WO1998016094A1 - Procede de fabrication d'un conducteur, ou circuit, electrique compense en parasites radioelectriques tels que micro-decharges et conducteur ou circuit correspondant - Google Patents
Procede de fabrication d'un conducteur, ou circuit, electrique compense en parasites radioelectriques tels que micro-decharges et conducteur ou circuit correspondant Download PDFInfo
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- WO1998016094A1 WO1998016094A1 PCT/FR1997/001786 FR9701786W WO9816094A1 WO 1998016094 A1 WO1998016094 A1 WO 1998016094A1 FR 9701786 W FR9701786 W FR 9701786W WO 9816094 A1 WO9816094 A1 WO 9816094A1
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- electrical circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Definitions
- the present invention relates to a method for manufacturing an electric conductor, or circuit, compensated for by radio interference, such as micro-discharges, and to the electric conductor or circuit obtained by this process.
- radio interference such as micro-discharges
- each conductor comprising a resistive part and an inductive part due to the skin effect, on the surface of the conductors, and to a proximity effect of the latter.
- p denotes the resistivity of the conductor in ⁇ xm
- f denotes the frequency of the signal transmitted in Hz.
- K 1.910852 r denotes the radius of the conductor, p and ⁇ 0 having been defined previously.
- the maximum radius of the conductor for a maximum frequency to be transmitted fc is given by:
- the penetration depths are given by: Hz 6 mm
- K, p and ⁇ are the parameters defined previously in the context of the phenomenon of the skin effect
- Pm represents the perimeter of each conductor.
- any amplifier - loudspeaker connection cable is comparable to its own impedance
- these cables used in the output transformers of tube amplifiers, have always shown excellent behavior, without appreciable reaction from experienced audiophiles. They consist of a copper conductor of a few tenths of a millimeter or more, covered with a layer of enamel based on polyurethane varnish, in one or more layers.
- each cable consists of two separate independent conductors, each conductor consisting of 8 to 16 elementary strands of enameled wire of 5/10 mm twisted, to achieve a section from 1.57 to 3.14 mm 2 , depending on the length of the connection.
- each elementary strand is undifferentiated in the twist, and, consequently, successively occupies in the twist all the positions in the section of the overall conductor.
- the connection of the cable to a connection plug is made in professional quality by means of a tin bath at 600 ° C which volatilizes the enamel and tinned the copper.
- a polarization can be carried out by means of an additional strand or one of the strands not subject to the signal to be transmitted.
- the modulation cable As far as the modulation cable is concerned, the most immediate solution consists simply in connecting the core and the ground of the connectors by two enamelled wires of 5/10 mm. To limit the capacity of the cable, tight twisting of the two enamelled wires cannot be carried out, twisting optimal at a pitch close to 1 cm which alone can be envisaged.
- a significant improvement in this type of modulation cable can consist, as shown in FIG. 1f, of inserting a 1/1 transformer at the output of the modulation source and a ferrite core on the cable before the input on the amplifier. . These measures make it possible to permanently block very disturbed common mode signals, signals passing simultaneously on the two conductors, when these signals come from sources such as tuners or optical disc players (CD) for example.
- this amplifier can be reduced to the diagram in Figure 1h.
- the 1000 ⁇ circuit adjustable capacity from 5 to 100 pF, stabilizes the operation of the AOP operational amplifier.
- This circuit is not essential because the AOP operational amplifier, gain 9.2, is intrinsically stable for this gain value, but was added due to the effects of saturation in the amplifiers. teurs. Indeed, on a musical transient, saturation, that is to say the clipping of the transient peak, is not a problem when listening. But this saturation is likely to disturb the internal circuits of the amplifier, the latter then being unable, because "blind", to correctly process the possibly weak signals which can follow this disturbance.
- the setting of the value of C is carried out experimentally.
- the subject of the present invention is a method for manufacturing a conductor or an electrical circuit compensated for by radio interference caused in particular by electrical micro-discharges, the surface of this conductor or this electrical circuit or more generally the interface conductor-insulator is inevitably the seat.
- Another object of the present invention is the use of a conductor or an electrical circuit compensated for by radio interference caused in particular by the electrical micro-discharges present on the surface of this conductor or this electrical circuit, such micro - discharges being on these conductors or compensated circuits substantially attenuated or eliminated.
- Another object of the present invention is the implementation of electrical conductors or circuits capable of being used for the transmission and / or processing of analog or digital signals in technical fields as varied as electrical equipment. or home electronics, HiFi devices and instrumentation and metrology.
- the method for manufacturing a conductor or an electrical circuit compensated for by radio interference generated in particular by phenomena of electrical micro-discharge present on this conductor or this energized electrical circuit, object of the present invention is remarkable in that '' it consists in carrying out, on the external surface of this conductor or of this bare circuit or coated with insulator, an application of a coating of semiconductor material, this semiconductor material having a linear resistivity value allowing both maintain the external surface of the conductor or of the static electric circuit of constant local value, close to that of the conductor, and absorb all the erratic electric discharge currents caused by these parasitic phenomena.
