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USRE46606E1 - Stamping tool, casting mold and methods for structuring a surface of a work piece - Google Patents

Stamping tool, casting mold and methods for structuring a surface of a work piece Download PDF

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USRE46606E1
USRE46606E1 US12662683 US66268310A USRE46606E US RE46606 E1 USRE46606 E1 US RE46606E1 US 12662683 US12662683 US 12662683 US 66268310 A US66268310 A US 66268310A US RE46606 E USRE46606 E US RE46606E
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surface
stamping
chambers
hollow
layer
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US12662683
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Thomas Sawitowski
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Sharp Corp
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Sharp Corp
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22CFOUNDRY MOULDING
    • B22C9/00Moulds or cores; Moulding processes
    • B22C9/06Permanent moulds for shaped castings
    • B22C9/061Materials which make up the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22CFOUNDRY MOULDING
    • B22C9/00Moulds or cores; Moulding processes
    • B22C9/22Moulds for peculiarly-shaped castings

Abstract

A simple, cost-effective stamping or molding in the nanometer range is enabled using a stamping surface or molding face with a surface layer having hollow chambers that have been formed by anodic oxidation.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part of International Patent Application No. PCT/EP02/07240 filed Jul. 1, 2002, which designated the United States and of International Patent Application No. PCT/EP01/04650 Apr. 25, 2001 which designated the United States.

Notice: More than one reissue application has been filed for the reissue of U.S. Pat. No. 7,066,234. In particular, three applications for reissue of U.S. Pat. No. 7,066,234 have been filed. The current application is a continuation reissue of the application Ser. No. 12/213,990 filed on Jun. 26, 2008 (issued as U.S. Pat. No. Re. 43,694 on Oct. 2, 2012), which is an application for reissue of U.S. Pat. No. 7,066,234. The application Ser. No. 12/662,682 is a divisional reissue, filed on Apr. 28, 2010 and issued as U.S. Pat. No. Re. 44,830 on Apr. 8, 2014, of the application Ser. No. 12/213,990 filed on Jun. 26, 2008, which is an application for reissue of U.S. Pat. No. 7,066,234.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a stamping tool having a structured stamping surface, a casting mold, a method for producing a stamping tool or a casting mold having a structured stamping surface, and methods for structuring a surface of a work piece.

2. Description of Related Art

Stamping constitutes a non-cutting manufacturing method for producing a relief-like or structured surface on a work piece. A stamping tool with a profiled or structured stamping surface is used for this. The stamping surface is pressed with such a stamping force onto the surface to be structured of the work piece or rolled on it, so that the work piece becomes plastic and flows into depressions in the stamping tool or the stamping surface. Due to the considerable stamping forces employed, the stamping tool and the stamping surface are usually made of metal.

Further, molding is known. A casting mold with a structured molding face can be used for producing a cast work piece with a structured surface by casting.

In the present invention, nanometer range is understood to mean profiling or structuring with structural widths of less than 1000 nm, especially of less than 500 nm. The structural width designates the dimension by which individual structural elements, such as bumps, are repeated, that is, for example, the average distance of adjacent bumps from one another or of depressions from one another.

It is very expensive to manufacture a stamping tool with a very finely structured or profiled stamping surface. To create a so-called “moth eye structure”—evenly arranged, egg carton-like bumps—or fine grooves in the nanometer range, it is known from practice to use a lighting pattern with periodic intensity modulation for illuminating photosensitive material via two interfering laser beams. After the illuminated material develops, a periodic surface structure results, which is molded into other materials using various replication methods and finally into nickel, for example, by electroforming. This type of manufacturing is very expensive and is suited only for structuring even surfaces.

In the nanometer range, lithographic methods for structuring a stamping surface of a stamping tool can still only be used in a limited way. It should be noted here that the wavelength of the visible light alone is already 400 to 750 nm. In each case, lithographic methods are very costly.

German Patent DE 197 27 132 C2 discloses the manufacturing of a stamping tool by means of electrolytic machining. During electrolytic machining, a metallic stamping surface of the stamping tool is treated electrolytically, wherein, being an anode in a fast-flowing electrolyte, the metal of the stamping surface is located at a minimal distance opposite a cathode and is dissolved in surface terms. The metal or the stamping surface contains the structure determined by the form of the cathode, and the cathode thus forms a recipient vessel that is shaped electrochemically. German Patent DE 197 27 132 C2 also provides the use of a cylindrical rotation electrode, whose covering surface presents a negative form of the desired stamping structure. Here, too, there is considerable expense involved and structuring in the nanometre range is at least only partly possible.

