WO2000052109A1 - Ensemble etiquette electronique et son procede - Google Patents

Ensemble etiquette electronique et son procede Download PDF

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Publication number
WO2000052109A1
WO2000052109A1 PCT/US2000/005522 US0005522W WO0052109A1 WO 2000052109 A1 WO2000052109 A1 WO 2000052109A1 US 0005522 W US0005522 W US 0005522W WO 0052109 A1 WO0052109 A1 WO 0052109A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
integrated circuit
circuit die
antenna pattern
conductive
Prior art date
Application number
PCT/US2000/005522
Other languages
English (en)
Inventor
Noel H. Eberhardt
Sean Loving
Original Assignee
Motorola Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc. filed Critical Motorola Inc.
Priority to AU37190/00A priority Critical patent/AU3719000A/en
Priority to CN00804478A priority patent/CN1374993A/zh
Priority to CA002364448A priority patent/CA2364448C/fr
Priority to KR10-2001-7011167A priority patent/KR100460473B1/ko
Publication of WO2000052109A1 publication Critical patent/WO2000052109A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
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    • G06K19/07773—Antenna details
    • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
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Definitions

  • This invention relates in general to electronic assemblies, and in particular, to electronic tag assemblies that include the use of an integrated circuit part.
  • assemblies that include an integrated circuit part and a carrier substrate, with an electrical connection therebetween.
  • an electrical interface is established between the integrated circuit die and the carrier substrate, by soldering, wire bonding, electroplating, or by anistropic conductive adhesive.
  • Anistropic conductive adhesives have gained in popularity because of certain identified advantages in the manufacturing process.
  • a typical anistropic conductive adhesive contains metallic or other conductive particles which when compressed between electrical interfaces form a unidirectional electrical bond between the interfaces. Compression may be promoted by bumps or raised portions on one or more of the electrical interfaces.
  • the adhesive must be accurately applied so as to avoid short circuiting closely spaced terminals. Additionally, contact surfaces may need to be specially prepared to promote proper electrical connections.
  • Electronic tag assemblies require a low-cost approach for attaching integrated circuit dies that is suitable for use in high-volume production.
  • the integrated circuit die bonding approaches described in the prior art do not adequately address these needs. Therefore, an improved method for bonding an integrated circuit to form an assembly, such as an electronic tag assembly is needed.
  • FIG. 1 is a plan view of an electronic tag assembly, in accordance with the present invention.
  • FIG. 2 is a cross-sectional view of electronic tag assembly of FIG. 1.
  • FIG. 3 shows a substrate and an integrated circuit die in a pre-assembled stage, in accordance with the present invention.
  • FIG. 4 shows electrical interface terminals on the integrated circuit die in contact with an antenna in the form of a conductive pattern on the substrate, in accordance with the present invention.
  • FIG. 5 shows a non-conductive adhesive being introduced in between the integrated circuit die and the substrate, in accordance with the present invention.
  • FIG. 6 shows the integrated circuit assembly in which the adhesive maintains electrical contact between the electrical interface terminals of the integrated circuit die and the conductive pattern of the substrate, in accordance with the present invention.
  • the present invention provides for an electronic tag assembly suitable for use in high-volume, low-cost applications in which an integrated circuit die is bonded to a substrate using non-conductive adhesive.
  • the integrated circuit die is placed on the substrate such that electrical terminals thereon contact an antenna in the form of a conductive pattern on the substrate.
  • a non-conductive adhesive is introduced in between the circuit die and the substrate, to secure the integrated circuit die to the substrate, and to maintain contact between the electrical conductors and the conductive pattern.
  • a clamping force is exerted on the integrated circuit die to maintain contact between the electrical terminals and the conductive pattern while the non-conductive adhesive is being introduced.
  • FIG. 1 shows a plan view and FIG. 2 shows a cross-sectional view of an electronic tag assembly 100, in accordance with the present invention.
  • the electronic tag assembly 100 is an integrated circuit assembly that includes a chip-type part 108 having communication circuitry thereon, and an electrically coupled antenna 104, 106.
  • the chip-type part 108 is a semiconductor die formed using a standard manufacturing process.
  • the die 108 has electrical interface terminals in the form of raised electrical conductors 204, 206 or bumps that function as electrical interface contacts.
  • the antenna 104, 106 is implemented on a substrate 102, preferably formed from fibrous material, such as paper or cloth, plastic, or other inexpensive material.
  • the antenna 104, 106 is formed as a pattern of two spaced apart deposits of conductive material.
  • Preferred conductive materials include carbon ink, carbon filled polymer, or other materials suitable for low cost applications.
  • the conductive pattern may be printed, painted, or otherwise disposed on the substrate in a low cost manner.
  • the conductive pattern and the electrical interface conductors are devoid of transitional elements.
  • the integrated circuit die 108 is adhesively affixed to the substrate 102 using an electrically non-conductive adhesive 202.
  • the electrical interface contacts 204, 206 protrude from the integrated circuit die 108 and directly contact or interface with the conductive pattern 104, 106 on the substrate 102.
  • the electrically non-conductive adhesive 202 is interposed between the integrated circuit die 108 and the substrate 102, and makes direct contact therewith. The adhesive 202 secures the integrated circuit die 108 to the substrate 102, and maintains electrical contact between the electrical conductors 204, 206 and the conductive pattern 104, 106.
  • FIGs. 3,4,5, and 6 show the electronic tag assembly 100 in various stages of construction, in accordance with the present invention.
  • the antenna or conductive pattern 104, 106 is printed on or otherwise disposed on the substrate, and the integrated circuit die 108 is separately prepared, such as by using a standard manufacturing process.
  • the integrated circuit die 108 and the substrate 102 are brought together such that contact is established between the electrical conductors 204, 206 on the die 108, and the conductive pattern 104, 106 on the substrate 102.
  • a clamping force is applied to maintain contact between the electrical conductors 204, 206 and the conductive pattern 104, 106.
  • the integrated circuit die 108 is held in place by the clamping force, while an adhesive dispensing needle 502 is positioned in between the die 108 and the substrate 102, and an adhesive dispensed.
  • the clamping force is maintained while the adhesive cures.
  • contact between the electrical conductors 204, 206 and the conductive pattern 104, 106 is maintained by the adhesive 602, see FIG. 6.
  • the present invention provides for significant advantages over the prior art.
  • An electronic tag assembly suitable for high- volume, low-cost applications is provided without the use of expensive anistropic adhesives, and without the use of special materials and processes that add substantial expense or complexity.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne un ensemble étiquette électronique (100), comprenant un substrat (102) sur lequel un motif d'antenne (140, 106) est disposé, une puce (108) de circuit intégré pourvue de bornes (204, 206) d'interface électrique en contact direct ou en interface avec ledit motif d'antenne (104, 106), et un adhésif (202) électriquement non conducteur, interposé entre le substrat et la puce de circuit intégré (108), et fixant les deux éléments ensemble, tout en maintenant l'intégrité de l'interface électrique. Une force de serrage s'exerce, de préférence, sur la puce de circuit intégré (108) afin de maintenir le contact entre les bornes électriques (204, 206) et le motif d'antenne (104, 106) pendant que qu'on introduit l'adhésif (202) non conducteur.
PCT/US2000/005522 1999-03-02 2000-03-02 Ensemble etiquette electronique et son procede WO2000052109A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU37190/00A AU3719000A (en) 1999-03-02 2000-03-02 Electronic tag assembly and method therefor
CN00804478A CN1374993A (zh) 1999-03-02 2000-03-02 电子标签组件及其方法
CA002364448A CA2364448C (fr) 1999-03-02 2000-03-02 Ensemble etiquette electronique et son procede
KR10-2001-7011167A KR100460473B1 (ko) 1999-03-02 2000-03-02 전자 태그 어셈블리 및 그 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12254799P 1999-03-02 1999-03-02
US60/122,547 1999-03-02

