WO1999006948A1 - Procede de production d'une carte a puce pour la transmission sans contact de donnees et/ou d'energie, et une telle carte a puce - Google Patents

Procede de production d'une carte a puce pour la transmission sans contact de donnees et/ou d'energie, et une telle carte a puce Download PDF

Info

Publication number
WO1999006948A1
WO1999006948A1 PCT/DE1998/002047 DE9802047W WO9906948A1 WO 1999006948 A1 WO1999006948 A1 WO 1999006948A1 DE 9802047 W DE9802047 W DE 9802047W WO 9906948 A1 WO9906948 A1 WO 9906948A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
card
coating
cavity
card body
Prior art date
Application number
PCT/DE1998/002047
Other languages
German (de)
English (en)
Inventor
Thies Janczek
Frank PÜSCHNER
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1999006948A1 publication Critical patent/WO1999006948A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]

Definitions

  • the invention relates to a method for producing a chip card for contactless data and / or energy transmission with external devices according to the preamble of patent claim 1. Furthermore, the invention relates to a corresponding chip card according to the preamble of patent claim 5.
  • Chip cards of this type are used, for example, as credit cards or ID cards for cashless payment transactions or to prove access authorization.
  • the chip cards can be divided into two categories with contact and contactless.
  • Chip cards for contact-related data and / or energy transmission have a chip module on the card surface with connection contacts which come into contact with a reading device when the chip card is inserted into an external device.
  • contactless chip cards have a coil which is arranged in the interior of the card body and acts as an antenna and which is connected on the one hand to the chip and on the other hand is used for contact-free data and / or energy transmission.
  • Chip cards are also known which are suitable for both contactless and contact-based transmission.
  • the invention is therefore based on the object of providing a method of the type mentioned at the outset with which a contactless chip card which can also be printed in the chip module area can be produced in the simplest and most economical manner.
  • a contactless chip card is to be created in the simplest and cheapest possible way, which also enables problem-free printing in the chip module area.
  • the chip module is provided with a coating of printable plastic on the side facing away from the chip before it is inserted into the cavity.
  • the exposed surface of the chip module is covered with a printable plastic plate only after it has been installed in the cavity of the card body
  • the surface which is subsequently exposed is already plastic-coated during the manufacture of the chip module that it is printable.
  • the subsequent punching out and implementation of a plastic plate on the chip module used is therefore eliminated.
  • Another advantage is that existing implanting devices, which are usually used for contact-type chip cards, can also be used for the production of contactless chip cards without modification or extension.
  • the coating with plastic is expediently carried out as the last method step of module production, since the temperatures required in the preceding module production steps could impair the quality of the plastic or destroy it.
  • the chip module is produced from a metal strip using leadframe technology and the plastic coating is applied to the metal strip.
  • a metal strip which serves as a chip carrier, can be produced and coated in a very cost-effective manner.
  • the coating material is advantageously passed through slots in the chip carrier and formed into a rivet on the opposite side. This results in an additional form fit through the rear grip sections of the rivet, so that the coating is held on the chip carrier in a very secure manner.
  • Another advantage is that these rivets can be used at the same time, for example by means of ultrasound or high-frequency welding, to establish a firm connection with the rest of the card body after the chip module has been inserted into the cavity.
  • the chip module has a separate coating made of printable plastic on the side facing away from the chip, which advantageously has a thickness of 50-500 ⁇ m.
  • This coating can be made of PVC or ABS.
  • FIG. 1 a schematic sectional illustration of the contactless chip card according to the invention before the chip module is inserted into the cavity of the card body, and
  • FIG. 2 shows a slightly modified embodiment of the chip card shown in FIG. 1 after the chip module has been inserted into the cavity of the card body.
  • FIG. 1 and 2 show a card body 1 which has a middle layer 2 which serves as a coil carrier. On this middle layer 2 there is an as
  • Antenna-acting coil 3 which has four windings in the exemplary embodiment shown and ends in two free coil ends 4, 5.
  • a bottom layer 7 is also provided on the lower side of the middle layer 2.
  • the layers 2, 6, 7, which consist of a non-conductive plastic, can be sprayed on or connected to one another by means of a laminating technique.
  • the middle layer 2 and the layer 6 lying thereon are initially in a cuboid state.
  • a cavity 8 is subsequently introduced from above, e.g. milled in.
  • the shape and size of this cavity 8 is adapted to a chip module 9 which is later inserted into this cavity 8.
  • the depth of the cavity 8 is dimensioned in the region of the coil ends 4, 5 in such a way that these coil ends 4, 5 are roughly milled to half, so that exposed coil end contact surfaces are created.
  • the cavity 8 extends down to the bottom layer 7.
  • the chip module 9 to be inserted into the cavity 8 consists of a chip carrier 10 which is punched out of a metal strip.
  • the chip carrier 10 has a chip carrier center section 11, on the underside of which an electronic chip 12 is fastened.
  • chip carrier side sections 13 which are spaced apart from the chip carrier center section 11, i.e. are isolated, and serve as connection contact surfaces for the chip 12.
  • Chip carrier side sections 13 connected, which is referred to as "wire bonding". Then a potting compound 15 made of resin (globe top) is applied to that side of the chip carrier 11 on which the chip 12 is located, so that the latter together with the connecting wires 14 completely confined will pour. This serves for additional fixation and
  • a plastic coating 16 is applied to the opposite side of the chip carrier 10 and consists of a plastic material suitable for printing, for example PVC or ABS.
  • a plastic material suitable for printing for example PVC or ABS.
  • slots or passages 17 can be provided in the chip carrier side sections 13, through which the plastic material of the plastic coating 16 passes on the opposite side of the chip carrier 10.
  • the plastic material passing through is shaped such that plastic rivets 18 are formed which engage behind the chip carrier side sections 13.
  • the plastic coating 16 is only applied to the chip carrier 10 when the chip 12 and the connecting wires 14 are placed on the chip carrier 10 and the casting compound 15 has been applied. This is because the temperatures used in these manufacturing steps could undesirably change or destroy the plastic coating 16.
  • the chip module 9 is expediently produced using lead-free technology, that is to say that many adjacent chip carriers 10 are in the form of a coherent metal strip and are accordingly equipped with chips 12.
  • the chip module 9 produced in this way is then inserted into the cavity 8 of the card body 1, as can be seen from FIG.
  • the chip carrier side sections 13, which serve as contact connection areas for the chip 12 are soldered or soldered with conductive adhesive 19 to the machined coil ends 4, 5 electrically connected.
  • the card body 1 can be connected to the card body 1 by means of ultrasound or high-frequency welding.
  • an adhesive for example cyanoacrylate, for this connection.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne un procédé de production d'une carte à puce pour la transmission sans contact de données et/ou d'énergie avec des appareils extérieurs. Selon ledit procédé, un module puce (9) est pourvu, avant son insertion dans une cavité (8) d'un corps de carte (1), d'un revêtement (16) en matière plastique imprimable, sur le côté opposé à la puce (12). Le module puce (9) correspondant présente donc sur le côté opposé à la puce (12), un revêtement (16) séparé en matière plastique imprimable.
PCT/DE1998/002047 1997-07-29 1998-07-21 Procede de production d'une carte a puce pour la transmission sans contact de donnees et/ou d'energie, et une telle carte a puce WO1999006948A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19732644.7 1997-07-29
DE1997132644 DE19732644C1 (de) 1997-07-29 1997-07-29 Verfahren zur Herstellung einer Chipkarte für kontaktlose Daten- und/oder Energieübertragung sowie Chipkarte

