JPH0727819A - Carrier board having heating, cooling and heat keeping function means - Google Patents

Abstract

PURPOSE:To reduce the measurement rising time of an IC testing device by providing a heat-insulated box which has a heating, cooling, and heat-keeping means for ICs to be measured and is composed of a heat-insulating frame made of an insulator and heat-insulating door on a carrier board. CONSTITUTION:A heater 6 is provided on one heat-insulating side wall 2a of a heat-insulating box 5 on a carrier board 101 and a terminal 107 through which electric power is supplied to a heater 906 and another terminal 108 for a sensor which monitors the temperature of the box 5 are provided on the side of A. The board 101 is carried to a position near the measuring section of an IC testing device by means of a carrying means and set to the position while the heat-insulating door 3 of the board 101 is opened. The board 101 is connected to a terminal 202 for measurement provided on a test board 201 by a contacting part on the bottom of the board 101 and electric signals, such as test signals, etc., are delivered and received between the boards 101 and 201.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier board (hereinafter referred to as a carrier board) for an auto handler used for a functional test of an IC.

[0002]

2. Description of the Related Art Conventionally, I under test in an auto handler
The functional test of C includes a test in a normal temperature atmosphere (normal temperature test), a test in a high temperature atmosphere (high temperature test), a test in a low temperature atmosphere (low temperature test), and the auto handler is a high temperature test. In order to create an atmosphere suitable for low-temperature testing, when the temperature is high, the IC to be measured is heated and conveyed to a predetermined location via a heating rail, where the IC is held in a thermostatic chamber, or when the temperature is low. To the I
A method is used in which C is stored in a constant temperature bath that can be cooled, and the IC to be measured is brought to a predetermined temperature by holding it for a certain period of time and then supplied to the measurement unit of the IC test device when necessary. As a technique in such a field, there is an invention described in the contents disclosed in JP-A-64-80035 of the applicant of the present invention (IC carrying / measuring method and device in IC auto handler). The structure according to the invention is, as shown in FIG. 14, an IC sequentially taken out from a loader 810.
872 is mounted on each compatible carrier plate 870, and each carrier plate 870 is configured to be transported on the transport path of the heating unit 820 and to measure the electrical characteristics of the IC mounted on the carrier plate 870. There is an IC transporting / measuring method and apparatus in an IC handler.

In the conventional auto handler in which the ICs to be measured 872 stored in the loader 810 as shown in FIG. 14 are sequentially taken out, measured by the IC test device 831 and then stored in the unloader 860, when performing a high temperature test, 0
[002], the rail heating mechanism or the constant temperature bath was equipped, and the auto handler used for the low temperature test was always equipped with a large constant temperature bath.

[0004]

Therefore, the autohandler becomes large due to the rail heating mechanism and the constant temperature bath.
Not only is the layout unfavorable, but the temperature is applied while the ICs to be measured are sequentially fed in, which often causes jams in the constant temperature chamber (clogging when the parts are being transported). It is difficult to handle the IC when it is fed into the constant temperature bath, and it becomes necessary to open the constant temperature bath for internal inspection. Once the constant temperature chamber door is opened, it takes a long time to return to the original temperature, and in the case of low temperature measurement, when the constant temperature chamber door is opened, dew condensation will occur in the chamber and the operation of the auto handler will start. By the time of resumption,
There were problems such as being incomparable to that at high temperature and requiring a long time.

[0005]

In order to solve the above-mentioned problems, in the present invention, instead of providing a large-sized constant temperature tank to be installed in a handler, a heat insulating member and a heat insulating body frame are provided on a carrier board according to claim 1. An insulating door forms an insulating box, or a carrier board is formed in the insulating box. The carrier board has a shape in which the IC to be measured can be mounted, and the upper surface of the heat insulating box serves as a heat insulating door, or the carrier board and the heat insulating body frame can be separated from each other, and heating, cooling and heat insulating function means are provided. Made up carrier board.

Further, the carrier board in which the heat pipe is provided is provided with means capable of improving the accuracy of the temperature applied to the IC to be measured in claim 2.

Further, in claim 3, the temperature sensor terminal does not have to be provided outside the carrier board, and the carrier board is equipped with a temperature controller capable of controlling the temperature in the heat insulation box.

