WO1999052142A1 - Dispositif de transfert pour corps a traiter - Google Patents

Dispositif de transfert pour corps a traiter Download PDF

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Publication number
WO1999052142A1
WO1999052142A1 PCT/JP1999/001765 JP9901765W WO9952142A1 WO 1999052142 A1 WO1999052142 A1 WO 1999052142A1 JP 9901765 W JP9901765 W JP 9901765W WO 9952142 A1 WO9952142 A1 WO 9952142A1
Authority
WO
WIPO (PCT)
Prior art keywords
processing
transport mechanism
processed
alignment
transfer
Prior art date
Application number
PCT/JP1999/001765
Other languages
English (en)
Japanese (ja)
Inventor
Masahito Ozawa
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Publication of WO1999052142A1 publication Critical patent/WO1999052142A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Definitions

  • the present invention relates to a device for transporting an object to be processed, and more particularly to a device for transporting an object to be processed while performing pretreatment of the object to be processed prior to processing of the object in a semiconductor manufacturing process or the like. It relates to a transport device. Background technology
  • a semiconductor manufacturing apparatus having a single-wafer processing apparatus for processing an object to be processed for example, a semiconductor wafer one by one
  • a semiconductor manufacturing apparatus for example, a multi-chamber single processing apparatus is widely used.
  • the multi-chamber single-processing apparatus includes, for example, a pair of carrier chambers for storing carriers for semiconductor wafers before and after processing, an alignment chamber for taking out semiconductor wafers one by one from the carriers in the carrier chamber, and performing alignment.
  • the film-forming processing is performed continuously.
  • an apparatus that consistently carries, aligns, and performs processing of a semiconductor wafer under reduced pressure that has reached a predetermined degree of vacuum is known.
  • semiconductor wafers When processing semiconductor wafers, for example, semiconductor wafers are taken out one by one from a carrier in one carrier chamber via a transfer device in an alignment chamber under atmospheric pressure and transported to an alignment mechanism.
  • the alignment mechanism detects an orientation flat (orientation flat) or a notch via a detector such as an optical sensor, and performs alignment of the semiconductor wafer, that is, adjusts the orientation to a predetermined direction.
  • the semiconductor wafer W after the alignment is transferred from the alignment mechanism to one of the load lock chambers via the transfer device under the atmospheric pressure.
  • the semiconductor wafer undergoes, for example, a pre-heat treatment, and is transported under reduced pressure from a mouth lock chamber to a predetermined process chamber via a transfer device in a transfer chamber, where the semiconductor wafer undergoes predetermined processing.
  • the processed semiconductor wafer is transferred to the other load lock chamber via the transfer chamber and cooled, for example, in the load lock chamber, and then stored in the carrier of the other carrier chamber via the alignment chamber.
  • the present invention has been made to solve the above-mentioned problems, and an object of the present invention is to perform other processes in parallel during the transfer of an object to be processed, such as a semiconductor wafer, to increase throughput and reduce footprint. It is an object of the present invention to provide a device for transporting an object to be processed.
  • a transfer apparatus for a workpiece includes a transport mechanism for holding and transporting a workpiece, and a transport mechanism disposed near the transport mechanism for receiving a workpiece from the transport mechanism in a predetermined manner. And a rotatable rotating body that supports the transport mechanism and the alignment mechanism.
  • the rotating body is configured to align the transfer mechanism and the workpiece while the workpiece is aligned in a predetermined direction by the alignment mechanism. It is designed to rotate with a mechanism.
  • the alignment mechanism is preferably configured to be able to move up and down on a rotating body for transferring the object to be processed to and from the transport mechanism.
  • the alignment mechanism is a transport mechanism It is preferable to have a temperature adjustment mechanism for adjusting the temperature of the object to be processed received from the substrate.
  • the apparatus for transporting a workpiece according to the present invention includes a transport mechanism that holds and transports the workpiece, and a temperature adjustment mechanism that is disposed near the transport mechanism and that adjusts the temperature of the workpiece received from the transport mechanism. And a rotatable rotating body that supports the transport mechanism and the mounting table.
  • the rotating body mounts the transfer mechanism and the object to be processed while the object to be processed is mounted on the mounting table and adjusted to a predetermined temperature by the temperature adjusting mechanism. It rotates with the mounting table on which it is mounted.