- the method and the electrical circuit, objects of the invention find application not only in the field of construction of HiFi electronic devices but also in home automation, instrumentation, metrology and transmission of digital signals.
- FIG. 2a schematically shows the architecture of a variable capacitor with dielectric insulator
- FIG. 2b to 2d represent the behavior of dipole molecules always present at the interface dielectric insulating material / conductor of a circuit or an electric conductor or cable subjected to an electric voltage of a given electric or electronic signal;
- FIG. 3a shows an illustrative diagram of the implementation of the process which is the subject of the present invention
- FIG. 3b shows an illustrative first embodiment of the method of the present invention
- FIG. 3c shows an illustrative second embodiment of the method of the present invention in the case where the semiconductor material used is in liquid or gel form after packaging;
- FIG. 3d shows a particular embodiment of the process object of the present invention in the case where the liquid or gel semiconductor material has ferromagnetic properties such as ferrofluids;
- FIG. 4a, 4b and 4c show, in a perspective view and in a sectional view along a longitudinal plane of symmetry, a conductor or circuit obtained by the implementation of the method according to one invention;
- FIGS 5a and 5b show modeling diagrams of the phenomenon of electrical micro-discharges at the insulating metal interface of an electrical conductor;
- FIG. 5c to 5f show timing diagrams of these micro-discharge phenomena
- FIG. 6a shows a view of an electronic circuit previously coated with insulation on its bare conductive parts, packaged in a liquid semiconductor material, in accordance with the object of the present invention
- - Figure 6b shows a sectional view of a loudspeaker at high frequencies with magnetic confinement of the semiconductor material with ferromagnetic properties.
- a TEFLON (polytetrafluoroethylene) adjustable capacitor consists of a stack of alternately fixed and mobile sectors, designated in the above-mentioned figure by SF respectively SM.
- a TEFLON insulating sheet FI is inserted between each successive sector.
- the metal surfaces exposed to the air of the fixed sectors SF and of the mobile sectors SM are almost immediately covered with a mono-molecular layer of adsorbed oxygen. It is indicated that, in addition to the air molecules, other molecules may be in contact with the conductive surfaces, molecules such as nitrogen, carbon dioxide, C0 2 , or water vapor H 2 0. However, among these molecules, at least two can be subjected to a polarization effect under the effect of an electric field: oxygen and water vapor.
- a first objection to the previous thesis could consist in indicating that the oxygen and water vapor molecules in particular are also present in an air condenser.
- the electric field on the surface of the conductor that is to say the surfaces of the mobile sectors SM and of the fixed sectors SF
- this field in known manner, being on the contrary multiplied by the value of the relative permittivity of the dielectric with respect to air, in the case of a capacitor with added dielectric material.
- the electric field on the surface of the conductor i.e. fixed and mobile sectors, is much greater than in the case of the capacitor with air.
- the insulator does not disturb the molecules, the phenomenon adsorption is permanent, these molecules thus enjoying greater mobility and the delays introduced due to the feedback loop are then very low, which explains the almost perfect behavior of the air capacitor.
- FIGS. 2b to 2d In the case of an electrical conductor such as a cable covered with a layer of insulator where the insulator weakly adheres, the same phenomenon can be highlighted and will be described in conjunction with FIGS. 2b to 2d.
- the central conductor C made of copper for example
- the insulating layer I the insulator possibly being for example a layer of material such as PTFE or PVC.
- the abovementioned dipole molecules MD are present on the surface of the conductor C and the adsorption phenomenon is somewhat frozen or at least reduced due to the presence of the insulating layer I
- the adsorbed dipole molecules cannot in any case be removed from the surface layer of the conductor C due to the very presence of the insulator I.
- the dipole molecules MD are subjected to a polarization field existing between the electrical conductor C and the insulator I and then undergo delocalization or orientation directly linked to their position and to the instantaneous polarity of the transmitted signal.
- the dipole molecules MD assume a different position in order to balance the electrostatic forces generated by the polarization field existing between the conductor C and the insulating material I, this process being associated with micro-discharges. Due to the fact that the aforementioned changes in position or orientation occur with a certain inertia, even a very small one, this inertia causes a certain delay in the conditions of propagation of the transmitted audio signal, this delay causing a very echo effect audible.
- the aforementioned supporting document obviously appears to be essentially qualitative. However, it is indicated that the contact phenomena between conductors and insulators with the addition of polarizable molecules are still very poorly understood.
- - C 0 represents the capacity equivalent to the metal-insulator interface
- - Ci represents the capacity between conductors due to their proximity
- the derivative current has the expression:
- the link thus formed consisted of two wires enamelled 5/10 mm, spaced approximately 1 to 2 cm, over a length of 50 cm, length of the link between the source optical disc player and the amplifier.
- dipole molecules are likely to adhere to the surface of the insulator, i.e. the enamel, and are therefore also likely to disturb the transmitted signal insofar as these same dipole molecules are also subjected to the electric field generated by this signal.
