JPH11248787A - Ic testing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC testing apparatus which can prevent the generation of dew formation in the outer part of a low-temperature thermostat during a test at a low temperature by a method wherein an airtight cover is placed on a part which generates dew formation. SOLUTION: An airtight cover 12 is placed on a dew-formation generation part 11 in which dew formation is generated on the outer. wall of a low- temperature thermostat TON. The airtight cover 12 is formed of a rigid material such as, e.g. a metal, a plastic or the like so as to be a box shape one face of which is opened. Its opening face is bonded to the dew-formation generation part 11 in the low-temperature thermostat TON so as to seal up the dew- formation generation part 11. Thereby, the air which comes into contact with members such as a shaft JKU, a housing HUG, a bearing BR and the like is limited to only the air which exists at the inside of the airtight cover 12. Then, the air inside the airtight cover 11 is cooled gradually, and the generation of dew formation is suppressed at the inside and the outside of the airtight cover 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC test apparatus for performing a test by applying a low-temperature thermal stress to an IC under test, and more particularly, to a structure for preventing the occurrence of dew condensation on the outer wall of a low-temperature oven. It is.

[0002]

2. Description of the Related Art FIG. 6 shows an example of an IC test apparatus provided with a low-temperature constant temperature bath. In the figure, TON indicates a low-temperature constant temperature bath. The IC transport device HAND is built in the low temperature constant temperature bath TON. Although the IC transfer device HAND is not shown in detail in FIG. 6, a tray on which a large number of ICs to be tested are mounted is inserted on the side of the low-temperature constant temperature bath TON where the open / close lid DOR is attached, and the test target mounted on this tray is mounted. One or several ICs are sucked by a vacuum suction head and arranged on a low-temperature plate arranged on the floor of the low-temperature constant temperature bath TON, and a low-temperature thermal stress is applied to the IC under test on the low-temperature plate.

The IC under test to which the thermal stress has been applied is sucked again by the vacuum suction head, and the sucked IC is carried to the opening WIN formed in the low temperature constant temperature bath TON.
IC placed on top of test head TSH through IN
The IC is brought into contact with the socket SK, and the IC under test is connected to the mainframe MIN through the IC socket SK and the cable KB.
, And a test of the IC under test is executed.

In the handler HAND, a rotary shaft JKU or the like is provided as a drive mechanism of a transfer means for moving the vacuum suction head in the XY directions. The rotating shaft JKU is, for example, inserted between the wall surfaces of the low-temperature constant temperature bath TON, and its ends are provided with a bearing BR and a housing HUG as shown in FIG.
And is exposed to the outside. As a result, there is a problem that the dew condensation KTU adheres to the exposed portion of the rotation shaft JKU as shown in FIG. That is, when the dew condensation KTU adheres, the dew drops at the end of the test and drops as water droplets, thereby contaminating the floor or the like, or dropping on the upper surface of the test head TSH and causing water to enter the electric circuit portion. Occurs.
For this reason, conventionally, there is a disadvantage that when all tests are completed, dew condensation must be forcibly removed by hand and a measure must be taken to prevent the condensation from falling as water droplets.

FIG. 8 shows another example of an IC test apparatus having a low-temperature constant temperature bath TON. In this type of IC test apparatus, for example, about 64 ICs are mounted on a test tray TST, and the test tray TST is circulated through the inside of the thermostat 100 and an external passage, and a test object is tested by a loader unit A on an external circulation path. I
C on the test tray TST and the IC under test
Is loaded in the test tray TST.
Introduced in 1. For example, a low temperature thermal stress is applied to the IC under test in the low temperature oven TON-1 and the IC is sent to the low temperature oven TON-2 containing the test unit.

