WO1997034247A2 - Carte a puce, systeme de connexion et procede de production d'une carte a puce - Google Patents

Carte a puce, systeme de connexion et procede de production d'une carte a puce Download PDF

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Publication number
WO1997034247A2
WO1997034247A2 PCT/EP1997/001256 EP9701256W WO9734247A2 WO 1997034247 A2 WO1997034247 A2 WO 1997034247A2 EP 9701256 W EP9701256 W EP 9701256W WO 9734247 A2 WO9734247 A2 WO 9734247A2
Authority
WO
WIPO (PCT)
Prior art keywords
chip
card
carrier
connection
module
Prior art date
Application number
PCT/EP1997/001256
Other languages
German (de)
English (en)
Other versions
WO1997034247A3 (fr
Inventor
Robert Wilm
Original Assignee
Pav Card Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19610044A external-priority patent/DE19610044C2/de
Priority claimed from DE1996133938 external-priority patent/DE19633938A1/de
Priority claimed from DE19637215A external-priority patent/DE19637215C2/de
Priority claimed from DE19637214A external-priority patent/DE19637214C2/de
Application filed by Pav Card Gmbh filed Critical Pav Card Gmbh
Priority to AU21556/97A priority Critical patent/AU2155697A/en
Priority to EP97914230A priority patent/EP0976104A2/fr
Publication of WO1997034247A2 publication Critical patent/WO1997034247A2/fr
Publication of WO1997034247A3 publication Critical patent/WO1997034247A3/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10666—Plated through-hole for surface mounting on PCB
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • Chip card connection arrangement and method for producing a chip card
  • the invention relates to a chip card, a connection arrangement and a method for producing a chip card, a semiconductor chip located on a module being used in a recess of a card carrier while maintaining an electrical and mechanical connection.
  • Chip cards for contact-based, but also contactless, ie inductive data transmission have a chip card module connected to the card body, which comprises a semiconductor chip located on a plastic carrier, which is connected to a galvanically generated contact field in contact cards. These contact areas are electrically scanned in a card reader, so that the necessary communication is possible.
  • the data is transmitted by alternating electromagnetic fields, by means of at least one induction coil or antenna arranged in the chip card or in the card carrier.
  • combination cards both systems mentioned are combined in one card.
  • the combination card therefore has both a contact field for contact-based transmission and an inductively connectable contact.
  • it is necessary to establish not only the electrically conductive connections from the semiconductor chip to the system for contact-based transmission, but also connections to the system for inductive data transmission.
  • a module is inserted into a card body, which comprises an IC chip.
  • the module is inserted into a recess in the card body and the like by means of joining. laminated with the card body to obtain a corresponding mechanical and electrical connection.
  • An electrically conductive connection between the module and the card body or contacts located on the card body, which are connected to the induction coil, comes about, for example, from the fact that an anisotropic conductive adhesive in the area of the connection points and / or the connection points of the respective agent applied for contactless data transmission and the adhesive is compressed or compressed so far at least in the area of the connection points that an electrically conductive bridge is formed.
  • the modules used in the production of chip cards generally use a plastic carrier on which the IC chip mentioned at the outset is optionally provided with ISO contact surfaces.
  • the prefabricated module is connected to the card carrier, which can be made of polycarbonate, for example. This connection or the insertion of the module into the card body in a milled recess, for example, usually takes place using a gluing method when using a hot or hot melt adhesive.
  • Chip cards are known in which a coil wound from wire is provided in the card body, the ends of which are connected to antenna contacts of the chip or its carrier. This overall arrangement is cast in the card body, the production being technologically very complex.
  • chip cards have already been presented in which the antenna has been etched out of an antenna layer, the antenna having chip contacts which are connected to the antenna contacts of the chip or its carrier via a conductive adhesive.
  • the chip contacts are left free via a corresponding recess in a cover layer applied to the antenna layer, which also makes the production complex.
  • the module and card carrier can be bonded by means of the production of the electrically conductive connection in a single operation .
  • the temperature and time regime required for the production of reliable electrical and mechanical connections is subject to narrow tolerances, so that the long-term stability of cards produced in this way is reduced if the process parameters are not optimal, and because of the dimensions and the plastic properties of the module as well as of the card carrier leads to twists and tension in the card with the consequence of contact faults and thus less reliability.
  • an antenna layer is initially completely built into the card material, but the chip contacts have sections which are thickened in such a way that the recess for the chip and its chip, which is also customary for the production of previously conventional chip cards, is milled Carrier parts of the thickened sections are milled and thereby chip contact surfaces are created, which can then be easily connected to the antenna contacts of the chip or its carrier.
  • the thickened sections can be made in various ways. For example, it is possible to selectively apply material in galvanic baths produce. However, the thickened sections are preferably formed from solder, in particular from soft solder. This can be done, for example, in the usual way which is used when tinning printed circuits, for example by passing the antenna layer over a solder wave or a wave soldering device, in which case only the contacts are uncovered. In another embodiment of the invention, the chip contacts are processed by means of known soldering or bonding machines, with a short wire possibly also being left inside the soldering "hill", which during the subsequent connection to the antenna contacts of a chip or its carrier can be beneficial. The only essential thing here is that the thickening is so strong that when the receiving recess for the chip or its carrier is subsequently milled out, the milling or the carrier, despite sufficient milling tolerance
  • Chip contacts can be safely exposed or formed. If one assumes that the antenna layer has a carrier thickness of approximately 200 ⁇ m and a copper layer of approximately 35 ⁇ m, then this copper layer thickness would not be properly and safely exposed with the predetermined milling tolerances of approximately 20 to 30 ⁇ m. If, however, a thickening of 100 to 200 ⁇ m is provided by soldering and forms such a bump, it is easy to see that a safe chamfering is then possible despite the specified tolerances and at the same time it is ensured that the very thin copper coating the antenna layer is not damaged or injured.
  • Embed traces in map material It is extremely surprising that the path that has now been followed actually leads to success and that such strong thickenings of 100 to 200 ⁇ m can easily be embedded in the standard cards with a total thickness of 760 ⁇ m ⁇ 80 ⁇ m.
  • the antenna contacts can be connected to the chip cards by a large number of electrical connection processes, which will be explained in more detail later. It is here For example, reminded of welding or gluing using electrically conductive glue.
  • the connection is preferably made by soldering, which is technologically easy to handle and at the same time provides particularly durable connections. This is especially true when the chip contacts are made of soft solder.
  • the arrangement is particularly favorable for the user or the programming manufacturer of the chip card if the chip or its carrier has additional contacts on its side facing away from the antenna layer for direct (contact-related) connection.
  • a card designed in this way which can be used both contactlessly and with contact, can be programmed, for example, by the manufacturer via direct, contact-based access and can then only be used by the user in a contactless manner.
  • the card body preferably comprises at least two cover layers, between which the antenna layer is laminated.
  • the cover layer which is on the side of the chip contacts, absorbs the thickening at the same time. Even if the thickening on the outside of the card becomes apparent after lamination, which would not be optimal for a finished card, this is not harmful since the area in which the chip contacts are located is later milled off.
  • the chip has a carrier with contact surfaces on the outside of the card, the antenna contacts being formed by plated-through sections (for example bores with corresponding galvanic metal deposits in the borehole) which pass through an insulating carrier material for holding the contact surfaces.
  • plated-through sections for example bores with corresponding galvanic metal deposits in the borehole
  • Such cards can also be used in contact systems.
  • the chip is mounted on a carrier with contact surfaces on the inside of the card, so that the antenna contacts come to rest directly on the chip contacts.
  • the carrier material for the contact surfaces of the chip is removed in the antenna contact areas, so that areas which are open to the outside lie over the rear sides of the antenna contacts.
