WO1995013625A1 - Structure and method for mounting semiconductor device and liquid crystal display device - Google Patents
Structure and method for mounting semiconductor device and liquid crystal display device Download PDFInfo
- Publication number
- WO1995013625A1 WO1995013625A1 PCT/JP1994/001887 JP9401887W WO9513625A1 WO 1995013625 A1 WO1995013625 A1 WO 1995013625A1 JP 9401887 W JP9401887 W JP 9401887W WO 9513625 A1 WO9513625 A1 WO 9513625A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- input
- circuit board
- output
- wiring
- terminal
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 185
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 72
- 238000000034 method Methods 0.000 title claims description 34
- 239000000758 substrate Substances 0.000 claims description 22
- 230000008569 process Effects 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 239000012263 liquid product Substances 0.000 claims 1
- 210000004027 cell Anatomy 0.000 description 27
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 101710179738 6,7-dimethyl-8-ribityllumazine synthase 1 Proteins 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 101710186608 Lipoyl synthase 1 Proteins 0.000 description 1
- 101710137584 Lipoyl synthase 1, chloroplastic Proteins 0.000 description 1
- 101710090391 Lipoyl synthase 1, mitochondrial Proteins 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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Definitions
- the present invention relates to a structure and a method for mounting a semiconductor element -f, and particularly to a semiconductor element for an electronic device such as a liquid crystal display device by using a circuit board. Learn about the structure and methods that are suitable for implementation.
- the present invention also relates to a liquid crystal display device in which the driving semiconductor element is mounted using the mounting structure and the method. Background technology
- TAB Tape Automated Bonding
- C0G Chip-0nGlass
- the above-described TAB method is used to drive around the panel of the liquid crystal display composed of matrix type XY electrodes. It is common to connect semiconductor chips.
- the input and output wiring power of the semiconductor element is formed on the same side of the TAB package, and
- each TAB package is a liquid crystal. Since it is mounted on the outer side of the nozzle, the mounting area becomes extremely large, and a large part around the liquid crystal display, that is, the so-called frame part There was a problem that the entire liquid crystal display device became large and the display area became relatively small.
- the applicant of the present application has proposed a liquid crystal driving LSI via a circuit board having a multi-layer structure.
- a structure in which is mounted on a liquid crystal display device As shown in FIGS. 26 and 27, the laminated circuit board 55 is provided with an input wiring 5 on a surface to which a driving LSI 56 is connected at a predetermined position. 7, Output wiring 58 and input terminal ⁇ 9 are formed, and the liquid crystal panel 60 connection terminal 6 is formed on the back side. An output terminal 6 2 for connecting to the terminal 1 is formed, and an input path wiring 63 is provided in the middle layer, and the output wiring and the output terminal are connected to each other. , And the input wiring and the bus wiring are connected between the layers via the via holes 64, respectively.
- the purpose of the present invention is to reduce or completely eliminate the layer-to-layer connection on the circuit board on which the semiconductor element is mounted by using a via hole.
- the key to downsizing Provide a mounting structure and a mounting method of a semiconductor element which can simplify the manufacturing process and reduce the manufacturing cost while being able to respond to contracts. It is here.
- Another object of the present invention is to provide a liquid crystal display device having a drive LSI mounted on the liquid crystal display device, and a frame area of a liquid crystal cell, that is, a display area.
- the size of the entire device can be reduced by minimizing the size of the device, and in response to the demand for downsizing, the size and thickness of the entire device can be reduced.
- Liquid crystal display device that can be provided. Disclosure of the invention
- a structure for mounting a semiconductor element on an electronic device is provided, and a semiconductor element is mounted on each of them, and the semiconductor element is connected to the semiconductor element.
- Two sets of input wiring and one set of output wiring, two sets of input terminals respectively connected to each set of input wiring, and one set of output wiring connected to the output wiring A plurality of circuit boards having power terminals and input bus wiring for mutually connecting the input terminals of each group are provided, and the output terminals of each circuit board are connected to the electronic device. Connect to the corresponding terminal, and electrically connect each circuit board power, ', and each set of input terminals to one set of input terminals of another circuit board adjacent to each other.
- the mounting structure of the semiconductor element is characterized by being interconnected by the Structure is provided.
- each circuit board has a surface on which an output wiring, an output terminal, and an input wiring power semiconductor element are mounted.
- the input terminals and the input path wiring are formed on the surface opposite to the semiconductor mounting surface, and connect each input terminal to the corresponding input wiring.
- a via hole is provided on the circuit board, and a bus is used to connect each semiconductor element on the adjacent circuit board by input bus wiring.
- the wiring route is configured.
- two sets of input wiring are connected to each other via the terminal of the semiconductor element, thereby forming the second input bus.
- a wiring is formed on the semiconductor mounting surface.
- the same signal is separately supplied to each block from two sets of input wiring and input terminal cables. be able to.
- a cascade connection in which the semiconductor element outputs a signal is also possible.
- the connection between such a semiconductor element and each of the two sets of input terminals and input wiring can be appropriately combined as required. .
- each circuit board is formed on the mounting surface of the input wiring, the input terminal and the output wiring power semiconductor element, and the output terminal is formed of the semiconductor.
- a via hole is formed on the surface opposite to the device mounting surface to connect each output terminal to the corresponding output wiring.
