WO1999045403A1

WO1999045403A1 - Ic test apparatus

Info

Publication number: WO1999045403A1
Application number: PCT/JP1999/000968
Authority: WO
Inventors: Tsuyoshi Yamashita; Akihiko Ito
Original assignee: Advantest Corporation
Priority date: 1998-03-02
Filing date: 1999-03-01
Publication date: 1999-09-10
Also published as: DE19980524T1; TW428095B; JPH11248787A; KR20010020333A

Abstract

An IC test apparatus provided with a low- and constant-temperature tank wherein a sealing cover is put on the portion of the tank which encounters the occurrence of dews, or an IC test apparatus provided with a low- and constant-temperature tank and a high- and constant-temperature tank, wherein the occurrence of dews on a circumferential surface of the low- and constant- temperature tank is prevented by supplying the heat of the high- and constant-temperature tank to the circumferential surface of the low- and constant-temperature tank.

Description

Specification

Ic test equipment

Technical field

The present invention relates to an IC test apparatus for performing a test by applying a low-temperature thermal stress to an IC under test, and in particular, proposes a structure for preventing frost or ice from being generated on the outer wall of a low-temperature constant temperature bath due to dew condensation. is there.

Conventional technology

Fig. 1 shows an example of an IC test device equipped with a low-temperature constant temperature bath. In the figure, 20L indicates a low-temperature constant temperature bath. The IC transfer device 21 is built in the low temperature oven 20L. The IC transport device 21 has the lid 22 of the low-temperature constant temperature bath 20L opened, and although not shown in detail in FIG. 1, a tray on which a large number of ICs are mounted is inserted. The mounted IC under test is sucked by a vacuum suction head one or several pieces at a time, moved by the drive belt 24, and placed on a low-temperature plate (not shown) placed on the floor in the low-temperature oven 20L. B) Apply a low-temperature heat stress in the range of 0 to -30 ° C to the IC under test on this low-temperature plate.

The IC under test subjected to the heat stress is again sucked into the vacuum suction head of the handler 21, and the sucked IC is transported to the opening 23 formed in the low-temperature constant temperature bath 20 L, and is tested through the opening 23. The IC is brought into contact with the IC socket 31 placed on the upper surface of the head 30, and the IC under test is electrically connected to the main frame 40 through the IC socket 31 and the cable 32. Perform the test.

Here, the handler 21 is provided with a metal rotary shaft 25 for driving a drive belt 24 as a transport means for moving the vacuum suction head in the X-Y directions. The rotating shaft 25 is inserted, for example, between the opposite heat insulating walls 20W (only one side is shown) of the low temperature constant temperature bath 20 and the end thereof is formed into the wall 20W as shown in FIG. The metal bearing housing 25H fitted and mounted in the formed hole 20A and the metal bearing 25B accommodated in the bearing housing 25H are exposed to the outside. Since the rotating shaft 25 in the low temperature oven 20 is cooled, the exposed portion of the rotating shaft 25, the bearing 25B, the bearing housing 25H containing it, and the insulating wall 20W around them are shown in Fig. 2. As shown in the figure, the inconvenience of frost or ice 2D (hereinafter simply referred to as ice) due to condensation may occur. Occurs. In other words, if the ice 2D adheres, the ice melts and drops as water drops at the end of the test, causing the floor or the like to become dirty, or it enters the tank 20L via the rotating shaft 25, and is fed to the test head. 30 Drops on the upper surface, causing inconvenience such as accidents such as water entering the electrical circuit. For this reason, conventionally, there is a disadvantage that when all the tests are completed, the ice 2D is forcibly removed by hand, and a measure must be taken to prevent the drops from falling as water droplets. Fig. 3 shows another example of an IC tester equipped with a 20L low-temperature oven. In this type of IC testing apparatus, for example, about 64 ICs are mounted on each test tray 11, and the test tray 11 is circulated through the inside of the constant temperature chamber 100 and the external passage, and the port on the external circulation path is provided. The IC under test is loaded on the test tray 11 by the loader section 100A, and the test tray 11 loaded with the IC under test is introduced into the low-temperature oven 20. Cryostat applied to the IC under test such as low temperature thermal stress at 20 teeth, sent into the cryostat 20 teeth ₂ containing the test portion.