[0006] In the low temperature oven TON-2 for testing, the IC under test is tested while being mounted on the test tray, and after completion of the test, is sent to the high temperature oven HON. Is removed, the IC under test is returned to room temperature, discharged again to the external passage, and the tested ICs are reloaded into a general-purpose tray (not shown in the drawing) by the loader unit B while being sorted into a non-defective product and a non-defective product, so that one test tray is obtained. TST
The test of the IC mounted on the is completed.

When a test is performed at a low temperature in this type of IC test apparatus, the insides of the low-temperature constant temperature baths TON-1 and TON-2 are maintained at a low temperature of, for example, about -30.degree. For this reason, dew condensation may occur on the outer wall surfaces of the low temperature constant temperature baths TON-1 and TON-2. Also cable KB
Condensation may also occur at the outlet KBH, and the dew may melt after the test to cause inconvenience.

[0008] It is an object of the present invention to provide a low-temperature constant-temperature bath.
An object of the present invention is to propose an IC test apparatus having a structure capable of preventing dew condensation from occurring outside a low-temperature constant-temperature bath during a low-temperature test in a C test apparatus.

[0009]

According to the present invention, outside of a low-temperature constant temperature bath maintained at a low temperature, a portion where dew condensation occurs can be covered with a sealing cover, and air released to the atmosphere is directly applied to a portion where dew condensation occurs. In addition to proposing a structure that does not make contact, the IC tester equipped with a low-temperature constant-temperature chamber and a high-temperature constant-temperature chamber distributes heat from the high-temperature constant-temperature chamber to the outer wall surface or the cable outlet of the low-temperature constant-temperature chamber. It is an object of the present invention to provide an IC test apparatus configured so as not to cause dew condensation on an outer wall of a bath or a cable drawing portion.

According to the IC test apparatus of the present invention, since dew condensation does not occur on the outer wall of the low-temperature constant-temperature bath, there is no need to remove dew condensation by hand after completion of the test, so that the IC test apparatus is easy to handle. Can be provided.

[0011]

FIG. 1 shows an embodiment of the present invention. In the embodiment shown in FIG. 1, a case is shown in which the present invention is applied to a portion where the rotating shaft JKU, the housing HUG, the bearing BR and the like are exposed from the inside of the low-temperature constant temperature bath TON. FIG.
In the example shown in FIG. 5, the sealing cover 12 is covered by the dew condensation generating portion 11 where dew condensation occurs on the outer wall of the low temperature constant temperature bath TON.

The cover 12 is made of a hard material such as metal or plastic, and is formed in a box shape having an opening on one side, and the opening surface is joined to the dew condensation generating portion 11 of the low temperature constant temperature bath TON. Allow to seal. An appropriate means such as a screw or an adhesive can be used to attach the cover 12. As shown in FIG.
2, the air in contact with members such as the rotating shaft JKU, the housing HUG, and the bearing BR is limited to air existing inside the sealing cover 12. Although the air inside the sealing cover 12 is gradually cooled and its temperature is lowered, the heat is exchanged with the outside air through the surface of the sealing cover 12, so that the temperature does not drop extremely and stabilizes at a temperature close to room temperature. . Therefore, the occurrence of dew condensation is suppressed both inside and outside of the sealing cover 12, and it is not necessary to treat the dew condensation, thereby facilitating the handling.

FIG. 2 shows a low-temperature oven TON and a high-temperature oven HO.
The case where the present invention is applied when N exists adjacently is shown. In this case, the low-temperature oven TON and the high-temperature oven HO
The boundary part of N becomes the dew condensation generating part 11. Therefore, it is sufficient to cover the dew condensation portion 11 with the sealing cover 12. FIG. 3 shows a case where the present invention is applied to an IC test apparatus of the type shown in FIG. In this case, part of the heat released from the high-temperature oven HON is distributed to the peripheral surface of the low-temperature ovens TON-1 and TON-2 by the blower 105, and the low-temperature oven TON-1 is supplied.
And the surface temperature of the low-temperature constant temperature baths TON-1 and TON-2 is raised to a temperature at which dew condensation does not occur due to the hot air while dew condensation is about to occur on the outer peripheral surface of the TON-2.