- the two sets of input wires connected to the input terminals of each set are connected to each other via the terminals of the semiconductor element.
- an input bus wiring is formed, and similarly, a bus wiring path connecting each semiconductor element of the adjacent circuit board is formed.
- the power scale connection as in the case of the first embodiment described above is possible.
- each circuit board is formed on the mounting surface of the input wiring, the input terminal, the output wiring, and the output terminal power semiconductor device, and
- the input bus wiring is formed by the input wiring that connects the set of one input terminal and the other set of input terminals via the terminal of the semiconductor element.
- the present invention by configuring in this manner, the number of power holes formed on the circuit board is reduced, or the number of via holes is reduced.
- the hole can be eliminated, and the mounting area of the circuit board can be reduced and the thickness can be reduced.
- a method for mounting a semiconductor element on an electronic device wherein the semiconductor element is mounted on one surface and the semiconductor device is mounted on the same surface. It has one of the input wiring and output wiring of the element, and one of the input terminals or output terminals, and has the other side. Has the other end of the input terminal or output terminal, and has the other end of the input terminal or output end and the corresponding input wiring or output wiring on one side. And a circuit board having input bus wiring on the same surface as the input terminal, and an output terminal connected to the electronic terminal.
- a method for mounting a semiconductor device which is characterized in that the circuit board is mounted on an electronic device by connecting to a corresponding terminal of the device. Is provided.
- a method for mounting a semiconductor element on an electronic device in which a semiconductor element is mounted on one side and a semiconductor element is mounted on the same side.
- a method for mounting a semiconductor device which comprises a step of mounting a circuit board on the electronic device.
- the semiconductor element for driving the liquid crystal is mounted and connected to the semiconductor element.
- Two sets of input wiring and one set of output wiring, two sets of input terminals respectively connected to each set of input wiring, and one set of output wiring connected to the output wiring A plurality of circuit boards having output terminals and input bus wiring for mutually connecting the input terminals of each group are provided, and these circuit boards are provided.
- the output wiring, the output terminal, and the input wiring are formed on the surface on which the semiconductor element is mounted, and the input terminal and the input bus wiring are connected to the semiconductor element mounting surface.
- a via is formed on the opposite side to connect each input terminal to the corresponding input wiring.
- Aho -A circuit board is installed, and the output terminals of each circuit board are connected to the electrode terminals of the liquid crystal display device, and each circuit board is connected to the input of each set.
- the terminals are electrically connected to a pair of input terminals of another circuit board adjacent to each other, so that the terminals are connected to each other.
- a liquid crystal display device is provided.
- FIG. 1 is a plan view of a liquid crystal display device to which the mounting structure of the semiconductor device of the first embodiment according to the present invention is applied.
- FIG. 2 is a plan view showing a circuit board used in the liquid crystal display device of FIG.
- FIG. 3 is a partially enlarged cross-sectional view taken along the line m--m in FIG. 1 showing a state in which the circuit board of the first embodiment is connected to an LCD cell.
- FIG. 4 is a sectional view similar to FIG. 3, showing a modification of the circuit board of the first embodiment.
- FIG. 5 is a partially enlarged view showing a connection state of adjacent circuit boards in the liquid crystal display device of FIG.
- FIG. 6 shows another embodiment in which adjacent circuit boards are connected using a flexible printed circuit board (FPC).
- FIG. 6 is an enlarged view similar to FIG. It is a figure.
- FIG. 7 is a cross-sectional view similar to FIG. 3, showing a state in which the circuit board according to the second embodiment of the present invention is connected to an LCD cell.
- FPC flexible printed circuit board
- FIG. 8 is a cross-sectional view showing a modification of the second embodiment.
- FIG. 9 is a plan view showing a circuit board according to a third embodiment of the present invention, on which two LCD driving LSIs are mounted.
- FIG. 10 is a plan view of a circuit board showing a modified example of FIG.
- FIG. 11 is a perspective view showing a liquid crystal display device in which a circuit board on which a large number of LCD driving LSIs are mounted is connected to the periphery of the LCD cell.
- FIG. 12 is a plan view of a circuit board used for the mounting structure of the semiconductor device according to the fourth embodiment of the present invention.
- FIG. 13 is a cross-sectional view of the circuit board taken along the line ⁇ — ⁇ of FIG.
- FIG. 14 is a cross-sectional view showing a state where the circuit board of the fourth embodiment is connected to an LCD cell.
- FIG. 15 is a cross-sectional view similar to FIG. 13 showing a modification of the circuit board of the fourth embodiment.
- FIG. 16 is a cross-sectional view showing a state where the circuit board of FIG. 15 is connected to an LCD cell.
- FIG. 17 is a cross-sectional view taken along the line XVI—XVI in FIG. 12 showing a circuit board according to another modification of the fourth embodiment.
- Fig. 18 (a) and (b) show adjacent circuits when connecting multiple circuit boards according to the modified example of Fig. 17 to the LCD cell. It is the top view and the side view which show the connection state of the road board respectively.
- FIGS. 19 (a) to (c) are cross-sectional views showing still another modified example of the circuit board according to the fourth embodiment.
- FIG. 20 is a perspective view showing another embodiment of the present invention for connecting a plurality of circuit boards to LCD cells.
- FIG. 21 is a perspective view showing a modification of the embodiment of FIG.
