WO1994004376A1 - Ic card - Google Patents
Ic card Download PDFInfo
- Publication number
- WO1994004376A1 WO1994004376A1 PCT/JP1993/001055 JP9301055W WO9404376A1 WO 1994004376 A1 WO1994004376 A1 WO 1994004376A1 JP 9301055 W JP9301055 W JP 9301055W WO 9404376 A1 WO9404376 A1 WO 9404376A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- module
- card
- long side
- long
- card according
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000004065 semiconductor Substances 0.000 claims abstract description 12
- 239000011248 coating agent Substances 0.000 claims 4
- 238000000576 coating method Methods 0.000 claims 4
- 239000000696 magnetic material Substances 0.000 claims 1
- 230000002040 relaxant effect Effects 0.000 abstract 1
- 230000007423 decrease Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/08—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/08—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means
- G06K19/083—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Definitions
- the present invention provides an IC card with a built-in semiconductor integrated circuit device, and in particular, a connection terminal for connecting an external device on the surface of the card, and a magnetic line (magnetic stripe) for storing information on the back of the card. It concerns the structure of IC cards. Background art
- the IC card has a built-in central processing unit (CPU) and a memory circuit.
- CPU central processing unit
- memory circuit a type of computer. Therefore, various applications are possible.
- IS0 International Organization for Standadization
- JIS Japanese Industrial Standard
- JISX 6303 JIS standard
- the distance A to the upper side of -2 (the side closest to the upper end 101 of the sides defining the terminal) is specified as a maximum of 19.23nim.
- IS 078 1 1-5 of the IS 0 standard (corresponding to JISX 6302 of the JIS standard) specifies the upper end 101 of the IC card 100 as shown in Fig. 16.
- the distance B from the magnetic stripe 105 to the lower side of the third track 105a of the magnetic stripe 105 is specified as a minimum of 15.32 mm and a maximum of 15.82 mm.
- FIG. 17 is an enlarged sectional view of a main part of an IC card with a magnetic stripe satisfying the above-mentioned standard (referred to as JIS-I type IC card in Japan). From this figure, the positional relationship between the IC chip module 103 and the magnetic stripe 105 can be easily understood.
- the distance C from the upper end 101 of the force to the lower side of the magnetic stripe 105 covers the error of the maximum value of the distance B from the upper end 101 to the lower side of the third track 105a of 15.82 mm.
- An object of the present invention is to alleviate such stress and to provide an IC card having higher durability than before. Disclosure of the invention
- a first invention of the present application is directed to a semiconductor integrated circuit having a card base having a front surface and a back surface, a magnetic stripe for storing information on the back surface, and a connection terminal for connecting to an external device in a predetermined area on the front surface.
- Module with built-in device In the IC module with the module, the end of the module is located in the vertical direction of the magnetic stripe.
- the second invention of the present application is configured such that the thickness of the end portion is gradually reduced.
- the third invention of the present application is configured such that a part of the end portion has a pointed shape. More specifically, the module is formed in a pentagonal or hexagonal shape, and the module is arranged so that the end of the module has a pointed shape.
- FIG. 1 is a plan view showing an appearance of an IC card according to a first embodiment of the present invention
- FIG. 2 is a plan view of an IC card showing a first embodiment of the present invention
- FIG. FIG. 4 is an enlarged cross-sectional view for explaining in detail a main part cross-sectional view shown in FIG. 3, and
- FIG. 5 is a second embodiment of the present invention.
- FIG. 6 is a plan view of the IC chip module in the second embodiment
- FIG. 7 is a cross-sectional view of the IC chip module shown in FIG. 6
- FIG. 9 is a cross-sectional view of a main part showing a positional relationship between an IC chip module and a magnetic stripe in the embodiment of FIG. 9;
- FIG. 9 is a cross-sectional view of a main part showing a positional relationship between an IC chip module and a magnetic stripe in the embodiment of FIG. 9;
- FIG. 9 is an enlarged cross-sectional view for explaining in detail the cross-sectional view of the main part shown in FIG.
- FIG. 0 is a plan view of an IC card showing a third embodiment of the present invention
- FIG. 11 is a plan view of an IC chip module in the third embodiment
- FIG. FIG. 13 is a cross-sectional view of the IC chip module
- FIG. 13 is a cross-sectional view of a principal part showing a positional relationship between the IC chip module and the magnetic strip in the third embodiment
- FIG. 14 is a cross-sectional view of FIG.
- FIG. 15 is a plan view showing the appearance of the surface of a general IC force
- FIG. 16 is a view showing FIG.
