JP2540703Y2 - IC test equipment - Google Patents

Description

[Detailed description of the invention] "Industrial application field" This invention relates to an IC test apparatus of a type for performing a test by applying a thermal stress to an IC by a constant temperature bath.

[Prior Art] FIG. 3 shows a form of an IC transfer path of an IC test apparatus. In the drawing, reference numeral 1 denotes an IC storage magazine that stores ICs. The IC storage magazine 1 is provided at two locations, that is, above and below the test apparatus.
The upper IC storage magazine 1 stores the IC under test 2A and
An operation of sequentially sending out IC2A to the connection unit 3 is performed.

On the other hand, the IC storage magazine 1 provided on the lower side is connected to the test head TH via the connection unit 3 and connected to the test apparatus main body (not shown in particular) through the test head TH, and the test apparatus main body determines pass / fail. Then, an operation of storing the tested IC2B sorted into a good product and a defective product is performed.

A thermostat 4 is provided on the connection unit 3 and on the upstream side of the connection unit 3. The thermostat 4 is, for example, −30 ° C. to + 125 ° C.
The temperature can be set freely within the range of
Is configured to be able to perform a test by applying a heat stress to the test piece.

A shutter 6 is provided at the outlet 5 of the constant temperature bath 4 and the tested IC
Each time 2B is released from the connection unit 3, the shutter 6 is opened. By providing the shutter 6 in this manner, the time during which the outlet 5 of the thermostatic bath 4 is exposed to the outside air is shortened, and in particular, the portion of the outlet 5 is prevented from dew condensation during the low-temperature test.

FIG. 4 shows the structure of the outlet 5 of the thermostat 4. The connection unit 3 is provided with a socket ST.
The IC2A to be tested is attached to the test.

The operation of mounting the IC under test 2A in the socket ST and the operation of discharging the IC downward at the end of the test are performed by the IC guide rails 7. This IC guide rail 7 has the arrow x direction and x
It is supported so that it can move in the X direction. For example, four to eight IC guide rails 7 are provided facing the connection unit 3,
A predetermined number of ICs 2A to be tested are supplied to each of the IC guide rails 7 in a predetermined number equal to the number of sockets ST arranged in the vertical direction from the upstream side, for example, four ICs 2A to be tested are inserted into one IC guide rail 7. Is held at a predetermined interval (interval between sockets ST). IC2A under test is attached to each IC guide rail 7
When the IC guide rail 7 is received, the IC guide rail 7 moves in the X direction, and the IC 2A under test is mounted on the socket ST. After the test is completed, the IC guide rail 7 moves in the XX direction, and when the axis of the IC guide rail 7 is aligned with the out rail 8 provided on the downstream side, the ICs held on the IC guide rail 7 are sequentially released from the lower side and the out rail is released. The water is discharged out of the thermostat 4 through 8.

A shutter 6 is provided below the out rail 8, and the shutter 6 is opened each time an IC is released from the IC guide rail 7, allowing passage of the tested IC 2B.
, The optical sensor 11 detects this and immediately closes the shutter 6.

The shutter 6 is composed of, for example, two band-shaped plates 6A and 6B having holes H formed at intervals of an arrangement pitch P of the IC guide rails 7 and the out rails 8 as shown in FIG. And the other plate 6B is a movable plate,
When the position of the hole H is matched by moving the 6B, the shutter 6 is opened, and when the position of the hole H is changed, the shutter 6 is closed.

A heater 12 is attached to the shutter 6 to prevent the shutter 6 from freezing, especially during a low-temperature test.

Further, a nozzle 12 is provided on the upper end side of the outrail 8,
Dry air 13 is ejected from the nozzle 12 so that when the shutter 6 is opened, outside air enters through the shutter 6 and prevents the outside air from contacting the lower part of the outrail 8 and forming dew.

[Problem to be Solved by the Invention] The outrail 8 is supported at the axial center position of the outrail storage hole 14 formed in the heat insulating wall 4A constituting the constant temperature bath 4. The diameter of the hole 14 is selected to be large because the outrail 8 is replaced every time the type of IC changes.

The reason why the diameter of the outrail housing hole 14 is increased is that the IC guide rail 7 and the outrail 8 must be replaced according to the lead-out type of the IC 2A under test.

That is, the IC is a DIP type, SOJ
And SOP type terminal types. These DIP type, SOJ
The type and the SOP type have a longitudinal direction in the X-axis direction with respect to the socket ST mounted on the connection unit 3.

On the other hand, the ZIP type IC shown in FIG.
Has a longitudinal direction in the Y-axis direction. Therefore, DIP type, SOJ
Guide rails 7 and out rails 8 that guide ICs of the SOP type and the SOP type are horizontally long in the X-axis direction.
The rail for guiding the mold IC has a vertically long shape in the Y-axis direction.

As described above, in the IC testing apparatus for testing ICs having various terminal types, the outrail storage hole 14 formed in the heat insulating wall 4A to penetrate the outrail 8 has various shapes of rails for guiding each type of IC. In order to allow the outrail 8 to be inserted into the outrail storage hole 14 even if it changes, the diameter of the outrail storage hole 14 is made large.

If the diameter of the outrail storage hole 14 is made large as described above, the effect of injecting the dry air 13 from the nozzle 12 is reduced, and it is difficult to completely prevent the invasion of the outside air.

