JPS637627B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an aging device for semiconductors such as ICs and LSIs.

Semiconductor testing is performed on many things at once in a fixed environment. Conventionally, this type of device has a first
As shown in Figures 3 to 3, a box body with a heat insulating material 2 pasted on the inside of an outer panel 1 is provided with a door 3 for putting in and taking out a semiconductor sample for testing, and a sample chamber 4 is provided inside the box body.
A blower 6 for blowing high-temperature air 5 is installed in the sample chamber 4, and a cooler 7 is connected to an external refrigeration device (not shown) for cooling semiconductor heat generation and temperature drop, etc. in the ventilation path of the high-temperature air 5. A heater heat exchanger 8 connected to an electric heater or refrigeration device for heating the air is provided, and samples 9 generally introduced into the sample chamber are tested. As shown in FIG. 3, the semiconductor sample 9 carried into the sample chamber is placed on an aging substrate 10.
A plurality of semiconductors 11 are attached to the acing substrate 1.
0 is connected to connector 12. Reference numeral 13 denotes a power supply connection section, which is connected to a power supply unit 14 by an electric wire 15. The connector 12 is provided inside the box, and when inspecting the aging board 10.
Connect by inserting it into the connector 12 above. The sample 9 made up of a large number of aging substrates 10 carried into the box is arranged horizontally, and therefore,
Air passes between the aging substrates 10 as indicated by arrow 5.

As described above, an inspection is performed under a predetermined temperature condition with a large number of semiconductors energized.

In the conventional method described above, the sample is carried into one place, and the connector is built into the box, so the sample carrying volume is small overall, and the number of semiconductors to be tested at one time is small. There was a drawback. It was also inconvenient to insert the aging board into the connector inside the box because the connector was located at the back of the box. Additionally, there is a temperature difference between the upstream and downstream parts of the circulating air, resulting in poor temperature distribution within the box.

As related to these, Jikoko 47-
There are issues such as No. 29265.

An object of the present invention is to provide a semiconductor aging device that overcomes the above-mentioned drawbacks.

In order to achieve the above object, the present invention provides openings with doors on both opposing walls of a box body through which samples can be taken in and out, a sample chamber in the center of the box body, and a heater and a cooler in the upper and lower parts. A heat exchanger chamber is provided, a blower is provided in the heat exchanger chamber, and conditioned air is supplied to the blower, a first heater, a sample chamber, a first cooler, a second heater, a sample chamber, a second The device is characterized in that it is configured to allow ventilation to flow in this order from the cooler and the blower, thereby improving temperature distribution, making it easier to carry in samples, and increasing the number of samples to be carried in.

Hereinafter, the present invention will be explained in detail with reference to an embodiment shown in FIGS. 4 to 6.

In the figure, the same parts as in FIGS. 1 to 3 are denoted by the same reference numerals, and their explanations are omitted. 3
0 is a box body with a heat insulating material pasted on the inside, with openings on both the front and back walls, and the openings are connected to the door 31,
It is configured so that it can be opened and closed at 32. 33 is a heat exchanger chamber formed in the lower part of the box 30, in which a blower 34, first heaters 35a, 35b, and second coolers 36a, 36b are arranged in parallel. 37
is the heat exchanger chamber formed in the upper part, and the second heater 3
8a, 38b and first coolers 39a, 39b are arranged in parallel. The first and second coolers 39a, 39b and 36a, 36b are connected to a refrigeration system (not shown) by piping,
The refrigerant is sent to the heat transfer tubes in the cooler to perform cooling action.
Further, the first and second heaters 35a, 35b and 38a, 38b are connected to an electric heater or a refrigeration device by piping, and send high-temperature fluid to the heat exchanger tube within the heater to perform a heating action. A sample chamber 40 is formed between the upper and lower heat exchanger chambers 33 and 37 of the box 30, and is fully opened when the doors 31 and 32 are opened. Aging board 10
A large number of semiconductors 11 are attached to the box, and the aging board 10 is connected to a connector 12 outside the box.
Insert it into the Then, when the aging substrates 10 with the connectors 12 attached thereto are vertically arranged and carried into the sample chamber 40, the connection part of the connector 12 comes into contact with the power supply connection part 13 located on the front door side of the box body. Thus, the air is heated by the first heaters 35a and 35b at the same time as the blower 34 is operated. On the other hand, each semiconductor 11 is energized by the power supply unit 14 and generates some heat. The heated air first passes between a number of aging substrates 10 arranged vertically at the bottom, and then flows between the aging substrates 10 at the top. By the time the air passes through the upper aging substrate group, the air temperature has risen above a predetermined temperature due to the heat generated by the semiconductor 11 itself, so this amount of heat is cooled by the first coolers 39a and 39b. . Although not shown, the coolers 39a and 39b are operated by a refrigeration system provided outside the box. This warm air is then transferred to the upper heat exchanger chamber 33.
The second heaters 38a, 38b installed at 7
After being heated to an appropriate temperature, it flows into the next upper aging board group, and further flows through the lower aging board group, where the temperature is controlled by the second coolers 36a and 36b, and is sucked into the blower 34, where the conditioned air is form the circulatory course of

In this way, in the above embodiment, a total of four coolers and four heaters are installed inside the box, and the heater is located upstream of the aging board group and the cooler is located downstream of the aging board group in the circulation ventilation path. The box is installed in parallel on the back side, making full use of the internal volume of the box, allowing for a large amount of samples to be carried in. Also, opening/closing doors are provided on both the front and back walls, making loading and unloading easy. . In addition, heat exchangers were installed in the upper and lower parts of the sample chamber to control the temperature, so that an average temperature of air could be sent to each group of aging substrates.

When the test is completed, the operation of the heater is stopped, and only the cooler is operated to lower the temperature inside the sample chamber 40. After the temperature has cooled down sufficiently, the opening/closing doors 31 and 32 are opened and the sample is taken out.

Since the present invention is configured as described above, a large number of semiconductors can be tested at once. In addition, the aging board can be easily inserted into the connector. Also,
It has practical effects such as good temperature distribution.

[Brief explanation of the drawing]

Figure 1 is a front view of the conventional machine, Figure 2 is a side view of Figure 1, Figure 3 is an assembled view of the aging board, Figure 4 is a front view of the aging device of the present invention, and Figure 5 is the
The side view of the figure, FIG. 6, is an assembled view of the aging board. 10... Aging substrate, 11... Semiconductor, 1
2...Connector, 13...Power connection part, 14...
...power supply unit, 15...electric wire, 30...box,
31, 32...Door, 33...Lower heat exchanger room, 3
4...Blower, 35a, 35b...First heater, 36a, 36b...Second cooler, 37...
Upper heat exchanger chamber, 38a, 38b...second heater, 39a, 39b...first cooler, 40...
Sample room.

Claims (1)

[Claims] 1. In an aging device for semiconductors, etc., in which a semiconductor sample is stored in a box and tested by circulating temperature-controlled air using a blower, an opening with a door is provided on both opposing walls of the box to allow the sample to be taken in and taken out. A sample chamber is provided in the center of the box, a heat exchanger room housing a heater and a cooler is provided in the upper and lower parts of the box, a blower is provided in the heat exchange room, and the conditioned air is supplied to the blower, the first heater, An aging device for semiconductors, etc., characterized in that ventilation is caused in the order of a sample chamber, a first cooler, a second heater, a sample chamber, a second cooler, and an air blower.