WO1990012481A1 - Procede de fabrication d'un outil d'impression - Google Patents

Procede de fabrication d'un outil d'impression Download PDF

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Publication number
WO1990012481A1
WO1990012481A1 PCT/CA1990/000112 CA9000112W WO9012481A1 WO 1990012481 A1 WO1990012481 A1 WO 1990012481A1 CA 9000112 W CA9000112 W CA 9000112W WO 9012481 A1 WO9012481 A1 WO 9012481A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
pattern
plating
tool
making
Prior art date
Application number
PCT/CA1990/000112
Other languages
English (en)
Inventor
George Robert Hagner
Original Assignee
Northern Telecom Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northern Telecom Limited filed Critical Northern Telecom Limited
Publication of WO1990012481A1 publication Critical patent/WO1990012481A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/24—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass dies
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits

Definitions

  • This invention relates generally to impressing and more particularly to a tool used for impressing.
  • impressing will be considered to be the act of causing relief in an otherwise flat surface.
  • One application for impressing is in the field of electrical circuit boards sometimes referred to as printed circuit boards or PCBs.
  • An example of a molded circuit board is depicted in U.S. patent No. 4,604,678 dated August 5, 1986 by George R. Hagner entitled "Circuit Board with High Density Electrical Tracers".
  • the present invention is directed to a tool that facilitates the impressing or the making of grooves or recesses on a molded circuit board.
  • the tool begins with a platen of steel approximately i inch thick. To that platen is bonded a layer of plastic approximately 15 mils thick. A laser beam is then used to trace the desired pattern on the plastic; in the process of using the laser beam the laser beam burns away the plastic down to the steel platen.
  • the assembly is then placed into an electrolytic plating tank. In the plating process, the plastic performs the function of a mask. Plated material builds up through the cut pattern in the plastic, level to the top of the plastic. A material such as nickel cobalt or chromium is deposited. Next, in an etching step, the plastic is stripped off.
  • the impressing tool is then complete, with the steel platen as a backing and with protrusions being composed of nickel cobalt or chromium.
  • This assembly is then placed in a press and is used for hot stamping.
  • the present invention is a method of making a tool for impressing, the method character-ized by the steps of: making a predetermined pattern in a first layer of a multi-layer assembly such that the pattern passes completely through the first layer to reveal a second layer; plating the assembly such that the pattern becomes filled with a plating material extending approximately the thickness of the first layer; and stripping off the first layer.
  • the present invention is a method of making a tool for impressing, the method comprising the steps of: applying a planar layer of plastic to a planar metal backing plate to form a multi-layer assembly; making a pattern in the plastic layer, down to the metal backing plate; plating the assembly such that the pattern becomes filled with a plating material bonded to the metal backing plate and extending approximately to be flush with the outer surface of the plastic layer; and stripping off the plastic layer.
  • the present invention is a method of making a tool for impressing, the method characterized by the steps of: applying a planar layer of a photosensitive material to a planar metal plate to form a two layer assembly: cutting a pattern into the photosensitive material, with photographic techniques, down to the metal plate; electroplating the assembly such that the pattern becomes filled with a metallic plating material bonded to the plate and extending to be approximately flush with the outer surface of the photosensitive layer; and stripping away the photosensitive layer.
  • the present invention is a method of making a tool for impressing, the method characterized by the steps of: applying a planar layer of a thermoplastic material to a planar metal backing plate to form a two layer assembly; cutting a pattern into the thermoplastic material with a laser, down to the metal backing plate; electroplating the assembly such that the pattern becomes filled with a metallic plating material bonded to the backing plate and extending to be approximately flush with the outer surface of the thermoplastic layer; and stripping away the thermoplastic layer.
  • the present invention is a tool for impressing characterized by: a backing plate of a first material; a second material, deposited in relief on the first material, in a predetermined pattern.