  • the mounting table can be moved up and down on a rotating body for transferring the object to be processed to the transport mechanism.
  • the present invention provides a transport mechanism for holding and transporting an object to be processed, an alignment mechanism disposed near the transport mechanism and aligning a workpiece to be received from the transport mechanism in a predetermined direction, and a transport mechanism. And a rotatable rotating body that supports the workpiece and an alignment mechanism; and a processing chamber for processing the workpiece, comprising: a processing chamber for processing the workpiece; and a processing chamber for processing the workpiece. is there.
  • the transfer device arrives at the front of the processing chamber when the alignment of the target object ends. Further, it is preferable that the processing chamber and the second processing chamber are arranged within the reach of the transfer mechanism, particularly at a position substantially equidistant from the rotating body.
  • the present invention provides a transfer mechanism for holding and transporting an object to be processed, a mounting table disposed near the transport mechanism, and having a temperature adjustment mechanism for adjusting the temperature of the object to be processed received from the transport mechanism;
  • a rotatable rotatable transporter that supports the mechanism and the mounting table;
  • a transporter for transporting the workpiece having: a processing chamber for processing the workpiece; and a processing chamber for processing the workpiece. Processing device.
  • the transfer device be configured to cause the object to arrive before the processing chamber when the temperature adjustment of the object is completed. Further, it is preferable that the processing chamber and the second processing chamber are arranged within the reach of the transfer mechanism, particularly at a position substantially equidistant from the rotating body.
  • FIG. 1 is a perspective view showing a main part of an embodiment of a device for transporting an object to be processed according to the present invention, and is a diagram showing a state where an alignment process is performed on a semiconductor wafer.
  • FIG. 2 is a perspective view corresponding to FIG. 1, showing a state in which the semiconductor wafer after the alignment processing is delivered to the multi-joint arm.
  • FIG. 3 is a cross-sectional view showing the entire structure of the transfer apparatus for the object shown in FIG.
  • FIG. 4 is a plan view showing an example of a processing apparatus to which the object transfer apparatus shown in FIG. 1 is applied.
  • FIG. 5 is a cross-sectional view showing a main part of another embodiment of the apparatus for transporting a workpiece according to the present invention.
  • the object transfer device 10 holds and transfers a semiconductor wafer W as an object to be processed, as shown in FIGS.
  • a rotatable transport body 13 that can rotate forward and backward, respectively, and supports the two.
  • the semiconductor wafer W is aligned in a predetermined direction based on the orientation flat, and is again transferred from the alignment mechanism 12 to a predetermined location, for example, the process chamber via the multi-joint arm 11.
  • This wafer transfer apparatus 100 can be applied to, for example, a multi-chamber single-processing apparatus 100 shown in FIGS.
  • the multi-chamber single-processing apparatus 100 includes a substantially hexagonal transfer chamber 110 and this transfer chamber.
  • a pair of carrier chambers 120 connected to the two sides of the bar 110 so as to be able to communicate with each other, and three sides of the transfer chamber 110 connected in a clockwise direction from one carrier chamber 120.
  • the three process chambers 130 and the other carrier chambers 120 are connected so as to be able to communicate with each other and perform a predetermined process such as a film forming process or a jetting process on the semiconductor wafer W.
  • a buffer chamber is connected between the chambers so as to be able to communicate with the transfer chamber.
  • One chamber is opened and closed by a gate valve 150.
  • the wafer transfer device 10 of the present embodiment is disposed in a transfer chamber 110, as shown in FIGS. 3 and 4, for example.
  • the wafer transfer device 10 will be further described with reference to FIGS. As shown in FIGS. 3 and 4, the articulated arm 11
  • the second arm 11C includes a hand 11D having a proximal end connected to a distal end of the second arm 11C. Connection between first arm 1 1B and second arm 1 1C
  • the (joint) is provided with a motor and a gear mechanism (both not shown), and the second arm 11 C can be bent and extended with respect to the first arm 11 B.
  • the joint between the second arm 11C and the hand 11D is configured similarly to the joint between the first and second arms 11B and 11C, and the hand 11D is connected to the second arm 11D. It is able to bend and stretch with respect to C.
