WO1997043785A1 - Procede d'alignement de plaquettes - Google Patents

Procede d'alignement de plaquettes Download PDF

Info

Publication number
WO1997043785A1
WO1997043785A1 PCT/JP1997/001590 JP9701590W WO9743785A1 WO 1997043785 A1 WO1997043785 A1 WO 1997043785A1 JP 9701590 W JP9701590 W JP 9701590W WO 9743785 A1 WO9743785 A1 WO 9743785A1
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
alignment
camera
stage
coordinates
Prior art date
Application number
PCT/JP1997/001590
Other languages
English (en)
Japanese (ja)
Inventor
Kiyonori Matsuno
Takeshi Okamoto
Shigeyuki Tada
Tomikazu Tanuki
Masaya Tanaka
Original Assignee
Komatsu Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Ltd. filed Critical Komatsu Ltd.
Publication of WO1997043785A1 publication Critical patent/WO1997043785A1/fr

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Definitions

  • This alignment is performed by coarse alignment called pre-alignment, in which the orientation is roughly adjusted with reference to the position of the wafer's orientation flat (hereinafter, abbreviated as the orientation flat). It is divided into precise alignment called fine alignment based on the pattern drawn on the wafer, which can be achieved by roughly aligning the orientation flat. This is because the alignment becomes easier.
  • this alignment and the fine alignment were performed by separate devices. In general, a technique was used in which a dedicated device was used to perform alignment, and then the wafer was transferred to a stage where fine alignment was performed.
  • the present invention has been made to solve the above-mentioned problems in the prior art, and a method of positioning a wafer in a wafer inspection apparatus or the like according to the present invention uses the same alignment step as the brial alignment step and the fine alignment step. Perform with a camera.
  • the characteristic pattern on the wafer and the design coordinates of the characteristic pattern are formed in at least two places.
  • a bridge alignment and a fine alignment can be performed by the same apparatus, and the structure of the whole apparatus is simplified.
  • positioning can be performed using a two-dimensional inspection device, which makes it possible to use a wafer positioning device for a linear alignment and a fine alignment. There is no need to provide a separate application.
  • 5 is an XY stage and 6 is a 0 stage.
  • the XY stage 5 is a stage that can move in the X direction and the Y direction.
  • 5 a, 5 b and mosquitoes ⁇ lines cover Te Contact Ri, c 7 where upper stages 5 a on the ⁇ stage 6 of this is mounted in a pivoting Ri CCD turtle Radea for photographing the surface of the wafer
  • the CCD camera also serves as a positioning device, and is mounted on each of the devices 1, 2, and 3 one by one.
  • step 13 when an edge is detected at the upper end G, the camera field of view is moved to the right end F of the wafer 11 (step 15), and the edge at the right end F is detected (step 15).
  • step 16 if there is no edge, wafer 11 is rotated counterclockwise as shown in FIG. 6B due to the force at which there is an orifice 24 on the right side. It rotates around the orientation flat rotation angle of 270 ° (step 17). As a result, the orifice 24 becomes the above-described briar alignment position located on the lower side.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Image Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Image Analysis (AREA)

Abstract

Dans un procédé d'alignement de plaquettes pour dispositifs d'inspection de plaquettes, etc., on procède à un préalignement ainsi qu'à un alignement fin à l'aide du même appareil photographique, de manière que le préalignement et l'alignement fin puissent être exécutés à l'aide du même dispositif.
PCT/JP1997/001590 1996-05-14 1997-05-12 Procede d'alignement de plaquettes WO1997043785A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11899296A JPH09306977A (ja) 1996-05-14 1996-05-14 ウエハ検査装置等におけるウエハの位置決め方法
JP8/118992 1996-05-14

Publications (1)

Publication Number Publication Date
WO1997043785A1 true WO1997043785A1 (fr) 1997-11-20

Family

ID=14750332

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1997/001590 WO1997043785A1 (fr) 1996-05-14 1997-05-12 Procede d'alignement de plaquettes

Country Status (2)