IC under test in the test cryostat 20L within ₂ for Te be sampled while being mounted on the test tray is performed, after the test completion is sent to a high temperature thermostatic chamber 20H, the thermal stress at high temperature thermostatic chamber 20H The IC under test is returned to room temperature, discharged again to the external passageway, and the tested IC is reloaded into a general-purpose tray (not shown in the figure) by a fan loader unit 100B while reclassifying it into good and defective products, and one test is performed. Tray 11 Testing of the IC mounted on 1 is completed.

If this is a kind of type of IC tester for testing at low temperatures, the interior of the cryostat 20 and Mr. cryostat 20 teeth ₂ is maintained, for example, one 3 0 ° C as low temperature. Therefore there is a case where the ice is attached due to condensation on the outer wall surface of the cryostat 20 Shito 20 teeth _2. Ice may also adhere to the outlet 32H of the cable K32, and this ice may melt after the test and cause inconvenience.

An object of the present invention is to propose an IC test apparatus equipped with a low-temperature constant-temperature bath, which has a structure capable of preventing the occurrence of dew condensation outside the low-temperature constant-temperature bath during a low-temperature test. Is what you do.

Disclosure of the invention

According to the present invention, a portion where dew condensation occurs can be covered with a sealing cover outside the low temperature constant temperature bath maintained at a low temperature, and the air open to the atmosphere is directly exposed to the portion where dew condensation occurs. In addition to proposing a structure that does not make contact, the IC tester equipped with a low-temperature constant-temperature bath and a high-temperature constant-temperature bath supplies the heat of the high-temperature constant-temperature bath to the outer wall surface of the low-temperature constant-temperature bath or the cable draw-out portion. The present invention proposes an IC test apparatus configured to prevent dew condensation on the outer wall of the low-temperature constant temperature bath or the cable outlet.

According to the IC test apparatus of the present invention, dew condensation does not occur on the outer wall of the low-temperature constant-temperature bath, so that there is no need to remove dew condensation by hand after the test is completed, so that an easy-to-handle IC test apparatus is provided. can do.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a side view for explaining an example of a preferred Ic test apparatus to which the present invention is applied. FIG. 2 is a cross-sectional view for explaining a conventional technique.

FIG. 3 is a schematic perspective view for explaining another type of IC test apparatus suitable for applying the present invention.

FIG. 4 is a sectional view of a main part showing an embodiment of the present invention.

FIG. 5 is a sectional view showing a modification of FIG.

FIG. 6 is a sectional view showing another embodiment of the present invention.

FIG. 7 is a sectional view showing a modified example of FIG.

FIG. 8 is a sectional view showing still another embodiment of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

FIG. 4 shows an embodiment of the present invention. In the embodiment shown in FIG. 4, a case is shown in which the present invention is applied to a portion where the rotating shaft 25, the bearing 25B, the bearing housing 25H, and the like are exposed from the inside of the low-temperature oven 20L. In the example shown in FIG. 4, a box-shaped hermetic cover 12 is covered on the dew condensation portion 2a where dew condensation occurs on the outer wall surface of the wall 20W of the low-temperature constant temperature bath 20L.

The cover 12 is made of a hard material such as metal or plastic, and is formed in a box shape having an opening on one side, and the opening surface is joined to the outer wall surface of the wall 20W around the dew condensation generating portion 2a of the low-temperature constant temperature bath 20L. And seal the condensation generating part 2a. A suitable means such as a screw or an adhesive can be used to attach the cover 12. As a result, the inside and outside of the sealed cover 12 are almost completely shut off both in the outside space and in the low-temperature constant temperature bath 20L.

