CROSS REFERENCE TO RELATED APPLICATIONS
This application is related to and claims the benefit of U.S. Provisional Application No. 61/492,193 entitled “METHODS AND DEVICES FOR RADIO FREQUENCY (RF) MITIGATION PROXIMATE THE EAR” filed on Jun. 1, 2011, the contents of which are incorporated herein by reference.
FIELD OF INVENTION
The present invention relates to earpieces and, more particularly, to earpieces and methods of forming earpieces for radio frequency (RF) mitigation proximate the ear.
BACKGROUND OF THE INVENTION
During data transmission, communication devices (such as mobile phones) may emit radio frequency (RF) waves, a form of electromagnetic radiation. There are generally two types of electromagnetic radiation, ionizing and non-ionizing radiation. It is known that large doses of ionizing radiation (for example, X-rays, ultraviolet (UV) rays, and gamma rays) may cause cancer. There is concern that non-ionizing radiation (for example, visible light, microwaves and RF waves) may also cause cancer. Recent studies have indicated that there may be a link between the non-ionizing radiation (such as the radiation emitted from mobile phones) and cancer.
SUMMARY OF THE INVENTION
The present invention relates to an earpiece configured to be inserted in an ear canal. The earpiece includes an insertion element and a sealing section disposed on the insertion element and configured to conform to the ear canal. The sealing section is configured to substantially mitigate RF transmission and to substantially isolate the ear canal from an ambient environment.
The present invention also relates to an earpiece configured to be inserted in an ear canal of an ear. The earpiece includes a stent, a housing coupled to the stent and a sealing section disposed on the stent and configured to conform to the ear canal. The sealing section is configured to substantially mitigate RF transmission from a communication device proximate the ear and to substantially isolate the ear canal from an ambient environment.
The present invention also relates to methods of forming an earpiece. The method includes forming an insertion element, forming a sealing section to substantially mitigate RF transmission and attaching the sealing section to the insertion element. The sealing section is configured to conform to an ear canal and to substantially isolate the ear canal from an ambient environment.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention may be understood from the following detailed description when read in connection with the accompanying drawing. It is emphasized, according to common practice, that various features of the drawing may not be drawn to scale. On the contrary, the dimensions of the various features may be arbitrarily expanded or reduced for clarity. Moreover, in the drawing, common numerical references are used to represent like features. Included in the drawing are the following figures:
FIG. 1 is a side-view diagram of an exemplary earpiece inserted in an ear, according to an embodiment of the present invention;
FIG. 2 is a cross-section diagram of the earpiece shown in FIG. 1 which may receive RF radiation, illustrating one or more components that may be included in the earpiece, according to an exemplary embodiment of the present invention;
FIGS. 3A and 3B are cross-section diagrams of exemplary sealing sections, according to embodiments of the present invention; and
FIG. 4 is a flowchart diagram of an exemplary method of forming an earpiece for RF mitigation proximate the ear, according to an embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
Aspects of the present invention relate to earpieces and methods of forming earpieces for RF mitigation proximate the ear. An exemplary earpiece may include an insertion element and a sealing section disposed on the insertion element. The sealing section is configured to be inserted in an ear canal and may be configured to conform to the ear canal. According to an exemplary embodiment, the sealing section may be configured to substantially absorb RF radiation. According to another embodiment, the insertion element may also be configured to substantially absorb RF radiation. Accordingly, the earpiece may absorb RF emission and provide sound isolation from an ambient environment. According to an exemplary embodiment, the sealing section may include an expandable element filled with a medium and particles configured to absorb the RF emission. According to another exemplary embodiment, the sealing section may include a sealing material and particles configured to absorb the RF emission.
According to an exemplary embodiment, an exemplary earpiece may include at least one transducer. A transducer may be configured to receive a sound signal from a communication device coupled to the earpiece and to transmit the sound signal to the ear canal. The communication device may emit RF radiation. Accordingly, exemplary earpieces of the present invention may be coupled to one or more communication devices and may provide acoustic signals to the ear canal, while providing RF mitigation to the ear canal from RF radiation emitted by the communication device.
Referring to
FIG. 1, a side-view diagram of an
exemplary earpiece 100 is shown. Earpiece
100 is shown relative to
ear 106 of
user 118.