Publications (1)

Publication Number Publication Date
WO1999006948A1 true WO1999006948A1 (fr) 1999-02-11

Family

ID=7837259

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1998/002047 WO1999006948A1 (fr) 1997-07-29 1998-07-21 Procede de production d'une carte a puce pour la transmission sans contact de donnees et/ou d'energie, et une telle carte a puce

Country Status (2)

Country Link
DE (1) DE19732644C1 (fr)
WO (1) WO1999006948A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19921230B4 (de) * 1999-05-07 2009-04-02 Giesecke & Devrient Gmbh Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten
DE10006515C5 (de) * 2000-02-15 2004-09-16 Datacard Corp., Minnetonka Verfahren zum Einbau von Chips in Kartenkörper
DE10107179C2 (de) * 2001-02-15 2003-02-27 Infineon Technologies Ag Chipkartenmodul
DE10207002A1 (de) * 2002-02-19 2003-08-28 Orga Kartensysteme Gmbh Verfahren zum Implantieren von Chipmodulen in Datenträgerkarten
DE10210606A1 (de) * 2002-03-11 2003-10-09 Giesecke & Devrient Gmbh Tragbarer Datenträger mit Displaymodul und Verfahren zu seiner Herstellung
US6940408B2 (en) * 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
US7224280B2 (en) 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01110994A (ja) * 1987-10-26 1989-04-27 Toshiba Corp 携帯可能媒体
EP0438742A1 (fr) * 1989-12-22 1991-07-31 Oki Electric Industry Company, Limited Méthode de fabrication d'un dispositif semiconducteur à encapsulation plate
EP0564051A1 (fr) * 1992-04-02 1993-10-06 N.V. Nederlandsche Apparatenfabriek NEDAP Carte d'identification avec une partie centrale réutilisable
EP0745955A2 (fr) * 1995-05-31 1996-12-04 HERBST, Richard Méthode et dispositif pour réaliser une carte intelligente
DE19533983A1 (de) * 1995-09-14 1997-04-10 Wendisch Karl Heinz Chipkarte mit Antennenwicklung
WO1997026621A1 (fr) * 1996-01-17 1997-07-24 Gemplus S.C.A. Module electronique sans contact pour carte ou etiquette

