Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
  • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
  • B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
  • B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
  • B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs

Definitions

• the present invention relates to a gas ejection structure for a levitation transfer device and an ejection hole forming method.
• a gas jet is ejected to a levitation transport device that moves, stops, stops, and changes the direction of the plate substrate in this state by ejecting gas to the plate substrate.
• the present invention relates to a gas ejection structure for a floating conveyance device for providing holes and a method for forming a jet hole for a floating conveyance device.
• INDUSTRIAL APPLICABILITY The present invention is suitably used for a levitation transfer device or a levitation transfer system that performs airflow transfer of a glass plate used for a liquid crystal display or a wafer on which a semiconductor device is formed.
• FIG. 17 As a system for floating and transporting a plate-like substrate, for example, there is a system for transporting a glass plate for a TFT type liquid crystal display.
• This transport system is shown in Figure 17.
• This transport system is configured by combining a transfer unit 100 and a control unit 200.
• the transfer unit 100 floats the rectangular glass plate 300 and moves it in the moving direction 310.
• the control unit 200 stops and stops while the glass plate 300 is floated, and turns the glass plate 300 in the turning direction 311.
• the transport system includes a processing unit for performing various processing on the glass plate 300.
• the transfer unit 100 is usually used in conjunction to move the glass plate 300 linearly.
• An example of this transfer unit 100 is shown in FIG.
• the transfer unit 100 is provided with a base 110, an enclosure, and a material 120.
• the base 110 has a supply system 111 for supplying a gas for floating the glass plate 300, for example, a nitrogen gas, an argon gas, or other gas that does not affect the glass plate 300. It is plumbed.
• the surface 112 of the enclosure 120, the base 110 of the base 110 is a transfer surface of the transfer path, and the transfer surface 112 has a plurality of ejection holes 113.
• the ejection holes 1 13 are provided to be inclined with respect to the transfer surface 1 12,
• the oblique direction of the ejection hole 113 is inclined toward the center 112 of the moving direction 310 of the glass plate 300.
• the ejection holes 115 for propulsion are aligned in parallel with the moving direction 310 of the glass plate 300, and are inclined with respect to the transfer surface 112. It is empty.
• the ejection holes 113 and 115 are provided between the transfer surface 112 and the gas chambers 114 and 116.
• the gas chambers 1 14 and 1 16 communicate with the supply system 1 1 1 respectively.
• the gas supplied from the supply system 111 through the outlets 113, 115 is ejected from the outlets 113, 115 through the gas chambers 114, 116.
• the ejection direction of gas from the ejection holes 113 and 115 is inclined obliquely upward with respect to the transfer surface 112, and the ejection hole 113 is perpendicular to the moving direction 310. Are parallel.
• the ejection of such a gas is represented two-dimensionally by the ejection directions 113A and 115A in FIG.
• the gas ejected from the ejection holes 113 and 115 in the ejection directions 113 A and 115 A causes the glass plate 300 to float and move in the movement direction 310, and at the same time, the center of the glass plate 300 As it moves along the center 112A, the side of the glass plate 300 is enclosed and the side of the material 120 is not controlled. That is, the glass plate 300 is moved in a non-worming state with respect to the transport surface 112, the surrounding area, and the material 120.
• the control unit 200 receives the glass plate 300 sent from the transfer unit 100, stops the glass plate 300, changes the moving direction of the glass plate 300, and rotates the glass plate 300 itself.
• the control unit 200 includes a base 210 and an enclosure 220, as shown in FIG. As in the case of the base 110, a supply system 211 for supplying a gas for floating the glass plate 300 is connected to the enclosure 220.
• the surface 212 of the base 210 covered by the enclosure 220 is the transport surface of the transport path, and the transport surface 212 is provided with a suction port and a plurality of ejection holes.
• a suction port 213 is provided as shown in FIG.
• the suction port 213 sucks the gas in the vicinity of the center, and stops the glass plate 300 while floating.
• setting lines 221 to 224 are set in order from the inside.
• the setting line 222 has an orifice 215. Vent hole 215 squirts As in the case of the holes 113, the force S, which is provided obliquely upward with respect to the transfer surface 211, and the jetting direction of the gas is the counterclockwise jetting direction 215A. The glass plate 300 is rotated in the counterclockwise direction by the gas from the ejection holes 2 15.
