WO2000052236A1 - Plaquette de silicium - Google Patents
Plaquette de silicium Download PDFInfo
- Publication number
- WO2000052236A1 WO2000052236A1 PCT/JP2000/001125 JP0001125W WO0052236A1 WO 2000052236 A1 WO2000052236 A1 WO 2000052236A1 JP 0001125 W JP0001125 W JP 0001125W WO 0052236 A1 WO0052236 A1 WO 0052236A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- defect
- silicon
- wafer
- cavity
- silicon wafer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
- H01L21/3225—Thermally inducing defects using oxygen present in the silicon body for intrinsic gettering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/21—Circular sheet or circular blank
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000602843A JP3800960B2 (ja) | 1999-03-04 | 2000-02-25 | シリコンウエーハ |
EP00905368A EP1087042A4 (en) | 1999-03-04 | 2000-02-25 | SILICON PLATE |
US09/673,955 US6599603B1 (en) | 1999-03-04 | 2000-02-25 | Silicon wafer |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11057738A JP2000256092A (ja) | 1999-03-04 | 1999-03-04 | シリコンウエーハ |
JP11/57738 | 1999-03-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000052236A1 true WO2000052236A1 (fr) | 2000-09-08 |
Family
ID=13064267
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2000/001125 WO2000052236A1 (fr) | 1999-03-04 | 2000-02-25 | Plaquette de silicium |
Country Status (6)
Country | Link |
---|---|
US (1) | US6599603B1 (ja) |
EP (1) | EP1087042A4 (ja) |
JP (2) | JP2000256092A (ja) |
KR (1) | KR100688628B1 (ja) |
TW (1) | TW531575B (ja) |
WO (1) | WO2000052236A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003086597A (ja) * | 2001-09-14 | 2003-03-20 | Wacker Nsce Corp | シリコン半導体基板およびその製造方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4463957B2 (ja) * | 2000-09-20 | 2010-05-19 | 信越半導体株式会社 | シリコンウエーハの製造方法およびシリコンウエーハ |
JP4646440B2 (ja) * | 2001-05-28 | 2011-03-09 | 信越半導体株式会社 | 窒素ドープアニールウエーハの製造方法 |
JP4567251B2 (ja) * | 2001-09-14 | 2010-10-20 | シルトロニック・ジャパン株式会社 | シリコン半導体基板およびその製造方法 |
KR20030043387A (ko) * | 2001-11-28 | 2003-06-02 | 주식회사 실트론 | 단결정 실리콘 웨이퍼 제조 방법 |
DE10205084B4 (de) | 2002-02-07 | 2008-10-16 | Siltronic Ag | Verfahren zur thermischen Behandlung einer Siliciumscheibe sowie dadurch hergestellte Siliciumscheibe |
DE10336271B4 (de) | 2003-08-07 | 2008-02-07 | Siltronic Ag | Siliciumscheibe und Verfahren zu deren Herstellung |
DE102005013831B4 (de) | 2005-03-24 | 2008-10-16 | Siltronic Ag | Siliciumscheibe und Verfahren zur thermischen Behandlung einer Siliciumscheibe |
JP4908885B2 (ja) * | 2006-03-17 | 2012-04-04 | 株式会社豊田中央研究所 | 半導体装置の特性予測方法及び特性予測装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60251190A (ja) * | 1984-05-25 | 1985-12-11 | Shin Etsu Handotai Co Ltd | シリコン単結晶の製造方法 |
WO1999057344A1 (fr) * | 1998-05-01 | 1999-11-11 | Nippon Steel Corporation | Plaquette de semi-conducteur en silicium et son procede de fabrication |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5096839A (en) * | 1989-09-20 | 1992-03-17 | Kabushiki Kaisha Toshiba | Silicon wafer with defined interstitial oxygen concentration |
JP2874834B2 (ja) * | 1994-07-29 | 1999-03-24 | 三菱マテリアル株式会社 | シリコンウェーハのイントリンシックゲッタリング処理法 |
DE19637182A1 (de) * | 1996-09-12 | 1998-03-19 | Wacker Siltronic Halbleitermat | Verfahren zur Herstellung von Halbleiterscheiben aus Silicium mit geringer Defektdichte |
JPH10152395A (ja) * | 1996-11-21 | 1998-06-09 | Komatsu Electron Metals Co Ltd | シリコン単結晶の製造方法 |
JPH10154713A (ja) * | 1996-11-22 | 1998-06-09 | Shin Etsu Handotai Co Ltd | シリコンウエーハの熱処理方法およびシリコンウエーハ |
US6157444A (en) * | 1997-11-28 | 2000-12-05 | Hitachi, Ltd. | Defect inspection apparatus for silicon wafer |
JP3011178B2 (ja) * | 1998-01-06 | 2000-02-21 | 住友金属工業株式会社 | 半導体シリコンウェーハ並びにその製造方法と熱処理装置 |
TW508378B (en) * | 1998-03-09 | 2002-11-01 | Shinetsu Handotai Kk | A method for producing a silicon single crystal wafer and a silicon single crystal wafer |
-
1999
- 1999-03-04 JP JP11057738A patent/JP2000256092A/ja active Pending
-
2000
- 2000-02-25 KR KR1020007011856A patent/KR100688628B1/ko active IP Right Grant
- 2000-02-25 WO PCT/JP2000/001125 patent/WO2000052236A1/ja active IP Right Grant
- 2000-02-25 US US09/673,955 patent/US6599603B1/en not_active Expired - Lifetime
- 2000-02-25 EP EP00905368A patent/EP1087042A4/en not_active Withdrawn
- 2000-02-25 JP JP2000602843A patent/JP3800960B2/ja not_active Expired - Lifetime
- 2000-03-03 TW TW089103834A patent/TW531575B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60251190A (ja) * | 1984-05-25 | 1985-12-11 | Shin Etsu Handotai Co Ltd | シリコン単結晶の製造方法 |
WO1999057344A1 (fr) * | 1998-05-01 | 1999-11-11 | Nippon Steel Corporation | Plaquette de semi-conducteur en silicium et son procede de fabrication |
Non-Patent Citations (2)
Title |
---|
A. IKARI ET. AL: "Defect Control in Nitrogen Doped Czochralski Silicon Crystals.", SOLID STATE PHENOMENA, vol. 69-70, September 1999 (1999-09-01), pages 161 - 166, XP002928046 * |
See also references of EP1087042A4 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003086597A (ja) * | 2001-09-14 | 2003-03-20 | Wacker Nsce Corp | シリコン半導体基板およびその製造方法 |
JP4549589B2 (ja) * | 2001-09-14 | 2010-09-22 | シルトロニック・ジャパン株式会社 | シリコン半導体基板およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1087042A1 (en) | 2001-03-28 |
US6599603B1 (en) | 2003-07-29 |
TW531575B (en) | 2003-05-11 |
JP3800960B2 (ja) | 2006-07-26 |
KR20010043007A (ko) | 2001-05-25 |
KR100688628B1 (ko) | 2007-03-09 |
EP1087042A4 (en) | 2006-04-12 |
JP2000256092A (ja) | 2000-09-19 |
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