The use of anodally oxidized surface layers made of aluminum or magnesium in casting molds to increase resistance is known from Swiss Patent CH 251 451. However, the forming of hollow chambers by oxidation for structuring a molded article in the nanometer range is not disclosed.

Forming hollow chambers by anodic oxidation of aluminum is described in published European Patent Application EP 0 931 859 A1, for example.

However, the related art does not provide a cost-effective solution to production of a work piece, like a stamped piece, or casting with a surface structured in the nanometer range.

Consequently, there is a need for a stamping tool, a casting mold, a method for manufacturing a stamping tool or a casting mold, a method for structuring a surface of a work piece and a method for using a surface layer provided with open hollow chambers, wherein structuring in the nanometer range is enabled in a simple and cost-effective manner.

SUMMARY OF INVENTION

A primary object of the present invention is to provide a stamping tool, a casting mold, a method for manufacturing a stamping tool or a casting mold, a method for structuring a surface of a work piece and a method for using a surface layer provided with open hollow chambers, wherein structuring in the nanometer range is enabled in a simple and cost-effective manner.

One aspect of the present invention is to use a porous oxide layer, and especially a surface layer, formed via anodic oxidation and provided with open hollow chambers, as stamping surface of a stamping tool. This leads to several advantages.

First, an oxide layer, especially the preferably provided aluminum oxide, is relatively hard. With respect to the often very high stamping forces, this is an advantage for being able to stamp work pieces of various materials and for achieving a long tool life of the stamping tool.

Second, model-free oxidation is very easy and cost-effective to carry out. In particular, producing hollow chambers is (quasi) independent of the form and configuration of the cathodes employed, so a model or negative form is not required, as in electrolytic machining.

Third, the provided model-free forming of open hollow chambers via anodic oxidation enables structures to be manufactured in the nanometer range very easily and cost-effectively. In particular, structural widths of 500 nm and less, even 100 nm and less are possible.

Fourth, depending on choice of procedural conditions the configuration—regular or irregular—and the surface density of the hollow chambers can be varied as required.

Fifth, likewise, by simply varying the procedural conditions—especially by variation of the voltage during anodizing—the form of the hollow chambers, and thus, the structure of the stamping surface, can be adjusted and varied.

Sixth, the anodally oxidized surface layer can be used directly, thus without further molding, as the stamping surface of a stamping tool.

A further aspect of the present invention is to use a porous oxide layer, and especially a surface layer with open hollow chambers, formed by anodic oxidation directly or model-free, thus independent of a cathode form, as molding face or inner face of a casting mold. This has a number of advantages.

First, an oxide layer, especially the preferably provided aluminum oxide, is relatively hard. With respect to the often very high forces utilized in casting or molding, this is an advantage for being able to produce work pieces of various materials and for achieving a long shelf life of the casting mold.

Second, the model-free oxidation is very easy and cost-effective to carry out. Producing hollow chambers is (quasi) independent on the form and configuration of the cathodes used, and a model or negative form is therefore not required.

Third, the model-free forming of open hollow chambers as provided via anodic oxidation enables structures to be manufactured in the nanometer range very easily and cost-effectively. In particular, structural widths of 500 nm and less, even 100 nm and less are possible.

Fourth, depending on choice of procedural conditions the Configuration—regular or irregular—and the surface density of the hollow chambers can be varied as required.

Fifth, likewise, by simply varying the procedural conditions—especially by variation of the voltage during anodizing—the form of the hollow chambers, and thus, the structure of the surface can be adjusted and varied.

Sixth, the anodally oxidized surface layer can be used directly, thus without further molding, as the surface of a casting mold.

Further advantages, properties, features and goals of the present invention will emerge from the following description of preferred embodiments with reference to the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a very schematic sectional elevation of a stamping tool and a work piece structured therewith according to a first embodiment; and

FIG. 2 is a very schematic sectional elevation of a proposed casting mold and a work piece structured therewith according to an second embodiment.