FIG. 1 also illustrates a general physiology of
ear 106. An external portion of
ear 106 includes
pinna 108. An internal portion of
ear 106 includes
ear canal 110 and tympanic membrane
112 (i.e., an eardrum).
Pinna
108 is a cartilaginous region of
ear 106 that focuses acoustic information from
ambient environment 116 to
ear canal 110. In general, sound enters
ear canal 110 and is subsequently received by
tympanic membrane 112. Acoustic information resident in
ear canal 110 vibrates
tympanic membrane 112. The vibration is converted to a signal (corresponding to the acoustic information) that is provided to an auditory nerve (not shown).
Earpiece 100 may include
insertion element 102 operatively coupled to sealing
section 104.
Earpiece 100 may be configured to be inserted into
ear canal 110, such that
sealing section 104 forms sealed volume
114 (also referred to herein as sealed cavity
114) between
sealing section 104 and
tympanic membrane 112.
Sealing section 104 may be configured to seal
ear canal 110 from sound (i.e., provide sound isolation from
ambient environment 116 external to ear canal
110).
As described further below,
sealing section 104 may be configured to substantially absorb RF radiation
206 (
FIG. 2) (i.e., RF transmission) emitted from communication device
202 (
FIG. 2).
Insertion element 102 may also be configured to substantially absorb RF emission.
Referring next to
FIG. 2, a cross-section diagram of
earpiece 100 in
ear 106 is shown.
FIG. 2 illustrates one or more components which may be included in
earpiece 100. In general,
earpiece 100 may be configured to be inserted into
ear canal 110, and to form an acoustic seal (via sealing section
104) with
walls 208 of
ear canal 110 at a
location 210 between
entrance 212 to
ear canal 110 and
tympanic membrane 112.
FIG. 2 also illustrates
communication device 202 proximate to
ear 106. Although one
communication device 202 is shown, it is understood that there may more than one
communication device 202 which may be proximate to
ear 106. In general,
communication device 202 may emit (i.e., transmit)
RF radiation 206 which may reach
ear 106.
Communication device 202 may include, for example, a mobile phone or a digital wireless system such as a data communication network. In general,
communication device 202 may include any device that may emit
RF radiation 206.
Sealing section 104 is described further below with respect to
FIGS. 3A and 3B. In general, sealing
section 104 may be configured to interfere with, absorb and/or reflect RF radiation
206 (i.e., to provide RF mitigation of RF radiation
206).
Insertion element 102 may be formed from, for example, thermoplastic elastomer (TPE) materials, materials having an elastomeric property (such as silicone), or other malleable materials capable of conforming to the ear canal. According to an exemplary embodiment,
insertion element 102 may also be configured to provide mitigation of
RF radiation 206. For example,
insertion element 102 may be impregnated with an RF damping material such as a TPE filled with graphite and/or nickel powder. In general, RF mitigation components in earpiece
100 (in sealing
section 104 and/or in insertion element
102) may be electrically coupled and/or grounded to
user 118 or an alternate acceptable location.
Insertion element 102 may include
stent 230 and
housing 232.
Stent 230 and/or
housing 232 may include one or more components of
earpiece 100, described further below.
Sealing section 104 may be disposed on
stent 230, such that
stent 230 is also inserted in
ear canal 110.
Housing 232 may be coupled to
stent 230 and may be placed at
entrance 212 to
ear canal 110. According to an exemplary embodiment, at least one of
stent 230 or
housing 232 may be configured to provide mitigation of
RF radiation 206. In
FIG. 2,
earpiece 100 is illustrated as being disposed in
ear 106. It is understood that various components of
earpiece 100 may also be configured to be placed behind
ear 106 or may be placed partially behind
ear 100 and partially in
ear 100.
According to an exemplary embodiment,
earpiece 100 may be configured to communicate with
communication device 202. According to another embodiment,
earpiece 100 may be configured as a sound isolation device (described further below) and thus, may not be configured to communicate with
communication device 202.
As shown in
FIG. 2,
insertion element 102 may include one or more components, such as electro-acoustical components, electrical components and/or
pumping mechanism 228 for sealing
section 104. Several example embodiments of components that may be included in
insertion element 102 are discussed below.
