KR100460473B1 - 전자 태그 어셈블리 및 그 방법 - Google Patents
전자 태그 어셈블리 및 그 방법 Download PDFInfo
- Publication number
- KR100460473B1 KR100460473B1 KR10-2001-7011167A KR20017011167A KR100460473B1 KR 100460473 B1 KR100460473 B1 KR 100460473B1 KR 20017011167 A KR20017011167 A KR 20017011167A KR 100460473 B1 KR100460473 B1 KR 100460473B1
- Authority
- KR
- South Korea
- Prior art keywords
- integrated circuit
- substrate
- circuit die
- antenna pattern
- electronic tag
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 20
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 239000000853 adhesive Substances 0.000 claims abstract description 30
- 230000001070 adhesive effect Effects 0.000 claims abstract description 30
- 239000004020 conductor Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
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- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12254799P | 1999-03-02 | 1999-03-02 | |
US60/122,547 | 1999-03-02 | ||
PCT/US2000/005522 WO2000052109A1 (fr) | 1999-03-02 | 2000-03-02 | Ensemble etiquette electronique et son procede |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010102475A KR20010102475A (ko) | 2001-11-15 |
KR100460473B1 true KR100460473B1 (ko) | 2004-12-08 |
Family
ID=22403347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2001-7011167A KR100460473B1 (ko) | 1999-03-02 | 2000-03-02 | 전자 태그 어셈블리 및 그 방법 |
Country Status (5)
Country | Link |
---|---|
KR (1) | KR100460473B1 (fr) |
CN (1) | CN1374993A (fr) |
AU (1) | AU3719000A (fr) |
CA (1) | CA2364448C (fr) |
WO (1) | WO2000052109A1 (fr) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2828570B1 (fr) * | 2001-08-09 | 2003-10-31 | Cybernetix | Procede de fabrication de cartes a puce sans contact et/ou mixte |
US7218527B1 (en) | 2001-08-17 | 2007-05-15 | Alien Technology Corporation | Apparatuses and methods for forming smart labels |
US7214569B2 (en) * | 2002-01-23 | 2007-05-08 | Alien Technology Corporation | Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
JP4109039B2 (ja) * | 2002-08-28 | 2008-06-25 | 株式会社ルネサステクノロジ | 電子タグ用インレットおよびその製造方法 |
US6940408B2 (en) * | 2002-12-31 | 2005-09-06 | Avery Dennison Corporation | RFID device and method of forming |
US7224280B2 (en) | 2002-12-31 | 2007-05-29 | Avery Dennison Corporation | RFID device and method of forming |
US7253735B2 (en) | 2003-03-24 | 2007-08-07 | Alien Technology Corporation | RFID tags and processes for producing RFID tags |
US7323993B2 (en) * | 2004-11-02 | 2008-01-29 | Zih Corp. | Variation of conductive cross section and/or material to enhance performance and/or reduce material consumption of electronic assemblies |
US7688206B2 (en) | 2004-11-22 | 2010-03-30 | Alien Technology Corporation | Radio frequency identification (RFID) tag for an item having a conductive layer included or attached |
WO2006068286A1 (fr) * | 2004-12-24 | 2006-06-29 | Semiconductor Energy Laboratory Co., Ltd. | Dispositif a semiconducteur |
JP2007108894A (ja) * | 2005-10-12 | 2007-04-26 | Brother Ind Ltd | タグテープロール製造装置及びタグテープロール製造方法 |
JP4915323B2 (ja) * | 2006-11-28 | 2012-04-11 | ブラザー工業株式会社 | 無線タグ情報通信装置 |
DE102011009577A1 (de) * | 2011-01-27 | 2012-08-02 | Texas Instruments Deutschland Gmbh | RFID-Transponder und Verfahren zum Verbinden eines Halbleiter-Dies mit einer Antenne |
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Publication number | Priority date | Publication date | Assignee | Title |
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KR19990036839A (ko) * | 1997-10-07 | 1999-05-25 | 롭송. 이안 | 외부 콘택트영역 및 안테나와 결합되는 집적회로 보드 및 이보드의 제조공정 |
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US5842273A (en) * | 1996-01-26 | 1998-12-01 | Hewlett-Packard Company | Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby |
IL119509A (en) * | 1996-10-28 | 2000-02-17 | Hi G Tek Ltd | Electronic tag |
JP3333417B2 (ja) * | 1997-02-04 | 2002-10-15 | 松下電器産業株式会社 | Icチップの封止方法及び装置 |
US6018299A (en) * | 1998-06-09 | 2000-01-25 | Motorola, Inc. | Radio frequency identification tag having a printed antenna and method |
-
2000
- 2000-03-02 AU AU37190/00A patent/AU3719000A/en not_active Abandoned
- 2000-03-02 CN CN00804478A patent/CN1374993A/zh active Pending
- 2000-03-02 KR KR10-2001-7011167A patent/KR100460473B1/ko not_active IP Right Cessation
- 2000-03-02 WO PCT/US2000/005522 patent/WO2000052109A1/fr active IP Right Grant
- 2000-03-02 CA CA002364448A patent/CA2364448C/fr not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990036839A (ko) * | 1997-10-07 | 1999-05-25 | 롭송. 이안 | 외부 콘택트영역 및 안테나와 결합되는 집적회로 보드 및 이보드의 제조공정 |
Also Published As
Publication number | Publication date |
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AU3719000A (en) | 2000-09-21 |
CA2364448C (fr) | 2004-10-26 |
CA2364448A1 (fr) | 2000-09-08 |
CN1374993A (zh) | 2002-10-16 |
WO2000052109A1 (fr) | 2000-09-08 |
KR20010102475A (ko) | 2001-11-15 |
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