• the setting line 222 has an orifice 216.
• the orifice 2 16 is provided diagonally above the transport surface 2 12, but the gas is emitted in the clockwise is there.
• the glass plate 300 is rotated clockwise by the gas from the orifice 2 16.
• the setting lines 2 2 1, 2 2 3, 2 2 4 have openings 2 14, 2 17, 2 18.
• the vents 2 14, 2 17, 2 18 are, like the vents 1 13, open diagonally above the transport surface 2 12.
• the gas from the ejection holes 2 14, 2 17, 2 18 is ejected in the ejection direction 2 14 A, 2 17 A, 2 18 A toward the suction port 2 13.
• the gas from the ejection directions 2 14 A, 2 17 A, and 2 18 A causes the center of the glass plate 300 to be located at the suction port 2 13.
• control unit 200 is provided with two rows of setting lines 2 25 and 2 26 for each of the ejection holes 25 1 to 25 3 for propelling and capturing the glass plate 300.
• the ejection hole 251 in the direction of movement of the glass plate 300, ejects gas in the ejection direction 251, A, which is opposite to the direction 180 degrees by 180 degrees, and the ejection hole 252, the movement direction 3
• the gas is ejected in the ejection direction 2 52 A, which is the same direction as 10.
• the ejection holes 25 3 eject gas in the ejection direction 2 53 A, which is the same direction as the turning direction 3 11 1 of the glass plate 300.
• the gas outlets 205 blow gas out in the direction opposite to the moving direction 310.
• the glass plate 300 is captured by the deceleration action of the ejected gas, and is smoothly stopped at the center of the transport surface 212. With this, the glass plate 300 can be smoothly stopped and rotated. For example, when the glass plate 300 is turned in the turning direction 311, the ejection holes 25 3 eject gas. Thereby, the glass plate 300 is propelled in the turning direction 311.
• the direction of the glass plate 300 is changed.
• the gas outlets 25 I do.
• a processing system for the glass plate 300 is constructed.
• One example of such a transport system is shown in International Application No. PCTZ J P91 01 469.
• the base 110 of the transfer unit 100 and the base 210 of the control unit 200 are made as follows.
• the base 110 includes a transfer plate 110A as shown in FIG.
• the transport plate 110A is composed of a calorie plate 130 and a sealing plate 140.
• processing of the processed plate 130 has been performed as follows. That is, as shown in FIG. 25, a hole 132 was drilled from the back surface 131 of the processed plate 130 by a drill (not shown). The diameter of the hole 132 was about several mm, and the hole was drilled from a direction perpendicular to the back surface 131. Dorinore is set in advance in a processing machine (not shown) for processing the processed plate 130.
• a hole 13 4 was formed from the surface 13 3 of the processed plate 13 toward the hole 13 2 as shown in FIG.
• the hole 134 has a diameter of about 0.3 mm and penetrates the hole 132. Drilling of holes 13 4 was performed by a drill (not shown) from a direction inclined with respect to surface 13 3.
• a hole 1332 and a hole 134 are formed in the work plate 130, the hole 132 is the gas chamber 114 and the gas chamber 116, and the hole 134 is ejected. These are holes 1 13 and vent holes 1 15.
• the grooves 1 3 5, 1 3 6 were processed as shown in Fig. 27. It was provided on the back surface 13 1 of the plate 130. At this time, a groove 135 was provided so as to connect only the gas chambers 114, and a groove 136 was provided so as to connect only the gas chambers 116.
• the sealing plate 140 is attached to the back surface 13 1 as shown in FIG. , 136 were sealed independently of each other.
• a supply system was formed in the transfer unit 100 by the grooves 135 and 136.
• the transport plate 11 OA was formed by the processed plate 13 and the sealing plate 14. W Further, the supply system in the transfer plate 11 OA was connected to the supply system 11 1 via a valve or the like for controlling the gas flow, and the base 110 was formed. Similarly, control unit 20
• the base 210 of 0 was also made by the working plate and the sealing plate.
• the transport plate was made of a processed plate and a sealing plate, and the processed plate was provided with a large number of ejection holes. Since the direction in which the gas outlet blows out the gas is inclined with respect to the surface of the processing plate, the processing for opening the hole was performed from the direction inclined with respect to the surface of the processing plate.