  • the present invention is a tool for impressing, having a backing plate of a first material and a second material, deposited in relief on the first material, in a predetermined pattern, the tool characterized by being made according to the following steps: cutting a predetermined pattern into a first layer of a multilayer assembly such that the pattern passes completely through the first layer to reveal a second layer; plating the assembly such that the pattern becomes filled with a plating material extending approximately the thickness of the first layer and bonded to the second layer; and stripping away the first layer whereby the tool is revealed with the second layer being the backing plate and the plating material being the second material, deposited in relief.
  • Figure 1 is a plan view of a not untypical molded circuit board
  • Figure 2 is a simplified cross-section of an impressing tool constructed according to the teachings of the present invention
  • Figure 3 is a simplified cross-section of the impressing tool of the present invention in an initial stage of construction
  • Figure 4 is similar to Figure 3 but shows the pattern etched during the construction of the tool
  • Figure 5 is similar to Figure 4 but additionally shows material deposited in the pattern
  • Figure 6 is a simplified cross-section of the impressing tool of the present invention in an initial stage of construction (second embodiment) ;
  • Figure 7 is an enlarged view of part of Figure 1 showing more detail
  • Figure 8 is a cross-sectional view of Figure 7, taken through the section lines 8-8 in Figure 7;
  • Figure 9 is a simplified cross-section of an impressing tool of the present invention in an initial stage of construction (third embodiment) ;
  • Figure 10 is similar to Figure 9 but shows a subsequent step in the process
  • Figure 11 is similar to Figure 10 but shows a subsequent step in the process
  • Figure 12 is similar to Figure 11 but shows a subsequent step in the process.
  • Figure 13 is a simplified isometric view, partly in section, of an impressing tool constructed according to the teachings of the present invention.
  • Figure 1 depicts a not untypical molded circuit board 20 constructed with a tool of the present invention.
  • Circuit board 20 is made of a thermoplastic material 21 (example Polyethersulfone) and comprises holes 22, recess pads 2S, and grooves 24 interconnecting pads 23 and holes 22.
  • the impressing tool of the present invention is used to make the recesses 23, the grooves 24 and the holes 22.
  • Figure 2 depicts impressing tool 26 of the present invention in simplified cross-section. Note that if tool 26 were to be used to make the pattern shown on circuit board 20 in Figure 1, then the plan view of tool 26 would match that of the pads 23, grooves 24, and holes 22 of Figure 1.
  • Tool 26 comprises a platen 27 made of hygrade steel that has projections 28 as shown in the cross-section of Figure 2. It should be noted that none of the Figures are to scale. In Figure 2, platen 27 is approximately ? inch thick although its thickness is not critical. The projections 28 are approximately 15 mils high and approximately 7 mils wide.
  • Figure 3 depicts tool 26 (in cross-section) in an initial stage of construction and is referred to as assembly 31.
  • Assembly 31 comprises platen 27, as previously described, and bonded thereto (by example using Eastman No. 910 adhesive) a plastic layer 32 approximately 15 mils thick.
  • the thickness of platen 27 is not critical.
  • the thickness of the plastic layer 32 is preferably the same dimension as the height of the protrusions 28 in Figure 2.
  • a laser beam is then used to trace the desired pattern on the plastic; in the process it burns away the plastic down to the steel of platen 27 as depicted by the recesses 25. This is depicted in more detail in Figure 4 to which attention is directed.
  • the next step in the construction of impressing tool 26 is to place the assembly 31 of Figure 4 into an electrolytic plating tank (containing, for example nickel- cobalt salt solution) .
  • the platen 27 is fastened to an electrical cathode.
  • the plastic layer 32 performs the function of a mask.
  • the material builds up through the cut pattern (i.e. fills the recesses 25) in the plastic layer 32 level to the top of the plastic 32.
  • the material deposited is nickel cobalt (approximately 98% nickel and 2% cobalt) . Chromium or certain other materials could also be used.
  • assembly 31 has the appearance as shown in Figure 5 wherein the platen 27 carries the plastic layer 32 as well as projections 28 as depicted in Figure 5.
  • etching step using, for example propapyhene 22GF20
  • plastic layer 32 is stripped off (i.e. removed) and impressing tool 26 is then finished and appears as that shown in Figure 2.
  • impressing tool 26 is placed in a press and is used for hot stamping. In the stamping process, both the die (i.e. tool 26) and the plastic 21 are heated. The plastic 21 is heated to approximately 350°F and the die or impressing tool 26 itself is heated to 350°F to 400°F temperature.
  • FIG. 6 depicts tool 26 (in cross-section) in an initial stage of construction and is referred to as assembly 31a.
  • Assembly 31a comprises platen 27a (identical to platen 27 of Figures 2 to 5) , and bonded thereto a photosensitive film 32a.