- FIG. 22 is a plan view showing a display portion and a deserial area of the liquid crystal display device.
- FIG. 23 is a cross-sectional view showing an electronic printing apparatus in which a driving LSI is mounted by applying the first embodiment of the present invention.
- FIG. 24 is a cross-sectional view similar to FIG. 23 showing an electronic printing apparatus using the circuit board of the fourth embodiment.
- FIG. 25 is a sectional view showing an electronic printing apparatus using the circuit board of FIG. 15 according to a modified example of the fourth embodiment.
- FIG. 26 is a cross-sectional view showing a mounting structure of a semiconductor device using a multi-layer circuit board according to the prior art.
- FIG. 27 is a plan view showing the circuit board of FIG. 26 (the best configuration for carrying out the invention).
- a liquid crystal display device 1 to which a mounting structure of a semiconductor element according to the present invention is applied has an LCD having a usual XY matrix electrode structure.
- a large number of circuit boards 3 are located on the periphery of cell 2 along the upper, lower and left sides, respectively. Are connected continuously.
- the circuit board 3 connected to the upper and lower sides of the LCD cell 2 has a liquid crystal driving LS 14 on the X side, and the circuit board 3 connected to the left side of the LCD cell.
- the liquid crystal driving LSIs 4 on the Y side are mounted one by one, as will be described later.
- the input bus wiring of the circuit board on the X side and the input bus wiring of the circuit board on the Y side are provided in the upper left corner and lower left corner of the LCD sensor 2, the input bus wiring of the circuit board on the X side and the input bus wiring of the circuit board on the Y side are provided.
- the relay boards 5 for connecting and connecting the and are provided respectively. Further, to the relay board 5 at the lower left corner of
- the circuit board 3 is shown in FIG. 2 using ordinary relatively rigid board materials such as ceramics, glass epoxy resin, and polyimide resin, for example. It is formed in a rectangular shape that is long and narrow in the direction of the long side.
- a liquid crystal driving LSI 4 which is also a slender rectangle, is disposed in the lower half substantially in the center of the circuit board 3 in the longitudinal direction. Along with this, it is implemented by face down bonding.
- the external shape of the circuit board 3 can be changed accordingly.
- the circuit board 3 may be electrically connected to the circuit board 3 according to the use conditions and necessity, for example, when the display content of the liquid crystal display device 1 increases and the frequency increases. It is necessary to set up a ground layer. In such a case, a ground layer is formed inside the circuit board 3. A conductive layer can be provided.
- the pitch of the output terminal 8 is about 100 to 200, but it is necessary to select the material and the deposition process appropriately. It can be formed in a narrow pitch of 50 m or less.
- the same number of input terminals as the number of input terminals of the LSI 4 are provided along the left and right sides, respectively. Terminals are arranged in a straight line at a fixed pitch. In this embodiment, the pitch of the input terminal 11 is about 100 to 300 ⁇ m. Further, on the surface 7 of the circuit board 3, the input wiring 12 is extended from the power of the LSI 4 to the position of the corresponding input terminal 11 toward each of the left and right sides of the circuit board. Thus, the pattern is formed. Each input terminal 11 is connected to a corresponding input wiring 12 via a corresponding via hole 13, thereby being connected to LSI 4.
- the diameter of the via hole 13 is 100 ⁇ m, and the force can be appropriately changed according to the required force. Further, on the back surface 10 of the circuit board 3, an input wiring 14 for connecting the input terminal 11 on the left side and the input terminal 11 on the right side mutually is connected. The turn is formed.
- each of the terminals 11 is connected to the input terminal of the LSI via the input wiring 12. Therefore, the input terminal 11 on the left side of the circuit board 3 and the input terminal 11 on the right side and the power, and the input wiring 12 via the input terminal of each LSI described above Since they are connected to each other, in addition to the input bus wiring 14 on the rear surface 10, the second input bus wiring power consisting of the input wiring 12 in parallel with it It will be installed on the LSI mounting surface 7. This makes it possible to reduce the resistance value of the input bus wiring as a whole of the circuit board 3.
- the inner part is divided into blocks, for example, left and right, and It is powerful to set up separate LSI input terminals for each block.
- the above-mentioned LSI input terminal of each block is connected to the input terminal 11 which is closer to the left or right via the input wiring 12, and accordingly, The same signal is supplied separately from the left and right.
- the input terminal 11 on the left side is connected to the LSI 4 via the input line 12 on the left side, and the output is connected to the input line 12 on the right side.
- these embodiments can be appropriately combined according to the requirements such as the configuration of the circuit board and the LSI to be used.
- the inside of the LSI 4 is partially divided, for example, the power supply system is divided into blocks, and some signals are divided into left and right input terminals. And other signals are input separately from the input wiring, and some of the other signals are connected to the cascade connection described above, for example, the input terminals and input wiring on the right side are connected.
- Via the input terminals of the remaining signal power LSIs which are transmitted to the LSI of the adjacent circuit board via the IC and the left and right input wirings are connected via the input terminals of the remaining signal power LSIs. It can also be configured to be transmitted via the input path wiring.
- These wirings 9, 12 and 14 and terminals 8 and 11 are made of Au alone or Ag Pd, Ag and Cu as base materials. It is formed by depositing Ni * Au or Sn etc. as necessary, and has a solder resist on its surface as necessary. By applying such a material, corrosion and damage can be prevented.