  • the contact surfaces are accessible from the outside in order to be able to press tools, in particular those for heating, onto the rear of the antenna contact. It is also possible to use infrared radiation, in particular a laser, to heat the contact surfaces for the purpose of soldering.
  • a contactless as well as a contact-type additional device can again be used to program the card or to use it.
  • openings are again provided in the carrier or in the contact areas attached to it in the area of the chip card.
  • the method according to the invention for producing a chip card according to the first aspect of the invention comprises the following steps:
  • antenna with chip contacts for connecting a chip is formed on an antenna layer.
  • antenna layer An antenna with chip contacts for connecting a chip is formed on an antenna layer.
  • thick sections are formed on the chip contacts. This can be done by all possible electrochemical processes, by build-up welding or by the application of conductive plastics.
  • a card body is formed in such a way that the antenna layer and the chip contacts, including the thickened sections, are covered by card material and are firmly connected to it.
  • a recess is formed in the card body in such a way that the thickened sections are at least partially removed and thereby exposed.
  • a chip comprising a carrier with antenna contacts for
  • Connection of the carrier conductor structures to the antenna is inserted into the recess.
  • the antenna contacts are connected to the chip contacts.
  • the antenna is preferably formed from the antenna layer in an etching or cutting process.
  • the application of material to the chip contacts is preferably carried out in a soldering process in a manner known per se.
  • the card body is preferably formed by means of a lamination process, the antenna layer being laminated in between two cover layers.
  • the top layer is of course not to be understood as an absolutely homogeneous structure, since such layers in turn usually have a multilayer structure, for example an imprint is covered by a clear top layer, or a layer to be laminated on to connect with the layers underneath
  • Layer includes special connection or adhesive layers.
  • the recess in the card is preferably formed in a manner known per se by milling.
  • the chip and its carrier are inserted and preferably glued into the recess formed in this way, using a hot melt adhesive.
  • the reason for this lies in particular in the fact that when the antenna contacts are subsequently soldered to the chip contacts, a height loss due to flowing solder material to the Contact occurs, which is difficult to compensate for when using known cyan acrylate adhesives, but is easy to compensate for when using welding adhesives, and can also be compensated for later by reheating.
  • the heat for soldering can be applied by an external soldering tool, that is, by heat conduction.
  • the heat is supplied by radiation, in particular by radiation from an IR laser. It is of course also possible to provide the heat using ultrasound, that is to say using frictional heat.
  • a chip card for contactless and / or contact-based data transmission which comprises a semiconductor chip and contact areas for contact-based data transmission and next to connection points and at least one means for contactless data transmission, which is generally an induction coil.
  • the chip card according to the second aspect of the invention is characterized in that the electrically conductive connections between the connection points and the means for contactless data transmission are also made by means of soldering, the mechanical connection being done by hot or hot melt, but also by Soldering, can be done.
  • the hot or hot melt adhesive expediently has partial electrically conductive and also solderable particles. These electrically conductive, solderable particles are particularly preferably added or applied already on the carrier film during the preparation of the adhesive.
  • the size and amount of the solder particles added to the adhesive in sections depends on the contact formation or the contact areas of the chip card.
  • the solder ball located in the adhesive is, for example, in the range between 15 and 25 ⁇ m.
  • the amount of conductive particles is expediently chosen so that there are sufficient particles between the connection points and the means for contactless data transmission in order to establish a sufficient electrical connection by soldering.
  • the electrically conductive connection is brought about by the fact that the adhesive on the carrier film has conductive particles or layers at least in the area of the connection points and / or the connection points of the agent for contactless data transmission can form an electrically conductive bridge between the connection points and the means for contactless data transmission by soldering.
  • a module is first produced which comprises a plastic carrier on which a semiconductor chip is arranged.
  • the module is then attached to the plastic card holder, e.g. Connected polycarbonate.
  • the module is usually implanted in a cavity milled into the card body, as has already been explained.
  • the chip cards according to the invention are particularly preferably produced using the already known components and method steps described.
  • the invention expediently uses a conventional module, to which, however, a contact level with the connection points for the means for contactless data transmission is added.
  • the module is supplemented with two further connection points which are connected to the semiconductor chip in the usual way.
  • connection points are particularly preferably raised on a surface of the module carrier, preferably the side that faces the Semiconductor chip carries, trained.
  • the height of the connection points according to the second aspect of the invention depends on the type and dimensions of the card and can be, for example, between 1 and 20 ⁇ m.
  • the connection points are preferably made of metal and are known per se
  • the additional connection level is particularly preferably produced by laminating a strip of metal onto the module carrier and then structuring it. Location and size depends on the size and location of the means for contactless data transmission and especially its connection points.
  • the means for contactless data transmission preferably an induction coil or antenna
  • the means for contactless data transmission is expediently integrated into or arranged on the card body, the connection points to the connection points being exposed.
  • connection points can also be exposed when milling the cavity.
  • the adhesive in order to be able to use the known hotmelt process, is provided with conductive and solderable particles in predetermined contact sections.
  • the mechanical adhesive connection according to the second aspect of the invention is then produced in a manner known per se, the electrical connection of the contacts being realized by targeted introduction or application of heat at least in or onto the areas of the contact sections.
  • a basic method according to the method is to produce a electrical and mechanical connection of a module inserted in a recess of a card carrier of a chip card to a non-conductive hot or hot-melt adhesive layer located on a film-like carrier, this hot or hot-melt adhesive layer in the area of electrical contacts to be formed between the module and the card carrier with a additional conductive layer or to be provided with conductive particles.
  • This additional conductive layer or the conductive particles can be formed by perforating the hot or hot melt adhesive layer with subsequent filling, using conductive material.
  • the hot or hot-melt adhesive layer with conductive sections thus prepared in accordance with the third aspect of the invention is then pre-fixed on the module or in the recess of the card carrier.
  • This fixing takes place in such a way that the sections provided with the additional conductive layer or the conductive particles are located between the contact surfaces of the module and the recess of the card carrier.
  • both the mechanical between the module and the card carrier as well as the electrical contacting between the opposing contact surfaces is realized in a single pressure-temperature action step.
  • the connection surface mentioned it is not necessary that the generally only small contact surface sections, based on the connection surface mentioned, make a significant contribution to the adhesive connection, rather optimized electrical properties, such as low line inductances or a low contact resistance, are to be achieved here.
  • the usual hot-melt or hot-melt adhesive connection ensures sufficient pressing and compression of the conductive particles, so that the desired long-term contact stability results.
  • soldering is carried out after or during the gluing of the module in the card carrier, as a result of which there is a further increase in contact reliability.
  • the solder joint is kept free of mechanical tensions, shear forces or other forces, since these can be absorbed over a large area by the adhesive connection even when the card is in use.
  • Module selected a suitable pre-assembled hot or hot melt adhesive and individually prepared and thus optimized with regard to layer thickness and selection of the conductive particles for the respective application.
  • the conductive particles or the conductive layer can be applied locally to the hot-melt or hot-melt adhesive film, for example by means of a dispenser, a roller or a stamp, a mask being able to be used if necessary, so that the reproducibility when applying conductive coatings is increased.
  • the layer applied in this way is briefly subjected to a thermal treatment, so that a certain melting of the respective particles and thus adhesion and connection with them the hot glue or the hot melt adhesive is the result. This measure ensures that the conductive layer or the conductive material is protected from unwanted removal during subsequent handling.