DETAILED DESCRIPTION OF THE INVENTION

In a highly simplified sectional elevation, FIG. 1 shows a proposed stamping tool 1 with a structured, i.e., profiled or relief-like, stamping surface 2. The stamping surface 2 is formed by a side of a surface layer 3 which is provided with open hollow chambers 4 produced by anodic oxidation or an originally flat surface.

In the illustrative example, the surface layer is applied to a support 5 of the stamping tool 1. For example, the surface layer 3 is applied to the support 5 by plasma coating. However, the surface layer 3 can also be formed directly by the support 5, and thus can be a surface area of the support 5.

It is understood that the surface layer 3 can also be deposited on the support 5 using other methods.

In the illustrative example, the surface layer 3 preferably is made of aluminum which is applied to the support 5, especially via plasma coating, and adheres well to the support 5, which is preferably made of metal, especially iron or steel.

The surface layer 3 is at least partially anodally oxidized in the illustrative example, to the depth of a covering layer 6, whereby the hollow chambers 4 are formed in the surface layer 3. The hollow chambers 4 are formed immediately and/or without any model or pattern, i.e., the arrangement, distribution, form and the like of the hollow chambers 4—as opposed to electrolytic machining—is, thus, at least essentially independent of the surface shape and the proximity of the cathode (not shown) used in oxidation. Moreover, according to the invention, the “valve effect,” namely the occurring, independent formation of hollow chambers 4 during oxidation or anodization of the surface layer 3—at least in particular in the so-called valve metals—is used. This immediate or undefined formation of the hollow chambers 4 does not preclude an additional (before or after) formation or structuring of the stamping surface 2 or the hollow chambers 4 by means of a negative form.

Depending on how completely or how deeply the surface layer 3 is oxidized, or whether the surface layer 3 is formed directly by the support 5, the surface layer 3 can correspond to the oxidized covering layer 6. In this case, for example, the intermediate layer 7, which is comprised of aluminum in the illustrative example, and which promotes very good adhesion between the covering layer 6 and the support 5, can be omitted.

For example, according to an alternative embodiment, the uncoated support 5 can be oxidized anodally on its surface forming the stamping surface 2 by formation of a porous oxide layer or hollow chambers 4. This is possible, for example, for a support 5 made of iron or steel, especially stainless steel. In this case, the surface layer 3 then corresponds to the covering layer 6, i.e., the oxidized layer.

Aluminum and iron or steel, especially stainless steel, have already been named as particularly preferred materials, used at least substantially for forming the anodally oxidized surface layer 3 or the covering layer 6. However, silicon and titanium as well as other valve metals, for example, can also be used.

In the illustrative example, the proportions in size are not presented true to scale. The stamping tool 1 or its stamping surface 2 preferably has a structural width S in the nanometer range, especially from 30 to 600 nm and preferably from 50 to 200 nm.

The hollow chambers 4 or their openings have an average diameter D of essentially 10 to 500 nm, preferably 15 to 200 nm and especially 20 to 100 nm.

In the illustrative example, the hollow chambers 4 are designed essentially lengthwise, wherein their depth T is preferably at least approximately 0.5 times the above-mentioned, average diameter D and especially approximately 1.0 to 10 times the diameter D.

Here, the hollow chambers 4 are designed at least substantially similarly in shape. In particular, the hollow chambers 4 are designed substantially cylindrically. However, the hollow chambers 4 can also present a form deviating therefrom, for example, they can be designed substantially conically.

In general, the hollow chambers 4 can also have a cross-section varying in its depth T, form and/or diameter. In addition to this, the hollow chambers 4 can be designed substantially conically as a rough structure, for example, and can be provided along their walls with many fine depressions (small hollow chambers) to form a fine structure in each case.

The hollow chambers 4 are preferably distributed at least substantially uniformly over the surface of the surface layer 3 or over the stamping surface 2. However, uneven distribution is also feasible.

The hollow chambers or their openings are preferably distributed over the stamping surface 2 with a surface density of 109 to 1011/cm2. In the illustrative example, the surface density is substantially constant over the stamping surface 2. However, the surface density can also vary partially on the stamping surface 2 as required.