- the via hole 13 is made of a metal material such as Au as in the above-described wirings and terminals, or is made of Ag Pd, Ag, and Cu as a base material. It is formed by plating Ni'Au or Sn etc. as needed, and painting with solder resist etc. as needed. Cloth will be.
- the LSI 4 mounted on the circuit board 3 is covered with a monolithic material 15 made of an adhesive such as an ultraviolet curing type or a thermosetting epoxy type as necessary. As a result, it is possible to improve the reliability by improving the moisture resistance and insulation properties.
- FIG. 3 shows the structure of the liquid crystal display device 1 in which the driving LSI 4 is mounted on the liquid crystal display device 1 by connecting the circuit board 3 to the LCD sensor 2.
- the LCD terminal 17 connected to the above-mentioned electrode is provided on the upper peripheral portion of the lower peripheral electrode substrate 16.
- Board 3 out It is formed in a straight line at a predetermined pitch corresponding to the force terminal 8.
- Each LCD terminal 17 is usually made up of an IT0 (oxidized indium tin) transparent electrode, and if necessary, a Cr, Ni, Au, Cu, etc. Metals or a combination of them can be stripped.
- IT0 oxidized indium tin
- the circuit board 3 aligns each output terminal 8 with the corresponding LCD terminal 17, and disposes an ACF, that is, an anisotropic conductive film 18 between them, between them. It is electrically and mechanically connected as a unit by performing thermocompression bonding with a predetermined pressure / heating tool.
- an AC600 type thermosetting type of AC600 series or 700000 series manufactured by Hitachi Chemical Co., Ltd. was used.
- ACF for example, a UV-curable material or a paste-like anisotropic conductive adhesive can be used.
- a monolide material 19 can be applied to the connection between the LCD sensor 2 and the circuit board 3 for the purpose of, for example, moisture proofing.
- the 4 A u to the output terminal 8 of the by the Hare twice circuit board 3 shown in the figure, that has server down flop 2 0 such as C u is formed (this, the 3
- the output terminal 8 and the LCD terminal 17 can be more securely and better electrically connected. I can do it.
- the circuit boards 3 and 3 'adjacently connected to the LCD cell 2 are connected to the input terminals 11 and 1 1' adjacent to each other.
- Metal wire such as', Au, Al, Cu, etc. or their combined power, wire bond using wire 21 They are connected to each other by wings.
- the input bus wires 14 of the entire circuit board 3 continuously mounted on the periphery of the LCD cell 2 are connected to each other.
- a suitable support section is provided on the lower side of the circuit boards 3 and 3 '. It is convenient to arrange timber.
- an adjacent circuit board is formed by using an FPC 22 in which wiring is patterned on the surface thereof. 3, 3 'can be connected between the input terminals 11 and 11'.
- the LSI 4 has input / output terminals 23 with bumps such as Au, and the circuit board 3 is mounted in a face-down manner. Directly connected to input and output wiring 11, 9. The input and output terminals of the LSI 4 fixed upward on the circuit board 3 using the face-up method are paired. Wire bonding with corresponding input and output wiring is also possible.
- the output terminal 8 of the circuit board 3 is provided on the same surface as the mounting surface 7 of the LSI 4 and the LCD cell 2 is mounted.
- the output wiring and the output terminal are connected as in the mounting structure described in Japanese Patent Application No.
- the number of output terminals is much larger than the number of input terminals, and as described above, the number of output terminals is 80 to several hundreds per semiconductor element, so
- the circuit board can be formed in a compact and inexpensive manner, and its area can be effectively used, so that the degree of freedom of wiring can be increased.
- the outer shape of the circuit board 3 is further reduced.
- the thickness can be reduced by eliminating the intermediate conductive layer.
- the mounting area indicated by A can be made very small.
- the LSI 4 can be kept within the range of its thickness. it can. Therefore, the mounting structure can be compacted and the entire liquid crystal display device 1 can be reduced in size.
- the mounting structure of the semiconductor device according to the present invention is used only on one side of the LCD sensor 2, and on two or all four sides. A similar effect can be obtained in such a case.
- FIG. 7 shows a second embodiment of the mounting structure of the semiconductor device according to the present invention.
- the circuit board 3 of the present embodiment has a slender rectangular shape which is substantially the same as the circuit board of the first embodiment shown in FIG. 2, and has an LCD driving LSI at the approximate center thereof. 4 is implemented.
- the LSI mounting surface 7 has the same number of input terminals as LS 14, one set for each of the left and right sides. Input terminals 11 1 are formed. Input terminal 11 on the left and input terminal 11 on the right Are connected to the input terminals of the LS 14 via the corresponding left and right input wirings 12, respectively.
- the input terminals 11 on the left and right sides are connected to the input terminals 11 on both the right and left sides via the input terminals before the LSI 4.
- another circuit board is provided via the input wiring 12 on the right side of the output of the LSI for the signal input from the input wiring 12 on the left side. It is also possible to combine a cascade connection that is sent to and output from another LSI.
- one set of output terminals is provided along the upper side in the longitudinal direction similarly to the circuit board of the first embodiment. 8 are formed, and are mutually connected to the corresponding output wirings 9 by via holes 2 ⁇ penetrating the circuit board 3, respectively. .