  • a sensor 11E for confirming the presence of the semiconductor wafer W is provided on the upper surface of the hand 11D. Therefore, when the articulated arm 11 confirms the presence of the semiconductor wafer W on the hand 11 D with the sensor 11 E, the articulated arm 11 moves in the forward or reverse direction by driving the motor 11 A on the rotating carrier 13. It rotates and bends and stretches through each joint to carry the semiconductor wafer W.
  • the alignment mechanism 12 includes a mounting table 12 A on which the semiconductor wafer W is mounted, a rotation of the mounting table 12 A in a horizontal plane (in the direction of ⁇ ) in a forward or reverse direction, and a vertical ( A drive mechanism 12 B for raising and lowering (in the Z direction) and an optical sensor for detecting an orientation flat or a notch of the semiconductor wafer W while the drive mechanism 12 B rotates and stopping the drive mechanism 12 B in a predetermined direction. And a control unit (not shown) I have.
  • the drive mechanism 12B air-tightly penetrates the rotary carrier 13 via the seal portion 12S.
  • the alignment mechanism 12 detects the orientation flat with a detector while rotating the mounting table 12A in the normal and reverse directions, and aligns the semiconductor wafer W in a predetermined direction by the control unit.
  • the alignment mechanism 12 is configured to hold the semiconductor wafer W on the mounting table 12A by a suction means such as a collision check.
  • a rotating shaft 13C is formed at the center of the lower surface of the rotating carrier 13 so that the rotating body driving mechanism 14 rotates forward and backward together with the transport mechanism 11 and the alignment mechanism 12. .
  • the rotator driving mechanism 14 is configured by, for example, a motor disposed below the rotator 13. Further, as shown in FIG.
  • the rotary carrier 13 forms a part of the bottom surface of the transfer chamber 110, and the transfer chamber 110 is formed by a seal portion 13s. It rotates in a gas-tight manner.
  • the vacuum state of the transfer chamber 1 is always maintained by the sealing function of the seal portions 11 s, 12 s, and 13 s.
  • the rotation axis 13 C of the rotary transport body is composed of a rotary axis (rotary axis of the motor 11 A) for rotating the transport mechanism with respect to the rotary transport body and a rotary axis (rotation axis of the alignment mechanism). (Rotation axis of motor 12B). According to this configuration, it is easy to balance the weight of the entire transport mechanism and the weight of the entire alignment mechanism around the rotation axis of the rotary transport body.
  • the rotation drive mechanism of the transport mechanism with respect to the rotating body may be provided substantially on the rotating shaft of the rotating body.
  • the motor 11A which is a rotating mechanism of the transport mechanism, may be provided at or near the center of the upper surface of the rotating body. Then, the rotation mechanism of the transport mechanism is substantially located on the rotation axis of the rotary transport body. According to this configuration, since the rotating mechanism of the transport mechanism, which would normally have a relatively large weight, is located on the rotation axis of the rotary transport body, the torque required for rotating the rotary transport body can be small, and the rotating motor can be rotated. —The size of the element is smaller, and the start, stop, and reversal of rotation can be performed quickly.
  • the process chamber 130 has a lower electrode 131 serving also as a mounting table for the semiconductor wafer W, and an upper electrode 130 disposed directly above the lower electrode 131 serving as a process gas supply unit. 1 and 2 are provided.
  • the lower electrode 13 1 is connected to a high frequency power supply 13 4 via a matching circuit 13 3.
  • the upper electrode 1 3 2 Have been Therefore, when high-frequency power is applied to the lower electrode 13 1 in a reduced pressure state where a predetermined degree of vacuum is reached, and a process gas is supplied from the upper electrode 13 2, the process between the two electrodes 13 1 and 13 2 is started.
  • the gas is turned into plasma, and a predetermined plasma process is performed on the semiconductor wafer W mounted on the lower electrode 13 1.
  • the semiconductor wafer W is transferred between the articulated arm 11 and the lower electrode 13 1 via a three-pin mechanism (not shown) attached to the lower electrode 13 1.
  • a holding shelf (not shown) for holding the semiconductor wafer W and a temperature control mechanism are provided in the buffer chamber 140 to temporarily store the semiconductor wafer W before processing.
  • the semiconductor wafer W after processing is held and preheated, or the semiconductor wafer W after processing is temporarily held and then cooled as processing.
  • each chamber is evacuated and the pressure is reduced to a predetermined degree.
  • the gate valve 150 between the carrier chamber 120 and the transfer chamber 110 is opened, the wafer transfer device 10 is driven, the articulated arm 11 is extended, and the semiconductor wafer W from the carrier C is extended. Are taken out one by one and transported into the buffer transfer 140.