Country Link
JP (1) JPH09306977A (fr)
WO (1) WO1997043785A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2776421A1 (fr) * 1998-03-05 1999-09-24 Nova Measuring Instr Ltd Dispositif et procede de fabrication de semi-conducteurs determinant l'alignement d'une galette a la station de fabrication de celle-ci
JP2004288792A (ja) * 2003-03-20 2004-10-14 Lintec Corp アライメント装置及びアライメント方法
JP2010177691A (ja) * 2010-04-02 2010-08-12 Lintec Corp アライメント装置及びアライメント方法
CN102338991A (zh) * 2011-08-31 2012-02-01 合肥芯硕半导体有限公司 一种激光位移传感器控制的预对准方法
CN103077904A (zh) * 2013-01-14 2013-05-01 陆伟 一种键合机台装置与键合对准的方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3386025B2 (ja) * 1999-12-15 2003-03-10 株式会社ニコン 画像特徴抽出装置、画像特徴抽出方法、監視検査システム、半導体露光システム、およびインターフェースシステム
IL146174A (en) * 2001-10-25 2007-08-19 Camtek Ltd Confocal system for testing woofers
JP5122880B2 (ja) * 2007-07-11 2013-01-16 株式会社ディスコ レーザー加工装置のアライメント方法
JP5560148B2 (ja) * 2010-09-14 2014-07-23 株式会社日立ハイテクノロジーズ 検査装置、及び位置決め装置
JP6134166B2 (ja) * 2013-03-12 2017-05-24 株式会社Ｓｃｒｅｅｎホールディングス 位置検出装置および位置検出方法
JP6461555B2 (ja) * 2014-10-22 2019-01-30 レーザーテック株式会社 バンプ検査装置
TWI667530B (zh) 2017-09-28 2019-08-01 日商紐富來科技股份有限公司 Inspection method and inspection device
JP2021050938A (ja) * 2019-09-20 2021-04-01 株式会社Ｓｃｒｅｅｎホールディングス 検査用モジュール、反転モジュールおよび検査装置
JP2022138338A (ja) * 2021-03-10 2022-09-26 株式会社ディスコ 処理装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04320333A (ja) * 1991-04-19 1992-11-11 Toshiba Corp 半導体ウエハ処理装置
JPH05152421A (ja) * 1991-11-29 1993-06-18 Toshiba Corp 半導体ウエハの位置合せ方法
JPH0661119A (ja) * 1992-08-07 1994-03-04 Sony Corp ウエハの回転角度補正方法
JPH0758185A (ja) * 1993-08-10 1995-03-03 Sony Corp 位置検出方法
JPH08298281A (ja) * 1995-01-11 1996-11-12 Nova Measuring Instr Ltd 物体表面上の特徴的部分を利用した物体上の部位を求める方法及び物体の位置決め方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04320333A (ja) * 1991-04-19 1992-11-11 Toshiba Corp 半導体ウエハ処理装置
JPH05152421A (ja) * 1991-11-29 1993-06-18 Toshiba Corp 半導体ウエハの位置合せ方法
JPH0661119A (ja) * 1992-08-07 1994-03-04 Sony Corp ウエハの回転角度補正方法
JPH0758185A (ja) * 1993-08-10 1995-03-03 Sony Corp 位置検出方法
JPH08298281A (ja) * 1995-01-11 1996-11-12 Nova Measuring Instr Ltd 物体表面上の特徴的部分を利用した物体上の部位を求める方法及び物体の位置決め方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2776421A1 (fr) * 1998-03-05 1999-09-24 Nova Measuring Instr Ltd Dispositif et procede de fabrication de semi-conducteurs determinant l'alignement d'une galette a la station de fabrication de celle-ci
JP2004288792A (ja) * 2003-03-20 2004-10-14 Lintec Corp アライメント装置及びアライメント方法
JP2010177691A (ja) * 2010-04-02 2010-08-12 Lintec Corp アライメント装置及びアライメント方法
CN102338991A (zh) * 2011-08-31 2012-02-01 合肥芯硕半导体有限公司 一种激光位移传感器控制的预对准方法
CN103077904A (zh) * 2013-01-14 2013-05-01 陆伟 一种键合机台装置与键合对准的方法
CN103077904B (zh) * 2013-01-14 2015-09-09 武汉新芯集成电路制造有限公司 一种键合机台装置与键合对准的方法

Also Published As

Publication number Publication date
JPH09306977A (ja) 1997-11-28

Similar Documents

Publication Publication Date Title
JP3203719B2 (ja) 露光装置、その露光装置により製造されるデバイス、露光方法、およびその露光方法を用いたデバイス製造方法
TWI755526B (zh) 用於將部件安裝在基板上的設備和方法
JP6174487B2 (ja) ワークピース上にパターンを生成するための方法および装置
US20050219533A1 (en) Exposure apparatus and aligning method
WO1997043785A1 (fr) Procede d'alignement de plaquettes
JP5381029B2 (ja) 露光装置
JP2002310929A (ja) 欠陥検査装置
JP5346759B2 (ja) 基板位置決め方法
US12027402B2 (en) Substrate processing apparatus and substrate processing method
JP6976205B2 (ja) チップ位置測定装置
JP2004146776A (ja) フリップチップ実装装置及びフリップチップ実装方法
WO2022091927A1 (fr) Procédé de détection de déplacement de position, dispositif de détection de déplacement de position, dispositif de positionnement et dispositif d'inspection
JP2015026738A (ja) 位置決め装置、位置決め方法および描画装置
JP2003152037A (ja) ウェハ検査方法、検査装置及び検査用赤外線撮像装置
CN115241110B (zh) 晶圆的运动控制方法及晶圆的运动控制系统
JP3679460B2 (ja) 移動体装置及びその制御方法
US6936386B2 (en) Reticle alignment procedure
JP4334917B2 (ja) アライメント装置
JP2005197338A (ja) 位置合わせ方法及び処理装置
JP3204253B2 (ja) 露光装置及びその露光装置により製造されたデバイス、並びに露光方法及びその露光方法を用いてデバイスを製造する方法
JP2000106345A (ja) 露光装置及びその露光装置により製造されたデバイス、並びに露光方法及びその露光方法を用いたデバイス製造方法
JPH1152545A (ja) レチクルおよびそれによって転写されたパターンならびにレチクルと半導体ウエハとの位置合わせ方法
JP2629659B2 (ja) 回路パターン形成方法
JP2000040662A (ja) 露光装置
JP2882821B2 (ja) アライメント装置

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): DE US

CFP Corrected version of a pamphlet front page
CR1 Correction of entry in section i

Free format text: PAT.BUL.50/97 UNDER INID (54) "TITLE",REPLACE THE EXISTING TEXT BY "WAFER ALIGNING METHOD"

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
REG Reference to national code

Ref country code: DE

Ref legal event code: 8642