The area of the openings of the hollow chambers 4 is, at the most, preferably 50% of the extension area of the stamping surface 2. A sufficiently high stability or carrying capacity of the stamping surface 2 or the surface layer 3/covering layer 6 is hereby achieved with respect to the high stresses arising during the stamping.

In general, the form, configuration, surface density and the like of the hollow chambers 4 can be controlled by corresponding choice of the procedural conditions during anodic oxidation. For example, with oxidation of aluminium under potentiostatic conditions—with at least substantially constant voltage—an at least substantially even cross-section of the hollow chambers 4 is achieved over their depth T, i.e., an at least substantially cylindrical form. Accordingly, the form of the hollow chambers 4 can be influenced by varying the voltage. For example, galvanostatic oxidation—i.e., at an at least substantially constant current—leads to a somewhat conical or hill-like form of the hollow chambers 4, so that a type of “moth eye structure” or the like can be formed in this way. The surface density of the hollow chambers 4, i.e., the number of hollow chambers 4 per surface unit of the stamping surface 2, depends inter alia on the voltage and the current during anodizing.

As required, the hollow chambers 4 can vary in their form, depth and/or surface density over the stamping surface 2, especially partially, and/or be designed only partly on the stamping surface 2.

If required, the stamping surface 2 can also be modified before and/or after oxidation—creation of the hollow chambers 4—for example, via a lithographic process, etching and/or other, preferably material-stripping methods, for example, to create a rough structure in the form of paths, ridges, areas with or without hollow chambers 4, large-surface bumps or depressions and the like on the stamping surface 2.

Chemical sizing, especially by partial etching of oxide material, can also be carried out to modify the stamping surface 2 or the hollow chambers 4. In this way, the surface ratio of the opening surfaces of the hollow chambers 4 to the extension area of the stamping surface 2 can be varied or increased. It is understood that other modifications of the stamping surface 2 or of the hollow chambers 4 can also be made, depending on reaction time and intensity.

A particular advantage of the proposed solution is that the stamping surface 2 can also be designed in a curved manner, for example, cylindrically, bulged, lenticular, or hemispherical. In particular, the stamping surface 2 can have practically any shape at all. Compared to the prior art, it is thus not necessary that the stamping surface 2 or the surface of the surface layer 3/covering layer 6 is at least substantially even.

The figure also shows a work piece 8, likewise in a highly simplified, not true-to-scale, sectional diagram, in the already stamped state, i.e., with a surface 9 already structured by the stamping tool 1. Stamping takes places especially by the stamping tool 1 being pressed with a corresponding stamping force onto the surface 9 of the work piece 8 to be structured, so that the material of the work piece 8 flows at least partially into the hollow chambers 4. Here, it is not necessary that the work piece 8, as illustrated diagrammatically in the figure, is designed in a monobloc manner. Instead, the work piece 8 can also present another type of surface layer or surface coating or the like, not illustrated here, which forms the surface 9 and is structured or designed in a relief-like manner by means of the stamping tool 1.

Instead of the stamp-like embossing, the stamping tool 1 can be unrolled with corresponding shaping/form of the stamping surface 2 and/or the surface 9 to be structured. By way of example, the stamping surface 2 and/or the surface 9 to be structured can be designed in a curved manner—for example, cylindrically—or in a bulged manner, to enable reciprocal unrolling for structuring the surface 9.

Both a die stamping process and also a rolling stamp process can be realized with the proposed solution.

Furthermore, the proposed solution can be used for embossing as well as closed-die coining or coining. A corresponding abutment for the work piece 8 or a corresponding countertool is not illustrated for clarification purposes.

The proposed stamping tool 1 allows very fine structuring of the work piece 8 or its surface 9. If needed, the work piece 8 or the surface 9 can also be profiled or structured repeatedly, first with a rough structured stamping tool—optionally manufactured also in customary fashion—and then with the finer structured stamping tool 1 proposed here. A lower stamping force is employed, especially during the second stamping procedure using the finer stamping tool 1 and/or, in an intermediate step, the surface 9 is hardened in order not to fully neutralize the rough structure produced at first stamping, but to achieve superposition from the rough structure and the fine structure of both stamping tools. Thus, it is possible, for example, to create on the surface 9 relatively large bumps of the order of 0.1 to 50 μm, each with several, relatively small protrusions, for example, of the order of 10 to 400 nm, on the surface 9 of the work piece 8.