- the circuit board 3 is arranged such that the output terminal 8 is aligned with the LCD terminal 17 on the electrode board 16, and the ACF 18 is arranged between them to perform thermocompression bonding. Similarly, it is electrically and mechanically connected to the LCD cell 2.
- the adjacent circuit boards 3 use the input terminals 11 1 and 2 by using wires or FPCs as in the first embodiment. They are connected to each other.
- the input wiring 12 on the LSI mounting surface 7, that is, the other side that requires a contact area with the electrode substrate 16 when designing the input bus wiring This is advantageous because the pitch can be set to be larger than that of the face 10. Also, it is necessary to set up a via hole to connect to input terminal 11 Therefore, the compactness of the power circuit board 3 which is not the same as that of the first embodiment described above, reduction of cost, and effective use of the board area are attempted. be able to.
- FIG. 8 shows a modified example of the above-described second embodiment, in which the peripheral portion of the electrode substrate 16 includes the entire circuit substrate 3 on the flat surface thereof. The area has been expanded.
- the circuit board 3 can be bonded to the electrode panel 16 not only at the output terminal 8 but also at the entire lower surface 10 thereof.
- the circuit board 3 can be more securely and securely connected to the LCD cell 2 mechanically.
- FIG. 9 shows a mounting structure of a semiconductor device according to a third embodiment of the present invention in which two LCD driving LSIs are mounted on one circuit board.
- This circuit board 31 has the same configuration as the circuit board 3 of the first embodiment shown in FIG. 2, and is formed in a strip shape which is thinner to the left and right than the force and thus.
- two LSIs 4 and 4 ' are powerful, and in a longitudinal direction, a face-down bonding is in series along one side. It is implemented by
- the same number of sets of output terminals 8, 8 'corresponding to the output terminals of the LSIs 4, 4', respectively, and the other side of the longer side, respectively. are arranged linearly at a constant pitch along the line.
- the output terminals of each of the sets are output wirings 9 and 9 ′ that are patterned so as to extend from the corresponding output terminals S 14, 4 ′, respectively. And are connected.
- the input terminals of each pair of left and right are connected to each other, and the input bus wiring is formed so as to extend the back side of the circuit board in the long direction. According to 4, they are connected to each other.
- the input wirings 12 and 12 ′ of the respective LSIs 4 and 4 ′ are respectively formed in a pattern.
- the input wirings 12 and 12 ′ extending toward the left side or the right side of the circuit board 3 from the above-described LSIs are connected to the input lines 13 and 13 ′ through the nozzles 13 and 13 ′. Then, the corresponding input terminals 11 and 11 'are mutually connected. Further, the input wirings 12 and 12 extending between the two LSIs 4 and 4 ′ are connected to each other and are connected to each other via a common via hole 13. Connected to input bus wiring 14.
- the input terminal 11 on the left side and the input terminal 11 'on the right side of the circuit board 3 1 and the power are applied to the input terminals of the two LSIs. Therefore, they are mutually connected by the input wirings 12 and 12 '.
- the second input bus wiring force and the wiring can be provided on the LSI mounting surface 7, so that the entire device can be provided. Thus, the resistance of the input bus wiring can be reduced.
- the input terminal of the left or right block of each LSI described above is connected to the input terminal 11 near the left or right side.
- 1 1 'and input wiring 1 2, 1 2' are connected via the input wiring 12 and 1 2 ', and the input wiring of the other block of each LSI is input wiring between the two LS 1. , 1 2 'and common via hole 1 3
- the input wiring 12 is connected to the left LSI 4 via the input wiring 12, and the output is connected to the right LSI 4 ′ via the input wiring 12, 12 ′ between the two LSIs, and
- the output includes a cascade connection that is connected to the input terminal 11 'on the right side via the input wiring 12' on the right side, or is combined. It is also possible to configure the wiring.
- the circuit board 31 is positioned on the LCD panel by using the ACF while the output terminals 8 and 8 'are aligned with the LCD terminals of the corresponding electrode board. Connected collectively.
- two liquid crystal driving LSIs can be mounted on the LCD sensor in a single connection process.
- the input terminals of the adjacent circuit boards 31 are connected to each other by wire bonding or FPC. As a result, a bus wiring path for connecting adjacent circuit boards is formed.
- the circuit board 31 can be configured such that output terminals are provided on the LSI mounting surface in the same manner as the second embodiment in FIG. Wear.
- FIG. 10 shows a mounting structure of a semiconductor element according to such a modification.
- the circuit board 31 in the figure also has a long and narrow strip shape.
- Two LSIs 4 and 4 ′ are face-downbonded on the surface 7 in a straight line along the long direction.
- a pair of input terminals 11 1 and 11 ′ are arranged at a fixed pitch on each of the left and right sides, and each of the input terminal forces described above is arranged.
- Input wirings 12 and 12 ' are formed in a pattern toward LSIs 4 and 4'. Further, the output wirings 9, 9 ', and' patterns 'of the respective LSIs 4, 4' are formed toward the upper side of the LSI mounting surface 7.
- On the back surface 10 of the circuit board 3 there is a pair of output terminals 8 and 8 'for connection to the LCD cell, respectively, along the longer side of the output terminals. They are arranged in a straight line at positions corresponding to the wirings 9 and 9 ′, and are mutually connected via via holes 25 and 25 ′ that pass through the circuit board 3. It has been done.