  • the hot or hot melt adhesive layer has recesses or perforations which are filled with conductive particles such as solder balls or solder paste, customary and proven solder can be used.
  • the metering of the amount of particles to be introduced into the recesses or perforations is not critical, since excess material during soldering and / or pressing and simultaneous gluing into the Adhesive layer can be displaced into it without the overall contact reliability being impaired.
  • the connecting means according to the third aspect for carrying out the described method consists of a non-conductive hot or hot-melt adhesive layer located on a carrier film, which has sections with conductive particles or a conductive layer in the area of electrical contacts to be produced.
  • These sections can consist of recesses or perforations filled with solder paste or conductive adhesive.
  • the conductive sections are located inside a hot or
  • Hot melt adhesive layer which is displaced during assembly by the action of pressure and temperature and raised contact surfaces come into active connection with the inner conductive layer or the inner conductive sections.
  • the third aspect of the invention it is possible to specify a method and a connecting means for producing an electrical and mechanical connection of a module inserted in a recess in a card holder of a chip card, known hot or hot melt adhesives being used on the one hand and high quality electrical ones on the other hand Contacts or electrical connections can be realized and the required mechanical strength of the module is given in the card carrier without adverse shear forces or other forces acting on the contact areas during operation.
  • the inventive method according to the third aspect is particularly suitable for contactless chip cards or combination cards, in which both mechanically contactable
  • a basic aspect of the method according to a fourth aspect of the invention is that the module to be implanted in the card recess is on its insert side or on its edge side has a conductive stiffening frame with insulated sections.
  • This stiffening frame has contact surfaces which, when the module is inserted, come into electrical connection with mating contact surfaces located in the recess.
  • the module with the semiconductor chip and the stiffening frame according to the fourth aspect of the invention is inserted into the recess of the card carrier, this is done, for example, by pressing in, additional material and / or form-fitting connections being possible.
  • a stiffening frame which fulfills both mechanical and electrical functions, simple technologies for connecting the module to the card carrier, namely press-in or a snap-in connection, can be used, so that overall productivity increases .
  • the stiffening frame leads to a stable design of the module, as a result of which twists and tensions can be absorbed during operation of the IC card without undesired forces reaching the semiconductor chip or other electronic components.
  • the stiffening frame is, for example, in two parts, so that two electrically insulated contact surfaces are created which can interact with corresponding counter-contact surfaces which are connected, for example, to an induction loop or an antenna which is arranged in the card carrier.
  • connection arrangement according to the fourth aspect for producing a chip card is based on the stiffening frame, which is arranged on the insert side of the module and has mutually insulating sections and is electrically connected to connections of the semiconductor chip.
  • This stiffening frame has contact surfaces which are located, for example, in the lateral edge area and / or on the underside, so that it is possible to work with very different counter-contact surfaces in the recess of the card carrier.
  • counter-contact surfaces are formed in the recess of the card carrier, the contact and counter-contact surfaces being pressed together and / or integrally or positively connected when the module is inserted.
  • stiffening frame In a special embodiment of the stiffening frame according to the fourth aspect of the invention, it is arranged on the outer edge side or with the outer edge of the module and has an essentially square or rectangular cutout shape.
  • the stiffening frame has lateral projections or latching lugs which interact with recesses located on the side walls of the recess.
  • the counter-contact surfaces in the side surfaces of the recess can have projections or latching lugs or be designed in this way, and can interact with corresponding recesses in the stiffening frame when the latter is inserted or pressed into the card carrier.
  • the snap-in connection can be formed in the area of the contact and counter-contact surfaces, but other sections of the stiffening frame or opposite surfaces of the recess of the card carrier can also comprise, so that the desired strength and reliability of the Connection between module and card is guaranteed.
  • the arrangement has a stiffening frame which is formed integrally with a chip carrier, the mutually insulated contact surfaces of the stiffening frame being electrically connected to respective chip contacts or bonding surfaces.
  • the module to be used can be formed by the chip carrier and stiffening frame, which carries the semiconductor chip attached by chip bonding on its underside.
  • a separate plastic module or wiring carrier for the semiconductor chip can therefore be dispensed with. Any electrical external insulation that may become necessary is possible by laminating on an insulation layer, expediently over the entire surface of the chip card.
  • the fourth aspect of the invention it is possible to specify a method for producing a chip card or a connection arrangement for such a production method, with which or with which a high degree of use stiffness of the card, in particular in the area of the recess for receiving a module, containing a semiconductor chip is achieved.
  • the stiffening frame provided which can also be formed integrally with a chip carrier, makes it possible to press the complete module into the recess and to use advantageous positive and / or non-positive connections for electrical and mechanical contacting of the module in the card carrier.
  • a cohesive connection in particular a soldered connection, can also take place in that thermal energy is supplied to the soldered connection points in a targeted manner using the metallic stiffening frame.
  • other types of connection are also conceivable, such as the hot or melt adhesive mentioned.
  • FIG. 1 shows schematic representations of five method steps according to the first aspect of the invention
  • FIG. 5 schematically shows a cross section through a chip card according to the second aspect of the invention in the region of an electrically conductive connection point between a connection point and a means for contactless data transmission;
  • FIG. 6 shows a schematic sketch to explain the method according to the second aspect of the invention, namely using the example of the production of the electrically conductive connection which is shown in FIG. 5;
  • FIG. 7 shows a section through a hot melt adhesive according to the third aspect of the invention.
  • FIG. 8 shows a plan view of a prepared hot melt film according to the third aspect of the invention
  • 9 shows a section through a hot-elt film with conductive particles inside according to the third aspect of the invention
  • FIG. 10 shows a basic sectional illustration of the installation position of the module in the recess of a card carrier using the connecting means according to an exemplary embodiment according to the third aspect of the invention
  • FIG. 11 is a perspective view of a top view of a module with a semiconductor chip and stiffening frame according to the fourth aspect of the invention.
  • Fig. 12 is a sectional view through a module along the
  • an antenna layer 10 is shown in cross section, which consists of a carrier 11 with a coating 12 thereon.
  • the layer thickness of the carrier can be approximately 200 ⁇ m, the coating 12 approximately 35 ⁇ m (copper).
  • a conductor track pattern is formed by selective etching, which according to FIG. 1b antenna tracks 13, 14, 15 (in itself is only a single track, but cut several times in FIG. 1b) and chip contacts 20, 21 includes.
  • thickenings 16, 17 are formed on the chip contacts 20, 21 created, which are formed in this embodiment of the invention as a soldering job.
  • These thickening tongues can be about 100 to 200 ⁇ m thick, but they should in any case be so thick that the inevitable tolerances that occur during the subsequent milling can be safely absorbed in any case.
  • an upper cover layer 18 and a lower cover layer 19 are laminated onto the overall arrangement shown in FIG. 1c, that is to say the antenna layer 10 together with the thickenings 16 and 17, so that the antenna layer ( 1c) is completely enclosed.
  • a recess 24 is milled in the card body according to FIG. 1d in a manner known per se.
  • the milling here is so deep that in the area in which the chip carrier (not yet shown) comes to lie later, the thickenings 16 and 17 are also milled or milled, so that they are in a bottom surface of the Depression 24 form exposed access areas 22, 23.
  • a chip with carrier 25 is then used.
  • This comprises an IC 26 and a carrier made of a carrier material 30 with external contacts 33, 34 and internal antenna contacts 31, 32, the connecting contacts (not shown) of the IC 26 being led to the external contacts 33, 34 via connecting wires 28, 29.
  • the IC 26 is covered together with parts of its carrier by means of a casting compound 27.