• machining of the orifice was started after the direction of the drill of the processing machine for opening the orifice was set so as to be inclined with respect to the surface of the work plate.
• the inclination direction of the injection hole is different, it becomes necessary to rotate the processing plate placed on the processing machine, causing a problem. This complicates the processing for providing the ejection holes because the processing involves rotation of the processing plate.
• the present invention provides a gas ejection structure for a levitation transfer device and an ejection hole formation for a levitation transfer device, which enable a discharge plate to be easily provided on a transfer plate used for a base of a transfer unit or a control unit.
• the aim is to provide a method. Disclosure of the invention
• a gas ejection structure for a levitation transport device includes a transport plate that floats a plate-like substrate with gas ejected from a transport surface, and a gas that is provided on the transport plate and supplies the gas ejected from the transport surface.
• a gas discharge structure for a levitation transfer device including a supply system, a receiving hole that is provided on the transfer surface at a position where the gas is discharged, and receives supply of gas from the supply system; And an engaging body inserted into the receiving hole and having an ejection hole for ejecting the gas supplied to the receiving hole.
• the ejection hole forming method for a floating conveyance device includes: a conveyance plate for floating a plate-like substrate with gas jetted from a conveyance surface; and a conveyance plate provided on the conveyance plate and jetted from the conveyance surface. And a supply system for supplying a gas.
• the method for forming an ejection hole for a levitation transfer device comprising: a supply surface for supplying a gas; A receiving hole is formed in the receiving surface, and an ejection hole for ejecting gas is formed in the receiving hole, and an engaging body having a shape to be fitted in the receiving hole is inserted into the receiving hole of the transport surface. I do.
• the engagement body having the ejection hole is inserted into the receiving hole formed in the transport plate.
• the engagement bodies may be inserted into the receiving holes so that the ejection directions of the engagement bodies match the arranged ejection directions. It becomes easy to form the ejection holes on the transfer surface of the transfer plate.
• FIG. 1 is a plan view showing a gas ejection structure for a levitation transfer device according to the first embodiment.
• FIG. 2 is an enlarged view showing a partial enlargement of FIG.
• FIG. 3 is a plan view showing a processing position set on the transfer surface.
• FIG. 4 is a cross-sectional view showing a II section of FIG.
• FIG. 5 is a cross-sectional view showing a II-II section of FIG.
• FIG. 6 is a front view showing a chip for making an engagement body.
• FIG. 7 is a cross-sectional view showing a state in which the ejection holes are formed in the engagement body.
• FIG. 8 is a cross-sectional view showing how the engagement body is attached.
• FIG. 9 is a cross-sectional view showing the transfer plate.
• FIG. 10 is an enlarged view showing a gas ejection structure for a levitation transfer device according to the second embodiment.
• FIG. 11 is a cross-sectional view showing a cross section taken along the line III-III of FIG. 10.
• FIG. 12 is a plan view showing a processed plate according to the third embodiment.
• FIG. 13 is a plan view showing an engagement body according to the third embodiment.
• FIG. 14 is a plan view showing a gas ejection structure for a levitation transfer device according to Embodiment 4. is there.
• FIG. 15 is a cross-sectional view showing a gas ejection structure for a levitation transfer device according to the fifth embodiment.
• FIG. 16 is a cross-sectional view showing a gas ejection structure for a levitation transfer device according to Embodiment 6.
• FIG. 17 is a plan view showing a conventional plate-shaped substrate transfer system.
• FIG. 18 is a perspective view showing a conventional transfer unit.
• FIG. 19 is a cross-sectional view taken along the line IV-IV of FIG.
• FIG. 20 is a sectional view taken along line VV of FIG.
• FIG. 21 is an explanatory view showing a jetting direction by a conventional transfer unit.
• FIG. 22 is a perspective view showing a conventional control unit.
• FIG. 23 is an explanatory diagram showing a jetting direction by a conventional transfer unit.
• FIG. 24 is a cross-sectional view showing the structure of a conventional transfer unit.
• FIG. 25 is a cross-sectional view showing a state of processing of a conventional transfer unit on a processing plate.