- PHEMASTAT marketed by PHEM S.A., 1 avenue Georges Clemenceau, 93420 Villepinte, France; - ANTISTATIK 100, marketed by the Company
- connection cables and conductors constituting these connection cables such as modulation cables or amplifier / speaker connection cables of HiFi installations are effective for a limited time, this time being a function of the ambient temperature and humidity. and up to a few hours.
- this operating mode makes it possible to validate all of the investigations, observations and discoveries made by the inventor, M.JOHANNET.
- the process which is the subject of the present invention consists in applying, to the external surface of a conductor 1 or of a circuit, a coating of semiconductor material 2.
- This semiconductor material has a linear resistivity value making it possible both to maintain the external surface of conductor 1 or of the electrical circuit at a static electrical potential of constant value close to that of conductor 1 and d 'absorb all the erratic electrical discharge currents caused by parasitic phenomena.
- the conductor 1 a cylindrical copper wire for example, can advantageously be subjected to a displacement Dep in translation and simultaneously in rotation Rot relative to its screw axis with respect to a system for spraying an aerosol or pulverulent product, symbolically represented by a reservoir and a nozzle, controlled manually or automatically.
- the speed of movement or of movement of the conductor in front of the nozzle as well as the speed of rotation are calculated in an adapted manner, so as to constitute a substantially homogeneous sleeve 2 of a few ⁇ m thick, covering the whole of the conductor 1.
- the notion of semiconductor means the qualifier relating to a non-metallic body which imperfectly conducts electricity and whose resistivity decreases when the temperature increases.
- This definition corresponds to the definition of the semiconductor as given by the Grand Dictionnaire LAROUSSE, Edition of 1982, page 9478.
- the operating mode in order to carry out the application on the external surface of the conductor 1 or of the circuit of the coating of semiconductor material 2, is not limited to spraying.
- FIG. 3b for example, other operations can be used such as the dipping of the conductor 1 or of the circuit in step a) of the abovementioned FIG.
- each operation is preferably followed by an operation for stabilizing the semiconductor material.
- the sleeve of semiconductor material 2 thus obtained after the stabilization operation can be liquid or solid, or if necessary in the form of a gel.
- the abovementioned stabilization operation may consist of a controlled drying operation.
- drying can be carried out, following the application of a layer of semiconductor material 2 or, where appropriate, of two layers or more layers of semiconductor material, in the open air, that is to say at room temperature, for a period of two hours between each application, or, on the contrary, in order to speed up the process, in a controlled atmosphere, that is to say in an oven, the conductor 1 provided with its sleeve or layer of semiconductor material 2 being placed in an enclosure heated for example at a temperature of the order of 60 ° for one hour.
- the operating method consisted in covering the modulation cables constituted, for example, by a 5/10 mm non-twisted enameled wire, each round-trip conductor being coated with a layer of this varnish of the order of a few ⁇ m. Conductors spaced approximately 1 cm apart to making the connection between the source and the amplifier under the experimental conditions indicated in FIG. 2e, then made it possible to obtain a very significant, immediate and lasting improvement in the transmission of the signals delivered by the source.
- connection cables between the output of the amplifier and the loudspeakers or loudspeakers were carried out with regard to the connection cables between the output of the amplifier and the loudspeakers or loudspeakers.
- the connecting cables consisted of conductors of 5/10 mm twisted enameled wires, which were subjected to similar spraying to form a layer a few microns thick.
- the perception is then characterized by an impression of softness of sounds, absence of distortion and background noise, analysis of micro-signals without loss of coherence of the transmitted signal, particularly remarkable . From a perceptual point of view, it is indicated that the perception felt is that of the discovery of a content different from the memory media read by the source.
- connection cables modulation cables and amplifier-speaker connection cables
- the quality of the results obtained can, after consideration and successive study, be attributed to: - the search for an optimal resistivity for the layer of semiconductor material applied to the electrical conductor,
- a particularly advantageous solution adopted consisted in using water added with dissolved sodium chloride NaCl so as to obtain suitable linear resistivity values.
- the corresponding concentration and linear resistivity of the solutions used were as follows:
- the salinity is expressed in g / 1 and the resistivity in ⁇ x m.
- the saline solution used can consist of physiological saline controlled at 9 g / l.
- the saline solution can consist of a potassium chloride solution KC1 at a concentration of llg / 1.
- This saline solution has the advantage of the same ionic mobility for positive and negative ions.
- the saline solution is preferably pH equal to 7.
- antibacterial and anti-algae stabilizing products can be added.
- the conductor 1 can advantageously be produced in the form of 8 strands of enameled copper wire of 5/10 mm, such as the enameled wire referenced ST2.NG marketed in France by the company LE GUIPAGE MODERNE. These strands are twisted in pairs in order to correct the effects of skin and proximity, as mentioned previously in the description.
- the stabilization operation may consist, as shown in FIG. 3c, of first performing an operation consisting in encapsulating the conductor 1 or electrical circuit in a final sealed enclosure 3.
- This sheathing operation is represented in point a) of FIG. 3c
- the sealed enclosure 3 may consist, by way of nonlimiting example, of a 4/7 mm polyethylene tube.
