WO1998001821A1 - Carte a puce et son procede de fabrication - Google Patents

Carte a puce et son procede de fabrication Download PDF

Info

Publication number
WO1998001821A1
WO1998001821A1 PCT/DE1997/001301 DE9701301W WO9801821A1 WO 1998001821 A1 WO1998001821 A1 WO 1998001821A1 DE 9701301 W DE9701301 W DE 9701301W WO 9801821 A1 WO9801821 A1 WO 9801821A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
recess
card
induction coil
base body
Prior art date
Application number
PCT/DE1997/001301
Other languages
German (de)
English (en)
Inventor
Martin Gruber
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1998001821A1 publication Critical patent/WO1998001821A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Definitions

  • one conductor track end is preferably routed on the outside to the semiconductor chip and all other conductor track sections are routed on the inside to the semiconductor chip.
  • the terms indoor and the outside are to be understood taking into account the semiconductor chip position on the overall chip card.
  • This arrangement of the induction coil ends allows contacting to be made with relatively short bond wires. If the conductor tracks are run along the outside of the semiconductor chip, the area of the induction coil and thus also the sensitivity increases. On the other hand, when the conductor tracks are guided along the inside of the semiconductor chip, it lies outside the main magnetic field, so that undesired couplings can be avoided.
  • the method is characterized by the direct mounting and wiring of the semiconductor chip 4 in the card base body 1, as a result of which the connection to the induction coil 14 in the region of the recess 3 can be established in a simple manner and without protrusion on the chip card surface.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne une carte à puce et son procédé de fabrication. Une bobine d'induction (14) imprimée ou appliquée par galvanisation sur le corps de base (1) d'une carte est amenée dans la zone de la puce jusqu'à des points de raccordement situés plus en bas dans un évidement (3), à la hauteur de la puce, et y est mise en contact avec la puce au moyen de fils électriques.
PCT/DE1997/001301 1996-07-10 1997-06-23 Carte a puce et son procede de fabrication WO1998001821A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19627827.9 1996-07-10
DE19627827A DE19627827A1 (de) 1996-07-10 1996-07-10 Chipkarte und Verfahren zu ihrer Herstellung

Publications (1)

Publication Number Publication Date
WO1998001821A1 true WO1998001821A1 (fr) 1998-01-15

Family

ID=7799462

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1997/001301 WO1998001821A1 (fr) 1996-07-10 1997-06-23 Carte a puce et son procede de fabrication

Country Status (2)

Country Link
DE (1) DE19627827A1 (fr)
WO (1) WO1998001821A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1280101B1 (fr) * 2000-04-04 2005-05-18 Toray Engineering Co., Ltd. Procede de production de boitier cof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0376062A1 (fr) * 1988-12-27 1990-07-04 Eta SA Fabriques d'Ebauches Module électronique pour un objet portatif de petite dimension, tel qu'une carte ou une clef, à circuit intégré, et procédé de fabrication de tels modules
FR2716022A1 (fr) * 1994-02-04 1995-08-11 Mitsubishi Electric Corp Module à semi-conducteur sans contact.
EP0671705A2 (fr) * 1994-02-14 1995-09-13 Gemplus Card International Procédé de fabrication d'une carte sans contact et carte sans contact
EP0682321A2 (fr) * 1994-05-11 1995-11-15 Giesecke & Devrient GmbH Porteur d'information à puce
EP0688051A1 (fr) * 1994-06-15 1995-12-20 Philips Cartes Et Systemes Procédé de fabrication et d'assemblage de carte à circuit intégré et carte ainsi obtenue
DE4441122C1 (de) * 1994-11-19 1995-12-21 Karl Heinz Wendisch Kontaktlose Ausweis-Chipkarte

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4431605C2 (de) * 1994-09-05 1998-06-04 Siemens Ag Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0376062A1 (fr) * 1988-12-27 1990-07-04 Eta SA Fabriques d'Ebauches Module électronique pour un objet portatif de petite dimension, tel qu'une carte ou une clef, à circuit intégré, et procédé de fabrication de tels modules
FR2716022A1 (fr) * 1994-02-04 1995-08-11 Mitsubishi Electric Corp Module à semi-conducteur sans contact.
EP0671705A2 (fr) * 1994-02-14 1995-09-13 Gemplus Card International Procédé de fabrication d'une carte sans contact et carte sans contact
EP0682321A2 (fr) * 1994-05-11 1995-11-15 Giesecke & Devrient GmbH Porteur d'information à puce
EP0688051A1 (fr) * 1994-06-15 1995-12-20 Philips Cartes Et Systemes Procédé de fabrication et d'assemblage de carte à circuit intégré et carte ainsi obtenue
DE4441122C1 (de) * 1994-11-19 1995-12-21 Karl Heinz Wendisch Kontaktlose Ausweis-Chipkarte

Also Published As

Publication number Publication date
DE19627827A1 (de) 1998-01-22

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