• FIG. 26 is a cross-sectional view showing a state of processing of a conventional transfer unit on a processing plate.
• FIG. 27 is a bottom view showing the bottom surface of the processing plate of the conventional transfer unit.
• FIG. 1 is a plan view showing a gas ejection structure for a levitation transfer device according to Embodiment 1.
• FIG. 2 is an enlarged view showing a partial enlargement of FIG.
• FIG. 3 is a plan view showing the Karoe position set on the transport surface.
• FIG. 4 is a cross-sectional view showing a II section of FIG.
• FIG. 5 is a cross-sectional view showing a II-II cross section of FIG.
• FIG. 6 is a front view showing a chip for making an engagement body.
• FIG. 7 is a cross-sectional view showing a state of formation of the ejection holes with respect to the engagement body.
• FIG. 8 is a cross-sectional view showing how the engagement body is attached.
• FIG. 9 is a cross-sectional view showing the transfer plate.
• the gas ejection structure for the levitation transfer device has a structure in which the transfer unit 100 in the levitation transfer system shown in FIG. 17 includes the ejection holes 1 13, 1 15 and the gas chamber 1 1 4.
• the mechanism is a combination of the orifices 2 14 to 2 18 and 25 1 to 25 3 and the gas chambers communicating with these orifices.
• a receiving hole 1 is formed in a transfer surface 21 of a processing plate 20.
• FIG. 2 is an enlarged view of a broken line portion 2OA in FIG.
• the receiving hole 1 is provided at the processing position 22 of the ejection hole of the transfer unit, which is set on the transfer surface 21 of the processing plate 20 of the transfer unit.
• the receiving hole 1 is a cylindrical hole having a diameter of a 2 that penetrates the processing plate 20.
• the length of the receiving hole 1 is the thickness a 1 of the processing plate 20. It is.
• the penetration direction of the receiving hole 1 is perpendicular to the transfer surface 21. That is, the processing for forming the receiving hole 1 is performed at a processing position 22 from a direction perpendicular to the transport surface 21.
• the engagement body 2 has a cylindrical shape with a diameter of a2, which fits into the receiving hole 1. As shown in FIG. 5, an ejection hole 2B is formed on the front surface 2A of the engagement body 2, and a gas chamber 2D connected to the ejection hole 2B is formed on the back surface 2C.
• the engagement body 2 is made as follows. That is, as shown in FIG. 6, a round bar-shaped chip 30 having a diameter a 2 and a length a 1 from the front surface 31 to the back surface 32 was prepared. A hole 33 having a diameter of about several mm was formed in the chip 30 from the rear surface 32 using a drill. The processing for making the holes 33 was performed at right angles to the back surface 32. This hole 3 3 becomes the gas chamber 2D of the force engaging body 2.
• a hole 34 having a diameter of about 0.3 mm was provided.
• the hole 34 was drilled from the surface 31 to the hole 33 using a drill 34A.
• the hole 34 is the ejection hole 2B of the engagement body 2.
• the direction opposite to the traveling direction of the drill 34A (the direction indicated by the arrow 401) is the direction of ejection of the ejection hole 2B.
• the processing for forming the hole 34 was performed by setting the chip 30 with a jig so as to sandwich the chip 30 in the processing machine, and thereafter, using a drill attached to the caro machine. As a result, even when the hole 34 is inclined with respect to the surface 31, since the tip 30 is held by being inclined by the jig, it is possible to perform machining from a right angle direction by the Kalo machine. .
• the ejection direction indicated by the arrow 401 is set to a predetermined direction as shown in FIG.
• the engaging body 2 was driven into the receiving hole 1 from the back surface 23 of the plate 20, and the engaging body 2 was inserted.
• a processed plate 20 shown in FIG. 1 was produced.
• a groove 35 is provided as a ventilation groove to connect the ejection hole 2B of the engagement body 2 that blows out gas in the same direction to the processing plate 20.
• the back surface 23 of the processed plate 20 was adhered to the sealing plate 40.
• a transport plate 50 for the transfer unit was produced.
• engaging body 2 formed separately from work plate 20 is driven into receiving hole 1 of work plate 20 to form ejection hole 2B.
• ejection hole 2B can be extremely easily formed. In addition, this makes it possible to reduce the processing time for the transport plate 50.