- the aforementioned sheathing step a) can then advantageously be followed by a shaping step b), represented in point b) of FIG. 3c, step in which the assembly is configured in the shape of a U for example, the ends of the conductor 1 protruding from the ends of the sealed enclosure 3.
- the actual shaping step b) is then followed by a filling step c), represented in point c) of FIG. 3c, of the gap formed between the conductor 1 and the sealed enclosure 3 by means of the saline solution.
- a filling step c) represented in point c) of FIG. 3c, of the gap formed between the conductor 1 and the sealed enclosure 3 by means of the saline solution.
- point c) thereof it is indicated that the filling is shown by way of illustration by means of a reservoir or pipette by way of nonlimiting example. However, it is indicated that in order to suppress the appearance of air bubbles in the saline solution contained in the sealed enclosure 3, it is advantageous to carry out such filling by means of a suction operation, preference.
- the filling step c) is then itself followed by a step d), represented in point d) of FIG. 3c, constituting a sealing of the ends.
- the appropriate watertight seals of the final watertight enclosure can be produced by means of a silicone adhesive intended to seal the ends of the watertight enclosure 3, the ends of the conductors 1 passing through the seal thus produced, the whole being capped by a heat-shrinkable tip or sleeve placed on each end to protect the seal.
- a silicone adhesive intended to seal the ends of the watertight enclosure 3, the ends of the conductors 1 passing through the seal thus produced, the whole being capped by a heat-shrinkable tip or sleeve placed on each end to protect the seal.
- the sealing of the ends can be carried out on the tubes or envelopes of self-weldable thermoplastic material, by means of a heating jaw clamp.
- the conductor 1 is a simple enameled wire, of 5/10 mm
- the sealed enclosure 3 is constituted by a 3/6 mm polyethylene tube or by any equivalent tube.
- This embodiment is not limiting and it can be envisaged, for each conductor constituting the modulation cable link, to use two twisted enameled wires to constitute each conductor 1 of the link. It is pointed out in particular that, in addition to the intrinsic quality recognized for enameled wires for constituting the connections of the modulation cables, already mentioned in the description, the presence of enamel makes it possible to protect the conductive copper from any attack on the saline solution, which makes it possible to maintain transmission quality properties substantially permanently.
- this stabilization operation may advantageously consist in adding to the material semiconductor an element having ferromagnetic properties to generate a ferromagnetic compound having properties of semiconductor material.
- this step of implementing the method is illustrated in an illustrative manner by a mixing operation using a paddle mixer of a liquid semiconductor material, denoted MSC, and a ferromagnetic material. in powder form to make a material, either liquid or gel, corresponding.
- the ferromagnetic compound having properties of semiconductor material obtained following the above-mentioned mixing operation is then applied to conductor C to constitute, for example, a layer or sleeve shown in dotted lines in FIG. 3d, and the assembly, in particular the sleeve 2 of semi-material -conductor constituted by the ferromagnetic compound having properties of semiconductor material, is then subjected to a permanent or maintained magnetic field, illustrated by the reference B arrowed on figure 3d, in order to ensure the confinement of the ferromagnetic compound having the properties of semiconductor material on the external surface of conductor 1 or of the electrical circuit.
- the electrical conductor or circuit 1 comprises, on its external surface, a coating 2 of semiconductor material, the concept of semiconductor material having been defined previously in the context of the description of process which is the subject of the present invention.
- the material semiconductor 2 forms a sleeve covering the electrical conductor 1 or, at the very least, a layer covering an electrical circuit, as will be described later in the description.
- the semiconductor material has a linear resistivity value making it possible both to maintain the external surface of this electrical circuit or electrical conductor at a static electrical potential of constant local value, close to that of the circuit or conductor 1, and to absorb all the erratic electric discharge currents caused by the above-mentioned parasitic phenomena.
- the semiconductor material may be solid, or liquid, or in the form of a gel, and may consist, for example, of a thin layer of a few ⁇ m deposited by spraying with the semiconductor varnish referenced 8001, sold by the company VON ROLL ISOLA.
- the assembly can be sheathed by a thin protective sheath 3, which makes it possible to ensure protection of the layer of semiconductor material and of the assembly thus formed.
- the conductor 1 can be constituted by an electric copper wire, enamelled or not, of appropriate section.
- the electrical conductor 1 can be constituted by a plurality of strands of twisted enameled copper wires, the central core bearing the reference 1 and the enamel the reference 10, as shown in Figure 4b.
- the protective sheath 3 can be added to protect the assembly.
- the electrical circuit compensated for radioelectric parasites object of the present invention may advantageously include the sealed enclosure 3 constituted by a polyethylene tube for example.
- the sealed enclosure 3 partially contains the circuit or the electrical conductor 1, which is constituted either by twisted 5/10 mm enameled electrical wire, or by a single enameled wire of 5/10 mm for example.
- a major part of the electrical circuit 1, or electrical conductor 1 is immersed in the liquid semiconductor material or in the form of a gel, only the ends intended for making the connections not being immersed in the semi-material aforementioned driver.
- connection terminals 4 external to the sealed enclosure 3 are interconnected to the major part of the submerged electrical circuit.