The proposed solution very easily and cost-effectively enables very fine structuring of the surface 9. Accordingly, there is a very broad area of application. For example, such especially very fine structuring can be utilized in anti-reflex layers, for altering radiation emission of structured surfaces, in sensory analysis, in catalysis, in self-cleaning surfaces, in improving surface wettability and the like. In particular, the proposed solution also extends to the use of work pieces 8 with structured surfaces 9 that have been structured by use of the proposed stamping tool 1 for the purposes mentioned hereinabove.

In particular, the proposed solution is suited for stamping synthetic materials—for example, PMMA (polymethyl methacrylates), Teflon or the like, metals—for example, gold, silver, platinum, lead, indium, cadmium, zinc or the like, polymer coatings—for example, paints, dyes or the like, and inorganic coating systems etc.

Expressed in general terms, an essential aspect of the present invention according to the first embodiment is using a surface layer with hollow chambers formed by anodic oxidation as a bottom die or upper die, to enable surface structuring in the nanometer range.

Now, the second embodiment of the present invention is discussed with reference to FIG. 2.

In a highly simplified partial sectional elevation, FIG. 2 shows a proposed casting mold 11 with an at least partially structured, thus profiled or relief-like inner face or molding face 12. The face 12 is formed by a top or flat side of a surface layer 13 that is provided with open hollow chambers 14 produced by anodic oxidation.

In the illustrative example, the surface layer 13 is applied to a support 15 of the casting mold 11. For example, the surface layer 13 is applied to the support 15 by plasma coating. However, the surface layer 13 can also be formed directly by the support 15, and thus can be a surface area of the support 15.

It is understood that the surface layer 13 can also be deposited on the support 15 using other methods.

In the illustrative example, the surface layer 13 preferably comprises aluminum, which is applied to the support 15 especially via plasma coating, and adheres well to the support 15 that is preferably made of metal, especially iron or steel.

The surface layer 13 is at least partially anodally oxidized, in the illustrative example, to the depth of a covering layer 16, by means of which the hollow chambers 14 are formed in the surface layer 13 or covering layer 16. The hollow chambers 14 are formed directly or model-free, that is, the configuration, distribution, form and the like of the hollow chambers 14 is, compared to electrolytic machining, therefore at least substantially dependent on the surface shape and proximity of the cathodes (not illustrated here) used during oxidation. Rather, the ‘valve effect’ is made use of here, as per the invention, namely the automatic development of the hollow chambers 14 occurring during oxidation or anodizing of the surface layer 13, at least especially with so-called valve metals. Such direct and model-free production of the hollow chambers 14 does not exclude additional (prior or subsequent) forming or structuring of the face 12 or of the hollow chambers 14 by a negative form.

Depending on how completely or how deeply the surface layer 13 is oxidized, or whether the surface layer 13 is formed directly by the support 15, the surface layer 13 can correspond to the oxidized covering layer 16. In the illustrative example, in this case, for example, the intermediate layer 17, which is comprised of aluminum and which promotes very good adhesion between the covering layer 16 and the support 15, can be omitted.

For example, according to a design alternative the uncoated support 15 can be oxidized anodally on its surface forming the face 12 by formation of a porous oxide layer or hollow chambers 14. This is possible for example, for a support 15 made of iron or steel, especially stainless steel. In this case the surface layer 13 then corresponds to the covering layer 16, i.e., the oxidized layer.

Aluminum and iron or steel, especially stainless steel, have already been named as particularly preferred materials, used at least substantially for forming the anodally oxidized surface layer 13 or the covering layer 16. However, silicon and titanium as well as other valve metals for example, can also be used.

In the illustrative example, the proportions in size are not presented true to scale. The face 12 preferably has a structural width S in the nanometer range, especially of 130 to 600 nm and preferably of 50 to 200 nm. The hollow chambers 14 or their openings have an average diameter D of essentially 10 to 500 nm, preferably 15 to 200 nm and especially 20 to 100 nm.

In the illustrative example, the hollow chambers 14 are designed essentially lengthwise, wherein their depth T is preferably at least approximately 0.5 times the above-mentioned, average diameter D and especially approximately 1.0 to 10 times the diameter D.

