium fluoride single crystal for the purpose of correcting chromatic aberration, and quartz glass is used for lenses other than the six. Is used.
- the optical member of the present invention for at least one of the lenses constituting the lens groups G1 to G6.
- the optical member of the present invention having the multilayer antireflection film for s-polarized light in combination with the optical member having the antireflection film for p-polarized light.
- the reflectance for s-polarized light having a wavelength of 250 mn or less is obtained. Since the reduction is achieved, optimization of performance such as improvement in resolution is achieved, and the degree of freedom in designing the device is increased, so that the size of the device can be reduced.
- Example 1 the present invention will be described more specifically with reference to Examples, but the present invention is not limited to the following Examples.
- Example 1
- MgF 2 and LaF 3 were alternately heated and evaporated by a vacuum evaporation method to form a film on the fluorite substrate, thereby producing an optical member having a multilayer antireflection coating having the following laminated structure.
- the film forming conditions were as follows.
- the design center wavelength (person) was 193 nm
- the optical thickness (n ⁇ L) of each low refractive index layer (MgF two layers) was 0.323.
- the optical thickness (n H d H ) of each high refractive index layer (LaF 3 layer) was 0.323.
- the optical period length (nd) is 0.646.
- the ratio ⁇ of the optical film thickness of the high refractive index layer to the optical period length was set to 0.500.
- the A1F 3 and NdF 3 the material of the multilayer antireflection film, a quartz glass substrate, respectively
- An optical member having a multilayer antireflection film having the following laminated structure was prepared in the same manner as in Example 1 except that the number of layers was 6, and the optical film thickness of each layer was as follows. .
- the design center wavelength (human) is 193 nm
- the optical period length (nd) is 0.635.
- the ratio ⁇ of the optical film thickness of the high refractive index layer to the optical period length was set to 0.328.
- the design center wavelength (E.) is 193 nm
- the optical thickness (riLd :) of each low refractive index layer (A1F 3 layers) is 0.427.
- the optical period length (nd) is 0.635.
- the ratio ⁇ of the optical film thickness of the high refractive index layer to the optical period length was set to 0.328.
- Example 1 An optical member having a multilayer antireflection film having a laminated structure was manufactured.
- Substrate Fluorite In the multilayer antireflection film of this optical member, the design center wavelength (human) was 193 nm, and the optical thickness ⁇ of each low refractive index layer (Na 3 AlF 6 layer) was 0.310. The optical thickness (n H d H ) of each high refractive index layer (LaF 3 layer) was 0.348. The optical period length (nd) is 0.658. The ratio ⁇ of the optical film thickness of the high refractive index layer to the optical period length was set to 0.529.
- a multilayer antireflection film having the following laminated structure was provided in the same manner as in Example 1 except that the number of layers of the multilayer antireflection film was 10 and the optical thickness of each layer was as follows. An optical member was manufactured.
- the design center wavelength (E) was 193 nm, 0.280 person having an optical film thickness (Ivlj of each low refractive index layer (MgF 2 layers)., 0.384 people having an optical film thickness (n H d H) of each of the high refractive index layer (LaF 3 layers).
- Optical The period length (nd) was 0.664, and the ratio ⁇ of the optical film thickness of the high refractive index layer to the optical period length was 0.578.
- the multilayer antireflection film of the present invention on an optical member, the reflectance for s-polarized light having a wavelength of 250 nm or less is sufficiently reduced. Therefore, by using an optical member having such a multilayer anti-reflection film in an optical system of a reduction projection exposure apparatus, the degree of freedom in designing the apparatus is increased in terms of performance optimization and compactness.