  • the arrangement is made using hot-melt adhesive in the
  • soldering tool is placed on the antenna contacts 31, 32, so that the solder contained in them melts and the underlying thickenings 16, 17, which are formed from solder material, also melt. Thereby a continuous soldering between the chip contacts 20, 21 and the external contacts 33, 34 and via the connecting wires 28, 29 to the IC 26 is created. After soldering, another final fixation can be done by warming up the hot melt adhesive.
  • the embodiment of the invention shown in FIG. 3 differs from that according to FIG. 2 in that the antenna contacts 31, 32 are formed as metallization layers which are formed on the carrier material 30 on the surface carrying the IC 26.
  • bores 35, 36 are provided in the carrier material 30, so that the thickenings 16, 17 or the soldering application provided there are freely accessible from the outside.
  • a laser beam can be directed through the bores 35, 36 for heating onto the soldering job 16 or 17, in order to establish a soldered connection between the chip contacts 20, 21 and the antenna contacts 31, 32.
  • the variant shown in FIG. 4 differs from that according to FIG. 3 in that the bores 35, 36 are not led through the antenna contacts 31, 32 or the layers forming them, but end on the rear side thereof. As a result, however, it is still possible to mount the antenna contacts 31, 32 by means of attached tools or by heat radiation
  • connection point 2 shows a cross section through a chip card 1 in the region of an electrically conductive connection point between a connection point 2 and a means 3 for contactless data transmission, here an induction coil.
  • the induction coil 3 is integrated in the card carrier 5, which usually consists of plastic, for example polycarbonate. A portion of the coil is exposed in the area of the connection point, for example by milling the card carrier surface.
  • the one of the two connection points 2 of the card to the coil 3 shown in FIG. 5 is designed as a metal strip on the carrier 6 of the module, for example a plastic film, and is located outside the region of the carrier in which the semiconductor chip is arranged.
  • the electrically conductive connection is made between connection point 2 and induction coil 3 by means of soldering in the adhesive layer 4 of selectively introduced solder balls 8.
  • the adhesive is applied in the area of the entire surface of the module, the conductive and solderable particles selectively located in the adhesive coming to rest between the induction coil 3 and the connection point 2.
  • a hot or hot melt adhesive is used as the preferred adhesive.
  • the connection from the module with the plastic carrier 6 and the connection point 2 to the card body 5 can be made while simultaneously making the soldered connection by means of solder balls 8 between the connection point 2 and the induction coil 3 using the widespread hot-melt method, for which a universal seller Heating and pressure stamp 9 can be used.
  • FIG. 6 This is schematically illustrated in FIG. 6, where a cross section through the chip card according to FIG. 5 is shown before the module and card body 5 are connected.
  • the card body 5 with integrated induction coil 3, which is coated with adhesive in the cavity for the module, is placed in a suitable position on the module with carrier 6 and connection point 2. Now pressure and heat is supplied with the help of the heating and pressure stamp 9. This softens the adhesive layer 4, and the module and card body 5 are pressed together until the coil 3 is electrically conductive Particles 8 and junction 2 touch each other and a soldered connection is created. At the same time, an adhesive connection is created between the surface of the card body cavity and the module. The adhesive is then allowed to harden by cooling.
  • the module and card body can be glued and electrically conductive connections made to the contactless data transmission system in one step using known methods.
  • the section through a hotmelt film shown in FIG. 7 has a carrier film 41 which is coated with a hot or hot melt adhesive 42.
  • the layer thickness is in the range between 20 and 80 ⁇ m, whereby different adhesives are used depending on the card material such as ABS, PVC, PC or PET.
  • the prepared hot or hot melt adhesive shown in FIG. 8 has perforations 43 for receiving the chip as well as laterally arranged sections 44 which consist of a conductive layer or of conductive particles 416 or contain them.
  • These sections 44 can, for example, be perforations or recesses which have been filled with solder paste.
  • the hot or hot melt adhesive 42 located on a carrier film 41 is made up.
  • the module 410 (FIG. 10) provided with a chip 411 can be attached to this blister-like film strip, in order to then, in a next operation, the module 410 provided with carrier film 41 and hot or hot melt adhesive 42 towards the recess 412 of a card carrier 413 to position (Fig. 10).
  • solder balls with a diameter of 25 ⁇ m were selectively applied to the hot or hot-melt adhesive layer, so that in a subsequent pressure-temperature process both a solder connection between the opposing contact surfaces using the Solder ball as well as the adhesive connection between module and card carrier can be realized.
  • this has an inner layer 45 made of conductive particles.
  • raised contact surfaces on the module or on the card carrier are able to displace the hot or melt adhesive which changes to the semi-liquid state during the pressure-temperature treatment step thus to come into active connection with the conductive particles of the inner layer, as a result of which the desired contacting is formed.
  • the provided with the prepared hot or hot melt adhesive layer 42 module 410 which comprises a chip 411, z. B. positioned in the recess 412 by means of a suitable tool.
  • Contact surfaces 414 which are connected to an induction coil for contactless data transmission, are located on the inner surface side of the recess 412.
  • the hot or hot-melt adhesive in the layer 42 heats up by exerting a compressive force in the direction of the arrow and by the action of temperature conductive particles 416, which are located in the sections 44 or in the layer 55, establish an electrical connection between the contact surfaces 414 and the opposite contact surfaces 415 of the module.
  • the adhesive cools and hardens, there is both a secure mechanical connection of the module 410 in the recess 412 of the card carrier 413 and a corresponding electrical connection between the contact surfaces 414 and 415.
  • solder paste in recesses or holes in the hot - or Hot melt adhesive 41 this serves to implement the electrical connection between the opposing contact surfaces 414 and 415.
  • additional heat can be applied locally in the area of the contact surfaces 414 and / or 415, so that the desired soldering process is carried out.
  • the conductive particles or the conductive layer can both be located inside the hot-melt adhesive film and can be applied on the surface side.
  • a layer applied on the surface or of particles arranged on the surface can be fixed by brief heat treatment, as a result of which the corresponding particles adhere to the adhesive.
  • a heated roller which is guided over the film, can be used, the roller also being usable at the same time for applying the conductive particles.
  • the latter comprises a chip carrier 51 and a semiconductor chip 52 fastened to the chip carrier 51 by bonding.
  • the chip carrier 51 can comprise regions which are insulated or structured from one another and which are electrical with corresponding contact surfaces of the semiconductor chip 52 are connected. This electrical connection can be achieved by wire bonding, but there is also the possibility of electrically connecting the semiconductor chip 52 directly to the chip carrier 51 by means of rear-side contacts.
  • a two-part stiffening frame 53 which has insulated sections 54, is arranged on the chip carrier 51.
  • the two parts of the stiffening frame 53 each form contact surfaces; 11 and 12 in the side region 55 in the example shown.
  • the side regions 55, but also the other side surfaces of the stiffening frame 53, can have means for achieving a snap-in connection when the module is inserted into a recess in a card carrier (FIG. 12).
  • the chip carrier 51 is made with the stiffening frame 53 as a one-piece part.
  • the parts or sections of the stiffening frame 53 on the chip carrier 51 can be obtained by maintaining the desired electrical and mechanical connection
  • Soldering or the like can be arranged.
  • the surfaces 56 of the stiffening frame 53 pointing towards the insert side can be provided on the surface side with an adhesive, in particular hot-melt adhesive, so that a secure mechanical connection of the module is achieved without the contact and counter-contact surfaces 55; 513 excessive forces have to be absorbed.
  • An IC card 510 has a recess 511, which can be produced, for example, by milling. Inside the IC card 510 there are conductor tracks 512 which e.g. Can be parts of an inductive element for wireless information exchange. These conductor tracks 512 extend as far as the recess 511 and have a counter-contact surface 513. This counter-contact surface 513 forms a contact with the stiffening frame 53 or the respective side regions 55 when the module 514 is inserted into the recess 511 of the IC card 510.
  • the side regions 55 of the stiffening frame 53 can be provided with latching lugs or projections, which correspond to the corresponding recesses in the
  • the module 514 can be pressed or pressed into the recess 511 of the IC card 510 are additionally applied specifically to the stiffening frame 53 by means of soldering stamps / heat, so that soldering is possible in the area of the connection between contact surfaces 55 and counter-contact surfaces 513.