Publications (1)

Publication Number Publication Date
WO2000052109A1 true WO2000052109A1 (fr) 2000-09-08

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PCT/US2000/005522 WO2000052109A1 (fr) 1999-03-02 2000-03-02 Ensemble etiquette electronique et son procede

Country Status (5)

Country Link
KR (1) KR100460473B1 (fr)
CN (1) CN1374993A (fr)
AU (1) AU3719000A (fr)
CA (1) CA2364448C (fr)
WO (1) WO2000052109A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2828570A1 (fr) * 2001-08-09 2003-02-14 Cybernetix Procede de fabrication de cartes a puce sans contact et/ou mixte
WO2005076353A2 (fr) * 2004-01-30 2005-08-18 Alien Technology Corporation Appareil comprenant des composants a petite largeur de trait et a grande largeur de trait, et procede de fabrication associe
EP1584125A2 (fr) * 2002-12-31 2005-10-12 Avery Dennison Corporation Organisation Dispositif rfid et procede de formation
US7224280B2 (en) 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
CN100417038C (zh) * 2002-08-28 2008-09-03 株式会社日立制作所 用作电子标签的输入装置及其制造方法
US7559486B2 (en) 2001-08-17 2009-07-14 Alien Technology Corporation Apparatuses and methods for forming wireless RF labels
GB2435183B (en) * 2004-11-02 2009-12-02 Precisia L L C Variation of conductive cross section or material to enchance performance and reduce material comsumption of electronic assemblies
US8912907B2 (en) 2003-03-24 2014-12-16 Alien Technology, Llc RFID tags and processes for producing RFID tags
US9070063B2 (en) 2004-11-22 2015-06-30 Ruizhang Technology Limited Company Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