- the connection terminals 4 may advantageously be constituted by a seal 40 ensuring the sealed closure of the sealed enclosure 3 at each of its ends, this seal 40 being produced for example by a silicone sealant.
- the assembly can be capped with heat-shrinkable sleeves 41, a connection pad or connection terminal of the banana plug type 42 for example being interconnected to the conductor 1, the connection plug 42 being preferably taken and held by the thermo sleeve. retractable 41.
- Such a manufacturing method makes it possible to produce modulation cables or amplifier / speaker connection cables of standard determined length having good stability over time and first-order electrical signal transmission conditions.
- Such a phenomenon can be compared to the phenomenon known as the corona effect on high-voltage lines, although the orders of magnitude of the voltages involved are very different. In the case of interface micro-discharges, these occur for extremely low voltages, of the order of ⁇ V, and appear only in the immediate vicinity of the conductor C, that is to say of the outer surface of it. It is understood in particular that, although the voltages involved at the level of the roughness and the roughness of the abovementioned external surface are a few ⁇ V, these potential differences, related to roughness or particle size distances of the order of ⁇ m, are likely to generate significant local electric fields, of the order of several volts per meter.
- this field can of course be locally very important.
- c represents the distance from the focal point of the ellipse to the surface of the conductor C
- a represents the distance from the apex of the ellipse, that is to say from the roughness with respect to the surface of this same conductor C
- h represents the transverse half-dimension of the ellipse.
- the roughness of the machining on the peripheral surface of the conductor C is high.
- bare conductors there are always one or two, or even more, layers of adsorbed molecules, as mentioned previously.
- non-precious metals, in particular copper there is almost always an oxidation of the surface layer thereof.
- FIG. 5b This modeling is represented in connection with FIG. 5a and the symbols used in FIG. 5b for this modeling represent: - E (t), a voltage source, that is to say ultimately a voltage induced on the cable, ie by the signal to transmit, either by an external radio interference;
- - R represents the internal resistance of the interface
- C - C x represents the capacity of the first insulating layers immediately in contact with the conductor. It is therefore air in the case of a bare conductor or the insulation applied to an insulated conductor;
- - e is a spark gap which short-circuits the capacitor Ci as soon as the voltage across C ⁇ exceeds a given threshold value and initiates the relaxation phenomenon;
- - C 2 represents the capacitance of the conductor C with respect to the mass, that is to say to the reference potential or to the earth.
- the set Cj + e translates the phenomenon of micro-discharges at the interface, insulating conductor C.
- FIG. 5c As shown in FIG. 5c, for a source voltage E (t) constituted by a pure sinusoidal voltage of frequency 1 kHz, the voltage across the terminals of the capacitor C x in the presence of the spark gap e is represented in FIG. 5c for a breakdown voltage assumed to be twice greater in positive signals than in negative signals. The current in the entire circuit as shown in FIG. 5d appears overall little affected by the successive breakdowns caused by the spark gap e.
- FIG. 5e and FIG. 5f of a positive and respectively negative peak of the current represented in FIG. 5b highlights the disturbances of this current by micro-discharges, the frequency of the disturbances tions appearing higher for the negative peak although the amplitude of these disturbances appears less.
- This recurrence frequency varies according to the following parameters: internal resistance of the discharge circuit breakdown threshold signal polarity. value of the breakdown capacitances C x value of the capacitances to earth C 2, that is to say according to the set of physical and geometric parameters of the metal / insulator interface.
- the micro-breakdowns are expressed at most by one, if necessary, two additional lines in the audio frequency spectrum, these additional lines being most often drowned in noise. It is no longer the same for a musical signal for which the frequency spectrum is rich and is constantly modified with the appearance of additional lines strongly correlated with the signal. Such additional lines then appear quite perceptibly, that is to say, audibly, while they nevertheless remain very difficult to detect by conventional measurements; at each micro-discharge, i.e. each micro-breakdown or when returning to the previous state, can probably be associated with a delay comparable to that mentioned previously in the description relative to the polarization of the dipole molecules, this delay causing additional complex phenomena although not modifying the spectrum of additional lines emitted;
- the Laplace transform applied to the latter is of the form l / l-exp (- ⁇ p), which results in a set continuous spectrum + line spectrum similar to that of 'an open transmission line, which makes it possible to reduce the case of delay phenomena or echoes incriminated many times in terms of musicality;
- the layer of semiconductor material in accordance with the process which is the subject of the present invention, makes it possible to avoid these micro-discharges by creating a local conductive equipotentiality / immediate environment.
- These currents are the transverse or longitudinal propagation currents in the conductor C.
- the aforementioned semiconductor screen must be in perfect contact with the conductor C or, more generally, with the insulator such as the enamel layer covering the conductor to be protected insofar as remaining vacuoles or surface irregularities would only make the problem worse.
- interface micro-discharges previously analyzed is not limited to cables consisting of conductive wires only, but also appears to occur at the level of electronic circuits in the most general sense of the term.