  • the gate valves 150 of the carrier chamber 120 and the buffer chamber 140 are closed, respectively, and the buffer chamber 150 is closed.
  • a pre-heat treatment is performed as a pre-treatment of the semiconductor wafer W.
  • the articulated arm 11 is operated to take out the semiconductor wafers W one by one from the buffer chamber 140 and transport them onto the mounting table 12 A of the alignment mechanism 12.
  • the rotating carrier 13 is rotated via its drive mechanism 14, and the mounting table 12A of the alignment mechanism 12 is raised and rotated, and the detector and the control are controlled.
  • the semiconductor wafer W is oriented in a predetermined direction by the part.
  • the rotation of the rotary transfer body 13 and the alignment mechanism 12 rotate and transfer the semiconductor wafer W to a position facing a predetermined process chamber 110.
  • the mounting table 12A of the alignment mechanism 12 is lowered, and the semiconductor wafer is transferred to the hand 11D of the articulated arm 11 as shown in FIG. Deliver W.
  • the articulated arm 11 receives the semiconductor wafer W
  • the arm extends and the hand 11 D moves straight, and the gate valve 150 opens.
  • the semiconductor wafer W is transferred to the lower electrode 13 1 in the process chamber 130.
  • the gate valve 1 5 0 closes, predetermined flop plasma treatment in the process chamber one 1 3 within 0 is executed.
  • the rotary carrier 13 rotates in the reverse direction to the position where the alignment mechanism 12 faces the buffer chamber 140.
  • the wafer transfer apparatus 10 repeats the above-described operation of transferring the semiconductor wafer W from the buffer chamber 140 to another process chamber 130 while performing the alignment processing of the semiconductor wafer W.
  • the wafer transfer device 100 transfers the processed semiconductor wafer W into the buffer chamber 140, where it is cooled and then processed.
  • the semiconductor wafer W is transferred into the carrier C in the carrier chamber 120.
  • the wafer transfer device 10 since the wafer transfer device 10 includes the articulated arm 11, the alignment mechanism 12, and the rotary transfer member 13, the transfer of the semiconductor wafer W can be performed.
  • the alignment process can be performed in parallel, and the throughput can be increased as compared with the case where the transport and the alignment process are performed separately. Also, the space dedicated to alignment processing can be reduced, and the footprint of the device itself can be reduced.
  • FIG. 5 is a diagram showing a main part of another embodiment of the present invention.
  • the present embodiment is characterized in that a mounting table having a temperature control mechanism for the semiconductor wafer W is provided instead of the alignment mechanism 12 of the above embodiment, and the rest is configured according to the above embodiment. I have.
  • the mounting table 20 incorporates a surface heater 21 and a coolant passage 22 provided over substantially the entire mounting surface, and when the semiconductor wafer W is preheated, The surface heater 21 is used to circulate the refrigerant in the refrigerant passage 22 when the semiconductor wafer W is cooled.
  • the buffer chamber 140 in the above embodiment can be omitted, and the transfer of the semiconductor wafer W and the preheating or cooling can be performed in parallel.
  • the footprint can be reduced and the throughput can be improved.
  • a temperature control mechanism can be provided in the alignment mechanism.
  • a transfer mechanism having a movement drive mechanism such as an XY stage may be used as a mechanism for holding and transferring an object to be processed such as a semiconductor wafer.
  • the present invention can also be applied to the present invention. In short, the present invention can be widely applied to a process of transporting an object in a semiconductor manufacturing process or the like, without departing from the gist of the present invention.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention porte sur un dispositif de transfert (10) d'un corps à traiter, ce dispositif comprenant un mécanisme de transfert (12) destiné à retenir et supporter un corps à traiter, un mécanisme d'alignement (3) situé près du mécanisme de transfert (12) et alignant un corps à traité (W) envoyé par le mécanisme de transfert (12) dans une direction déterminée, et un corps (11) rotatif destiné à supporter de manière rotative le mécanisme de transfert (12) et le mécanisme d'alignement (13), et tournant en même temps que le mécanisme d'alignement qui positionne le mécanisme de transfert (12) et le corps à traiter (W), ce dernier (W) étant positionné dans un sens déterminé par le mécanisme d'alignement (13). Le processus d'alignement peut s'effectuer simultanément avec le transfert du corps à traiter de façon à augmenter le rendement et réduire l'empreinte.
PCT/JP1999/001765 1998-04-04 1999-04-02 Dispositif de transfert pour corps a traiter WO1999052142A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10/108580 1998-04-04
JP10858098A JPH11288996A (ja) 1998-04-04 1998-04-04 被処理体の搬送装置