• the engaging body 2 is driven into the receiving hole 1, it is possible to completely prevent generation of emis- sions of the ejection holes with respect to the transport plate 50.
• FIG. 10 is an enlarged view showing a gas ejection structure for a levitation transfer device according to the second embodiment.
• FIG. 11 is a sectional view showing a section taken along a line III-III in FIG. 10.
• a guide portion is provided in the first embodiment. That is, as shown in FIGS. 10 and 11, the groove 3 is provided as a guide groove on the side wall of the receiving hole 1 in the gas ejection direction.
• a protrusion 4 that fits with the groove 3 of the receiving hole 1 is provided as a guide protrusion on the side wall of the engagement body 2 where the ejection hole 2B faces.
• the guide portion includes a groove 3 and a projecting portion 4.
• FIG. 12 is a plan view showing a processed plate according to the third embodiment.
• FIG. 13 is a plan view showing an engagement body according to the third embodiment.
• a guide portion different from that of the second embodiment is provided in the receiving hole 1 and the engagement body 2 of the first embodiment. That is, as shown in FIG. 12, the alignment mark 5 is provided on the back surface 23 of the processing plate 20. The alignment mark 5 is formed around the receiving hole 1 by printing or the like.
• a matching mark 6 is provided on the back surface 2C of the engagement body 2.
• the alignment mark 6 is for alignment with the alignment mark 5, and indicates the direction of the ejection hole 2B.
• the alignment mark 6 is formed near the outer periphery of the back surface 2C by printing or the like.
• the guide part is formed by the alignment marks 5 and 6.
• the alignment mark 6 of the engaging body 2 is aligned with the alignment mark 5 provided around the receiving hole 1. This makes it possible to easily set the ejection direction of the ejection hole 2B with respect to the receiving hole 1.
• FIG. 14 is a plan view showing a gas ejection structure for a levitation transfer device according to the fourth embodiment.
• a hexagonal receiving hole 7 as a polygon is formed in the processing plate 20.
• a hexagonal engaging body 8 having a shape fitting with the receiving hole 7 is inserted into the receiving hole 7.
• a guide portion is formed by the hexagonal receiving hole 7 and the combination 8. With the hexagonal guide portion, the ejection direction of the ejection hole 2B can be specified. [Embodiment 5]
• FIG. 15 is a cross-sectional view showing a gas ejection structure for a levitation transfer device according to the fifth embodiment.
• the locking portion is provided in the first to fourth embodiments. That is, when the receiving hole 9 having the diameter a2 is formed, the step 9A is provided as the first step in the receiving hole 9 near the transfer surface 21. Due to the step 9A, the receiving hole 9 is smaller than the diameter a2. Thus, a receiving hole 9 having a stepped portion 9 A and a force S are formed in the processed plate 20.
• the engagement body 10 has a shape that fits into the receiving hole 9. That is, a portion near the surface 1OA of the engaging body 10 having the diameter a2 is formed to be narrower than the diameter a2. Thus, similarly to the receiving hole 9, the engaging portion 10 is also provided with the stepped portion 10B as the second stepped portion.
• the locking portion is formed by the step 9A of the receiving hole 9 and the step 9B of the engaging body 10. With this locking portion, it is possible to prevent the surface of the engaging body 10 from jumping out of the transport surface 21 when the engaging body 10 is driven into the receiving hole 9. As a result, the surface of the engagement body 10 can be easily flattened with respect to the transfer surface 21 of the processing plate 20.
• FIG. 16 is a cross-sectional view showing a gas ejection structure for a levitation transfer device according to the sixth embodiment.
• a different locking portion from the fifth embodiment is provided in the first to fourth embodiments.
• a cone-shaped receiving hole 11 having a diameter a 2 as the maximum diameter and a diameter a 3 as the minimum diameter is formed in the work plate 20.
• the maximum diameter of the receiving hole 11 is located on the back surface 23 of the processing plate 20, and the minimum diameter is located on the transfer surface 21 of the processing plate 20.
• the engagement body 12 has a shape that fits into the receiving hole 11. That is, the engaging body 12 is a cone having the diameter a2 as the maximum diameter, the diameter a3 as the minimum diameter, and the length a1 as the height.