According to a fourth aspect of the present invention, there is provided a carrier board in which a member for utilizing electromagnetic induction heating that can apply temperature to an IC to be measured is provided in a heat-insulating box without applying a power source for heating and heat retention. Configured.

In the fifth aspect, a DC voltage is applied to the Peltier element so that the IC to be measured can be maintained at a predetermined temperature in low temperature measurement, and the polarity of the DC voltage applied to the Peltier element after low temperature measurement is temporarily changed. In reverse, the carrier board having the Peltier element is configured so that the IC to be measured can be taken out at a temperature close to room temperature without dew condensation even if the heat insulating door is opened. Further, a plus / minus voltage applied to the Peltier element is converted at a constant interval, and a carrier board in which the Peltier element capable of performing a high temperature / low temperature cycle test on the IC to be measured is configured.

In the sixth aspect, the IC to be measured is placed in the heat insulation box.
However, we constructed a carrier board equipped with an intake port and an exhaust port that can shorten the time to reach the set temperature and maintain the atmosphere at the set temperature.

[0012] The above items 2 to 6 alone or
A carrier board for solving the problems is constituted by means including a combination and the heating, cooling and heat retaining function means according to claim 1.

[0012]

As described above, since the carrier board of the present invention is configured, the work for mounting the IC to be measured is performed at room temperature, and after heating or cooling, the function of the IC to be measured is completed until the heat insulation door It is not necessary to open and close, and IC to be measured
Since the heat capacity of is very small, the heating or cooling equipment on the carrier board can be much smaller than in the case of the heating or cooling equipment of a large temperature chamber associated with the conventional autohandler, so a short heating time is required. It is possible to heat the inside of the heat insulation box to the temperature required for measurement. Therefore, it is possible to shorten the measurement rise time of the IC test equipment,
The internal inspection and maintenance of the heat insulation box of the carrier board can be performed at a place different from the handler.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a carrier board 101 showing an embodiment of the present invention with a part of the upper surface cut away. 1 is a substrate for carrier board, 2 is a heat insulator frame, 2a is a heat insulator side wall, 3
Is an adiabatic door, and the adiabatic side wall 2a has four surfaces and the adiabatic door 3 constitutes an adiabatic box 5, which is disposed on the carrier board substrate 1.

FIG. 1 shows a state in which the heat insulation door 3 is closed,
The IC 12 to be measured is set at a predetermined position inside the heat insulating box 5. The measured IC 12 has an upper heating block 4 for heating.
And a lower heating block 904 are installed, and the upper heating block 4 is provided on the upper part of the heat insulation box 5 and the lower heating block 9 is provided.
04 is installed in the lower part of the heat insulation box 5. Inside the upper heating block 4 and the lower heating block 904, a heater 6 for heating and a heater 906 for heating are respectively incorporated. The ICs 12 to be measured are structured so that they can be inserted into the IC socket 10 one after another in the longitudinal direction of the carrier board.
4 forms a structure in which the IC 12 is sandwiched from above and below and heated.

A heat insulating box 5 is formed on a carrier board substrate 1 in which a required number of IC sockets 10 are arranged in a certain number of rows, and a heat insulating door 3 is attached with one side as a hinge. The openable / closable heat insulating door 3 constitutes an upper lid of the heat insulating box 5. With this structure, the constant temperature function can be maintained on the carrier board substrate 1. As another method, the heat insulating box 5 may be formed of a heat insulating member and the substrate may be set inside the heat insulating box 5.

Although not shown in FIG. 1, a power supply terminal 107 for supplying power to the heater 6 for heating and the heater 906 on the side wall 2a of the front side of the carrier board 101 on the side wall 2a of the heat insulating body of the heat insulating box 5, but not shown in FIG. A temperature monitoring sensor terminal 108 that outputs a signal from a sensor that monitors the temperature in the box 5 is provided.