According to one embodiment,
earpiece 100 may include
insertion element 102 and sealing
section 104, without any electro-acoustic elements. In this embodiment,
earpiece 100 may be configured simply as a sound isolation device, where sealing
section 104 and/or
insertion element 102 are configured to substantially mitigate
RF radiation 206 from
communication device 202. In this manner,
RF radiation 206 may be substantially mitigated and/or prevented from reaching
closed cavity 114 of
ear canal 110. If sealing
section 104 is configured to be expanded (such as described with respect to
FIG. 3A),
housing 232 may include
pumping mechanism 228 to provide medium
304 (
FIG. 3A) to sealing
section 104 via
stent 230.
According to another embodiment,
earpiece 100 may include one or more electro-acoustical components (i.e., transducers). For example,
stent 230 may include ear canal receiver (ECR)
214 (i.e., a loudspeaker).
ECR 214 may be configured to provide acoustic content to sealed
volume 114.
ECR 214 may receive the acoustic content from
communication device 202 or any other device capable of providing acoustic content (such as a portable audio player).
As a result of the seal provided by sealing
section 104,
ECR 214 may be able to generate a full range bass response time when reproducing sounds for user
118 (
FIG. 1). The seal (by sealing section
104) may also significantly reduce a sound pressure level at
tympanic membrane 112 resulting from the sound field at
entrance 212 to ear canal
110 (to provide sound isolation).
According to another exemplary embodiment,
stent 230 may include ear canal microphone (ECM)
216 located adjacent to
ECR 214, which may also be acoustically coupled to sealed
cavity 114.
ECM 216 may measure a sound pressure level in sealed
cavity 114. For example, the sound pressure level in sealed
cavity 114 may be measured as a part of testing a hearing acuity of user
118 (
FIG. 1). The sound pressure level in sealed
cavity 114 may also be used to confirm an integrity of the acoustic seal of sealing
section 104, as well as the working conditions of
ECM 216 and
ECR 214.
According to another exemplary embodiment,
housing 232 may include ambient sound microphone (ASM
218).
ASM 218 may monitor a sound pressure at
entrance 212 to (occluded)
ear canal 110. The sound pressure monitored by
ASM 218 may be used, for example, to adjust the sound isolation provided by sealing
section 104. As another example, the sound pressure monitored by
ASM 218 may be used to adjust a volume of the audio content provided by
ECR 214 to
closed cavity 114.
All transducers (such as
ECR 214,
ECM 216 and ASM
218) may respectively receive or transmit audio signals to control
circuit 220 in
housing 232.
Control circuit 220 may undertake at least a portion of the audio signal processing described above.
Control circuit 220 may include, for example, a logic circuit, a digital signal processor or a microprocessor. Although not shown,
earpiece 100 may also include a memory to store one or more signals from
ECR 214,
ECM 216 and
ASM 218. As another example,
earpiece 100 may be coupled to a memory that is remote from
earpiece 100. The memory may include, for example, a random access memory (RAM), a magnetic disk, an optical disk, flash memory or a hard drive. Although
ECR 214 and
ECM 216 are shown in
FIG. 2 as being in
stent 230, it is understood that one or more of
ECR 214 and
ECM 216 may be formed in
housing 232 and coupled to
closed cavity 114 via acoustic channels formed in
stent 230.
Housing 232 may also include
communication circuit 222 coupled to control
circuit 220. In general,
communication circuit 222 may be configured to receive and/or transmit signals to
earpiece 100.
Communication circuit 222 may be configured to communicate with
communication device 202 via
communication path 224.
Communication path 224 may include a wired or wireless connection. It is understood that any transceivers (not shown) of
communication circuit 222 may be positioned on
housing 232 such that they are out of range of the RF mitigation provided by sealing
section 104 and/or
insertion element 102, such that the RF mitigation provided by
earpiece 100 may not interfere with data transmission and/or reception by
communication circuit 222.
According to another exemplary embodiment,
housing 232 may include
user interface 226.
Housing 232 may also include
pumping mechanism 228 for controlling expansion of sealing
section 104.
User interface 226 may be configured to control one or more of
ECR 214,
ECM 216,
ASM 218,
control circuit 220,
communication circuit 222 and
pumping mechanism 228.
ECR 214,
ECM 216,
ASM 218,
control circuit 220,
communication circuit 222,
user interface 226 and
pumping mechanism 228 may be coupled together via a data and control bus (not shown). It is understood that
earpiece 100 may include additional components (not shown) such as a battery.