- a first investigation consisted in verifying the previous assumption at the level of electronic circuits in general. In order to simplify the verification procedure, this consisted in applying to the entire circuit, this circuit being produced in the form of experimental wiring without any particular precautions, a layer of antistatic fluid as mentioned previously in the description, PHEMASTAT.
- the layer of antistatic material was applied to the upper face and the lower face of the printed circuit, and in particular to all of the components, and in particular to the parts of bare or insulated conductor.
- one solution may consist in depositing a layer of semiconductor material such as a layer of graphite using the GRAPHIT 33 material. as previously described in the description.
- This deposition of a layer of semiconductor material in the form of graphite can be carried out by spraying the GRAPHIT 33 product previously described or an equivalent product such as the KF-BLINDOTUB product applied by aerosol spray to the trans windings.
- trainers such as power transformers and wiring wires connecting power supplies to circuits.
- a particularly advantageous conditioning of any electronic circuit can consist in providing a sealed enclosure, bearing the reference 3, constituted for example by a box made of metal coated or not inside a layer of protective material such as a layer of polyurethane for example.
- This enclosure 3 is provided so as to partially contain the electrical or electronic circuit to be conditioned, as well as the semiconductor material 2 in which a major part of the electrical or electronic circuit is immersed.
- the semiconductor material 2 can advantageously be produced by a suitable resistivity gel, as mentioned previously in the description, where where appropriate by a saline solution in the conditions mentioned previously in the description.
- the electronic circuit in order to ensure anti-corrosion protection of the entire electronic circuit or, at the very least, of most of it which is immersed in the semiconductor material 2, it is indicated that the electronic circuit, as shown in Figure 6a, can generally be advantageously coated with a protective film, bearing the reference 10, against corrosion and electrolysis phenomena.
- this protective layer 10 can consist of the application of two or three thin layers of polyurethane spaced over time for perfect successive drying of each layer deposited.
- connection terminals T lr T 2 , T 3 / T 4 respectively T, T ' 2 , T' 3 are provided outside the sealed enclosure 3, these terminals such as supply terminals of the electronic circuit and input and output terminals of the signal to be processed being interconnected to the major part of the submerged electrical circuit. It is understood of course that the connections can be protected in the same way as the electronic circuit itself to constitute the major part of the submerged electrical circuit, only the parts external to the sealed crossings, supporting the connection terminals, not being understood of course coated with the anti-corrosion protection layer.
- the sealed metal enclosure 3 may be provided with a terminal making it possible to connect this sealed enclosure 3 to a reference potential such as the mass of the assembly of a more complex device.
- This terminal bears the reference 30 in FIG. 6a.
- the input and output terminals bear the references T x to T 4 , respectively T to T ' 3 in a nonlimiting manner.
- the processing module when the sealed enclosure 3 constitutes an electrical shielding and if necessary a magnetic shielding with metal, for example, is it completely protected, not only from external electrical or radioelectric disturbances which are stopped by the shielding formed by the aforementioned sealed enclosure 3, but also internal radioelectric disturbances constituted by the interface micro-discharges, which makes it possible to obtain processing of the input signal substantially free of any parasite.
- the electric circuit in accordance with the object of the present invention comprises, as represented in FIG. 6b above-mentioned, disposed between the pole pieces PP and the core CO of a permanent magnet, the aforementioned electric winding BO formed by a multiple winding in electric wire enamelled by example, this winding BO being wound on the base of the diaphragm M of the loudspeaker. In its middle position or rest position, the winding surrounds the core CO of the permanent magnet.
- FIG. 6b disposed between the pole pieces PP and the core CO of a permanent magnet
- the aforementioned electric winding BO formed by a multiple winding in electric wire enamelled by example, this winding BO being wound on the base of the diaphragm M of the loudspeaker.
- the winding surrounds the core CO of the permanent magnet.
- a semiconductor material 2 having ferromagnetic properties is placed between the pole pieces and the CO core so that this semiconductor material 2, endowed with ferromagnetic properties, provides 1 ' total immersion of the winding BO in its average position.
- the semiconductor material 2 is then subjected to the permanent magnetic field of confinement in the space defined by the pole pieces PP and by the core CO of the permanent magnet.
- the pole pieces PP are connected by a magnetic circuit CM in a conventional manner.
- the semiconductor material 2 having ferromagnetic properties was constituted by a mixture of: - 70 to 90% by weight of FERROFLUIDE, and - 30 to 10% by weight of a material miscible powder with low electrical conductivity.
- the pulverulent material being powdered graphite mixed in the proportions indicated with respect to FERROFLUIDE. Sensitive results have been obtained, the semiconductor material 2 having the ferromagnetic properties thus obtained having been conditioned so as to have a linear resistivity p of between 0.1 ⁇ xm and 10 ⁇ x m. Finally, in all cases where the electrical or electronic circuit cannot be encapsulated, very good results have been obtained by spraying the electrical conductor with wire enamelled with a graphite aerosol, such as the GRAPHIT 33 previously mentioned. , and by carefully wiping off the excess product. This is particularly the case for: transformers and their connection harnesses; cable harnesses for power; the loudspeaker coils in which FERROFLUIDE is not used; in general, all insulated conductors which cannot be encapsulated.
