KR20020074845A - Heating chamber of handler for testing module IC - Google Patents

Abstract

PURPOSE: A heating chamber of a module IC test handler is provided, which improves a reliability in a high temperature by making a uniform temperature distribution in the heating chamber rapidly as occupying a small space on a motherboard of the handler. CONSTITUTION: A module IC test handler performs a test by mounting a plurality of module ICs(1) on sockets of a mother board. According to the heating chamber(100), a chamber housing(110) is installed around the socket of the mother board and seals up the module ICs mounted on the mother board. A radiation heater(120) is installed on an upper part in the chamber housing and generates a radiation. A metallic heat dissipation plate(130) is installed on a lower part of the radiation heater and is heated by the radiation of the radiation heater. And a plurality of ventilation fans(141,142,143,144) are installed on one side of the heat dissipation plate and convects a heat of the heat dissipation plate into the chamber housing by force.

Description

Heating chamber of handler for testing module IC

The present invention relates to a heating chamber used for high temperature testing in a module IC test handler, and more particularly to a module IC test handler that makes it possible to test module ICs mounted on a motherboard of a module IC test handler under high temperature environmental conditions. It relates to a heating chamber of.

In general, a module IC is composed of independent circuits by soldering and fixing a plurality of ICs (ICs) and other devices on a single substrate. Such module ICs play a very important role among various components mounted on a motherboard. Therefore, it is essential to go through the process of getting an abnormal state more precisely by a dedicated handler before using it.

1 of the accompanying drawings shows a configuration of a module IC mounting test handler for directly testing the module IC as described above mounted on the motherboard.

As shown in FIG. 1, the module IC mounting test handler includes a loading unit 2 in which user trays (not shown) in which a plurality of module ICs are stored are vertically stacked in two rows, and A DC test unit 3 installed on a base and receiving a module IC stored in a user tray of the loading unit 2 to perform a test such as a short inspection, and a DC test unit installed on one side of the DC test unit If a defect is found in the test unit, the DC unit is provided with a buffer unit 4 for temporarily storing the good product and the defective product according to the state of the module IC tested and a plurality of motherboards M for mounting test. A test site (5; test site) for performing a test after mounting the module IC, which is primarily tested in the unit, to the socket (S) of the motherboard (M), and a module tested in the test site (5) The unloading unit 7 in which the shipping trays (not shown) on which the module ICs determined to be good are mounted among these are loaded, and the trays which classify and store the module ICs determined as defective or re-inspected by the test grades are classified and stored according to the grade. The loaded reject unit 6 and the module IC are transferred from the loading unit 2 to the respective components such as the DC test unit 3, the test site 5, and the unloading unit 7. It consists of a picker robot (not shown).

On the other hand, in the module IC test handler as described above is to test whether the module IC is functioning even under extreme temperature conditions through a high temperature test, the socket of the motherboard (M) for this high temperature test (not shown) The module ICs mounted in the are placed under predetermined temperature conditions in a space enclosed by the heating chamber.

2 and 3 show a conventional heating chamber structure that performs this role, the heating chamber is a chamber housing 10 of the rectangular box-shaped open side toward the motherboard (M) on the motherboard (M) It is pivotally installed on one side of the chamber housing 10, the cartridge heater 11 for generating heat and the cross-flow fan 12 for blowing the heat generated from the cartridge heater 11 toward the module IC (1) (Cross flow fan) is installed.

Therefore, during the high temperature test, the housing 10 rotates around its hinge axis to generate heat from the cartridge heater 11 while covering the portion where the module IC 1 is mounted to seal the module ICs 1. Test will be performed.

However, in the conventional heating chamber as described above, since the cartridge heater 11 using the heat conduction method is used as the heating means, a blower fan that always blows the heat of the cartridge heater toward the module IC should be installed near the cartridge heater. And, accordingly, when the design of the housing had to always secure the installation space of the blowing fan, the size of the housing was large, there was a problem that the installation on the motherboard is not easy.

In addition, the temperature near the cartridge heater is high because the heat supply is high, but the temperature is low because the heat supply is relatively low on the far side of the cartridge heater, there is a problem that the temperature distribution inside the heating chamber is not uniform.

Accordingly, the present invention has been made to solve the above problems, by improving the reliability in high temperature test by allowing the temperature distribution inside the heating chamber to be made uniformly within a short time while occupying little space on the handler's motherboard. The purpose is to provide a heating chamber of a modular IC test handler.

1 is a plan view from above showing the configuration of a general module IC handler

Figure 2 is a plan view showing a conventional heating chamber structure used in the handler of Figure 1

3 is a longitudinal sectional view of the heating chamber of FIG. 2 seen from the side;

Figure 4 is a perspective view showing a heating chamber structure of the present invention

5 is a cross-sectional plan view of the heating chamber of FIG.

FIG. 6 is a longitudinal sectional view seen from the side of the heating chamber of FIG. 4. FIG.

Explanation of Reference Symbols in Major Parts of Drawings

1-module IC 100-heating chamber

110-chamber housing 115-hinged shaft

120-Halogen Heater 130-Heat Sink

131-through grooves 141, 142, 143, 144-axial fans

In order to achieve the above object, the present invention, in the handler for mounting a plurality of module IC to the socket of the motherboard to perform the test, rotatably installed near the socket of the motherboard mounted on the motherboard A box-shaped chamber housing configured to seal the module IC so as to be opened and closed, a radiant heat heater provided at an inner upper portion of the chamber housing to generate radiant heat, and a metal material installed below the radiant heat heater and heated by radiant heat of the radiant heat heater. The heat sink of the, and provided on one side of the heat sink provides a heating chamber of the module IC test handler, characterized in that it comprises a plurality of blower fan for convection the heat of the heat sink into the chamber housing.