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  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne une carte à puce, un système de connexion et un procédé de production d'une carte à puce. Selon ce procédé, une puce à semi-conducteur située dans un module est insérée dans une cavité (24) d'un support de carte, de manière à maintenir une connexion électrique et mécanique. Selon une première caractéristique de ce procédé, lors de la création par fraisage de la cavité, une section de bosse de contact est dégagée (22, 23), ce qui assure une connexion fiable entre le module et la bobine de self ou la bobine-antenne (11). Selon une deuxième et une troisième caractéristique du procédé, des contacts électriques sont réalisés par brasage et des contacts mécaniques sont produits à l'aide d'agents thermocollants ou de colles à fusion. Il est en outre prévu de munir l'adhésif de particules et de le comprimer sous pression lors de l'assemblage, de manière à former le contact électrique voulu. Selon une quatrième caractéristique du procédé, il est prévu un cadre raidisseur spécial qui présente des sections isolantes. Ce cadre raidisseur sert à renforcer la stabilité mécanique et à absorber les forces de torsion et les contraintes risquant d'intervenir lors de l'utilisation de la carte. Ce cadre raidisseur permet simultanément d'établir aisément un contact avec les tracés conducteurs situés à l'intérieur de la carte, par ex. des éléments inductifs, qui constituent une antenne pour la transmission de données sans contact.
PCT/EP1997/001256 1996-03-14 1997-03-12 Carte a puce, systeme de connexion et procede de production d'une carte a puce WO1997034247A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU21556/97A AU2155697A (en) 1996-03-14 1997-03-12 Smart card, connection arrangement and method of producing smart card
EP97914230A EP0976104A2 (fr) 1996-03-14 1997-03-12 Carte a puce, systeme de connexion et procede de production d'une carte a puce