Referring next to
FIGS. 3A and 3B,
exemplary sealing sections 104,
104′ are shown. In particular,
FIG. 3A is a cross-section diagram of sealing
section 104 including expandable element
302 (such as a balloon) filled with
medium 304; and
FIG. 3B is a cross-section diagram of sealing
section 104′ in
ear canal 110 including sealing
material 310. Each of sealing
section 104 and sealing
section 104′ may include
particles 306 to substantially absorb RF radiation
206 (
FIG. 2) (for example, between about 3 kHz to about 300 GHz).
Referring to
FIG. 3A, sealing
section 104 may include
expandable element 302 filled with
medium 304 mixed with particles
306 (for example, suspended in solution).
Sealing section 104 is configured to substantially attenuate sound from ambient environment
116 (
FIG. 1).
Sealing section 104 is also configured to substantially absorb RF radiation
206 (
FIG. 2) via
particles 306. In general,
particles 306 may be configured to interfere with, absorb and/or reflect RF radiation
206 (
FIG. 2).
Expandable element 302 may include balloons of various shapes, sizes and materials, for example constant volume balloons (low elasticity<=50% elongation under pressure or stress) and variable volume (high elastic>50% elongation under pressure or stress) balloons. Pumping mechanism
228 (
FIG. 2) may be used to provide medium
304 to
expandable element 302.
Expandable element 302 may be formed from any compliant material that has a low permeability to
medium 304. Examples of materials of
expandable element 302 include any suitable elastomeric material, such as, without being limited to, silicone, rubber (including synthetic rubber) and polyurethane elastomers (such as Pellethane® and Santoprene™). Materials of
expandable element 302 may be used in combination with a barrier layer (for example, a barrier film such as SARANEX™), to reduce the permeability of
expandable element 302. In general,
expandable element 302 may be formed from any suitable material having a range of Shore A hardness between about 5 A and about 90 A, with an elongation of about 500% or greater.
Expandable element 302 may also be made of RF absorbing elastomers such as a polyurethane filled with electrically conductive material such as iron graphite and/or nickel particles.
Medium 304 may include, without being limited to, electrically conductive liquids such as saline and colloidal liquids that have carrier fluids including, for example, fluorocarbon liquids such as Flourinert™ (manufactured by 3M™) (including, for example, FC-770), ethylene glycol and isopropyl alcohol (with
particles 306 suspended in solution).
Medium 304 may include any suitable liquid or gel capable of expanding and contracting
expandable element 302 and that would maintain a comfortable level of pressure for user
118 (
FIG. 1) of
earpiece 100. In general, examples of
medium 304 include, without being limited to, silicone, non or low permeable-based polymers, gels, fluorocarbon liquids, ethylene glycol, isopropyl alcohol or saline.
Particles 306 may include ferromagnetic particles, ferrimagnetic particles or electrically conductive particles such as graphite, nickel, and/or iron. As understood by one of skill in the art,
particles 306 may be formed large enough to provide adequate radio frequency interference (RFI) shielding and may be formed small enough to not impede a mechanical operation of earpiece
100 (
FIG. 1). In an exemplary embodiment, a size of
particles 306 may range from about 0.1 μm to about 100 μm in diameter. In general,
particles 306 may include any suitable particles configured to interfere with, absorb and/or reflect RF radiation
206 (
FIG. 2). Although
particles 306 are described herein, it is understood that medium may include fibers instead of or in addition to
particles 306. The fibers may also be formed of ferromagnetic material, ferrimagnetic material or electrically conductive material, as described above with respect to
particles 306.
As shown in
FIG. 3B, sealing
section 104′ is similar to sealing section
104 (
FIG. 3A), except that
sealing section 104′ includes sealing
material 310 having embedded
particles 306 for substantially mitigating RF radiation
206 (
FIG. 2). Thus, sealing
section 104′ may also be configured to seal
ear canal 110 from ambient sound
116 (
FIG. 1).
Sealing material 310 may include, without being limited to, foam, rubber or any suitable sealing material capable of conforming to
ear canal 110 and for sealing
ear canal 110 to provide sound isolation.
Sealing material 310 may also be composed of RF damping materials such as a polyurethane and or any other applicable polymer or rubber such as silicone filled with RF shielding materials such as nickel, graphite, and/or iron particles.
In general, earpiece 100 (FIG. 1) may provide RF shielding by using any suitable electrically conductive material. Because metals are typically not flexible and may be difficult form into a suitable earpiece shape (such as by injection molding), in an exemplary embodiment, conductive particles/fibers may be used as fillers to make polymers conductive (and thus to provide effective RF shielding materials).