- the musical signals that is to say the electronic signals at audio frequencies, translated in the form of voltage in the conductors, cause micro-discharges at the conductor / insulator interfaces.
- listening at low level is substantially the same as listening at high level, the sound planes being generally preserved as well as the stereo image allowing a listener to locate, at least perceptually, the various musical instruments generating the signals transmitted to the recording.
- M.JOHANNET from a commercial optical disc source of the PHILIPS brand, entirely classic model, associated with an amplifier as described in connection with FIG. Lg and lh, and associated with speakers single channel acoustic quality of any quality, overall enabled a hearing of such quality that the the poor quality of the speakers was itself overlooked.
Abstract
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Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10517259A JP2001502109A (ja) | 1996-10-10 | 1997-10-07 | 微小放電などの電磁波ノイズを補償した電気導体及び電気回路の製造方法と、それらの導体及び回路 |
CA002266655A CA2266655A1 (fr) | 1996-10-10 | 1997-10-07 | Procede de fabrication d'un conducteur, ou circuit, electrique compense en parasites radioelectriques tels que micro-decharges et conducteur ou circuit correspondant |
AU46268/97A AU4626897A (en) | 1996-10-10 | 1997-10-07 | Method for making a conductor, or electric circuit balanced in radioelectric interference such as micro-discharge and corresponding conductor or circuit |
EP97944935A EP0931440A1 (fr) | 1996-10-10 | 1997-10-07 | Procede de fabrication d'un conducteur, ou circuit, electrique compense en parasites radioelectriques tels que micro-decharges et conducteur ou circuit correspondant |
BR9712303-0A BR9712303A (pt) | 1996-10-10 | 1997-10-07 | Processo de fabricação de um condutor, ou circuito elétrico compensado em parasitas rádioelétricas, tais como microdescargas e condutor ou circuito correspondente |
US09/284,255 US6438250B1 (en) | 1996-10-10 | 1997-10-07 | Method for making a conductor, or electric circuit balanced in radioelectric interference such as micro-discharge and corresponding conductor or circuit |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9612369A FR2754630B1 (fr) | 1996-10-10 | 1996-10-10 | Procede de fabrication d'un conducteur, ou circuit electrique compense en parasites radioelectriques tels que micro-decharges et conducteur ou circuit correspondant |
FR96/12369 | 1996-10-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998016094A1 true WO1998016094A1 (fr) | 1998-04-16 |
Family
ID=9496539
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR1997/001786 WO1998016094A1 (fr) | 1996-10-10 | 1997-10-07 | Procede de fabrication d'un conducteur, ou circuit, electrique compense en parasites radioelectriques tels que micro-decharges et conducteur ou circuit correspondant |
Country Status (11)
Country | Link |
---|---|
US (1) | US6438250B1 (fr) |
EP (1) | EP0931440A1 (fr) |
JP (1) | JP2001502109A (fr) |
KR (1) | KR20000048903A (fr) |
CN (1) | CN1233386A (fr) |
AU (1) | AU4626897A (fr) |
BR (1) | BR9712303A (fr) |
CA (1) | CA2266655A1 (fr) |
FR (1) | FR2754630B1 (fr) |
TW (1) | TW352476B (fr) |
WO (1) | WO1998016094A1 (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2784000A1 (fr) * | 1998-09-29 | 2000-03-31 | Electricite De France | Dispositif de protection d'un circuit electrique contre les phenomenes de microdecharges d'interface |
FR2811510B1 (fr) * | 2000-07-06 | 2002-10-11 | Electricite De France | Dispositif de protection d'un circuit electronique contre les parasites engendres dans ce circuit par le phenomene de micro-decharges d'interface |
FR2823634B1 (fr) * | 2001-04-13 | 2003-05-30 | Pierre Henri Raymond Johannet | Dispositif de protection des conducteurs electriques contre les microdecharges d'interface (mdi) |
SE0101720D0 (sv) * | 2001-05-16 | 2001-05-16 | Bang & Olufsen Powerhouse As | Apparatus for electric to acoustic conversion |
FR2827116A1 (fr) * | 2001-07-03 | 2003-01-10 | Pierre Johannet | Dispositif de protection des conducteurs et haut-parleurs contre les microdecharges d'interface (mdi) |
WO2009036556A1 (fr) | 2007-09-19 | 2009-03-26 | Ken Hotte | Câble de transport d'électricité |
US10362381B2 (en) * | 2011-06-01 | 2019-07-23 | Staton Techiya, Llc | Methods and devices for radio frequency (RF) mitigation proximate the ear |