- the LCD panel 2 has one elongated band-shaped turn at each of the upper, lower, and left sides along the periphery.
- the circuit boards 32 to 34 are connected.
- Each of the circuit boards 32, 34 has eight X-side driving LSIs 41, 42, and the circuit board 33 has four Y-side driving LSIs 43, respectively. , And are mounted linearly and continuously on one side along the longer direction.
- Each of the circuit boards 32 to 34 has substantially the same configuration as that of the embodiment shown in FIG. 10 and the LSI mounting surface has a pair of input and output sections provided on both the left and right sides.
- the input wiring connected to the input terminals and the input bus wiring for connecting adjacent LSIs are formed in a pattern.
- the output terminal of each SI is formed along one long side in the longer direction. Therefore, the circuit boards 32 to 34 can be easily connected to the electrode board 16 easily by using the ACF between the output terminal and the electrode board 16. It is done.
- a relay board 5 is disposed, and the X-side circuit board 32 and the Y-side circuit board 33 are connected to each other through the input terminal. And are connected to each other.
- a relay board 5 ′ having an external cable integrated is provided, and the lower X-side circuit board 34 and the lower-side circuit board 33 are provided.
- the X-side circuit boards 32 and 34 should not have the input terminals on the right or left side where the Y-side circuit board is not connected. You may.
- each of the sides of the LCD cell By connecting a single circuit board to each of them, a large number of liquid crystal driving LSIs can be mounted, thereby reducing the man-hours. Work can be facilitated, productivity can be improved, and manufacturing costs can be reduced.
- the mounting area of the liquid crystal display device can be greatly reduced as compared with the related art.
- a liquid crystal display panel of 20 cm (8 inch) size is manufactured using the mounting structure according to the present invention.
- the size of the frame area formed around the display section 24 with respect to the same external dimensions, that is, the size of the display area is indicated by the dimension A shown in the figure.
- the circuit board 35 is configured such that output terminals are provided on the LSI mounting surface in the same manner as the circuit board 3 of the first embodiment in FIG. In this case, two liquid crystal driving LSIs can be mounted in the same manner.
- FIGS. 12 and 13 show a circuit board 35 having a semiconductor element mounting structure according to a fourth embodiment of the present invention.
- the circuit board 35 of the present embodiment has a long and narrow rectangular shape like the circuit board of the first to third embodiments described above, and the mounting surface of the LCD driving LSI 4. 7, the output terminal 8, output wiring 9, input terminal 11 and input wiring 12 are patterned. They differ in that they do not have any via holes for that. In this way, the circuit is not used at all by connecting the output terminals or input terminals to the output wiring or the input wiring, and the circuit is not used at all.
- the configuration of the substrate 35 itself can be extremely simplified, and the manufacturing cost can be further reduced.
- the same number of input terminals 11 as the input terminals of a set of LSIs 4 are arranged, respectively. It is connected to the aforementioned LSI input terminal via input wiring 12. In this way, the input terminals 11 on the left and right sides are used to connect another circuit board at the same time by the input wiring 12 that connects them. Pass wiring is formed. Also, in this embodiment, as in each of the embodiments described above, the output wiring of the SI for the signal input from the input wiring 12 on the left side is the input wiring on the right side. It is possible to combine the cascade connections which are sent to the LSI of another circuit board via 12 and output.
- the circuit board 35 of this embodiment uses an ACF 18 as in each of the above-described embodiments, and the output terminal 8 is connected to the electrode board 16 as shown in FIG. LCD terminal 17 is electrically and mechanically connected.
- the circuit board 35 which is thinned and the LSI 4 and the output terminal 8 are provided on the same surface, is connected to the LCD cell 2. Therefore, since the LSI 4 is arranged on the side of the electrode substrate 16 and within the range of its thickness, the entire liquid crystal display device can be thinned. You.
- the circuit board 35 of this embodiment is shown in FIG. So that the input terminal 8, output wiring 9, input wiring 12 and input terminal 11 are embedded from the LSI mounting surface 7 of the circuit board 35 to the inside. Has been established. Therefore, for example, as shown in Fig. 15, the back surface 10 of the circuit board 35 is partially removed and the window 26 is opened. Thus, the output terminal 8 can be exposed to the rear surface 10 side.
- the circuit board 35 By exposing the output terminal 8 to both sides of the circuit board 35 in this manner, the circuit board 35 is exposed from the back as shown in FIG. It can be connected to the LCD terminal 17 of the electrode substrate 16 from the surface 10 side. In this case, since the circuit board 35 can be bonded to the electrode board 16 over the entire surface thereof, the circuit board 35 can be more securely and stably fixed.
- the window 26 of the circuit board 35 is easily formed by selectively removing the back surface 10 by, for example, excimer laser processing. You can do this.
- FIG. 12 Another embodiment of a circuit board 35 with an open window is strongly shown in FIG.
- the circuit board 35 of the fourth embodiment is provided with input terminals 11 and protrudes slightly outwardly from the left and right side component force with the input terminal 11 provided.
- the rear surface 10 of the left and right side portions is removed, and the input terminal 11 is exposed to the rear surface 10 side.
- a plurality of circuit boards 35 are adjacent to the periphery of the LCD cell 2.
- the adjacent input terminals 11 of the circuit board 35 are overlapped with each other and the ACF They can be connected to each other by means of, for example, a solder joint.