- FIG. 15 Plan view showing the appearance of the back side of the C-force, No. 17 The figure is a cross-sectional view of the principal part of the IC card shown in FIG. 15, and FIG. 18 is I shown in FIG.
- FIG. 4 is a cross-sectional view for explaining a state in which a stress is applied to a force.
- FIG. 1 is a plan view of an IC card 1 in the present embodiment. This plan view is schematically shown to explain the present invention.
- This IC card 1 has a plurality of connection terminals 5-1 for connecting to external devices on the surface of a card base 3, and an IC chip module (hereinafter, referred to as a module) 5 with a built-in semiconductor integrated circuit. Magnetic stripes 7 for storing information are formed on the back side, similar to a general IC card.
- a characteristic part of the present invention is that the end 5 a (indicated by a dashed line in the figure) of the module 5 is formed so as to extend above the magnetic stripe 7 formed on the back surface. It is a point.
- FIG. Fig. 2 schematically shows the IC card in Fig. 1.
- the main part of the sectional view taken along line XX of FIG. 2 is shown in FIG.
- the IC card in this embodiment is a module 5 is formed so as to extend to a position above the magnetic stripe 7. That is, the module 5 is arranged so that the distance L is smaller than the distance M as described above.
- the module 5 covers a substrate 5-2, a semiconductor integrated circuit device 5-3 mounted on one surface of the substrate 5-2, and covers these. It is composed of a mold resin 5-4 and a connection terminal 5-1 mounted on the other surface of the substrate 5-2 for connecting to an external device (not shown).
- the module is generally formed with a module receiving portion called a spot facing on the substrate surface and in the vicinity thereof, and is accommodated therein.
- the magnetic stripe is also contained in a counterbore formed on the back surface of the substrate and in the vicinity thereof.
- the thickness of the substrate changes gradually in the vicinity of the gap between the module and the magnetic stripe, so that the stress applied to this portion is reduced.
- FIG. 5 is a plan view schematically showing an IC force in the present embodiment.
- the IC card in this embodiment has a pointed shape 5b as shown in FIG. 6 at the end 5a of the module 5 of the IC card in the first embodiment, and furthermore, as shown in FIG. In this way, the thickness of the end is gradually reduced toward the tip 5c.
- the module 5 has a pentagonal shape in plan view, and its thickness gradually decreases from the bottom 5 d of the end 5 b toward the tip 5 c. That is, the end 5b has a tapered shape 5e.
- this IC card has a distance N from the upper end 3a of the card base 3 to the upper end of the module 5, that is, the tip 5c, and the distance N from the upper end 3a to the lower side 7a of the magnetic stripe 7 It is formed so as to be smaller.
- FIG. 5 In order to easily understand the positional relationship between such a module 5 and the magnetic stripe 7, a main part of a cross-sectional view taken along line YY of FIG. 5 is shown in FIG.
- the IC card according to the present embodiment is configured such that the end of the module 5 is positioned to extend above the magnetic stripe 7 and that the thickness of the end is gradually reduced. Is formed.
- Fig. 9 shows an enlarged detail of this part. As is clear from this figure, the end 5b of the module 5 is formed so that its thickness gradually decreases toward the tip 5c.
- the change in the thickness of the substrate near the gap between the module and the magnetic stripe becomes more gradual than in the first embodiment.
- the applied stress is further reduced.
- FIGS. 10 to 14 a third embodiment of the present invention will be described with reference to FIGS. 10 to 14.
- the same parts as those described in the first and second embodiments are denoted by the same reference numerals, and description thereof will be omitted.
- FIG. 10 is a plan view schematically showing the IC force in the present embodiment.o
- FIG. 10 is a plan view schematically showing an IC force in this embodiment.
- the IC card in this embodiment is such that the module 5 in the second embodiment is further provided with an end 5f at a portion facing the end 5b.
- the IC card is bent in the short side direction.
- the bending force 5 ' was considered only for the most concentrated "gap".
- the lower part of the module 5 where such stress is concentrated secondly is also considered, and further, an IC card with improved durability is obtained.
- the end 5f has the same shape as the end 5b. That is, the end 5f is symmetrical to the end 5b as shown in FIG. Further, as shown in FIG. 12, the end 5 gradually becomes thinner toward the tip 5 g. As can be easily understood from FIGS. 11 and 12, this module 5 has a hexagonal shape in plan view and has a thickness from the bottom 5 h at the end 5 mm to the tip 5 g at the end 5 mm. Is gradually becoming thinner. That is, the end 5f has a tapered shape 5i.