Cover the dew condensation area 2a with the sealing cover 1 2 and seal as shown in Fig. 4. As a result, the air in contact with members such as the rotating shaft 25, the housing 25B, and the bearing housing 25H is limited to only the air existing inside the sealing cover 12. The air inside the sealed cover 1 2 is gradually cooled and the temperature decreases, but heat is exchanged with the outside air through the surface of the sealed cover 1 2, so that the temperature is between the room temperature and the temperature in the low-temperature thermostat 20 L. Stabilizes at near temperature. In this sealed cover 12, the water vapor that can be supplied to the wall area of the rotating shaft 25, the bearing 25 B, the bearing housing 25, and the surrounding cover 12 is at most The total amount of water vapor is very small, and even if all the water vapor is condensed, the amount of condensation is significantly smaller than that of conventional equipment. In addition, since the temperature inside the cover 12 is much higher than the temperature inside the low-temperature oven 20L, the occurrence of dew condensation on the outer surface of the cover 12 is also reduced, and there is no need to treat dew. It will be easier.

Fig. 5 shows the case where the present invention is applied when the low temperature oven 20L and the high temperature oven 20H are adjacent to each other. The higher the temperature of the air, the higher the saturation humidity, and the more air it can contain. Therefore, dew condensation is particularly likely to occur on the surface of the low-temperature oven 20 close to the high-temperature oven 20H. In the case of Fig. 5, the boundary between the low temperature oven 20L and the high temperature oven 20H is the dew condensation part 2a. Therefore, if the sealing cover 12 is put on the dew condensation generating portion 2a.

FIG. 6 shows a case where the present invention is applied to an IC test apparatus of the type shown in FIG. Fig. 6 shows the vertical cross section of the test equipment. As explained in Fig. 3, the test tray 11 with the IC under test is inserted into the low-temperature oven 20 at the highest position, and It is moved and cooled during this time. Torei 1 1 lowermost position is moved in the horizontal direction, into the cryostat 20L _2. Here, the IC is tested, and then inserted into the lowest position of the high-temperature oven 20H. The IC in the tray is heated to room temperature while being moved to the uppermost position, and then is taken out by horizontal movement. In this embodiment supplies by the blower 105 to a portion of the heat released from the hot thermostatic chamber 20H to the peripheral surface of the cryostat 20 Shito 20 teeth _2, to raise the surface temperature to a temperature at which no condensation by the hot air It is composed. Thus the hot air it is possible to suppress the generation of dew condensation by spraying the cryostat 20 Shito 20L ₂ of surface.

The embodiment shown in FIG. 6 may be combined with the embodiment shown in FIG. That is, As shown by the line, a sealing cover 12 is provided so as to surround the dew condensation portion 2a on the upper surface of the low temperature oven 20L ₂ adjacent to the high temperature oven 20H, and the temperature from the blower 105 is provided on the upper surface of the cover 12. It is configured to blow the wind.

FIG. 7 shows a modification of the embodiment shown in FIG. In the embodiment shown in FIG. 7, a tube 106 is piped along the inner wall of the high-temperature bath 20H, compressed air is sent from the air conditioner 107 into the tube 106, and the warm air 108 discharged from the outlet of the tube 106 is cooled at a low temperature. An example is shown in which the configuration is such that dew condensation is prevented by injecting water onto the peripheral surfaces of the constant temperature baths 20 and 20, particularly at a portion where dew condensation occurs. This embodiment may be implemented in combination with the embodiment shown in FIG. That is, a sealed cover 12 surrounding the dew condensation portion 2a on the upper surface of the low temperature constant temperature bath 20L ₂ adjacent to the high temperature constant temperature bath 20H is provided as shown by a broken line, and the hot air from the tube 106 is provided on the upper surface of the cover 1 2. Spray.