Although not shown in FIG. 1, a carrier having a heat insulating box 5 in which the IC 12 to be measured is mounted with the heat insulating door 3 opened by an IC mounting means such as an orthogonal robot and the heat insulating door 3 is closed after mounting the IC 12 to be measured. The board 101 is an IC by the transportation means.
It is carried near the measuring section of the tester device. Although not shown in FIG. 1, the carrier board 101 having heating, cooling, and heat retaining function means is provided at a preset position from the control department of the IC auto handler via the power supply terminal 107 and the heater 6 for heating.
And 906, and although not shown, the temperature sensor in the heat insulation box 5 passes through the temperature monitoring sensor terminal 108 and the IC.
The carrier board 101 is set to the measurement position when it is connected to the control section of the handler, the heat insulation box 5 is heated and kept warm, and when the element temperature in the heat insulation box 5 reaches a predetermined measurement temperature. Contact area 9 set at the bottom of the carrier board
An electric signal such as a test signal is transmitted and received between the carrier board 101 and the test board 201 by being connected by contact (not shown) to the measuring terminal 202 arranged on the test board 201.

FIG. 2 shows an embodiment of an installation block of the IC 12 to be measured mounted on the carrier board 101 of FIG.
The IC socket 10 is provided with a lower heating block 904 heated by a heater 906 for heating from the carrier board substrate 1 via a heat insulating plate, and the IC to be measured 12 is connected to the IC.
It is held by the socket pedestal 11 so as to be heated while being inserted in the socket 10. The measured I
The upper heating block 4 heated by the heating heater 6 is disposed above the C12. That is, the IC 12 to be measured is inserted into the IC socket 10, and the upper heating block 4 and the lower heating block 904 form a block structure capable of heating in a sandwich shape from above and below. Further, as shown in FIG. 7, depending on the shape and type of the IC to be measured, the IC socket board 21 is set on the socket pedestal 11, the IC socket 10 is arranged on the IC socket board 21, and the IC to be measured 12 is inserted. , Effective heating,
It is possible to perform the measurement while keeping heat.

FIG. 3 is a front view of the carrier board 101 shown in FIG. The heat insulation door 3 is shown in a closed state, and the internal structure is shown by a dotted line in the B-b cross section. An infrared temperature sensor measuring hole 15 is set on the front surface of the heat insulating box 5 as viewed in the direction of the arrow a, so that the internal temperature of the heat insulating box 5 can be monitored. The hole 15 is covered with glass to block the air inside and outside the heat insulating box 5.

FIG. 4 is a sectional view of the carrier board 101 of FIG. 1 taken along the line B-b as seen in the direction of arrow a, and the heat insulating door 3 described in FIG. 1 is shown by a dotted line when one end is opened as a hinge.
The heat insulating spacer 58 above the upper heating block 4 is the heat insulating door 3
Is stuck to. I to be measured on the carrier board substrate 1
When the C12 is attached or detached, the door 3 may be opened. The heat-insulating door 3 does not necessarily need to be hinged with one end as a hinge, and may be any door that can be installed and removed without damaging the heat insulating function of the heat insulating box 5 in the closed state.

FIG. 5 is a perspective view of a carrier board 101 in which a heating block and a heating heater are separately set and a part of the upper surface is cut out, showing an embodiment of the present invention. Heaters 6 and 906 for heating are provided inside the heat insulating box 5 on the carrier board substrate 1 on the upper side heating block 4 and the lower side heating block 90.
4 to be mounted on each of the ICs 4, the array of the ICs 12 to be measured is divided, and the upper heating block 4 and the lower heating block 904 are divided to correspond to the ICs 12 to be measured.
It is set to increase the accuracy of the heating temperature for C12.

FIG. 5 shows the power supply terminal 107 shown in FIG.
The temperature monitoring sensor terminal 108 is not provided, and the power supply terminal 71 of the power supply board 70 of the IC test device and the temperature monitoring terminal 7 are provided.
2. From the temperature control terminal 73 to the carrier board terminal 1
Carrier board 1 through contact area 79 (not shown) of
01 signal from the temperature sensor, and the power supply board 7
From 0, it is possible to transfer power to the heaters 6 and 906 for heating the adiabatic box controlled by the temperature control signal.

Further, in FIG. 5, since the upper heating block 4 and the lower heating block 904 are divided, a temperature sensor must be provided for each divided heating block, but the temperature controller 19 is provided on the carrier boat 101. The number of connecting terminals such as a temperature sensor to the outside of the carrier board 101 can be reduced by mounting the device, and the power source of the temperature controller 19 can be shared with the power source of the heating heater.

