JP3194483B2 - Burn-in test method and burn-in test apparatus - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a burn-in test method and a burn-in test method.
The present invention relates to a burn-in test apparatus , and more particularly to a burn-in test method and a burn-in test method, in which a plurality of electronic components mounted on a printed circuit board are maintained at a constant temperature for a predetermined time while being energized.
Test equipment .

2. Description of the Related Art In an IC (integrated circuit) or the like, in order to remove an initial failure of the IC, an IC chip is energized under a temperature condition of about 150 ° C. to accelerate the IC.
A burn-in process for promoting an absolute change in C is performed.

In such a burn-in process, an IC
It is required to keep the chip at a constant temperature.

[0004]

2. Description of the Related Art FIG. 8 shows a block diagram of a burn-in device.
In the drawing, reference numeral 1 denotes a printed board for burn-in. A plurality of sockets 1a are mounted on the burn-in printed board 1, as shown in FIG. Socket 1a is printed board 1
Is connected to the connection portion 1c formed at the edge portion by the conductive pattern 1b formed at the edge portion.

An IC chip 2 to be subjected to burn-in processing is mounted on the socket 1a. A drive signal input from the connection portion 1c is supplied to the IC chip 2 via the conductive pattern 1b and the socket 1a. The IC chip 2 operates experimentally by the drive signal. The printed board 1 is a device 4
It is inserted into and held by the card edge connector 3 provided in the accommodating portion 4a.

A fan 4b and a temperature control device 4c are provided in the device 4 to blow air heated or cooled to a constant temperature into the storage portion 4a, and the temperature at the IC chip 2 on the printed board 1 ( Junction temperature: Tj) is 150
°, the entire atmosphere in the storage section 4a was controlled to a constant temperature.

In the case of such a conventional burn-in apparatus, since the temperature is controlled only by the thermal operation section of the apparatus main body, the heat generation of the device is increased, the package having a large air resistance, and the inside of the tank provided by these are increased. ambient temperature: variation in T _a occurs. In order to cope with this variation, the blowing capacity of the atmosphere circulation fan 4b is increased, or the setting of the ambient temperature in the tank is changed according to the variation. In addition, for a package having a large thermal resistance (Tj = 150 ° C.), the temperature setting is changed, for example, by setting a lower ambient temperature.

Further, in order to improve the heat radiation characteristics, a method of mounting a heat radiation fin 5 dedicated to the test process as shown in FIG. 10 by using a fixing metal 6 so as to sandwich the IC between the heat radiation fin 5 and the socket 1a. Was also considered.

[0009]

However, in the conventional burn-in apparatus, the controllability and accuracy of the temperature (T _j ) of the IC are:
(Because there is no other thermal operation function), it depends only on the thermal capabilities (cooling, heating, air blowing, etc.) of the device main body.

However, the recent trend of high integration of ICs / LSIs is remarkable, and accordingly, the power (power consumption) of these ICs is also remarkable.

An IC having a large power generates a large amount of heat.
The temperature of the IC cannot be kept constant unless the necessary temperature control (cooling) capability is taken into consideration, and the temperature rises excessively, and the necessary B / I conditions cannot be obtained.

If the air blowing capacity is not sufficient, a temperature difference is generated between the front and rear and upper and lower sides of the circulation path of the atmosphere, and the temperature of the IC also differs depending on the position. This also becomes more pronounced for ICs that generate more heat.

[0013] The diversification of packages is also remarkable.
Like TAB (Tape Automaded Bonding) package
Chip temperature (T_j) And ambient temperature (T_aHeat resistance between
Anti (: R _ja[° C / W])
Yes, necessary T_jTo obtain the ambient temperature T_aKana
Control or lower the chip heat dissipation.
It is necessary to consider the means of:

In the case of a package having a large radiating fin portion, the fin itself is a pressure loss element for circulating the atmosphere in the tank. If the air blowing capacity of the device is not sufficient, the IC has a temperature difference depending on its position, and the target (necessary) ) The temperature may be higher or lower.

As described above, the realization of the (temperature) conditions required for the BI process is becoming stricter, but the thermal capabilities of the apparatus are limited, and in the current system, each individual in the apparatus is limited. Thermal conditions (cooling or heating,
It is becoming difficult to stably apply air blow.