Figure 8 shows the case of applying the invention of the cable outlets 32H Nico drawn from cryostat 20L ₂ shown in FIG. In this case, the cable outlet 32H is sealed with a heat-insulating bush 109, and one side of the L-shaped heat transfer plate 11 1 is brought into contact with the closed surface of the bush 109, and the other surface perpendicular to it is kept at high temperature and temperature. The structure was screwed to the wall of tank 20H.

Since the heat of the high temperature thermostatic chamber 20H This structure is transmitted to the bushing 109 through the heat transfer plate 1 11 can be higher than the temperature of the internal temperature of the cryostat 20L ₂ of the bushing 109. As a result, it is possible to prevent moisture from condensing even when the bush 109 is brought into contact with air containing moisture. The embodiment of FIG. 8 can be implemented in combination with any of the embodiment of FIG. 6 and the embodiment of FIG.

The invention's effect

As described above, according to the present invention, in an IC test apparatus provided with a low-temperature constant-temperature bath, dew condensation is prevented from occurring outside the low-temperature constant-temperature bath, and if dew condensation occurs, a measure is taken at the end of the test. Necessary items can be omitted. Therefore, an easy-to-handle IC test apparatus can be constructed, and its effect is extremely large for practical use.

Claims

The scope of the claims

1. In an IC test apparatus that performs a test by applying a low-temperature thermal stress to an IC under test inside a low-temperature constant temperature chamber,

An IC test device, characterized in that a dew condensation portion on the outer wall of the low-temperature constant temperature bath is provided with a sealing cover for covering the dew condensation portion.

2. In the IC test apparatus according to claim 1, a hole is formed through the wall of the low-temperature constant temperature bath so as to penetrate outside, and one end of a rotating shaft that constitutes a driving means for transporting the IC is exposed from the hole. A bearing means for rotatably holding one end of the rotating shaft is provided, and the dew condensation generating section, which is surrounded and sealed by the sealing cover, includes one end of the rotating shaft, the bearing means, and Including the surrounding area.

3. The IC test apparatus according to claim 1, wherein the low-temperature constant temperature bath is provided adjacent to the high-temperature constant temperature bath, and the dew condensation portion surrounded and sealed by the sealing cover is the high-temperature constant temperature bath of the low-temperature constant temperature bath. And the outer surface of the adjacent wall.

4. Perform the test by applying a low-temperature thermal stress to the IC under test inside the low-temperature constant-temperature chamber, and after discharging the test, apply heat to the IC under test in the high-temperature constant-temperature chamber to return it to normal temperature, and In an IC tester that discharges ICs from the high-temperature oven, the heat of the high-temperature oven that applies heat to the tested ICs is distributed to the outer wall of the low-temperature oven, and dew forms on the outer wall of the low-temperature oven. An Ic test apparatus characterized by having a structure that does not generate any cracks.

5. The IC test apparatus according to claim 4, wherein the low-temperature constant temperature bath is provided adjacent to the high-temperature constant temperature bath, and the dew condensation portion surrounded by the sealing cover is sealed with the high-temperature constant temperature bath of the low-temperature constant temperature bath. The outer surface of the wall adjacent to the thermostat.

6. In the IC test apparatus according to claim 4 or 5, the heat discharged from the high-temperature bath is heat released from an outer wall of the high-temperature bath.

7. The IC test apparatus according to claim 4 or 5, wherein the heat discharged from the high-temperature bath is heat supplied by hot air through a tube that is piped into the high-temperature bath and led out. .

8. The IC test apparatus according to claim 4 or 5, wherein heat is transferred from a wall surface of the high temperature constant temperature bath to a periphery of a cable outlet drawn from the low temperature constant temperature bath. Transmission means is provided.

9. The IC test apparatus according to claim 8, wherein the heat transfer means has a first plate portion, one end of which is in surface contact with a wall surface of the high temperature constant temperature bath, and a substantially L-shape formed from one end edge of the first plate portion. And an L-shaped fitting having a second plate portion which is integrally extended so as to be in contact with the periphery of the cable outlet.