Publications (1)

Publication Number Publication Date
WO1999052142A1 true WO1999052142A1 (fr) 1999-10-14

Family

ID=14488427

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1999/001765 WO1999052142A1 (fr) 1998-04-04 1999-04-02 Dispositif de transfert pour corps a traiter

Country Status (2)

Country Link
JP (1) JPH11288996A (fr)
WO (1) WO1999052142A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009037673A2 (fr) * 2007-09-22 2009-03-26 Dynamic Micro Systems Mécanisme intégré de transfert de tranches

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060090703A1 (en) 2004-11-01 2006-05-04 Tokyo Electron Limited Substrate processing method, system and program
JP5031186B2 (ja) * 2004-11-01 2012-09-19 東京エレクトロン株式会社 基板処理方法、基板処理システム及び基板処理プログラム
DE102016118462A1 (de) * 2016-09-29 2018-03-29 Asys Automatic Systems Gmbh & Co. Kg Handhabungsvorrichtung für Substrate, insbesondere Halbleitersubstrate
KR20210080776A (ko) * 2019-12-23 2021-07-01 캐논 톡키 가부시키가이샤 성막 시스템 및 기판 반송 시스템

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07106404A (ja) * 1993-09-29 1995-04-21 Canon Inc 位置決め装置
JPH08255821A (ja) * 1995-03-15 1996-10-01 Metsukusu:Kk シリコンウェハー搬送装置
JPH08321540A (ja) * 1995-03-20 1996-12-03 Tokyo Electron Ltd 位置決め装置および処理システム
JPH0940112A (ja) * 1995-07-26 1997-02-10 Metsukusu:Kk 薄型基板搬送装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07106404A (ja) * 1993-09-29 1995-04-21 Canon Inc 位置決め装置
JPH08255821A (ja) * 1995-03-15 1996-10-01 Metsukusu:Kk シリコンウェハー搬送装置
JPH08321540A (ja) * 1995-03-20 1996-12-03 Tokyo Electron Ltd 位置決め装置および処理システム
JPH0940112A (ja) * 1995-07-26 1997-02-10 Metsukusu:Kk 薄型基板搬送装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009037673A2 (fr) * 2007-09-22 2009-03-26 Dynamic Micro Systems Mécanisme intégré de transfert de tranches
WO2009037673A3 (fr) * 2007-09-22 2009-09-03 Dynamic Micro Systems Mécanisme intégré de transfert de tranches
US7976263B2 (en) 2007-09-22 2011-07-12 David Barker Integrated wafer transfer mechanism

Also Published As

Publication number Publication date
JPH11288996A (ja) 1999-10-19

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