As described above, even when hot air is distributed to the surfaces of the low-temperature constant temperature baths TON-1 and TON-2, the occurrence of dew condensation can be suppressed. FIG. 4 is a modification of the embodiment shown in FIG.
In the embodiment shown in FIG. 4, a tube 106 is piped along the inner wall in the example of the high-temperature constant-temperature bath HON.
6, compressed air is sent from the air compressor 107,
A case is shown in which the warm air 108 discharged from the outlet of the tube 106 is injected to the peripheral surfaces of the low-temperature constant temperature baths TON-1 and TON-2, particularly to a portion where dew condensation occurs, to prevent the dew formation.

FIG. 5 shows a case where the present invention is applied to a cable outlet KBH drawn out of a low-temperature constant temperature bath TON-2. In this case, the cable outlet KBH is sealed with a heat-insulating bush 109, and the heat transfer plate 111 is brought into contact with the closed surface of the bush 109, and the end of the heat transfer plate 111 is attached to the wall member of the high-temperature constant temperature bath HON. It has a screwed structure.

According to this structure, the heat of the high temperature oven HON is transmitted to the bush 109 through the heat transfer plate 111, so that the temperature of the bush 109 is reduced to the low temperature oven TOH-.
2 can be higher than the internal temperature. As a result, it is possible to prevent moisture from condensing even when air containing moisture contacts the bush 109.

[0017]

As described above, according to the present invention, in an IC test apparatus provided with a low-temperature constant-temperature bath, the occurrence of dew condensation outside the low-temperature constant-temperature bath is prevented, and the test ends when the dew condensation occurs. Items that must be dealt with sometimes can be omitted. Therefore, an easy-to-handle IC test apparatus can be constructed, and the effect is extremely large for practical use.

[Brief description of the drawings]

FIG. 1 is a sectional view of a main part showing one embodiment of the present invention.

FIG. 2 is a sectional view showing a modification of FIG. 1;

FIG. 3 is a sectional view showing another embodiment of the present invention.

FIG. 4 is a sectional view showing a modified example of FIG. 3;

FIG. 5 is a sectional view showing still another embodiment of the present invention.

FIG. 6 is a side view for explaining an example of a preferred IC test apparatus to which the present invention is applied.

FIG. 7 is a sectional view for explaining a conventional technique.

FIG. 8 is a schematic perspective view for explaining another type of IC test apparatus suitable for applying the present invention.

[Explanation of symbols]

 HAND Handler MIN Main frame TON, TON-1, TON-2 Low temperature oven HON High temperature oven TSH Test head SK IC socket KTU Condensation 11 Condensation generating part 12 Sealing cover

Claims (3)

[Claims] 1. An IC test apparatus for performing a test by applying a low-temperature thermal stress to an IC under test inside a low-temperature constant-temperature bath, wherein the dew-condensation generating portion on the outer wall of the low-temperature constant-temperature bath covers the dew condensation generating portion. An IC test apparatus having a structure with a cover attached. 2. A test is performed by applying a low-temperature thermal stress to the IC under test inside the low-temperature oven, and after the test is completed, heat is applied to the IC under test in a high-temperature oven to return to normal temperature. An IC testing apparatus having a structure for discharging a tested IC from a high-temperature oven, wherein the heat of the high-temperature oven for applying heat to the tested IC is distributed to an outer wall surface of the low-temperature oven, and an outer wall surface of the low-temperature oven is provided. An IC test apparatus characterized by having a structure in which dew condensation does not occur. 3. The IC test apparatus according to claim 2, wherein
An IC test apparatus having a structure in which heat of the high-temperature constant-temperature bath is transmitted to an outlet of a cable drawn from the low-temperature constant-temperature bath to prevent dew condensation from occurring at the cable outlet.