Families Citing this family (4)

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EP1829102A4 (fr) * 2004-12-24 2014-08-13 Semiconductor Energy Lab Dispositif a semiconducteur
JP2007108894A (ja) * 2005-10-12 2007-04-26 Brother Ind Ltd タグテープロール製造装置及びタグテープロール製造方法
JP4915323B2 (ja) * 2006-11-28 2012-04-11 ブラザー工業株式会社 無線タグ情報通信装置
DE102011009577A1 (de) * 2011-01-27 2012-08-02 Texas Instruments Deutschland Gmbh RFID-Transponder und Verfahren zum Verbinden eines Halbleiter-Dies mit einer Antenne

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US5842273A (en) * 1996-01-26 1998-12-01 Hewlett-Packard Company Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby
US6002343A (en) * 1996-10-28 1999-12-14 Hi-G-Tek Ltd. Changing Indicia in an electronic tag when tampered with
US6018299A (en) * 1998-06-09 2000-01-25 Motorola, Inc. Radio frequency identification tag having a printed antenna and method
US6055724A (en) * 1997-02-04 2000-05-02 Matsushita Electric Industrial Co., Ltd. Method and device for sealing IC chip

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FR2769389B1 (fr) * 1997-10-07 2000-01-28 Rue Cartes Et Systemes De Carte a microcircuit combinant des plages de contact exterieur et une antenne, et procede de fabrication d'une telle carte

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US5842273A (en) * 1996-01-26 1998-12-01 Hewlett-Packard Company Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby
US6002343A (en) * 1996-10-28 1999-12-14 Hi-G-Tek Ltd. Changing Indicia in an electronic tag when tampered with
US6055724A (en) * 1997-02-04 2000-05-02 Matsushita Electric Industrial Co., Ltd. Method and device for sealing IC chip
US6018299A (en) * 1998-06-09 2000-01-25 Motorola, Inc. Radio frequency identification tag having a printed antenna and method

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2828570A1 (fr) * 2001-08-09 2003-02-14 Cybernetix Procede de fabrication de cartes a puce sans contact et/ou mixte
US7559486B2 (en) 2001-08-17 2009-07-14 Alien Technology Corporation Apparatuses and methods for forming wireless RF labels
CN100417038C (zh) * 2002-08-28 2008-09-03 株式会社日立制作所 用作电子标签的输入装置及其制造方法
US8072333B2 (en) 2002-12-31 2011-12-06 Avery Dennison Corporation RFID device and method of forming
EP1584125A4 (fr) * 2002-12-31 2006-12-27 Avery Dennison Corp Organisati Dispositif rfid et procede de formation
US7224280B2 (en) 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
EP1584125A2 (fr) * 2002-12-31 2005-10-12 Avery Dennison Corporation Organisation Dispositif rfid et procede de formation
US8912907B2 (en) 2003-03-24 2014-12-16 Alien Technology, Llc RFID tags and processes for producing RFID tags
US9418328B2 (en) 2003-03-24 2016-08-16 Ruizhang Technology Limited Company RFID tags and processes for producing RFID tags
WO2005076353A3 (fr) * 2004-01-30 2006-02-02 Alien Technology Corp Appareil comprenant des composants a petite largeur de trait et a grande largeur de trait, et procede de fabrication associe
WO2005076353A2 (fr) * 2004-01-30 2005-08-18 Alien Technology Corporation Appareil comprenant des composants a petite largeur de trait et a grande largeur de trait, et procede de fabrication associe
GB2435183B (en) * 2004-11-02 2009-12-02 Precisia L L C Variation of conductive cross section or material to enchance performance and reduce material comsumption of electronic assemblies
US9070063B2 (en) 2004-11-22 2015-06-30 Ruizhang Technology Limited Company Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

Also Published As

Publication number Publication date
KR100460473B1 (ko) 2004-12-08
CN1374993A (zh) 2002-10-16
AU3719000A (en) 2000-09-21
KR20010102475A (ko) 2001-11-15
CA2364448A1 (fr) 2000-09-08
CA2364448C (fr) 2004-10-26

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