Therefore, when the shutter 6 is opened for a long time in a state where the temperature of the constant temperature bath 4 is lowered to a low temperature for adjustment or the like, dew condensation occurs at the lower portion of the outrail 8 and freezes, and the IC cannot pass through. There is an inconvenience that an accident occurs.

As described above, when the lower portion of the outrail 8 freezes, the temperature of the constant temperature bath 4 must be once returned to room temperature, and the temperature must be lowered again from the state where the freezing is released.

It takes a long time of several hours to lower the temperature of the thermostat 4 to the predetermined temperature, and wasteful time is wasted before starting the test.

This invention intends to provide an IC test apparatus in which the lower portion of the outrail 8 does not freeze even if the target shutter 6 is opened for a long time.

[Means for Solving the Test] In the present invention, a structure is provided in which a heat-insulating airtight material is provided to seal the gap between the outrail storage hole formed in the thermostatic chamber and the outrail.

According to the configuration of the present invention, since the gap between the outrail storage hole and the outrail is sealed, the cool air inside the constant temperature bath is formed through the gap formed between the inner wall of the outrail storage hole and the outer wall of the outrail. There is no leakage to the outlet side of the thermostat.

Accordingly, the outrail is prevented from being cooled, and there is no dew condensation even when the outside air touches the lower end of the outrail. Therefore, even if the shutter is opened for a long time, the condensation freezes
It is possible to provide a highly reliable IC test apparatus without an accident that blocks an IC passage.

FIG. 1 shows an embodiment of the present invention. In FIG. 1, parts corresponding to those in FIG. 4 are denoted by the same reference numerals.

In the present invention, heat-insulating airtight materials 15A and 15
5B is provided, and a gap portion 14A formed between the outrail storage hole 14 and the outrail 8 is sealed by the heat insulating airtight materials 15A and 15B.

That is, in this example, the upper end side of the outrail 8 is sandwiched from the front and rear directions by the heat insulating airtight materials 15A and 15B, and
In this case, the upper end is sealed. In this case, the heat-insulating airtight material 15A is fixed to the heat-insulating wall 4A, while the other heat-insulating airtight material 15B is rotatably attached to the heat-insulating wall 4A by the hinge 16, and when the outrail 8 is replaced, The outrail 8 is rotated in the upright posture as shown by a broken line, and the outrail 8 can be replaced in this state.

In this way, the upper end of the gap portion 14A is insulated from the heat-insulating airtight materials 15A and 15A.
By closing with B, the cool air in the thermostat 4 does not flow out into the gap 14A.

Therefore, even if the shutter 6 is opened for a long time, dew condensation can be prevented from occurring at the lower end of the outrail 8 because the outrail 8 is not cooled.

"Modified embodiment" Fig. 2 shows a modified embodiment of the present invention. In this example, the upper end of the gap portion 14A is sealed by the heat insulating airtight materials 15A and 15B, and the first hot conductor 17A and the second heat conductor 17B are attached to the outrail 8 and the shutter 6, respectively. And the second thermal conductor 17B are thermally coupled to each other to form the first thermal conductor 17B.
A, a heater 18 is attached, the outrail 8 is heated by the heater 18, and the shutter 6 is further heated through the good conductors 17A and 17B.
In this case, heat is transmitted to the shutter 6 and the heater 12 attached to the shutter 6 is omitted.

According to this embodiment, the upper end of the outrail storage hole 14 is sealed by the heat-insulating airtight materials 15A and 15B, so that cool air does not enter the gap 14A.

Of course, the outrail 8 and the shutter 6 are always warmed by the heater 18. Therefore, even when the outside air comes into contact with the lower end of the outrail 8, dew condensation does not occur in this portion.

Also, in this example, a first heat good conductor 17A and a second heat good conductor 17B
A dry air supply hole 19 is formed at the boundary between the opening and the opening, and by flowing dry air into the gap 14A through the dry air supply hole 19, the internal pressure of the gap 14A is increased. Can be prevented from entering. Further, the occurrence of dew condensation can be suppressed by the dry air.

"Effects of the invention" As described above, according to the invention, the gap 14A formed between the outrail storage hole 14 and the outrail 8 is sealed at the upper end, so that when the shutter 6 is opened. Cool air does not leak from the inside of the thermostat 4 to the gap portion 14A. Therefore, the rate at which the outrail 8 is cooled is small, and thus it is possible to prevent the formation of condensation at the lower end of the outrail 8.

As a result, the lower end of the outrail 8 does not freeze and a highly reliable IC test apparatus can be provided.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing an embodiment of the present invention, FIG. 2 is a cross-sectional view showing a modified embodiment of the present invention, and FIG. FIG. 4 is a cross-sectional view for explaining the prior art, FIG. 5 is a plan view for explaining the structure of a shutter provided at the outlet of the thermostat, and FIGS. It is a front view for explaining. 2A: IC under test, 2B: Tested IC, 6: Shutter, 8: Outrail,
14: Outrail storage hole, 14A: void portion, 15A, 15B: heat-insulating airtight material.

Claims (1)

(57) [Scope of request for utility model registration] A. An IC test apparatus configured to test an IC under test in a thermostat and discharge the tested IC from the thermostat through an outrail and a shutter provided at an outlet of the thermostat. An IC that is provided with a heat-insulating airtight material that seals a gap formed between the outrail and the heat-insulating wall that forms the thermostat
Testing equipment.