Here, the radiant heat heater is a halogen heater, a plurality of through grooves are formed in the heat sink to deviate from the radiant heat heater, so that the radiant heat emitted from the halogen heater can be discharged to the lower chamber chamber.

In addition, according to the present invention, the blower fan is characterized in that the plurality of axial flow fan is provided opposite to both sides of the chamber housing.

Hereinafter, a preferred embodiment of a heating chamber of a module IC test handler according to the present invention will be described in detail with reference to the accompanying drawings.

For reference, in the following description, the same or similar parts as in the prior art of the handler elements are denoted by the same reference numerals as in the prior art, and the detailed description thereof is omitted.

4 to 6 show the structure of the heating chamber 100 of the present invention, and the lower side of the chamber housing 110 in the form of a rectangular box in which the bottom side thereof is opened near the socket S of the motherboard M has a hinge shaft ( 115 is pivotally installed to open and close the module ICs 1 mounted on the socket S. As shown in FIG.

A plurality of halogen heaters 120 are installed in the upper portion of the chamber housing 110 in the module IC installation direction to radiate radiant heat during a high temperature test, and a heat sink 130 made of metal is immediately below the halogen heaters 120. ) Is installed to be heated by the radiant heat emitted from the halogen heater (120).

In addition, four axial flow fans 141, 142, 143, and 144 are installed in pairs on both sides of the inner side of the chamber housing 110 to force convection of heat inside the chamber housing 110. The pair of fans 141, 142, 143, 144 preferably blows heat in different directions.

On the other hand, the heat sink 130 is provided with a plurality of through grooves 131 in a position shifted from the halogen heater 120, these through grooves 131 is a heat sink heated by the radiant heat of the halogen heater 120 By discharging the high heat of the upper side to the lower side 130, the heat is diffused into the chamber housing 110 in a faster time.

Here, the reason why the through groove 131 is formed at a position shifted from the halogen heater 120 is to prevent the radiant heat of the halogen heater 120 from being directly transmitted to the module IC 1.

In addition, the chamber housing 110 is made of a synthetic resin material such as plastic for heat insulation, but the inner wall of the chamber housing is padded with a metal plate 111 to increase heat generation therein, and the lower edge of the chamber housing 110. The packing material 112 is attached to the chamber housing 110 to maintain the airtight when the module IC sealed.

In addition, a temperature sensor (not shown) for detecting an internal temperature is installed at a predetermined position inside the chamber housing 10.

On the other hand, although not shown in the drawings, the outer surface of the chamber housing 110 is tested when the motherboard (M) is withdrawn from the test site 5 (see Fig. 1) for mounting the module IC on the motherboard (M) An actuation mechanism is provided for pivoting the chamber housing 110 in conjunction with a portion of the site 5.

The heating chamber as described above operates as follows.

First, in a state where the motherboard M is drawn out of the test site 5, the module ICs 1 are mounted in the socket S of the motherboard M, and then the motherboard M is connected to the test site 5. When it is reintroduced into the inside, the heating chamber 100 is swiveled by an operating mechanism (not shown) of the heating chamber to seal the portion where the module ICs 1 are mounted.

Subsequently, when the test proceeds, radiant heat is generated by the halogen heater 120 to heat the heat sink 130, and the heat generated in the heat sink 130 is chambered by the axial fans 141, 142, 143, and 144. Spread evenly inside the 110 to heat the module IC.

At this time, the heat of the upper portion of the heat sink 130 is introduced into the lower through the through groove 131 of the heat sink 130 to further promote the temperature rise.

The temperature inside the chamber housing 110 is measured and controlled by a temperature sensor (not shown) installed therein.

On the other hand, although the halogen heater is used as the heat generating means in the above-described embodiment, all heaters using radiant heat may be applied thereto.

As described above, according to the present invention, since the heat sink is heated by the radiant heat of the radiant heat heater such as halogen heater, the heat is spread evenly inside the chamber housing by the blowing fan, so that the temperature distribution inside can be made relatively uniform. Since the internal temperature can be adjusted to the desired temperature in a shorter time than the conventional conductive heat heater, the test reliability is improved and the test time can be shortened at the time of high temperature test.

Claims (4)

In the handler that performs a test by mounting a plurality of module IC to the socket of the motherboard, A box-shaped chamber housing rotatably installed near the socket of the motherboard to open and close the module IC mounted on the motherboard, and a radiant heat heater installed on the inner upper portion of the chamber housing to generate radiant heat; And a heat dissipation plate of a metal material installed under the radiant heat heater and heated by radiant heat of the radiant heat heater, and a plurality of blower fans installed on one side of the heat dissipation plate to force convection of heat from the heat dissipation into the chamber housing. Heating chamber of modular IC test handler. The heating chamber of claim 1, wherein the radiant heat heater is a halogen heater. The heating chamber of a module IC test handler according to claim 1 or 2, wherein the heat dissipation plate has a plurality of through grooves formed at positions displaced from the radiant heat heater. 3. The heating chamber of claim 1 or 2, wherein the blowing fan is a plurality of axial flow fans installed opposite to both sides of the chamber housing.