• the engaging portion is formed by the conical shape of the receiving hole 11 and the conical shape of the engaging body 12.
• the engaging body is provided in the same manner as in the fifth embodiment.
• the present invention is not limited to these embodiments.
• the caroe board is for a transfer unit, but the present invention is similarly applied to a work board for a control unit.
• high-purity dry air high-purity nitrogen gas, high-purity argon gas, high-purity carbon dioxide gas, or the like can be used as the gas ejected from the ejection holes.
• a high-purity nitrogen gas having an impurity concentration of several ppb or less is optimal to use as a carrier gas.
• a system that transports a glass plate or the like for a TFT-type liquid crystal display by air flow is used as an example. It is possible.
• the receiving hole is provided on the transfer surface at a position where the gas is ejected, and the receiving hole receiving the supply of gas from the supply system is fitted to the receiving hole of the transfer plate. And an engaging body which is inserted into the receiving hole and has an ejection hole for ejecting the gas supplied to the receiving hole.
• a gap may be formed between the transfer surface and the supply system, at a position where the gas is blown out, a receiving hole may be formed in the transfer surface, and a blowout hole for blowing out the gas may be formed.
• an engaging body having a shape to be fitted in the receiving hole is inserted into the receiving hole of the transport surface.
• the ejection holes can be formed in the conveyance plate by inserting the engagement body having the ejection holes into the receiving holes of the conveyance plate. This makes it possible to easily form the ejection holes on the transport plate.
• the transport plate includes: a processed plate having a surface as the transport surface; and a sealing plate that covers a back surface of the processed plate.
• Receiving hole 14 CT / JP99 / 04700 are provided respectively, and a ventilation groove for connecting the ejection hole of the same direction is provided for the processing plate in which the engagement body is inserted into the receiving hole, and the ventilation groove is used as the supply system.
• the present invention provides the working plate having a transfer surface as a transfer surface, and a sealing plate closing a back surface of the work plate, forming the transfer plate, and forming receiving holes so as to penetrate the work plate.
• the engaging body is inserted into the receiving hole, and a ventilation groove is provided on the back surface of the processing plate so that the direction of the ejection hole connects the engaging body, and the back surface is covered with the sealing plate. Is a supply system.
• the receiving plate is opened in the processing plate, and the back surface is covered with the sealing plate, so that the production of the transport plate can be simplified.
• a guide portion for determining the direction of the ejection hole of the engaging body with respect to the receiving hole is provided in the receiving hole and the engaging body. Further, as the guide portion, a guide groove is provided on a side wall of the receiving hole, and a guide protrusion having a shape to be fitted into the guide groove is provided on a side wall of the engagement body. Further, according to the present invention, a guide portion for determining the direction of the ejection hole of the engaging body with respect to the receiving hole is provided in the receiving hole and the engaging body. Further, as the guide portion, a guide groove is provided on a side wall of the receiving hole, and a guide protrusion having a shape to be fitted into the guide groove is provided on a side wall of the engagement body. As a result, according to the present invention, the ejection direction of the gas ejected from the ejection holes is indicated by the guide portion, so that the ejection direction of the gas can be easily determined.
• a locking portion for locking the engaging body inserted into the receiving hole is provided in the receiving hole and the engaging body. Further, a first step portion is provided on a side wall of the receiving hole as the locking portion, and a second step portion fitted with the first step portion is provided on the engagement body. Further, according to the present invention, a locking portion for locking the engaging body inserted into the receiving hole is provided in the receiving hole and the engaging body. Further, a first step portion is provided on a side wall of the receiving hole as the locking portion, and a second step portion fitted with the first step portion is provided in the engagement body.
• the engaging body when the engaging body is inserted into the receiving hole, the engaging body is stopped by the locking portion, so that the engaging body can be prevented from protruding from the transport surface.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Fluid Mechanics (AREA)
• Mechanical Engineering (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
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• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

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Citations (5)

• 1998
  • 1998-08-31 JP JP24464498A patent/JP2000072250A/ja not_active Withdrawn
• 1999
  • 1999-08-30 TW TW88114818A patent/TW418427B/zh not_active IP Right Cessation
  • 1999-08-31 WO PCT/JP1999/004700 patent/WO2000012417A1/ja unknown

Patent Citations (5)

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