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
DE19610044A DE19610044C2 (de) 1996-03-14 1996-03-14 Kartenkörper und Verfahren zur Herstellung einer Chipkarte
DE19610044.5 1996-03-14
DE19633938.3 1996-08-22
DE1996133938 DE19633938A1 (de) 1996-08-22 1996-08-22 Chipkarte und Verfahren zum Herstellen einer Chipkarte
DE19633937.5 1996-08-22
DE19633936.7 1996-08-22
DE19633936 1996-08-22
DE19633937 1996-08-22
DE19637214.3 1996-09-12
DE19637215A DE19637215C2 (de) 1996-08-22 1996-09-12 Verbindungsanordnung zur Herstellung einer Chipkarte
DE19637215.1 1996-09-12
DE19637214A DE19637214C2 (de) 1996-08-22 1996-09-12 Verfahren zur Herstellung einer elektrischen und mechanischen Verbindung eines in einer Ausnehmung eines Kartenträgers einer Chipkarte eingesetzten Moduls

Publications (2)

Publication Number Publication Date
WO1997034247A2 true WO1997034247A2 (fr) 1997-09-18
WO1997034247A3 WO1997034247A3 (fr) 1998-01-08

Family

ID=27545041

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1997/001256 WO1997034247A2 (fr) 1996-03-14 1997-03-12 Carte a puce, systeme de connexion et procede de production d'une carte a puce

Country Status (3)

Country Link
EP (1) EP0976104A2 (fr)
AU (1) AU2155697A (fr)
WO (1) WO1997034247A2 (fr)