- this IC card has a distance N from the upper end 3a of the card base 3 to the upper end of the module 5, that is, the tip 5c, is smaller than the distance M from the upper end 3a to the lower side 7a of the magnetic stripe 7. Needless to say, it is formed as follows.
- the IC force in the present embodiment is formed so that the end of the module 5 is positioned to extend above the magnetic stripe 7 and the thickness of the end gradually decreases.
- the opposite end has a similar shape symmetrically. .
- Fig. 14 shows an enlarged view of this part.
- the end 5f of the module 5 is formed so that its thickness gradually decreases toward the tip 5g like the end 5b.
- the module, the magnetic strap, the change in the thickness of the substrate near the gap is moderated, so that the stress applied to this portion is alleviated, and the stress is also alleviated in the second portion where the stress is concentrated.
- the present invention relates to an IC card with a built-in semiconductor integrated circuit device, and in particular, a connection terminal for connecting an external device to the surface of the card, and a magnetic line (magnetic stripe) for storing information on the back of the force card. It can be applied to the provided IC skills.
- the step change of the substrate near the upper part of the module is reduced, and the portion thereof is reduced.
- the stress on the surface is reduced o
- the thickness of the end portion is configured to be gradually reduced, furthermore, the step change force s ′ of the substrate near the upper part of the module becomes smaller, and the portion has The applied stress is further reduced.
- the module is formed in a pentagonal or hexagonal shape, and Since the module is arranged so that the tip of the part has a pointed shape, the change in the level difference of the substrate near the upper part of the module is reduced, and the stress applied to that part is reduced.
- the invention when the first, second, and third inventions of the present application are added to the upper part of the module of the IC card, and the present invention is applied to the lower part of the module, the invention is applied to the IC card.
- the stress can be reduced at the portion where the stress in the short side direction is most concentrated and the portion where the stress is concentrated second. As a result, a highly durable IC card can be provided.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Credit Cards Or The Like (AREA)
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/211,570 US5544014A (en) | 1992-08-12 | 1993-07-27 | IC card having a built-in semiconductor integrated circuit device |
DE69314466T DE69314466T2 (de) | 1992-08-12 | 1993-07-27 | Chip-Karte |
EP93916231A EP0618083B1 (en) | 1992-08-12 | 1993-07-27 | IC Card |
JP50387194A JP3169965B2 (ja) | 1992-08-12 | 1993-07-27 | Icカード |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21510092 | 1992-08-12 | ||
JP4/215100 | 1992-08-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1994004376A1 true WO1994004376A1 (en) | 1994-03-03 |
Family
ID=16666756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1993/001055 WO1994004376A1 (en) | 1992-08-12 | 1993-07-27 | Ic card |
Country Status (5)
Country | Link |
---|---|
US (1) | US5544014A (ja) |
EP (1) | EP0618083B1 (ja) |
JP (1) | JP3169965B2 (ja) |
DE (1) | DE69314466T2 (ja) |
WO (1) | WO1994004376A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002312743A (ja) * | 2001-04-09 | 2002-10-25 | Dainippon Printing Co Ltd | 可逆表示部付きicカード |
JP2011521377A (ja) * | 2008-05-22 | 2011-07-21 | アメリカン エクスプレス トラベル リレイテッド サービシーズ カンパニー, インコーポレイテッド | 金属を含有する取引カードおよびその作製方法 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4416697A1 (de) * | 1994-05-11 | 1995-11-16 | Giesecke & Devrient Gmbh | Datenträger mit integriertem Schaltkreis |
US6268237B1 (en) | 1995-04-03 | 2001-07-31 | Aptek Industries, Inc. | Stress-free silicon wafer and a die or chip made therefrom and method |