- the connection work is easy because there is no need to use a wire bonding FPC as in the first and second embodiments described above.
- the reliability of the part is improved, and the number of parts is reduced, so that the cost can be reduced.
- FIGS. 19 (a) to (c) each show still another modification of the circuit board of the fourth embodiment.
- the circuit board 35 in FIG. 19 (a) is provided with a window 27 in an area corresponding to the LSI 4 on the back face 10 of the circuit board.
- FIG. 19 (b) shows a window which exposes the output terminal 8 in the same manner as in FIG. 14 by focusing on the window 27 shown in FIG. 19 (a). Part 28 is openly formed.
- the circuit board 35 shown in FIG. 19 (c) has almost the entire back surface of the circuit board 10 including the output terminal 8, the output wiring 9, and the input wiring 12 exposed. There is a window 29 to be installed.
- a window corresponding to the mounting area of the LSI 4 is provided on the back surface 10 of the circuit board 35 so that the LSI 4 is connected to the circuit board 35.
- the heating tool can be directly in contact with the input wiring 12 and the output wiring 9. For this reason, each input / output terminal of LSI 4 is connected to the input and output wirings 12 and 9 by gating-bonding more easily. can do.
- FIGS. 20 and 21 show different configurations for connecting the circuit board 35 of the fourth embodiment to the LCD cell 2, respectively.
- the input terminals 11 are The output terminals 8 are arranged on the left and right sides of the array of the output terminals 8 along one of the long sides, not on the left and right sides of the circuit board 35. .
- the output terminal 8 and the input terminal 11 are exposed on the back surface of the circuit board 35 opposite to the LSI mounting surface 7, as shown in FIG. 17.
- the windows to open the windows are open.
- a turn connection terminal 30 is formed at a position corresponding to the input terminal 11 of the circuit board 35. Further, in order to connect another circuit board 35 'adjacent to the circuit board, the electrode board 16 has the same LCD terminal 17' and panel connection terminal. 30 ′, a pattern is formed along the periphery of the electrode substrate 16.
- the panel connection terminal 17 of the circuit board 35 and the panel connection terminal 17 of the adjacent circuit board 35 ' are each formed on the electrode board 16 with a pattern. They are connected to each other by the bus wiring 36 provided. Therefore, the circuit board 3 5 3 5 ′, its output terminal 8 8 ′ and its input terminal 11 1 1 1 ′ correspond to the corresponding LCD terminals 17 17 and panel, respectively.
- the circuit board 3 5 3 5 ′, its output terminal 8 8 ′ and its input terminal 11 1 1 1 ′ correspond to the corresponding LCD terminals 17 17 and panel, respectively.
- the wire bonding FP By simply mounting each circuit board on the electrode board without using C, the adjacent circuit boards are connected, and the input bus wiring is connected. They will be contacted each other. Therefore, there is an advantage that the connection work is easy and the man-hour can be reduced. Further, in this embodiment, since the output terminal 8 and the input terminal 11 of the circuit board 35 are arranged in a straight line, the pressure head is connected in a straight line. This makes it possible to easily form the binding device.
- a circuit having the same configuration as that of FIG. 17 in which the windows are opened on the back surface of the circuit board to expose the input / output terminals is provided. If the power using the board and at least the output terminal and the input terminal are arranged on the same surface, it is possible to use a circuit board of another configuration. Wear. For example, it is possible to use a structure having no window on the back surface of the circuit board shown in FIG. 12. In this case, the circuit board 35 is arranged such that the LSI 4 is located on the side of the electrode board 16 and within the range of its thickness, as in the case of FIG. Connected to.
- the LCD terminals 17 and the panel connection terminals 30 are arranged on the inner side of the electrode substrate 16, and the bus wiring 36 is arranged on the outer side of the electrode substrate 16. The turn has been formed.
- the circuit board 35 has the same configuration as that of the embodiment shown in FIG. 20. Similarly, the circuit board 35 is collectively connected to the electrode board 16 using ACF or the like.
- the length of the wiring from the LCD terminal 17 to the X electrode or the Y electrode of the LCD cell 2 is shorter than in the embodiment of FIG. 20.
- the periphery of the electrode substrate 16 forming the LCD terminals 17 and the like can be made smaller than in the embodiment shown in FIG.
- an area for providing the bus terminal 36 outside the LCD terminal 17 and the panel connection terminal 30 is secured around the electrode substrate 16. Since it is necessary, it is difficult to connect the circuit board shown in Fig. 13 which does not have a window on the back side as in the embodiment shown in Fig. 20. .
- Fig. 23 Fig. 25-Fig. 25 shows an example of a structure in which a driving LSI is mounted on a thermal printer head as an electronic printing apparatus.
- the thermal printer head 37 has a driving substrate 40 on a ceramic substrate 39 on which a heating portion 38 is formed.
- the circuit board 4 on which is mounted is connected.
- the circuit board 4 4 has the same configuration as the circuit board 3 in FIG. 1, and the output wiring 45, the output terminal 46, and the input wiring are provided on the surface on which the driving LSI 40 is mounted. 4 7 is formed, and on the opposite side, input bus wiring for connecting to the input terminal 48 and the LSI of the adjacent circuit board is formed. Also, the input terminal 48 is mutually connected to the input wiring 47 by the via hole 49.