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FR2769390A1 (fr) * 1997-10-08 1999-04-09 Gemplus Card Int Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
WO1999023606A1 (fr) * 1996-06-17 1999-05-14 Smart Pac Gmbh Technology Services Procede de fabrication de cartes a puce sans contact et cartes a puces sans contact ainsi obtenues
FR2788646A1 (fr) * 1999-01-19 2000-07-21 Bull Cp8 Carte a puce munie d'une antenne en boucle, et micromodule associe
EP1065627A2 (fr) * 1999-07-02 2001-01-03 Shinko Electric Industries Co. Ltd. Carte à puce sans contact et procédé de fabrication
EP1093082A2 (fr) * 1999-10-12 2001-04-18 Fujitsu Limited Carte combinée avec un module à puce
SG80663A1 (en) * 1998-11-30 2001-05-22 Sony Corp An antenna device and card-shaped storage medium
FR2807186A1 (fr) * 2000-04-03 2001-10-05 Sagem Procede de realisation d'une carte a puce mixte et carte a puce mixte incluant un circuit electrique dans une couche enterree de la carte
KR20020011361A (ko) * 2001-12-27 2002-02-08 최완균 집적회로 카드 및 이에 사용되는 회로 기판
US6651891B1 (en) 1997-11-04 2003-11-25 Elke Zakel Method for producing contactless chip cards and corresponding contactless chip card
WO2004040508A1 (fr) * 2002-10-31 2004-05-13 3B System, Inc. Carte intelligente de type combine equipe d'un dispositif de communication sans contact stable
US7017799B2 (en) 2001-12-04 2006-03-28 The Gates Corporation Spindle sleeve with transponder
EP1821242A1 (fr) 2006-02-15 2007-08-22 Assa Abloy Identification Technology Group AB Transpondeur multi-frequences sans contact, son module électronique et procédé pour la fabrication du transpondeur
EP1821241A2 (fr) 2006-02-15 2007-08-22 Assa Abloy Identification Technology Group AB Unité de transpondeur sans contact à fréquence hybride, module pour celle-ci et procédé de fabrication de celle-ci
WO2007124769A1 (fr) * 2006-04-28 2007-11-08 Telefonaktiebolaget Lm Ericsson (Publ) Structure de support pour puce hyperfréquence
EP2143046A2 (fr) * 2007-04-24 2010-01-13 On Track Innovations Ltd. Appareil d'interface électronique et procédé et système de fabrication de celui-ci
EP2198455A2 (fr) * 2007-10-08 2010-06-23 Giesecke & Devrient GmbH Module de puce pour une carte a puce
EP2239692A1 (fr) * 2009-04-11 2010-10-13 Cardag Deutschland GmbH Carte à puce et procédé destiné à sa fabrication
KR101103186B1 (ko) 2007-11-08 2012-01-04 스마트랙 아이피 비.브이. 전자 인터페이스 장치 및 방법, 및 그 제조 시스템
EP2463809A1 (fr) * 2010-12-07 2012-06-13 NagraID S.A. Carte électronique à contact électrique comprenant une unité électronique et/ou une antenne
WO2013171314A1 (fr) 2012-05-16 2013-11-21 Nagraid S.A. Procede de fabrication d'une carte electronique ayant un connecteur externe et un tel connecteur externe

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EP0689165A1 (fr) * 1994-06-22 1995-12-27 SOLAIC (société anonyme) Carte à mémoire sans contact dont le circuit électronique comporte un module
WO1996007985A1 (fr) * 1994-09-09 1996-03-14 International Business Machines Corporation Circuit haute frequence et memoire dans un boitier souple mince
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DE4302387A1 (fr) * 1992-01-30 1993-08-05 Mitsubishi Electric Corp
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EP0671705A2 (fr) * 1994-02-14 1995-09-13 Gemplus Card International Procédé de fabrication d'une carte sans contact et carte sans contact
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Cited By (53)