  • Film 32a can be up to approximately 0.060 inches thick, but is typically 0.015 inches to 0.020 inches thick.
  • Product No. Fanton 306 aqueous developable photoresist manufactured by Armstrong World Industries is the preferred film for layer 32a.
  • the desired pattern for board 20 ( Figure 1) in the form of a "mask" (not shown) is placed on top of assembly 31a (i.e. next to layer 32a) and exposed to light. This is the same type of process that is used to make the patterns in printed circuit boards (PCBs) .
  • PCBs printed circuit boards
  • the mask is removed and the film 32a is developed, thereby revealing the pattern of the mask.
  • the developing is continued until the exposed pattern has penetrated completely through layer 32a and platen 27a is just exposed.
  • impressing tool 26b The version of tool 26 with the "hole feature" will be referred to as impressing tool 26b.
  • Figure 7 depicts a portion of molded circuit board 20 (from Figure 1) showing a hole 22 in more detail.
  • Figure 8 is a cross-sectional view of Figure 7 through the section lines 8-8. From Figure 7 and 8 it can be seen that hole 22 is comprised of three main parts. Hole 22 is comprised of annular ring 22b on one surface of board 20, annular ring 22c on an opposite surface of board 20, and a cylindrical opening or hole 22a passing completely through board 20 from annular ring 22b to annular ring 22c.
  • Figure 9 depicts impressing tool 26b (in cross- section) in an initial stage of construction and is referred to as assembly 31b.
  • assembly 31b is at the same stage of construction as was assembly 31 in Figure 5. That is, assembly 31b of Figure 9 comprises steel platen 27b (approximately ? inch thick) carrying a plastic layer 32b as well as projections 28a and 28b. As in Figure 5, projections 28a and 28b are nickel cobalt deposited in a plating process.
  • projections 28a will serve to form the grooves 24 (in Figure 1) while projections 28b will serve to form the annular rings 22b and 22c of holes 22; projections 28a are the same size as projections 28 of Figures 2 and 5.
  • assembly 31b (of Figure 9) is identical to assembly 31 (of Figure 5) except for the inclusion of projection 28b.
  • Figure 10 shows assembly 31b with a second plastic layer 33b placed overtop of layer 32b as depicted.
  • the thickness of layer 33b will depend upon the thickness of circuit board 20 ( Figure 1) .
  • two dies are used simultaneously. One die is placed on one side of board 20 and a second die is placed on the opposite side.
  • any projection used to form hole 22a need go only half way through the thickness of board 20; a corresponding projection will be coming from the opposite side.
  • the combined thickness of layers 32b and 33b should be approximately one half of the thickness of circuit board 20 of Figure 1.
  • Figure 11 shows assembly 31b with layer 33b and a recess 25b cut away by a laser beam, similar to making recesses 25 in Figure 4.
  • the only difference in Figure 11 is that recess 25b is a cylindrical recess or hole, whereas recess 25 (of Figure 4) was a groove or a track.
  • Figure 12 depicts assembly 3lb with layer 33b after a plating process has occurred and nickel cobalt has been deposited to form projection 28c. This plating process is the same as the one used to form projections 28 in Figure 5.
  • the final step is to remove plastic layers 32b and 33b by an etching step. This leaves the final impressing tool 26b as shown by an isometric view in Figure 13, partially i ⁇ section.
  • projections 28a serve to form grooves 24 in circuit board 20 of Figure 1.
  • Projection 28b serves to form annular: ring 22b ( Figure 8), and projection 28c serves to form one half of hole 22a ( Figure 8) .
  • tool 26b can alternatively be formed by a .photographic process. In that case, plastic layers 32b and 33b would be replaced by photosensitive film as was explained in connection with Figure 6.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Le procédé décrit sert à fabriquer un outil d'impression servant à imprimer des cartes de circuits obtenues par moulage et similaires. Une plaque de fond métallique plane (27) est recouverte d'une couche relativement fine d'un matériau thermoplastique (32). Un faisceau laser est utilisé pour découper les contours de configuration d'un motif dans le matériau thermoplastique, jusqu'à atteindre la plaque de fond. On effectue ensuite une étape de placage, dans laquelle un métal (28) (par exemple du chrome ou du nickel) est déposé par placage sur la plaque de fond, selon la configuration du motif découpée dans la couche thermoplastique, laquelle sert en l'occurence de masque. La couche thermoplastique (32) est ôtée au moyen d'une étape d'attaque et l'outil est ainsi achevé. Dans un second mode de réalisation, une technique photographique est utilisée au lieu de l'opération laser.
PCT/CA1990/000112 1989-04-11 1990-04-06 Procede de fabrication d'un outil d'impression WO1990012481A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33642489A 1989-04-11 1989-04-11
US336,424 1989-04-11

