Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
  • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
  • H01R12/70—Coupling devices
  • H01R12/71—Coupling devices for rigid printing circuits or like structures
  • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
  • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
  • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
  • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
  • H05K3/061—Etching masks
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/01—Dielectrics
  • H05K2201/0104—Properties and characteristics in general
  • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/03—Conductive materials
  • H05K2201/0332—Structure of the conductor
  • H05K2201/0335—Layered conductors or foils
  • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/05—Patterning and lithography; Masks; Details of resist
  • H05K2203/0562—Details of resist
  • H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/06—Lamination
  • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/24—Reinforcing the conductive pattern
  • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/36—Assembling printed circuits with other printed circuits
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/36—Assembling printed circuits with other printed circuits
  • H05K3/361—Assembling flexible printed circuits with other printed circuits

Definitions

• This invention relates to a film-like connector used when connecting between printed wiring boards or connecting a printed wiring board to an electrode in an electronic device, and a method for manufacturing the same.
• a thin plate-shaped connector in which conductive rubber thin plates and insulating rubber thin plates are alternately adhered to each other, and a large number of laminated thin plates are thinly cut in a direction intersecting the thin plate surface.
• Silicone Flexible insulating film made by mixing conductive particles of metal powder with an insulating elastic material such as rubber gauze and forming this into a sheet.
• the connector (3) has poor conductivity and low reliability due to irregularities in the conductive particles.
• the reliability of the connector is high because the connection with the mating electrode is made by physical crimping. Missing thing
• a predetermined striped strip-shaped connector circuit pattern is screened using insulating thermocompression suspension and conductive suspension in this order. It is formed by a printing method and cut into a desired size.
• FIGS. 11 and 12 are cross-sectional views of a 1 2 5 8 6 JP to serial mounting off I Lum shaped connector.
• reference numeral 13 denotes a flexible insulating substrate film
• reference numeral 14 denotes a thermocompression bonding formed by a screen printing method using an insulating thermocompression suspension.
• Layer 15 is a conductive vertical stripe layer also formed by using a conductive suspension.
• such a connector has poor adhesion and lacks reliability because the connection between the electrodes is only due to the application of the insulating thermocompression suspension. Is the pattern formed by the conductor base?
• the present invention provides a method of forming a laminate of a conductive metal thin film pattern layer and a conductive printing pattern layer having an etching resist function on an insulating base film. Forming a conductive circuit pattern portion, and forming a hot-melt adhesive layer having anisotropic conductivity on the surface on which the conductive circuit pattern portion is formed. To provide a flexible film-like connector in which a fine conductive circuit pattern having good electrical characteristics is formed with high precision, and to easily manufacture the film-like connector.
• FIG. 1 to 3 are cross-sectional views showing an embodiment of a film-like connector according to the present invention.
• FIG. 4 to FIG. 7 are cross-sectional views showing steps of manufacturing the film-like connector according to the present invention.
• FIG. S to FIG. 10 are cross-sectional views showing the state of use of the film-like connector according to the present invention.
• FIG. 11 and FIG. 12 are cross-sectional views showing a conventional connector.
• FIG. 1 is a sectional view showing one embodiment of a film-like connector according to the present invention.
• Reference numerals 5 and 5 denote a conductive circuit pattern portion made of a laminate of the metal thin film pattern layer 2 and the print pattern layer 3.
• Reference numeral 6 denotes a conductive powder dispersed in the adhesive layer 4.
• FIG. 2 is a sectional view showing another embodiment of the film connector according to the present invention.
• 1 is an insulating substrate film