* Cited by examiner, † Cited by third party
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WO1999023606A1 (fr) * 1996-06-17 1999-05-14 Smart Pac Gmbh Technology Services Procede de fabrication de cartes a puce sans contact et cartes a puces sans contact ainsi obtenues
US7958622B1 (en) 1997-10-08 2011-06-14 Gemalto S.A. Method for making smart cards
WO1999018541A1 (fr) * 1997-10-08 1999-04-15 Gemplus S.C.A. Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact, et sans contact
FR2769390A1 (fr) * 1997-10-08 1999-04-09 Gemplus Card Int Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
US7740180B2 (en) 1997-10-08 2010-06-22 Gemalto, S.A. Method for making smart cards capable of operating with and without contact
US7663564B2 (en) 1997-10-08 2010-02-16 Gemalto, S.A. Method for making smart cards capable of operating with and without contact
CN100437636C (zh) * 1997-10-08 2008-11-26 格姆普拉斯公司 能以接触和非接触方式操作的智能卡制造方法
US6651891B1 (en) 1997-11-04 2003-11-25 Elke Zakel Method for producing contactless chip cards and corresponding contactless chip card
US6626363B2 (en) 1998-11-30 2003-09-30 Sony Corporation Antenna device and card-shaped storage medium
SG80663A1 (en) * 1998-11-30 2001-05-22 Sony Corp An antenna device and card-shaped storage medium
US6568600B1 (en) 1999-01-19 2003-05-27 Bull Cp8 Chip card equipped with a loop antenna, and associated micromodule
FR2788646A1 (fr) * 1999-01-19 2000-07-21 Bull Cp8 Carte a puce munie d'une antenne en boucle, et micromodule associe
WO2000043951A1 (fr) * 1999-01-19 2000-07-27 Bull Cp8 Carte a puce munie d'une antenne en boucle, et micromodule associe
EP1065627A3 (fr) * 1999-07-02 2003-01-02 Shinko Electric Industries Co. Ltd. Carte à puce sans contact et procédé de fabrication
EP1065627A2 (fr) * 1999-07-02 2001-01-03 Shinko Electric Industries Co. Ltd. Carte à puce sans contact et procédé de fabrication
EP1093082A2 (fr) * 1999-10-12 2001-04-18 Fujitsu Limited Carte combinée avec un module à puce
EP1093082A3 (fr) * 1999-10-12 2002-06-12 Fujitsu Limited Carte combinée avec un module à puce
US6460773B1 (en) 1999-10-12 2002-10-08 Fujitsu Limited Combination card having an IC chip module
FR2807186A1 (fr) * 2000-04-03 2001-10-05 Sagem Procede de realisation d'une carte a puce mixte et carte a puce mixte incluant un circuit electrique dans une couche enterree de la carte
US7017799B2 (en) 2001-12-04 2006-03-28 The Gates Corporation Spindle sleeve with transponder
KR20020011361A (ko) * 2001-12-27 2002-02-08 최완균 집적회로 카드 및 이에 사용되는 회로 기판
WO2004040508A1 (fr) * 2002-10-31 2004-05-13 3B System, Inc. Carte intelligente de type combine equipe d'un dispositif de communication sans contact stable
EP1821241A2 (fr) 2006-02-15 2007-08-22 Assa Abloy Identification Technology Group AB Unité de transpondeur sans contact à fréquence hybride, module pour celle-ci et procédé de fabrication de celle-ci
EP1821242A1 (fr) 2006-02-15 2007-08-22 Assa Abloy Identification Technology Group AB Transpondeur multi-frequences sans contact, son module électronique et procédé pour la fabrication du transpondeur
WO2007124769A1 (fr) * 2006-04-28 2007-11-08 Telefonaktiebolaget Lm Ericsson (Publ) Structure de support pour puce hyperfréquence
WO2007125094A1 (fr) * 2006-04-28 2007-11-08 Telefonaktiebolaget Lm Ericsson (Publ) Structure de support pour puce hyperfréquence
CN101432871B (zh) * 2006-04-28 2015-07-08 艾利森电话股份有限公司 微波芯片支撑结构
US8253028B2 (en) 2006-04-28 2012-08-28 Telefonaktiebolaget L M Ericsson (Publ) Microwave chip supporting structure
EP2212975A2 (fr) * 2007-04-24 2010-08-04 Smartrac IP B.V. Appareil d'interface électronique et procédé et système pour sa fabrication
US9038913B2 (en) 2007-04-24 2015-05-26 Smartrac Ip B.V. Electronic interface apparatus and method and system for manufacturing same
EP2143046A4 (fr) * 2007-04-24 2010-09-08 Smartrac Ip Bv Appareil d'interface électronique et procédé et système de fabrication de celui-ci
EP2212975A4 (fr) * 2007-04-24 2011-07-27 Smartrac Ip Bv Appareil d'interface électronique et procédé et système pour sa fabrication
US9773201B2 (en) 2007-04-24 2017-09-26 Smartrac Ip B.V. Electronic interface apparatus and method and system for manufacturing same
US8333004B2 (en) 2007-04-24 2012-12-18 Smartrac Ip B.V. Electronic interface apparatus and method and system for manufacturing same
EP2143046A2 (fr) * 2007-04-24 2010-01-13 On Track Innovations Ltd. Appareil d'interface électronique et procédé et système de fabrication de celui-ci
EP2198455B1 (fr) * 2007-10-08 2017-05-24 Giesecke & Devrient GmbH Module de puce pour une carte a puce
EP2198455A2 (fr) * 2007-10-08 2010-06-23 Giesecke & Devrient GmbH Module de puce pour une carte a puce
KR101103186B1 (ko) 2007-11-08 2012-01-04 스마트랙 아이피 비.브이. 전자 인터페이스 장치 및 방법, 및 그 제조 시스템
EP2239692A1 (fr) * 2009-04-11 2010-10-13 Cardag Deutschland GmbH Carte à puce et procédé destiné à sa fabrication
WO2012076627A3 (fr) * 2010-12-07 2012-08-23 Nagraid S.A. Carte électronique ayant un connecteur externe
KR101628447B1 (ko) * 2010-12-07 2016-06-21 나그라비젼 에스에이 외부 커넥터를 갖는 전자 카드
KR20130095825A (ko) * 2010-12-07 2013-08-28 나그라아이디 에스.에이. 외부 커넥터를 갖는 전자 카드
CN103262102A (zh) * 2010-12-07 2013-08-21 纳格雷德股份有限公司 具有外部连接器的电子卡
AU2011340524B2 (en) * 2010-12-07 2015-11-26 Nagravision S.A. Electronic card having an external connector
US9247643B2 (en) 2010-12-07 2016-01-26 Nagravision S.A. Electronic card having an external connector
EP2463809A1 (fr) * 2010-12-07 2012-06-13 NagraID S.A. Carte électronique à contact électrique comprenant une unité électronique et/ou une antenne
US9684863B2 (en) 2010-12-07 2017-06-20 Nagravision S.A. Electronic card having an external connector
WO2012076627A2 (fr) 2010-12-07 2012-06-14 Nagraid S.A. Carte électronique ayant un connecteur externe
CN103262102B (zh) * 2010-12-07 2016-10-12 耐瑞唯信有限公司 具有外部连接器的电子卡
US20160234946A1 (en) * 2012-05-16 2016-08-11 Nagravision S.A. Process for the production of an electronic card having an external connector and such an external connector
WO2013171314A1 (fr) 2012-05-16 2013-11-21 Nagraid S.A. Procede de fabrication d'une carte electronique ayant un connecteur externe et un tel connecteur externe
US9367789B2 (en) 2012-05-16 2016-06-14 Nagravision S.A. Process for the production of an electronic card having an external connector and such an external connector
US10064290B2 (en) 2012-05-16 2018-08-28 Nagravision S.A. Process for the production of an electronic card having an external connector and such an external connector

Also Published As

Publication number Publication date
AU2155697A (en) 1997-10-01
WO1997034247A3 (fr) 1998-01-08
EP0976104A2 (fr) 2000-02-02

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