- the circuit board 4 4 Position the thermal printer head 50 formed on the substrate 39 of the thermal printer head 37 with the output terminal 46. Then, they are electrically and mechanically connected by thermocompression bonding using ACF51.
- the circuit board 52 has the same configuration as the circuit board 35 shown in FIG. 12 and has the same configuration as that shown in FIG. It is connected to the board 39 of the solar head 37.
- the circuit board 53 has the same configuration as the circuit board 35 shown in FIG. 15 and is the same as the case shown in FIG. In this way, it is connected to the substrate 39 of the thermal printer head 37.
- the mounting structure of the semiconductor element of the present invention not only the electronic display device but also the electronic printing device and other various electronic devices can be used.
- the mounting area can be extremely small and the entire device can be made thinner, which meets the demand for downsizing. It is possible to realize a compact electronic device with a small number of shells.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Combinations Of Printed Boards (AREA)
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950702920A KR100321883B1 (ko) | 1993-11-12 | 1994-11-09 | 반도체소자의실장구조및실장방법과,액정표시장치 |
EP95900275A EP0680082B1 (en) | 1993-11-12 | 1994-11-09 | Structure for mounting semiconductor device and liquid crystal display device |
JP51371695A JP3579903B2 (ja) | 1993-11-12 | 1994-11-09 | 半導体素子の実装構造及び半導体装置の実装構造並びに液晶表示装置 |
DE69432460T DE69432460T2 (de) | 1993-11-12 | 1994-11-09 | Struktur zur montage eines halbleiters- und eines fluessigkristallanzeigeapparates |
US08/481,460 US5893623A (en) | 1993-11-12 | 1994-11-09 | Structure and method for mounting semiconductor devices, and liquid crystal display |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28369493 | 1993-11-12 | ||
JP5/283694 | 1993-11-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1995013625A1 true WO1995013625A1 (en) | 1995-05-18 |
Family
ID=17668874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1994/001887 WO1995013625A1 (en) | 1993-11-12 | 1994-11-09 | Structure and method for mounting semiconductor device and liquid crystal display device |
Country Status (8)
Country | Link |
---|---|
US (1) | US5893623A (ja) |
EP (1) | EP0680082B1 (ja) |
JP (1) | JP3579903B2 (ja) |
KR (1) | KR100321883B1 (ja) |
DE (1) | DE69432460T2 (ja) |
SG (1) | SG63572A1 (ja) |
TW (1) | TW285751B (ja) |
WO (1) | WO1995013625A1 (ja) |
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JP2002539486A (ja) * | 1999-03-09 | 2002-11-19 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 表示装置 |
US6519021B1 (en) | 1999-01-18 | 2003-02-11 | Seiko Epson Corporation | Wiring board for connection of electro-optical panel, electro-optical device and electronic apparatus |
JP2003516560A (ja) * | 1999-12-10 | 2003-05-13 | テレフオンアクチーボラゲツト エル エム エリクソン(パブル) | インタポーザ装置 |
US6781662B1 (en) | 1998-04-09 | 2004-08-24 | Seiko Epson Corporation | Compression-bond connection substrate, liquid crystal device, and electronic equipment |
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KR101061531B1 (ko) * | 2010-12-17 | 2011-09-01 | 테세라 리써치 엘엘씨 | 중앙 콘택을 구비하며 접지 또는 배전을 개선한 적층형 마이크로전자 조립체 |
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US9423906B2 (en) | 2011-05-17 | 2016-08-23 | Ching-Yang Chang | Drive system adaptable to a matrix scanning device |
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CN105261602A (zh) | 2015-09-16 | 2016-01-20 | 京东方科技集团股份有限公司 | 一种显示面板的封装结构、转接板、封装方法及显示装置 |
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- 1994-11-09 EP EP95900275A patent/EP0680082B1/en not_active Expired - Lifetime
- 1994-11-09 KR KR1019950702920A patent/KR100321883B1/ko not_active IP Right Cessation
- 1994-11-09 WO PCT/JP1994/001887 patent/WO1995013625A1/ja active IP Right Grant
- 1994-11-09 DE DE69432460T patent/DE69432460T2/de not_active Expired - Lifetime
- 1994-11-09 JP JP51371695A patent/JP3579903B2/ja not_active Expired - Lifetime
- 1994-11-09 SG SG1996003319A patent/SG63572A1/en unknown
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6781662B1 (en) | 1998-04-09 | 2004-08-24 | Seiko Epson Corporation | Compression-bond connection substrate, liquid crystal device, and electronic equipment |
US6519021B1 (en) | 1999-01-18 | 2003-02-11 | Seiko Epson Corporation | Wiring board for connection of electro-optical panel, electro-optical device and electronic apparatus |
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Also Published As
Publication number | Publication date |
---|---|
TW285751B (ja) | 1996-09-11 |
DE69432460T2 (de) | 2004-01-15 |
DE69432460D1 (de) | 2003-05-15 |
KR960700524A (ko) | 1996-01-20 |
US5893623A (en) | 1999-04-13 |
EP0680082A1 (en) | 1995-11-02 |
SG63572A1 (en) | 1999-03-30 |
EP0680082A4 (en) | 1997-04-02 |
JP3579903B2 (ja) | 2004-10-20 |
EP0680082B1 (en) | 2003-04-09 |
KR100321883B1 (ko) | 2002-06-20 |
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