• 2a and 2b are conductive metal thin film butter layers formed as two or more layers by different metal materials
• 3 is a conductive printed pattern layer
• 5 of the metal thin film pattern layer 2 a, 2 ⁇ 3 the print pattern layer 3 having the anisotropic conductive conductive powder 6 Ru are dispersed This is a conductive circuit pattern section.
• FIG. 3 is a sectional view showing still another embodiment of the film-like connector according to the present invention.
• 1 is an insulating substrate film
• 2 is a metal thin film pattern layer having conductivity
• 3 is a printing pattern layer having conductivity
• 4 is an anisotropic conductivity in which conductive powder 6 is dispersed.
• a hot-melt adhesive layer 5 is a conductive circuit pattern portion made of a laminate of the metal thin film pattern layer 2 and the printed pattern layer 3,, is a primer layer, and 8 is a back coat layer. is there.
• FIG. 4 to FIG. 4 are cross-sectional views showing the steps of manufacturing the film-like connector shown in FIG. 1 and FIG.
• a metal thin film layer 9 is formed on an insulating substrate film 1 using a conductive metal material 5 (see FIG. 4-a).
• Examples of the insulating substrate film 1-according to the present invention include, for example, a polyester film, a polyimide film, a polycarbonate film, and a polysulfone film. Films, polyether sanfoam films, polyvinylene films, single films or composite films, which are flexible and have excellent dimensional stability. In addition, a plastic film having electrical insulation properties can be used.
• the full I Lum thickness is suitably in the range of 1 2 im ⁇ 1 00 ⁇ M. This is because if it is thinner than 12 m, the dimensional stability will be reduced and it will be difficult to handle [9]. On the other hand, if it is thicker than 1 OO mis, it will cause problems in terms of flexibility. Because it is.
• the insulating substrate film 1 is subjected to a corona discharge treatment, a plasma treatment, a chemical treatment, or the like, or a gas flame in order to increase the adhesion strength to the conductive metal thin film layer 9 described later. It is preferred to use exposed or primed ones. Further, a back coat layer 8 for preventing curling may be used (see FIG. 3).
• Examples of the conductive metal thin film layer 9 according to the present invention include gold, silver, copper, aluminum, nickel, any single metal, an alloy of the above metals, and an oxidized metal. tin is formed using an oxide Lee emissions di c mull 5 which metal oxide Monoru any metallic material.
• the metal thin The layer thickness of the film layer 9 is preferably in the range of 100 to 10,000, preferably 500 to S, OOOA.
• Examples of the method of forming the metal thin film layer 9 include a vacuum deposition method, a sputtering method, a CVD method, and a chemical plating method.
• the metal thin film layer 9 may be formed as two or more layers of a different metal material appropriately selected from the metal materials (see FIG. 41b). This is to obtain excellent electrical properties and at the same time excellent quality stability.
• a different metal material appropriately selected from the metal materials (see FIG. 41b).
• low-resistance metallic materials such as gold, silver, copper, aluminum, and other metallic materials such as nickel, tin, indium oxide, and tin oxide that are highly stable to humidity, temperature, and air. It is better to combine them appropriately.
• 9a and 9b are such two metal thin film layers.
• a printing pattern having a predetermined shape is formed on the insulating base film 1 on which the metal thin film layer 9 is formed, using a printing ink having conductivity and an etching resist function. Layer 3 is formed (see FIG. 5).
• a binder having acid resistance and aluminum resistance is appropriately selected and used in accordance with an etching step described later.
• Examples of the method for forming the conductive printing pattern layer 3 include a screen printing method, a letterpress printing method, a lithographic printing method, and a flexographic printing method.
• the conductive circuit pattern portion 5 is formed by appropriately using a printing means. Therefore, the pattern can be formed into an arbitrary shape.
• the metal thin film layer 9 is etched by using the printing pattern layer 3 as an etching resist (see FIG. 6).
• an etching method for example, an insulative substrate in which the metal thin film layer 9 , the printing pattern layer 3, and the like are formed in an etching liquid capable of etching the metal thin film layer 9 .
• the metal thin film layer 9 other than the portion where the printing pattern layer 3 is formed is preferably removed by corrosion and dissolution.
