JPS58196025A - Aging device for semiconductor, etc. - Google Patents

Abstract

PURPOSE:To improve the distribution of temperatures and increase the number of the sample to be accommodated by such an arrangement wherein conditioned air from a blower provided in a heat exchanger chamber is forcibly sent through in the order of No.1 heater, a sample chamber, No.1 cooler, No.2 heater, the sample chamber, No.2 cooler and then the blower. CONSTITUTION:In the center of an aging device equipped, at its front and back, with openings with doors 31, 32, a sample chamber 40 and heat exchanger chambers 33, 37 are provided at the upper and lower portions. Air heated by heaters 35a, 35b is sent between aging base plates 10 by a blower 34. Since the air passing through base plates 10 is heated by the heat of semiconductors themselves placed on the base plates 10, it is cooled by coolers 39a, 39b. After this hot air is conditioned by No.2 heaters 38a, 38b, it passes through between aging base plates 10 and then conditioned by No.2 coolers 36a, 36b and resucked by the blower 34 and by this, a circulation path of conditioned air is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an aging device for semiconductors such as ICs and LSIs.

Semiconductor testing is performed on many things at once in a fixed environment. Conventionally, this type of apparatus, as shown in FIGS. 1 to 3, has a box body with a heat insulating material 2 pasted on the inside of an outer panel 1, and a door 3 for putting in and taking out a semiconductor sample for inspection. A sample chamber 4 and a blower 6 for blowing high-temperature air 5 into the sample chamber 4 are installed inside the box, and an external refrigeration device (not shown) is installed in the ventilation path of the high-temperature air 5 to cool the heat generation and cooling of the semiconductor. A connected cooler 7, an electric heater for heating air, or a heater heat exchanger 8 connected to a freezing device are installed, and a sample 9 placed in the sample chamber is tested. As shown in FIG. 3, the semiconductor sample 9 carried into the sample chamber has a plurality of semiconductors 11 attached to an aging substrate 10.
Acing board 10 is connected to connector 12. 1
Reference numeral 3 denotes a power supply connection part, which is connected to a power supply unit 14 by an electric wire 15. The connector 12 is provided inside the box, and the aging board 10 is inserted into the connector 12 and connected when inspecting. A sample 9 made up of a large number of aging substrates 10 carried into the box is arranged horizontally, so that air passes between the aging substrates 10 as indicated by the arrow 5.

As described above, when a large number of semiconductors are energized, a predetermined m
= Test under conditions.

In the conventional method described above, the sample is carried into one place, and the connector is built into the box, so the sample carrying volume is small overall, and the number of semiconductors to be inspected at one time is small. There was a drawback. When inserting the aging board into the connector Ic inside the box, it was also inconvenient to insert it because the connector was recessed. Additionally, there is a temperature difference between the upstream and downstream parts of the circulating air, resulting in poor temperature distribution within the box.

The object of the present invention is to provide a semiconductor aging apparatus that eliminates the above-mentioned drawbacks. An opening with a door is provided, a sample chamber is provided in the center of the box, and a heat exchanger room containing a heater and a cooler is provided in the upper and lower parts of the box, and a blower is provided in the heat exchanger room to supply conditioned air. The configuration is such that ventilation flows through the first heater, the sample chamber, the first cooler, the second heater, the sample chamber, the second cooler, and the blower in this order to improve temperature distribution and facilitate sample loading. This is characterized by the ease of handling and the ability to increase the number of imported samples.

Hereinafter, the present invention will be explained in detail with reference to an embodiment shown in FIGS. 4 to 6.

In the figure, the same parts as in FIGS. 1 to 3 are represented by the same reference numerals, and the explanation thereof will be omitted. Reference numeral 30 denotes a box body whose inner surface is lined with a heat insulating material, with openings provided on both the front and back walls, and the openings can be opened and closed with doors 31 and 32. 33 is a heat exchanger room formed in the lower part of the box 30, in which a blower 34, first heaters 35a, 351), and second coolers 36a, 136t) are arranged in parallel.