FIG. 6 is a perspective view of a carrier board 101 in which a heat pipe and centrally arranged heaters are used together and a part of the upper surface is cut away, showing an embodiment of the present invention. The upper central heating heater 16 and the lower central heating heater 9 are provided in the heat insulating box 5 set on the carrier board substrate 1.
16 central heating blocks 20 and 920 respectively
In a state of being heated, they are centrally arranged in the heat insulating box 5 on the arrow A side. By the upper heat pipe 18 and the lower heat pipe 918 which are thermally coupled to the central heat blocks 20 and 920, respectively, it is possible to transmit the heating temperature to the IC 12 to be measured with high accuracy and set the temperature.

FIG. 7 is a perspective view showing an embodiment of an installation block of the IC to be measured 12 mounted on the carrier board 101 of FIG. IC1 inserted in IC socket 10
In No. 2, the heating heater 6 heats the upper heating block 4, the heating heater 906 heats the lower heating block 904, and the upper heat pipe 18 and the lower heat pipe 918 are attached to each heating block. By utilizing the good heat conductivity of the heat pipe, it is possible to heat the IC 12 to be measured with high temperature accuracy. Further, an upper heat insulating plate 59 is provided on the upper heat insulating door 3 side, and a heat insulating plate 959 is provided on the carrier board substrate 1 side below the heating heater 906 so that the heat of the heating heater is transferred to the outside of the housing of the heat insulating box 5. It has a structure that reduces power consumption.

The IC socket 10 is mounted on the socket board 21.
By using different types of ICs and mounting different types of ICs in the same heat insulation box 5, the increase in the types of ICs 12 to be measured on the carrier board 101 is considered. As described in "0021", the IC blocks can be divided and set in the same heat insulating box 5. Even when a small amount and a large variety of products are mounted by mounting different types of ICs having different package shapes on the same carrier board 101 , various tests can be supported and efficient carrier board operation can be achieved.

FIG. 8 shows the carrier board 101 shown in FIG.
FIG. 9 is a sectional view taken along line Aa of FIG. Insulation box 5 as shown
Central heat blocks having an upper central heating heater 16 and a lower central heating heater 916 attached to the upper and lower parts of the central heating block 20 respectively correspond to the heating heaters,
920, which is separated like the heat pipe, so the upper side can be separated by the heat insulating door 3, and the IC to be measured 1
It is possible to easily attach and detach 2 and inspect the inside of the heat insulating box 5. 54 is an upper heat conduction block, and the upper heat pipe 18
Therefore, the structure is such that heat can be quickly transferred to the IC 12 to be measured.

FIG. 9 shows the carrier board 101 shown in FIG.
3 is a cross-sectional view taken along the line A-B of FIG. Upper heat conduction block 5
4. The lower heat conduction block 954 receives heat from the central heat blocks 20, 920 (not shown) from the upper heat pipe 18 and the lower heat pipe 918, respectively, and heats the IC 12 to be measured from above and below. . The upper heat insulating spacer 58 and the lower heat insulating spacer 958 reduce heat leak to the outside of the heat insulating box 5. The upper heat conduction block 54, the upper heat pipe 18, and the upper heat insulating spacer 58 together with the central heat block 20 are heat insulating doors 3.
It is a structure attached to.

FIG. 10 is a perspective view of a carrier board 101 in which an electromagnetic induction heating member according to an embodiment of the present invention is arranged and a part of the upper surface is cut away. Upper heat pipe 18,
A metal block 29, 929 having a high electric resistance is fixed to one side of each of the lower heat pipes 918, and although not shown here, the front side of the metal block 29, 929 outside the carrier board on the IC test device of the auto handler. The electromagnetic induction coils 31, 931 set in the position and arranged (see FIG.
(Indicated by a two-dot broken line in the front of arrow A), power can be supplied to the inside of the heat insulating box 5 without directly supplying power to the inside of the heat insulating box 5 for heating and heat retention. Figure 1
Although not shown in FIG. 0, the internal temperature of the heat insulation box 5 is detected through the measuring hole for the evening infrared temperature sensor, and the electromagnetic induction coil 3
Induction coils 31, 9 for adjusting the current applied to the 1, 931
The upper heat pipe 1 by adjusting the current applied to 31
8. The temperature of the IC 12 to be measured and temperature can be controlled through the lower heat pipe 918. Measured I
For C12, “0021”, as shown in FIG. 5, division heating is also possible. By this electromagnetic induction heating, it is possible to supply power to the heater and power to the temperature controller, and various operations can be performed on the carrier board 101 .