US6054372A (en) * | 1995-04-03 | 2000-04-25 | Aptek Industries, Inc. | Stress-free silicon wafer and a die or chip made therefrom |
US5733814A (en) * | 1995-04-03 | 1998-03-31 | Aptek Industries, Inc. | Flexible electronic card and method |
TW381236B (en) * | 1995-07-07 | 2000-02-01 | Docusystem Inc | Integrated circuit chip card and the method and system for the manufacture same |
JPH1097599A (ja) * | 1996-09-24 | 1998-04-14 | Hitachi Ltd | Icカード用携帯端末装置 |
WO2006025017A1 (en) * | 2004-09-02 | 2006-03-09 | Philips Intellectual Property & Standards Gmbh | Identification document with a contactless rfid chip |
USD707682S1 (en) * | 2012-12-05 | 2014-06-24 | Logomotion, S.R.O. | Memory card |
US9888283B2 (en) | 2013-03-13 | 2018-02-06 | Nagrastar Llc | Systems and methods for performing transport I/O |
USD729808S1 (en) | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface |
USD758372S1 (en) * | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
US9647997B2 (en) | 2013-03-13 | 2017-05-09 | Nagrastar, Llc | USB interface for performing transport I/O |
USD759022S1 (en) | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface |
USD780763S1 (en) | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
USD864968S1 (en) | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
US10115047B2 (en) * | 2016-12-09 | 2018-10-30 | Capital One Services, Llc | Transaction card with secured magnetic strip and method for making the same |
JP1633612S (ja) * | 2018-02-01 | 2019-06-10 | ||
USD930000S1 (en) | 2018-10-12 | 2021-09-07 | Huawei Technologies Co., Ltd. | Memory card |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58125892A (ja) * | 1981-12-24 | 1983-07-27 | ゲ−ア−オ−・ゲゼルシヤフト・フユ−ル・アウトマチオン・ウント・オルガニザチオン・エム・ベ−・ハ− | 集積回路モジユ−ルを有する識別カ−ドおよびキヤリヤ要素 |
JPS6384989A (ja) * | 1986-09-30 | 1988-04-15 | 株式会社東芝 | 照合カ−ド装置 |
JPS63233892A (ja) * | 1987-03-23 | 1988-09-29 | 松下電子工業株式会社 | Icカ−ド |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2920012B1 (de) * | 1979-05-17 | 1980-11-20 | Gao Ges Automation Org | Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte |
DE3029939A1 (de) * | 1980-08-07 | 1982-03-25 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung |
NL191959B (nl) * | 1981-03-24 | 1996-07-01 | Gao Ges Automation Org | Identificatiekaart met IC-bouwsteen en dragerelement voor een IC-bouwsteen. |
JPS59228743A (ja) * | 1983-06-10 | 1984-12-22 | Kyodo Printing Co Ltd | Icカ−ド用icモジユ−ル |
JPS61123990A (ja) * | 1984-11-05 | 1986-06-11 | Casio Comput Co Ltd | Icカ−ド |
FR2662000A1 (fr) * | 1990-05-11 | 1991-11-15 | Philips Composants | Carte a microcircuit. |
-
1993
- 1993-07-27 DE DE69314466T patent/DE69314466T2/de not_active Expired - Fee Related
- 1993-07-27 WO PCT/JP1993/001055 patent/WO1994004376A1/ja active IP Right Grant
- 1993-07-27 JP JP50387194A patent/JP3169965B2/ja not_active Expired - Fee Related
- 1993-07-27 EP EP93916231A patent/EP0618083B1/en not_active Expired - Lifetime
- 1993-07-27 US US08/211,570 patent/US5544014A/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58125892A (ja) * | 1981-12-24 | 1983-07-27 | ゲ−ア−オ−・ゲゼルシヤフト・フユ−ル・アウトマチオン・ウント・オルガニザチオン・エム・ベ−・ハ− | 集積回路モジユ−ルを有する識別カ−ドおよびキヤリヤ要素 |
JPS6384989A (ja) * | 1986-09-30 | 1988-04-15 | 株式会社東芝 | 照合カ−ド装置 |
JPS63233892A (ja) * | 1987-03-23 | 1988-09-29 | 松下電子工業株式会社 | Icカ−ド |
Non-Patent Citations (1)
Title |
---|
See also references of EP0618083A4 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002312743A (ja) * | 2001-04-09 | 2002-10-25 | Dainippon Printing Co Ltd | 可逆表示部付きicカード |
JP4686045B2 (ja) * | 2001-04-09 | 2011-05-18 | 大日本印刷株式会社 | 可逆表示部付きicカード |
JP2011521377A (ja) * | 2008-05-22 | 2011-07-21 | アメリカン エクスプレス トラベル リレイテッド サービシーズ カンパニー, インコーポレイテッド | 金属を含有する取引カードおよびその作製方法 |
Also Published As
Publication number | Publication date |
---|---|
JP3169965B2 (ja) | 2001-05-28 |
DE69314466D1 (de) | 1997-11-13 |
EP0618083A1 (en) | 1994-10-05 |
EP0618083B1 (en) | 1997-10-08 |
US5544014A (en) | 1996-08-06 |
DE69314466T2 (de) | 1998-05-07 |
EP0618083A4 (en) | 1994-12-07 |
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