37 is a heat exchanger chamber formed in the upper part, and a second heater 38
a%38t) and a first cooler 39a%391) are arranged in parallel. The first and second coolers 391
L% 39tl, 36a, 36t) are connected to a refrigeration system (not shown) by piping, and the refrigerant is sent to the heat exchanger tubes in the cooler to effect cooling.

Further, the first and second heaters 35a%, 35b, asa, and 3gb are connected to an electric heater or a refrigeration device by piping, and send high-temperature fluid to the heat exchanger tube within the heater to perform a heating action. 40 is a sample chamber, and the box body 30 is
The aging board 10 is formed between the upper and lower heat exchanger chambers 33 and 37, and is fully opened when the doors 31 and 32 are opened.A large number of semiconductors 11 are attached to the aging board 10. Connector 12 outside the box
Insert it into the Then, when the Acing board 10 with the connector 12 attached thereto is vertically arranged and carried into the sample chamber 40, the connection part of the connector 12 comes into contact with the power supply connection part 13 located on the front door side of the box body. Thus, at the same time as the blower 34 is operated, the first heater 35!
L% 351) heats the air. On the other hand, each semiconductor 11 is energized by the power supply unit 14 and generates some heat. The heated air first passes between a number of aging substrates 10 arranged vertically at the bottom, and then flows between the aging substrates 10 at the top. By the time it passes through the upper aging board group, the air temperature has risen above a predetermined temperature due to the heat generated by the semiconductor 11 itself, so this amount of heat is transferred to the first coolers 395L and 3.
9t). Although not shown, the coolers 39a and 39b are operated by a refrigeration system provided outside the box. This warm air is then transferred to the upper heat exchanger chamber 37.
After being heated to an appropriate temperature by second heaters 38a and 38b installed in The temperature of the air is controlled by the ASB, and the air is sucked into the blower 34, forming a circulation process of conditioned air.

In this way, in the above embodiment, a total of four coolers and four heaters are circulated inside the box, and the internal volume of the box is utilized without waste, so a large amount of samples can be carried in, and Opening/closing doors are provided on both the front and back walls, making loading and unloading easy. In addition, heat exchangers were installed at the top and bottom of the sample chamber to control the temperature, so that an average amount of hot air could be sent to each group of aging substrates.

When the inspection is completed, the operation of the heater is stopped, and only the cooler is operated to lower the inside of the sample house 40. Then, after descending sufficiently, the opening/closing doors 31 and 32 are opened and the sample is taken out.

Since the present invention is configured as described above, a large number of semiconductors can be tested at once. In addition, the aging board can be easily inserted into the connector. It also has practical effects such as good temperature distribution.

[Brief explanation of drawings]

Figure 1 is a front view of the conventional machine, Figure 2 is a side view of Figure 1, Figure 3 is an assembled view of the aging board, Figure 4 is a front view of the aging device of the present invention, and Figure 5 is the The side view in the figure, FIG. 6 is an assembly diagram of the aging board. 0 10... Aging board 11... Semiconductor 12.
... Connector 13 ... Power supply connection part 14 ... Power supply unit 15 ... Electric wire 30 ... Box 31.
32...Door 33...Lower heat exchanger room 34...Blower 35a. 35 t)--First heater 31L, 36 t)--
・Second cooler 37-... Upper heat exchanger room 38a%
381)...Second heater al, 39b...First cooler 40...Sample chamber

Claims (1)

[Claims] In an aging device for semiconductors, etc., in which samples such as semiconductors are stored in a box body and tested by circulating air at vI4m using a blower, an opening with a door is provided on both opposing walls of the ζ box body to allow samples to be taken in and out. A sample chamber is provided in the center of the box, a heat exchanger room housing a heater and a cooler is provided in the upper and lower parts of the box, and a blower is provided in the heat exchange room to supply conditioned air.
a first heater, a sample chamber, a first cooler, a second heater,
An aging device for semiconductors, etc., characterized in that ventilation is caused in the order of a sample chamber, a second cooler, and a blower.