FIG. 11 shows a carrier board in which a Peltier element according to an embodiment of the present invention is installed and a part of the upper surface is cut out.
It is a perspective view of 101 . Since the temperature difference between the high temperature side and the low temperature side of the Peltier element (trade name Thermo Module) 32, 932 can be up to 65 ° C without load, the low temperature environment at the time of measurement of the IC 12 to be measured at a temperature lower than room temperature is maintained. However, since the temperature on the opposite side of the Peltier element becomes high, it is also necessary to provide a radiator on the outside of the heat insulating box 5 and radiate heat by means such as forced air cooling.

The Peltier elements 32 and 932 are thermally coupled to the upper radiator 43 and the lower radiator 943 through the upper heat pipe 18 and the lower heat pipe 918, respectively. Further, it is also possible to transfer heat with a metal having good heat conduction without using a heat pipe. Furthermore, after the function measurement of the IC 12 to be measured at a low temperature is completed by utilizing this heat dissipation, the heat insulating door 3 is opened when the IC 12 is taken out, so that the polarity of the applied DC voltage is temporarily changed to prevent dew condensation in the heat insulating box 5. Instead, the temperature of the IC block in the heat insulating box 5 is returned to near room temperature, and the IC
You can get twelve.

Therefore, the IC 12 to be measured in the heat insulating box 5 of the carrier board 101 is effectively cooled to a predetermined temperature and can be tested in a low temperature atmosphere while being mounted on the carrier board 101 while being kept warm. . It is also possible to perform high temperature heating. Therefore, in the thermal cycle test (test that repeats high temperature test and low temperature test at regular intervals) that could not be done by the conventional auto-handler, the polarity of the DC current of the power supply applied to the Peltier elements 32 and 932 should be converted at regular intervals. Is possible.

FIG. 12 is a sectional view taken along the line Aa of the carrier board 101 of FIG. 11 as viewed from the side of the arrow b, which is thermally coupled to the upper heat pipe 18 and the lower heat pipe 918, respectively. Upper radiator 43, lower radiator 94
3 is shown. The temperature controller 19 is installed outside the heat insulating box 5 on the carrier board substrate 1 and is supplied with power from the power supply board 70. The contents are [0022]
Since it is the same as the case of FIG. 5, it is omitted.

FIG. 13 is a side sectional view of a carrier board 101 having an intake port and an exhaust port, showing an embodiment of the present invention. The intake port 13 and the exhaust port 14 are provided with an intake valve 913 and an exhaust valve 914, respectively. Although not shown in the figure, by blowing hot air or cold air from the outside into the heat insulation box 5, it is possible to shorten the time required for the IC 12 to be measured in the carrier board to reach the set temperature and to increase the test time.
At the time of the performance test of No.2, although not shown, air regulated to a constant temperature is inserted into the inside of the heat insulating box 5 to
It is possible to maintain the atmosphere during measurement inside the.
The intake port 13 and the exhaust port 14 do not have to be fixed at the positions shown in the figure, but may be installed on the heat insulator side wall 2a. Also,
It is also possible to place it on the carrier board 101 together with other equipment required for the present invention, which has heating, cooling and heat retaining function means.

FIG. 14 is a perspective view of an embodiment of a conventionally used autohandler disclosed in JP-A-64-80035 (IC carrying / measuring method and device in IC autohandler). That is, the IC to be measured 12 mounted on the carrier plate 870 from the loader 810 is the heating unit 820.
The configuration is shown in FIG.

[0036]

As can be understood from the examples, the means for heat insulating function, cooling or heating function, heat absorbing function, temperature control function and power supply to the carrier plate (carrier board shown in the present invention) of the conventional auto handler. Since it is configured by combining as required, it is not necessary to provide a large-sized constant temperature tank in the auto handler as in the past, which is advantageous in terms of layout, and a carrier board with the IC to be measured mounted can be used. Since the same auto-handler can be used for measurements with different temperature conditions, the waiting time for switching the measurement temperature is not required, which significantly improves the operating rate of the test system and has a great effect on productivity.

