JPH075425Y2 - Condensation preventive device for measuring part - Google Patents

Description

[Detailed description of the device] "Industrial application" In addition to room temperature tests, IC tests include high-temperature tests or low-temperature tests in which the desired temperature is applied to the IC under test. This is done using the IC handler.

In the case of a low temperature test in which the IC to be tested is cooled to about −55 ° C., the IC to be tested is first cooled to a desired test temperature in a constant temperature bath. Next, this cooled IC to be tested is set in the IC socket of the measuring section installed in the constant temperature bath, and test measurement is performed.

However, in the case of such a low temperature test, the temperature difference between the inside and the outside of the constant temperature bath causes dew condensation on the measurement part having a relatively poor heat insulating property, which seriously hinders the IC test.

The present invention relates to a device for preventing dew condensation on a measuring part in an IC handler in order to avoid such a trouble.

"Prior Art" Fig. 2 shows a plan view (cross section) of a conventional IC handler, which is a structure for preventing dew condensation on a measuring section and a connection with an IC tester.

The constant temperature bath is a box constituted by a wall (9) having excellent heat insulation. The wall (9) of the constant temperature bath is usually composed of a heat insulating material and a metal plate covering them.

In the case of the low temperature test, the IC to be tested supplied to the constant temperature bath is cooled to a desired test temperature, and is set in the IC socket (1) by a setting mechanism (not shown) for test measurement. . In FIG. 2, the upper part of the wall (9) is a thermostatic chamber.

The measuring section comprises an IC socket (1), a socket board (2) on which the IC socket is mounted, and a base (11) to which the socket board is fixed. The base (11) is made of a material having excellent heat insulation and heat resistance, and is usually formed in a thick plate shape to improve heat insulation.

When performing a low temperature test of an IC using the IC handler configured as described above, for example, by introducing the nitrogen gas discharged from the cylinder filled with liquid nitrogen into the inside of the thermostatic chamber, the test target is tested. The IC is cooling to the desired temperature. Therefore, a temperature difference occurs inside and outside the constant temperature bath, which causes dew condensation. In particular, as compared with the wall (9) forming the constant temperature bath, dew condensation is likely to occur at a portion contacting with the outside air in a measuring portion having poor heat insulation, that is, a contact surface with the test head (10). Therefore, dew condensation is prevented by directly blowing hot air or the like on the contact surface with the test head (10) with the air nozzle (12).

[Problems to be solved by the invention] A large amount of hot air is required in the conventional structure in which hot air or the like discharged from the air nozzle is directly blown to the measurement unit to prevent dew condensation.

"Means to solve problems" Measurement that has a cavity to hold the gas supplied between the socket board where the IC under test is set and the contact board connected to the test head for a certain period of time Configure a dew condensation prevention device.

[Example] Fig. 1 shows a plan view (cross-section) when a measuring unit having a dew condensation preventing device of the present invention is fixed to a constant temperature bath.

As described in the section of "Prior Art", the constant temperature oven is a box constituted by the wall (9) having excellent heat insulation. In the low temperature test, the IC to be tested supplied to the constant temperature bath is cooled to a desired temperature, set in an IC socket (1) by a setting mechanism (not shown), and tested. In FIG. 1, the upper side of the wall (9) is inside the thermostatic chamber, and the lower side is the test head (not shown) side of the IC tester.

The measuring unit is composed of a socket board (2) on which an IC socket (1) is mounted, a contact board (3) having a contact surface with a test head of an IC tester, and a spacing frame (4). Has been done.

Here, the spacing frame (4) is made of heat-resistant resin or metal and has a relatively large through hole. At both ends of the through hole, a socket board (2) and a contact board (3) are fixed by means such as screws. As a result, a cavity (6) is formed between the socket board (2) and the contact board (2), and the cable passed through the cavity (6) makes contact with the socket board (2). The board (3) is electrically connected.

The spacing frame (4) is provided with an air joint (5) so that hot air or the like can be supplied to the cavity (6). The contact board (3) has a required number of small holes (not shown) of a suitable size. For this reason, the hot air supplied from the air joint (5) is retained in the cavity (6) for a certain period of time and then discharged from the small hole to the outside of the constant temperature bath. The size and number of the small holes formed on the contact board (3) are determined by the time for which the supplied hot air is retained in the cavity (6). The hot air staying time in the cavity (6) is determined by the temperature inside and outside the constant temperature bath, the temperature difference, the hot air temperature, and the like.

The measuring unit configured as described above is fixed to the wall (9) of the constant temperature bath by a fixing means such as a screw. Here, in this embodiment, it is considered that the sealing material (8) is sandwiched between the spacing frame (4) and the wall (9) of the constant temperature oven to increase the airtightness of the constant temperature oven. .

When actually performing a low temperature test of the IC using the apparatus of the present embodiment, the temperature of the inside of the thermostatic chamber is lowered while supplying hot air to the cavity (6) through the air joint (5) to perform the IC test. Carry out.

Although not shown in this embodiment, when the contact between the socket board (2) and the spacing frame (4) is not sufficient, a sealing material is sandwiched between them to supply the power. It is also possible to prevent the generated hot air from leaking inside the constant temperature bath. Further, the spacing frame (4) does not necessarily have to be an integral part, and may be composed of a plurality of parts as necessary.

[Advantage of Device] According to the dew condensation preventing device of the measuring section as shown in the present embodiment, hot air or the like supplied to prevent dew condensation can be retained in the cavity provided in the measuring section for a certain period of time. As a result, the amount of hot air or the like required to prevent dew condensation can be significantly reduced compared to the conventional case.

[Brief description of drawings]

FIG. 1 shows a plan view (cross-sectional view) of the present invention, and FIG.
The figure shows a plan view (cross-sectional view) of a dew condensation preventing structure in a conventional measuring unit. 1; IC socket 2; Ket board 3; Contact board 4; Spacing frame 5; Air fitting 6; Cavity 7; Cable 8; Sealing material 9; Constant temperature chamber wall 10; Test head 11; Base 12; Air nozzle

Claims (1)

[Scope of utility model registration request] 1. A socket board on which an IC to be tested is set, a contact board connected to a test head and having a plurality of small holes, and a spacing frame having a gas supply port. And a spacing frame to form a cavity, gas is supplied from the gas supply port into the cavity, and the supplied gas is discharged from the plurality of small holes of the contact board. A dew condensation prevention device for the measuring part.