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4416697A1 (de) * 1994-05-11 1995-11-16 Giesecke & Devrient Gmbh Datenträger mit integriertem Schaltkreis
DE19609149C2 (de) * 1996-03-08 2000-05-31 Freudenberg Carl Fa Chipkarte

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01110994A (ja) * 1987-10-26 1989-04-27 Toshiba Corp 携帯可能媒体
EP0438742A1 (fr) * 1989-12-22 1991-07-31 Oki Electric Industry Company, Limited Méthode de fabrication d'un dispositif semiconducteur à encapsulation plate
EP0564051A1 (fr) * 1992-04-02 1993-10-06 N.V. Nederlandsche Apparatenfabriek NEDAP Carte d'identification avec une partie centrale réutilisable
EP0745955A2 (fr) * 1995-05-31 1996-12-04 HERBST, Richard Méthode et dispositif pour réaliser une carte intelligente
DE19533983A1 (de) * 1995-09-14 1997-04-10 Wendisch Karl Heinz Chipkarte mit Antennenwicklung
WO1997026621A1 (fr) * 1996-01-17 1997-07-24 Gemplus S.C.A. Module electronique sans contact pour carte ou etiquette

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 8923, Derwent World Patents Index; AN 89-169579, XP002089364 *

Also Published As

Publication number Publication date
DE19732644C1 (de) 1998-11-12

Similar Documents

Publication Publication Date Title
DE68921179T2 (de) Elektronisches Modul mit einer integrierten Schaltung für ein kleines tragbares Objekt, z.B. eine Karte oder ein Schlüssel und Herstellungsverfahren für solche Module.
EP1271399B1 (fr) Porteur de données avec circuit intégré
DE19710144C2 (de) Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte
EP1162569B1 (fr) Méthode de production d'un porteur de données
EP0902973B1 (fr) Substrat pour puce de semiconducteur
EP0931343A1 (fr) Module puce en particulier pour implantation dans un corps de carte a puce
EP0071255A2 (fr) Carte portative pour le traitement d'informations
DE69824679T2 (de) Kontaktlose elektronische Karte und Verfahren zur Herstellung einer solchen Karte
WO1997034247A2 (fr) Carte a puce, systeme de connexion et procede de production d'une carte a puce
DE19709985A1 (de) Chipkarte, Verbindungsanordnung und Verfahren zum Herstellen einer Chipkarte
WO2001073686A1 (fr) Procede pour fabriquer une bande support dotee d'une multitude d'unites electriques presentant chacune une puce et des elements de contact
DE19610507C2 (de) Chipkarte
WO1999006948A1 (fr) Procede de production d'une carte a puce pour la transmission sans contact de donnees et/ou d'energie, et une telle carte a puce
DE19610044C2 (de) Kartenkörper und Verfahren zur Herstellung einer Chipkarte
DE102007022615A1 (de) Kontaktloses Übertragungssystem und Verfahren zum Herstellen desselben
EP0569417B1 (fr) Procede pour fabriquer un support de donnees portable
EP0708414A2 (fr) Porteur d'informations sans contact et méthode pour sa fabrication
EP2491582B1 (fr) Procédé de réalisation de trous métallisés
DE10052517B4 (de) Transpondermodul, Identifikationsträger und Verfahren zum Herstellen eines Transpondermoduls
EP2817768A1 (fr) Module électronique et support de données portatif équipé dudit module électronique et leur procédé de production
DE10234751B4 (de) Verfahren zur Herstellung einer spritzgegossenen Chipkarte und nach dem Verfahren hergestellte Chipkarte
DE19915050A1 (de) Verfahren zur Herstellung einer Chipkarte und Chipkarte, erhalten unter Verwendung des Verfahrens
EP2239692B1 (fr) Carte à puce et procédé destiné à sa fabrication
DE29703548U1 (de) Plastikkarte für ein elektronisches Combi-Card-Modul
DE19612718B4 (de) Chipkarte mit Batterie sowie Verfahren zur Montage einer Chipmodul/Batterie-Einheit

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): BR CN JP KR MX RU UA US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
NENP Non-entry into the national phase

Ref country code: KR

122 Ep: pct application non-entry in european phase