• the metal thin film pattern layer 2 having a shape completely matching the printing pattern layer 3 is formed, and the printing pattern layer 3 and the metal thin film pattern layer 2 are formed.
• a conductive circuit pattern portion 5 made of a laminate with the above is formed.
• the etching step can be performed not only by the X-cut step but also by the dry process.
• a hot-melt adhesive layer 4 having anisotropic conductivity is formed on the surface on which the conductive circuit pattern portion 5 is formed (see FIG. 1).
• the hot-melt adhesive layer 4 may be formed on the entire surface of the surface on which the conductive circuit pattern portion 5 is formed, or at least only at a portion connected to the counter electrode. It may be formed.
• hot-melt adhesive layer 4 examples include a vinyl acetate-based, vinyl-based, acrylic-based, wax-based, polyolefin-based, polyamide-based, and synthetic rubber-based adhesive layer.
• Any single or mixed type of general hot melt adhesives can be used as conductive powders 6 such as iron, gold, silver, copper, nickel, tin oxide, oxides, etc. ⁇ What disperse
• distributed can be used. The ratio at which the conductive powder 6 is dispersed in the adhesive is determined by appropriately adjusting the heat-fusible adhesive layer 4 to an anisotropic conductivity.
• preferred Sig is from 0.5 to 1 range O parts by weight preferred arbitrariness.
• the ratio of the conductive powder 6 to be divided becomes less than 0.1 part by weight with respect to 100 parts by weight of the adhesive, the conductive powder 6 is sandwiched between the conductive circuit pattern part 5 and a counter electrode described later.
• the number of particles of the conductive powder 6 to be immersed is small.] It is difficult to obtain the effect as a connector, and if it exceeds 2 parts by weight, the heat-meltable adhesive layer 4 itself becomes conductive It also has the effect of being a connector.
• the thickness of the hot-melt adhesive layer 4 is usually preferably 1 to 100 ⁇ . This is because if it is less than 1 ⁇ , the adhesive strength will be reduced, and if it exceeds 100 m, there is a possibility of poor conduction.
• the hot-melt adhesive layer 4 As a method for forming the hot-melt adhesive layer 4, a coating method, a printing method, or the like was directly formed on the surface on which the conductive circuit pattern portion 5 was formed! ) Or formed on the carrier film 10-prepared in advance by a coating method, a printing method, and the like. There is a method of laminating the hot-melt adhesive layer 4 on the surface on which the conductive circuit pattern portion 5 is formed (see FIG. 7).
• the conductive circuit pattern section 5 is overlapped with the transparent electrode section 12 formed on the glass substrate 11 , for example, so as to face the corresponding position, and heat is applied (see FIGS. S, 9 and 9). cf. 1 O view). By doing so, the conductive circuit pattern section 5 and
• the conductive powder (6) in the hot-melt adhesive layer (4) is sandwiched between the transparent electrode portion (12) and the conductive powder (6).
• the conductive circuit pattern portion 5 and the transparent electrode portion 12 are connected to each other so that the effect as a connector can be obtained.
• FIGS. 2 and 3 The film connectors shown in FIGS. 2 and 3 can be used in the same manner as those shown in FIG. 1 (not shown).
• the film-like connector according to the present invention can be applied not only to the connection with the transparent electrode but also to, for example, a connection between electrodes of a printed wiring board. Needless to say, various
• the present invention relates to a method for manufacturing a film-shaped connector having the above-described configuration. That is, a conductive circuit pattern portion is formed by a printing process that is merely a metal thin film forming process. Therefore, a film-like connector having a predetermined conductive circuit pattern formed thereon can be extremely easily manufactured.
• the film-like connector obtained according to the present invention has a good resistance because the metal thin film pattern layer having a low resistance value is used as a constituent layer of the conductive circuit pattern portion. It has electrical characteristics.
• the conductive circuit pattern is — 1U—connects to the partner electrode, so perfect adhesion is obtained, conduction failure due to long-term use 0 No danger, reliable and reliable connection possible It is something.
• the film-like connector according to the present invention can be used for a computer and its peripheral devices, communication devices, broadcasting devices, control devices, measuring devices, telephone devices, various display devices, and other printed wiring boards. It can be used effectively for connection with electrodes in other electrical and electronic equipment.