[Brief description of drawings]

FIG. 1 is a perspective view of an embodiment of a carrier board of the present invention.

FIG. 2 is an installation block diagram of the IC to be measured in FIG.

FIG. 3 is a front view seen from the arrow a in FIG.

FIG. 4 is a sectional view taken along the line B-b of FIG.

FIG. 5 is a perspective view of a carrier board in which a heating block and a heating heater are separately set according to an embodiment of the present invention.

FIG. 6 is a perspective view of a carrier board in which a heat pipe and centrally arranged heaters are used together according to an embodiment of the present invention.

FIG. 7 is a block diagram of installation of the IC to be measured in FIG.

FIG. 8 is a sectional view taken along the line Aa of FIG.

FIG. 9 is a sectional view taken along the line B-b of FIG.

FIG. 10 is a perspective view of a carrier board on which an electromagnetic induction heating member according to an embodiment of the present invention is installed.

FIG. 11 is a perspective view of a carrier board on which a Peltier element according to an embodiment of the present invention is installed.

12 is a sectional view taken along the line Aa of FIG.

FIG. 13 is a side sectional view of a carrier board in which an intake port and an exhaust port are arranged according to an embodiment of the present invention.

FIG. 14: "IC disclosed in Japanese Patent Laid-Open No. 64-80035"
Device perspective view of one embodiment of "IC transport / measurement method and device in auto handler"

[Explanation of symbols]

1 Carrier Board Substrate 2 Insulator Frame 2a Insulator Sidewall 3 Insulation Door 4 Upper Heating Block 5 Insulation Box 6 Heating Heater 9 Contact Site 10 IC Socket 11 Socket Pedestal 12 Measured IC 13 Inlet Port 14 Exhaust Port 15 Infrared Temperature Sensor Measurement hole 16 Upper heating heater 18 Upper heat pipe 19 Temperature controller 20 Central heat block 21 IC socket board 29 Metal block 31 Electromagnetic induction coil 32 Peltier element 43 Upper radiator 54 Upper heat conduction block 58 Upper heat insulating spacer 59 Upper heat insulating plate 70 power supply board 71 power supply terminal 72 temperature monitor terminal 73 temperature control terminal 79 contact sites 101 carrier board 107 feeding terminal 108 temperature monitoring sensor terminal 201 test board 202 measuring terminal 810 loader 81 Loader transfer means 820 Heating unit 831 IC test head 860 Unloader 870 Carrier plate 872 IC to be measured 904 Lower heating block 906 Heating heater 913 Intake valve 914 Exhaust valve 916 Lower central heating heater 918 Lower heat pipe 920 Central heat Block 929 Metal block 931 Electromagnetic induction coil 932 Peltier element 943 Lower radiator 954 Lower heat conductive block 958 Lower heat conductive spacer 959 Lower heat insulating plate A A arrow direction B B arrow direction a a arrow direction b b Arrow direction Aa sectional view Bb sectional view

Claims (6)

[Claims] 1. A carrier board of an IC autohandler in which ICs to be measured stored in a loader are sequentially taken out and measured by an IC test apparatus, and then stored in an unloader. A carrier board comprising a heat insulating box including a heat insulating body frame of a heat insulating member and a heat insulating door, which has means for heating, cooling, and heat retaining functions of a measurement IC. 2. The heating according to claim 1, wherein a heat pipe is set in an insulating box on the carrier board.
Carrier board with cooling and heat retaining function means. 3. A carrier board having heating, cooling and heat retaining means according to claim 1, wherein a temperature controller is mounted on the carrier board. 4. A carrier board having heating and heat retaining function means according to claim 1, wherein an electromagnetic induction heating member is provided on the carrier board, and means for applying a predetermined temperature to the IC to be measured is provided. 5. A carrier board having heating and cooling heat retaining function means according to claim 1, further comprising a Peltier element for holding the IC to be measured at a predetermined temperature on the carrier board. 6. The IC to be measured in the carrier board
2. The carrier board having heating, cooling and heat retaining function means according to claim 1, wherein an intake port and an exhaust port are set so as to shorten the time required to reach the set temperature and maintain the atmosphere at the set temperature.