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10080898T DE10080898T1 (de) | 1999-03-29 | 2000-03-29 | Mehrschicht-Antireflexionsfilm, optisches Element und Reduktionsprojektionsbelichtungsapparat |
US09/684,517 US6590702B1 (en) | 1999-03-29 | 2000-10-10 | Multilayer antireflection film, optical member, and reduction projection exposure apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8727599 | 1999-03-29 | ||
JP11/87275 | 1999-03-29 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/684,517 Continuation-In-Part US6590702B1 (en) | 1999-03-29 | 2000-10-10 | Multilayer antireflection film, optical member, and reduction projection exposure apparatus |
Publications (1)
Publication Number | Publication Date |
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WO2000058761A1 true WO2000058761A1 (fr) | 2000-10-05 |
Family
ID=13910232
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2000/001950 WO2000058761A1 (fr) | 1999-03-29 | 2000-03-29 | Film multicouche antireflechissant, composant optique, et systeme reduisant l'exposition a des projections |
Country Status (3)
Country | Link |
---|---|
US (1) | US6590702B1 (ja) |
DE (1) | DE10080898T1 (ja) |
WO (1) | WO2000058761A1 (ja) |
Cited By (9)
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WO2003009015A1 (fr) * | 2001-07-18 | 2003-01-30 | Nikon Corporation | Element optique comportant un film de fluorure de lanthane |
WO2004006310A1 (ja) * | 2002-07-09 | 2004-01-15 | Nikon Corporation | 露光装置 |
JP2004046079A (ja) * | 2002-05-22 | 2004-02-12 | Canon Inc | 反射防止膜、該反射防止膜を有する光学素子及び光学系 |
US6732546B1 (en) | 1999-08-12 | 2004-05-11 | Nikon Corporation | Product method of synthetic silica glass and thermal treatment apparatus |
JP2005136244A (ja) * | 2003-10-31 | 2005-05-26 | Semiconductor Leading Edge Technologies Inc | 露光方法 |
US7301695B2 (en) | 2004-06-16 | 2007-11-27 | Canon Kabushiki Kaisha | Anti-reflective film and optical element having anti-reflective film |
US7544619B2 (en) | 2005-09-29 | 2009-06-09 | Renesas Technology Corp. | Method of fabricating semiconductor device |
US8552443B2 (en) | 2009-02-20 | 2013-10-08 | Lg Innotek Co., Ltd. | Light emitting device, light emitting device package and lighting system including the same |
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DE10064143A1 (de) * | 2000-12-15 | 2002-06-20 | Zeiss Carl | Reflexionsminderungsbeschichtung für Ultraviolettlicht bei großen Einfallswinkeln |
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- 2000-03-29 WO PCT/JP2000/001950 patent/WO2000058761A1/ja active Application Filing
- 2000-03-29 DE DE10080898T patent/DE10080898T1/de not_active Ceased
- 2000-10-10 US US09/684,517 patent/US6590702B1/en not_active Expired - Fee Related
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JPS62127701A (ja) * | 1985-11-29 | 1987-06-10 | Toshiba Corp | 反射防止膜 |
US5963365A (en) * | 1996-06-10 | 1999-10-05 | Nikon Corporation | three layer anti-reflective coating for optical substrate |
JPH10253802A (ja) * | 1997-03-07 | 1998-09-25 | Nikon Corp | 反射防止膜 |
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US6732546B1 (en) | 1999-08-12 | 2004-05-11 | Nikon Corporation | Product method of synthetic silica glass and thermal treatment apparatus |
WO2003009015A1 (fr) * | 2001-07-18 | 2003-01-30 | Nikon Corporation | Element optique comportant un film de fluorure de lanthane |
US6809876B2 (en) | 2001-07-18 | 2004-10-26 | Nikon Corporation | Optical element equipped with lanthanum fluoride film |
JP2004046079A (ja) * | 2002-05-22 | 2004-02-12 | Canon Inc | 反射防止膜、該反射防止膜を有する光学素子及び光学系 |
WO2004006310A1 (ja) * | 2002-07-09 | 2004-01-15 | Nikon Corporation | 露光装置 |
JP2005136244A (ja) * | 2003-10-31 | 2005-05-26 | Semiconductor Leading Edge Technologies Inc | 露光方法 |
US7301695B2 (en) | 2004-06-16 | 2007-11-27 | Canon Kabushiki Kaisha | Anti-reflective film and optical element having anti-reflective film |
US7544619B2 (en) | 2005-09-29 | 2009-06-09 | Renesas Technology Corp. | Method of fabricating semiconductor device |
US7935636B2 (en) | 2005-09-29 | 2011-05-03 | Renesas Electronics Corporation | Method of fabricating semiconductor device |
US8552443B2 (en) | 2009-02-20 | 2013-10-08 | Lg Innotek Co., Ltd. | Light emitting device, light emitting device package and lighting system including the same |
JP2017054105A (ja) * | 2015-09-11 | 2017-03-16 | 旭硝子株式会社 | マスクブランク |
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US6590702B1 (en) | 2003-07-08 |
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