• Three types of aluminum evaporated films with the following thicknesses are formed on a 25 ⁇ -thick polyester film that has been subjected to electrical discharge treatment as a conductive metal thin film layer.
• One type of copper vapor deposition film was formed.
• a screen printing method using a printing ink having the following composition was used as a printing pattern layer having conductivity respectively.
• Line width O.3 ⁇ , pitch O.6 ⁇ , dry printed film thickness 1 O ⁇ , 50 ⁇ square vertical stripe-shaped conductive circuit pattern is printed, dried, and dried in air.
• Active ingredient Carbon and roughite
• Viscosity 1 6 8,0 O O ⁇ 1 7,6 O O cps (Rotation viscometer mouth rotation 1 O rpm)
• the printing pan layer is used as an etching resist, in the case of an aluminum-deposited film, a weakly alkaline aqueous solution, and in the case of a copper-deposited film, a dilute sulfuric acid / ferric chloride mixed solution. Then, an etching process of the metal thin film layer is performed to form a metal thin film pattern layer having a shape conforming to the printing pattern layer, and a printing pattern is formed on the polyester film. A conductive circuit pattern portion composed of the layer and the metal thin film pattern layer was formed.
• a film is entirely formed by a screen printing method using a hot-melt adhesive having the following composition to cover the surface on which the conductive circuit pattern portion is formed. Shaped to be 5-6 thick
• Table 1 shows the conduction results when the film-like connector thus produced was actually bonded under the following crimping conditions.
• “0” also shows the conduction results under the same conditions of a film-shaped connector in which the conductive circuit pattern portion is made of a single conductive paste.
• the film-like connector according to the present invention has a conductive circuit pattern portion made of a single conductive paste. It's a room-shaped connector! ) It was found that the conduction resistance was low for several steps.
• Example 2
• a 2 OOA film on a copper vapor deposition film A metal film layer consisting of a copper layer and a nickel layer was formed by laminating a vapor-deposited film of nickel.
• Viscosity 40,0 O O ⁇ 45,0 ⁇ ⁇ cps (rotor rotation speed of rotational viscometer 2 O pm)
• the printing pattern layer is used as an etching resist, the metal thin film layer is etched with a ferric chloride solution, and the printing pattern matches the printing pattern.
• a metal thin film pattern layer having a shape as described above was formed, and a conductive circuit pattern portion composed of a printing pattern layer and a metal thin film pattern layer was formed on the polyester film.
• the conductive circuit pattern portion is formed by using a heat-adhesive film having a heat-meltable adhesive layer having the following composition on a carrier film.
• the entire surface was laminated by a laminating method so as to cover the surface on which was formed.
• Table 2 shows the conduction results of the sections. Table 2 also shows the conduction results under the same conditions for a film-shaped connector whose conductive circuit pattern consists of a single conductive paste.o i-
• the metal thin film pattern layer having a low resistance is used as one constituent layer of the conductive circuit pattern portion, good electrical characteristics can be provided.
• the conductive circuit pattern is connected to the counter electrode by the fusing action of the hot-melt adhesive, so perfect adhesion is obtained and there is a risk of poor conduction due to long-term use. It is reliable and can be connected reliably.
• the conductive circuit pattern portion can be formed by a single metal thin film forming step and a printing step, a film-like connector having a predetermined conductive circuit pattern portion is provided. Can be easily manufactured.

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• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Parts Printed On Printed Circuit Boards (AREA)
• Manufacturing Of Electrical Connectors (AREA)
• Non-Insulated Conductors (AREA)
• Manufacturing Of Printed Wiring (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=17177479

Family Applications (1)

Country Status (3)

Families Citing this family (16)

Citations (9)

Family Cites Families (7)

• 1983
  • 1983-12-28 JP JP58248396A patent/JPS60140685A/ja active Granted
• 1984
  • 1984-12-27 EP EP19850900497 patent/EP0170703A4/en not_active Withdrawn
  • 1984-12-27 WO PCT/JP1984/000626 patent/WO1985002946A1/ja not_active Ceased

Patent Citations (9)

Non-Patent Citations (1)

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