JPH0466588U - - Google Patents
Info
- Publication number
- JPH0466588U JPH0466588U JP10943090U JP10943090U JPH0466588U JP H0466588 U JPH0466588 U JP H0466588U JP 10943090 U JP10943090 U JP 10943090U JP 10943090 U JP10943090 U JP 10943090U JP H0466588 U JPH0466588 U JP H0466588U
- Authority
- JP
- Japan
- Prior art keywords
- thermostatic chamber
- test
- outrail
- heat insulating
- tested
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Description
第１図はこの考案の一実施例を示す断面図、第
２図はこの考案の変形実施例を示す断面図、第３
図はＩＣ試験装置のＩＣ搬送通路の形態を説明す
るための側面図、第４図は従来の技術を説明する
ための断面図、第５図は恒温槽の出口に設けられ
るシヤツタの構造を説明するための平面図、第６
図乃至第９図はＩＣの種類を説明するための正面
図である。
２Ａ……被試験ＩＣ、２Ｂ……試験済ＩＣ、６
……シヤツタ、８……アウトレール、１４……ア
ウトレール収納孔、１４Ａ……空隙部分、１５Ａ
，１５Ｂ……断熱性気密材。
Fig. 1 is a sectional view showing one embodiment of this invention, Fig. 2 is a sectional view showing a modified embodiment of this invention, and Fig. 3 is a sectional view showing an embodiment of this invention.
The figure is a side view to explain the form of the IC transport path of the IC testing device, Figure 4 is a sectional view to explain the conventional technology, and Figure 5 is the structure of the shutter provided at the outlet of the thermostatic chamber. 6th floor plan for
9 to 9 are front views for explaining the types of ICs. 2A...IC under test, 2B...Tested IC, 6
... Shutter, 8 ... Out rail, 14 ... Out rail storage hole, 14A ... Gap part, 15A
, 15B...Insulating airtight material.
Claims (1)
されたＩＣをアウトレールと恒温槽の出口に設け
たシヤツタを通じて恒温槽から排出するように構
成したＩＣ試験装置において、 Ｂ 上記アウトレールと恒温槽を構成する断熱壁
との間に形成される間隙を封止する断熱性気密材
を設けて成るＩＣ試験装置。[Scope of Claim for Utility Model Registration] A. In an IC testing device configured to test an IC under test in a thermostatic chamber and discharge the tested IC from the thermostatic chamber through an outrail and a shutter provided at the outlet of the thermostatic chamber. , B. An IC test device comprising a heat insulating airtight material for sealing a gap formed between the outrail and a heat insulating wall constituting a thermostatic chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10943090U JP2540703Y2 (en) | 1990-10-19 | 1990-10-19 | IC test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10943090U JP2540703Y2 (en) | 1990-10-19 | 1990-10-19 | IC test equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0466588U true JPH0466588U (en) | 1992-06-11 |
| JP2540703Y2 JP2540703Y2 (en) | 1997-07-09 |
Family
ID=31856632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10943090U Expired - Lifetime JP2540703Y2 (en) | 1990-10-19 | 1990-10-19 | IC test equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2540703Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999045403A1 (en) * | 1998-03-02 | 1999-09-10 | Advantest Corporation | Ic test apparatus |
-
1990
- 1990-10-19 JP JP10943090U patent/JP2540703Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999045403A1 (en) * | 1998-03-02 | 1999-09-10 | Advantest Corporation | Ic test apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2540703Y2 (en) | 1997-07-09 |
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