The present invention has been made in view of the above points, and has been made to cool, heat, and cool an electronic component from the vicinity of the electronic component.
A burn-in test method and a burn-in test device capable of accurately and efficiently setting and maintaining the temperature of various IC device packages by having a temperature module for performing a thermal operation such as air blowing. The purpose is to provide.

[0017]

SUMMARY OF THE INVENTION The present invention is directed to a burn-in
Mounting an electronic component to be tested on a substrate; and
Controlling the temperature of the electronic component mounted on the
Performing a burn-in process on the electronic component under a temperature environment
And dividing the substrate into a plurality of portions, and for each of the portions,
It is characterized by performing temperature control. Also attached to the board
Temperature control for each of the selected electronic components.
You.

[0018]

According to the present invention , a test is performed on a burn-in substrate.
The temperature of the electronic components mounted on the board
Control the burn-in of electronic components under the desired temperature environment
When performing processing, the substrate is divided into multiple parts,
Or, perform temperature control for each electronic component mounted on the board
This enables fine temperature control and reliability of the test.
Can be improved.

[0019]

FIG. 1 is a perspective view showing an embodiment of the present invention. In the figure, reference numeral 7 denotes a printed board on which a plurality of sockets 8 and connectors 9 are mounted.

The plurality of sockets 8 and connectors 9 are connected to connection portions 7b formed at the edge portions by conductive patterns 7a formed on the printed board 7.

An IC 10 as an electronic component for performing a burn-in process is inserted into the socket 8. The connector 9
Is mounted with a temperature module 11.

As shown in FIG. 2, the temperature module 11 has a plurality of openings 11a, and a blower fan 11b is provided in each of the plurality of openings 11a.

The temperature module 11 is provided with a connection portion 11c for engaging with the connector 9.
Reference numeral 1 denotes a connector that is held by the printed board 7 by inserting the connecting portion 11 c into the connector 9 and electrically connects the printed board 7 and the temperature module 11 via the connector 9.

The connection portion 7b of the printed board 7 is inserted into a card edge connector 12 connected to a control device (not shown) shown in FIG.
A signal for driving and controlling the fan 10 and a signal for driving the blower fan 11b constituting the temperature module 11 are supplied.

The printed circuit board 7 on which the temperature module 11 is provided is installed in a thermostat, and the IC 10 is operated at a required temperature (Tj).
= 150 ° C.), and burn-in processing is performed for a required time (generally about 48 to 196 hours, which depends on the IC).

By providing the temperature module 11 composed of a plurality of blower fans 11b on the printed board 7 as described above, it is possible to blow air to the IC 10 from a direction in which air is efficiently blown (generally right above). The heat radiation and heat absorption of the IC 10 can be promoted, and the shortage / variation in the air flow of the BI apparatus main body can be compensated. At this time, the blowing direction (angle) is set according to the package and the BI conditions.

FIG. 3 is a block diagram showing a main part of a second embodiment of the present invention. In the figure, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof will be omitted. In this embodiment, a temperature module 11 is provided with a heater 11d in addition to a blower fan 11b.

The heater 11d has a grid-like frame 11d-
1 has a configuration in which a heating wire 11d-2 is wound.

The lattice pitch of the frame 11d-1 is provided, for example, in correspondence with the pitch of the ICs 10 arranged on the printed board 7. The fan 11 is connected to the heating wire 11d-2.
Similarly, the driving power is supplied via the connector 9 to heat the heating wire 11b-2. By rotating the blower fan 11b, the air heated by the heater 11d is blown in the direction of the arrow in FIG.
The temperature of C10 is maintained at a burn-in temperature of about 150 ° C.

FIG. 4 is a schematic block diagram of a third embodiment of the present invention. In the figure, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals, and description thereof will be omitted.

The present embodiment is used for an IC having a particularly large power.
And a heat sink 11e.

The heat sink 11e is formed by integrally forming a cooling portion 11e-1 in contact with the IC 10 and a heat radiating portion 11e-2 provided on the blower fan 11b side to radiate heat via a metal plate 11e-3.

By blowing air from the blower fan 11b as shown in FIG. 4 (B), heat is radiated from the heat radiating portion 11e-2, the cooling portion 11e-1 is cooled, cooling of the IC 10 is promoted, and the temperature of the IC 10 is required. Burn temperature (about 150
(° C).

With such a configuration, the temperatures of all the ICs 10 on the printed board 7 can be efficiently maintained substantially uniformly.