WO2015124352A1 (fr) * | 2014-02-19 | 2015-08-27 | Tetra Laval Holdings & Finance S.A. | Bloc d'alimentation |
CN105207135A (zh) * | 2015-09-21 | 2015-12-30 | 国家电网公司 | 一种高压电缆头中间芯线的处理方法 |
CN105207134B (zh) * | 2015-09-21 | 2018-03-16 | 国家电网公司 | 应用半导体涂覆的高压电缆头制作方法 |
JP2017219801A (ja) * | 2016-06-10 | 2017-12-14 | 東洋製罐グループホールディングス株式会社 | 多芯光コネクタ及びその製造方法 |
US10520923B2 (en) * | 2018-05-22 | 2019-12-31 | Mantle Inc. | Method and system for automated toolpath generation |
Citations (5)
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WO1985000245A1 (fr) * | 1983-06-21 | 1985-01-17 | Compagnie Francaise De Raffinage | Nouvelle structure de cable electrique et ses applications |
EP0161805A1 (fr) * | 1984-04-12 | 1985-11-21 | Electro Materials Corp. Of America | Matériau électroconducteur détachable |
US4749506A (en) * | 1984-09-29 | 1988-06-07 | Ricoh Co., Ltd. | Fine particle substance-containing microgel dispersions |
EP0271407A1 (fr) * | 1986-12-04 | 1988-06-15 | Gérard Philippe Alain Noel | Procédé de protection d'un élément d'installation plongé dans un milieu environnant et sensible aux influences électriques, magnétiques et/ou électromagnétiques présentes dans ce milieu |
US5461677A (en) * | 1993-09-16 | 1995-10-24 | Ferrofluidics Corporation | Loudspeaker |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US3963882A (en) * | 1975-03-14 | 1976-06-15 | Control Data Corporation | Boron or graphite reinforced voice coil and manufacturing process |
US3991286A (en) * | 1975-06-02 | 1976-11-09 | Altec Corporation | Heat dissipating device for loudspeaker voice coil |
US4091139A (en) * | 1975-09-17 | 1978-05-23 | Westinghouse Electric Corp. | Semiconductor binding tape and an electrical member wrapped therewith |
US4604229A (en) * | 1985-03-20 | 1986-08-05 | Ferrofluidics Corporation | Electrically conductive ferrofluid compositions and method of preparing and using same |
JP2940588B2 (ja) * | 1993-04-19 | 1999-08-25 | 株式会社ケンウッド | ボイスコイルの構造 |
JP3161673B2 (ja) * | 1994-05-30 | 2001-04-25 | 松下電器産業株式会社 | マイクロスピーカ用磁気回路ユニット及びその製造方法 |
US5894524A (en) * | 1995-08-02 | 1999-04-13 | Boston Acoustics, Inc. | High power tweeter |
US6086792A (en) * | 1999-06-30 | 2000-07-11 | Union Carbide Chemicals & Plastics Technology Corporation | Cable semiconducting shields |
-
1996
- 1996-10-10 FR FR9612369A patent/FR2754630B1/fr not_active Expired - Fee Related
-
1997
- 1997-10-07 EP EP97944935A patent/EP0931440A1/fr not_active Withdrawn
- 1997-10-07 US US09/284,255 patent/US6438250B1/en not_active Expired - Fee Related
- 1997-10-07 WO PCT/FR1997/001786 patent/WO1998016094A1/fr not_active Application Discontinuation
- 1997-10-07 BR BR9712303-0A patent/BR9712303A/pt not_active Application Discontinuation
- 1997-10-07 AU AU46268/97A patent/AU4626897A/en not_active Abandoned
- 1997-10-07 TW TW086114619A patent/TW352476B/zh active
- 1997-10-07 CN CN97198694A patent/CN1233386A/zh active Pending
- 1997-10-07 JP JP10517259A patent/JP2001502109A/ja active Pending
- 1997-10-07 KR KR1019990702933A patent/KR20000048903A/ko not_active Application Discontinuation
- 1997-10-07 CA CA002266655A patent/CA2266655A1/fr not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1985000245A1 (fr) * | 1983-06-21 | 1985-01-17 | Compagnie Francaise De Raffinage | Nouvelle structure de cable electrique et ses applications |
EP0161805A1 (fr) * | 1984-04-12 | 1985-11-21 | Electro Materials Corp. Of America | Matériau électroconducteur détachable |
US4749506A (en) * | 1984-09-29 | 1988-06-07 | Ricoh Co., Ltd. | Fine particle substance-containing microgel dispersions |
EP0271407A1 (fr) * | 1986-12-04 | 1988-06-15 | Gérard Philippe Alain Noel | Procédé de protection d'un élément d'installation plongé dans un milieu environnant et sensible aux influences électriques, magnétiques et/ou électromagnétiques présentes dans ce milieu |
US5461677A (en) * | 1993-09-16 | 1995-10-24 | Ferrofluidics Corporation | Loudspeaker |
Also Published As
Publication number | Publication date |
---|---|
BR9712303A (pt) | 1999-08-31 |
AU4626897A (en) | 1998-05-05 |
JP2001502109A (ja) | 2001-02-13 |
CN1233386A (zh) | 1999-10-27 |
CA2266655A1 (fr) | 1998-04-16 |
KR20000048903A (ko) | 2000-07-25 |
TW352476B (en) | 1999-02-11 |
US6438250B1 (en) | 2002-08-20 |
FR2754630B1 (fr) | 2000-12-01 |
EP0931440A1 (fr) | 1999-07-28 |
FR2754630A1 (fr) | 1998-04-17 |
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