According to another exemplary embodiment, at least one of
insertion element 102 or sealing
section 104 may be formed from a flexible material that is inherently conductive, without using fillers (such as conductive particles and/or fibers). For example, a metal earpiece body may be formed. An example of this is provided with respect to the medium
304 (
FIG. 3A) used to fill
expandable element 302. If a fluid is conductive, it may be capable of provide RF shielding without fillers such as particles and/or fibers. However, based on the desired shielding characteristics (i.e., a frequency range of RF radiation and a desired reflectivity), fillers may be added to improve conductivity and thus, RF shielding. For example, the higher the conductivity and the thicker the material, the greater the shielding capability by the material, and the greater the shielding at lower frequencies. As is the case with solids, shielding ability may be afforded to nonconductive fluids by using conductive fillers.
Referring back to
FIG. 2, although
earpiece 100 is described above as being configured to mitigate
RF radiation 206 from
communication device 202,
earpiece 100 may also be configured to mitigate RF radiation produced by
earpiece 100 itself. For example,
insertion element 102 and/or sealing
section 104 may mitigate RF radiation emitted by
communication circuit 222. In an exemplary embodiment,
earpiece 100 may be configured to absorb between about 70% and about 100% of generated and/or received RF radiation within a frequency range of
communication device 202 and internally generated radiation typically in a range between about 3 kHz and 300 GHz.
Referring next to FIG. 4, a flowchart diagram of an exemplary method for forming an earpiece capable of RF mitigation is shown. The steps illustrated in FIG. 4 represent an example embodiment of the present invention. It is understand that certain steps may be performed in an order different from what is shown. It is also understood that certain steps may be eliminated.
At
step 402, stent
230 (
FIG. 2) is formed, for example, via injection molding. According to an exemplary embodiment, stent
230 (
FIG. 2) may be formed with a material capable of RF mitigation. For example, stent
230 (
FIG. 2) may be formed of an RF damping material such as polyurethane filled with RF shielding material such as iron, nickel and/or graphite particles. As another example, stent
230 (
FIG. 2) may be formed of a material with embedded ferromagnetic particles, ferrimagnetic or electrically conductive particles for RF mitigation.
At
optional step 404, one or more components may be inserted in stent
230 (
FIG. 2). For example, as shown in
FIG. 2, one or more electro-acoustic components (such as
ECR 214 and/or ECM
216) may be formed in
stent 230.
At
step 406, housing
232 (
FIG. 2) may be formed, for example, via injection molding. According to an exemplary embodiment, housing
232 (
FIG. 2) may be formed with a material capable of RF mitigation. For example, housing
232 (
FIG. 2) may be formed of an RF damping material such as polyurethane filled with RF shielding material such as iron, nickel, and/or graphite particles. As another example, housing
232 (
FIG. 2) may be formed of a material with embedded ferromagnetic particles, ferrimagnetic or electrically conductive particles for RF mitigation.
At
optional step 408, one or more components may be inserted in housing
232 (
FIG. 2). For example, as shown in
FIG. 2, electro-acoustic components (such as ASM
218), electrical components (such as
control circuit 220,
communication circuit 222 and/or user interface
226) and/or other components (such as pumping mechanism
228) may be formed in
housing 232. At
step 410, housing
232 (
FIG. 2) is coupled to
stent 230.
At
step 412, sealing section
104 (
FIG. 1) is formed such that it includes RF mitigation properties. For example, sealing
section 104 may include medium
304 (
FIG. 3A) and
particles 306 for RF mitigation or may include sealing material
310 (
FIG. 3B) with embedded
particles 306 for RF mitigation. Sealing material
310 (
FIG. 3B) may also be formed of RF damping material such as polyurethane filled with RF shielding materials such as iron, nickel and/or graphite particles.
At
step 414, sealing section
104 (
FIG. 2) is attached to
stent 230. Sealing section
104 (
FIG. 2) may be attached to
stent 230 via any suitable attachment method, such as, but not limited to, bonding, adherence with an adhesive, thermal bonding, molding and ultrasonic bonding.
Although the invention is illustrated and described herein with reference to specific embodiments, the invention is not intended to be limited to the details shown. Rather, various modifications may be made in the details within the scope and range of equivalents of the claims and without departing from the invention.