FIG. 5 shows a block diagram of a fourth embodiment of the present invention. 5, the same components as those in FIGS. 1, 2, and 4 are denoted by the same reference numerals, and the description thereof will be omitted.

This embodiment is different from the third embodiment in that the heat radiating portion 11 is used.
e-2 and the cooling unit 11e-1 are each separated from another metal plate 11e-
3 ', 11e-3 ", and an electronic cooler 11e-4 such as a Peltier element serving as a temperature control means is sandwiched between the metal plates 11e-3' and 11-e3".

By using the electronic cooler 11e-4, the cooling unit 11 in contact with the IC 10 of the heat sink 11e
Since the temperature of e can be set to a normal temperature or lower, temperature control (cooling) of a package having a large thermal resistance, which has been difficult until now, can be performed.

When the electronic cooler 11d-4 is constituted by a Peltier device, the polarity of the voltage applied to the Peltier device is inverted, so that it becomes a heater, and the IC 10 can be heated through the heat sink 11d.

In all of the embodiments described above, the temperature module 11 can be separated from the printed board 7. When the IC 10 is inserted into or removed from the IC socket 8, the temperature module 11 is connected to the printed board 7. You can remove it.

At this time, as shown in FIGS. 6A and 6B, fulcrums 13 and 14 such as hinges are provided on the printed board 7, and when the temperature module 11 and the IC 10 are inserted / extracted, the temperature module 11 is inserted. The printed circuit board 7 retreating from the printed circuit board 7 around the fulcrums 13 and 14 may be combined to form a configuration.

Further, as shown in FIG.
1 is provided with a temperature detecting element 11f such as a platinum resistance temperature measuring element, and controls the rotation of the blower fan 11b based on the temperature detected by the temperature detecting element 11e, the heating control of the heater 11c, and the electronic cooler 11d-4. By performing the drive signal control, the accuracy and reliability of the holding temperature can be further improved.

In this embodiment, the temperature modules 11 are provided for each printed board. However, by providing the temperature modules corresponding to the respective ICs 10, more detailed temperature control can be performed.

[0043]

As described above, according to the present invention, multiple substrates are used.
By dividing into several parts and controlling the temperature for each part
Temperature control, and temperature control for each electronic component.
The degree does not differ, and the reliability of the test can be improved .

[Brief description of the drawings]

FIG. 1 is a perspective view of a first embodiment of the present invention.

FIG. 2 is a perspective view of a main part of the first embodiment of the present invention.

FIG. 3 is a perspective view of a main part of a second embodiment of the present invention.

FIG. 4 is a perspective view of a main part of a third embodiment of the present invention.

FIG. 5 is a perspective view of a main part of a fourth embodiment of the present invention.

FIG. 6 is a perspective view of a modification of the first embodiment of the present invention.

FIG. 7 is a perspective view of another modification of the first embodiment of the present invention.

FIG. 8 is a schematic configuration diagram of a burn-in device.

FIG. 9 is a perspective view of a conventional example.

FIG. 10 is a perspective view of a main part of another conventional example.

[Explanation of symbols]

 7 printed board 9 connector 10 IC 11 temperature module 12 card edge connector

Claims (6)

(57) [Claims] (1)Electronic components for testing burn-in boards
Mounting the Controlling the temperature of the electronic component mounted on the substrate
When, Perform burn-in processing of the electronic component under a desired temperature environment.
And a step The substrate is divided into a plurality of portions, and temperature control is performed for each portion.
A burn-in test method characterized by being performed. 2. The burn-in test method according to claim 1, wherein the temperature is controlled by a fan. 3. The burn-in test method according to claim 1, wherein the temperature is controlled by a Peltier device. (4)Electronic components for testing burn-in boards
Mounting the Controlling the temperature of the electronic component mounted on the substrate
When, Perform burn-in processing of the electronic component under a desired temperature environment.
And a step Temperature control is performed for each electronic component mounted on the board.
A burn-in test method. 5. The trialA board on which electronic components to be tested are mounted, The substrate is divided into a plurality of portions, and the electronic portion is provided for each of the portions.
Temperature control means for controlling the temperature of the article.
Burn-in test equipment. 6.A board on which electronic components to be tested are mounted; Controlling the temperature of each electronic component mounted on the substrate;
Burn-in having temperature control means
Testing equipment.