Publications (1)

Publication Number Publication Date
WO1990012481A1 true WO1990012481A1 (fr) 1990-10-18

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Application Number Title Priority Date Filing Date
PCT/CA1990/000112 WO1990012481A1 (fr) 1989-04-11 1990-04-06 Procede de fabrication d'un outil d'impression

Country Status (2)

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AU (1) AU5409090A (fr)
WO (1) WO1990012481A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000062729A1 (fr) * 1999-04-15 2000-10-26 Adma S.R.L. Film fait d'une matière plastique percée à forme tridimensionnelle et matrice correspondante permettant de réaliser ce film
EP1320287A1 (fr) * 2000-01-04 2003-06-18 Elmicron AG Elément de connexion électrique et demi-produit
WO2003061356A1 (fr) * 2002-01-17 2003-07-24 Elmicron Ag Matrice d'estampage destinee a fabriquer des interconnexions a haute densite et procede de fabrication correspondant
CN102076186A (zh) * 2009-11-20 2011-05-25 深圳富泰宏精密工业有限公司 电子装置外壳及其制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1310651A (en) * 1971-04-28 1973-03-21 Marechal Ets Embossing cylinder process and product
EP0106977A2 (fr) * 1982-09-30 1984-05-02 International Business Machines Corporation Procédé et dispositif pour le traitement électrochimique d'un substrat
FR2553710A1 (fr) * 1983-10-19 1985-04-26 Hueck Fa E Procede pour former des structures superficielles sur une matrice, notamment pour la production de gravures estampees sur des panneaux comprimes en matiere plastique ou sur des stratifies de matiere plastique
US4769309A (en) * 1986-10-21 1988-09-06 Westinghouse Electric Corp. Printed circuit boards and method for manufacturing printed circuit boards

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1310651A (en) * 1971-04-28 1973-03-21 Marechal Ets Embossing cylinder process and product
EP0106977A2 (fr) * 1982-09-30 1984-05-02 International Business Machines Corporation Procédé et dispositif pour le traitement électrochimique d'un substrat
FR2553710A1 (fr) * 1983-10-19 1985-04-26 Hueck Fa E Procede pour former des structures superficielles sur une matrice, notamment pour la production de gravures estampees sur des panneaux comprimes en matiere plastique ou sur des stratifies de matiere plastique
US4769309A (en) * 1986-10-21 1988-09-06 Westinghouse Electric Corp. Printed circuit boards and method for manufacturing printed circuit boards

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
CHEMICAL ABSTRACTS, vol. 97, no. 24, December 1982 Columbus, Ohio, USA GRILIKHES ET. AL.: "Improvement in electroforming equipment for molding plastics" page 468; ref. no. 204909R & GAL'VANOPLAST. PROM-STI, Mater. Semin.1981, 103-5 see abstract *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000062729A1 (fr) * 1999-04-15 2000-10-26 Adma S.R.L. Film fait d'une matière plastique percée à forme tridimensionnelle et matrice correspondante permettant de réaliser ce film
EP1320287A1 (fr) * 2000-01-04 2003-06-18 Elmicron AG Elément de connexion électrique et demi-produit
WO2003061356A1 (fr) * 2002-01-17 2003-07-24 Elmicron Ag Matrice d'estampage destinee a fabriquer des interconnexions a haute densite et procede de fabrication correspondant
CN102076186A (zh) * 2009-11-20 2011-05-25 深圳富泰宏精密工业有限公司 电子装置外壳及其制作方法

Also Published As

Publication number Publication date
AU5409090A (en) 1990-11-05

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