The hollow chambers 14 are designed, here, at least substantially identically. In particular, the hollow chambers 14 are designed substantially cylindrically. However, the hollow chambers 14 can also present a form deviating therefrom, for example, they can be designed substantially conically.

In general the hollow chambers 14 can also have a cross-section varying in its depth T in form and/or diameter. In addition to this, the hollow chambers 14 can be designed substantially conically as a rough structure, for example, and can be provided with many fine depressions (small hollow chambers) along their walls to form a fine structure in each case.

The hollow chambers 14 are preferably distributed at least substantially uniformly over the surface of the surface layer 13 or over the face 12. However, uneven distribution is also feasible.

The hollow chambers or their openings are preferably distributed with a surface density of 109 to 1011/cm. In the illustrative example, the surface density is substantially constant over the face 12. However, the surface density can also vary selectively on the surface 12 as required.

The area of the openings of the hollow chambers 14 is at the most preferably 50% of the extension area of the face 12. A sufficiently high stability or carrying capacity of the face 12 or the surface layer 13/covering layer 16 is thereby achieved with respect to the high stresses arising partially from molding or casting.

In general, the form, configuration, surface density and the like of the hollow chambers 14 can be controlled by corresponding choice of the procedural conditions during anodic oxidation. For example, with oxidation of aluminium under potentiostatic conditions—i.e., at least at substantially constant voltage—an at least substantially uniform cross-section of the hollow chambers 14 is achieved over their depth T, i.e., an at least substantially cylindrical form. Accordingly, the form of the hollow chambers 14 can be influenced by varying the voltage. For example, galvanostatic oxidation, i.e., at an at least substantially constant current, leads to a somewhat conical or hill-like form of the hollow chambers 14, so that a type of “moth eye structure” or the like can be formed in this way. The area density of the hollow chambers 14, i.e., the number of hollow chambers 14 per area unit on the face 2, depends inter alia on the voltage and the current during anodizing.

As required, the hollow chambers 14 can vary in their form, depth and/or surface density over the face 2, especially partially, and/or be designed only partially on the face 12.

And, if required, the face 12 can also be modified before and/or after oxidation—thus, creation of the hollow chambers 14—for example, via a lithographic process, etching and/or other, preferably material-stripping methods, for example, to create a rough structure in the form of paths, ridges, areas with or without hollow chambers 14, large-surface bumps or depressions and the like on the face 12.

Mechanical processing and/or chemical sizing, especially by partial etching of oxide material, can also be carried out to modify the face 12 or the hollow chambers 14. In this way, the area ratio of the opening areas of the hollow chambers 14 to the extension area of the face 12 can be varied or increased. It is understood that other modifications of the face 12 or of the hollow chambers 14 can also be made, depending on reaction time and intensity.

A particular advantage of the proposed solution is that the face 12 can also be designed in practically any shape at all.

The figure also shows a molded article or work piece 18, likewise in a highly simplified, not true-to-scale, sectional diagram, in the already finished state, i.e., with a surface 19 already structured by the casting mold 11 after casting.

The proposed casting mold 11 allows very fine structuring of the work piece 18 or its surface 19. It is possible, for example, to create relatively large bumps of the order of 0.1 to 50 μm each with several, relatively small projections on the surface 19, for example, of the order of 10 to 400 nm, on the surface 19 of the work piece 18.

The proposed solution very easily and cost-effectively enables very fine structuring of the surface 19. Accordingly, there is a very broad area of application. For example, such especially very fine structuring can be utilized in anti-reflex layers, for altering radiation emission of structured surfaces, in sensory analysis, in catalysis, in self-cleaning surfaces, in improving surface wettability and the like.

Expressed in general terms, an essential aspect of the present invention is casting or molding a surface layer with hollow chambers formed directly or model-free by anodic oxidation, to enable surface structuring in the nanometer range.

The present invention is especially not limited to a casting mold 11 in the narrower sense. Rather, the surface layer 13 or covering layer 16 is to be understood as model for a general structuring of a surface, a tool, a work piece or the like in the nanometer range. In particular, the model may be molded in any way at all. In particular, no reshaping is required when molding. For example, with the work piece 18 to be manufactured having a structured surface 19, this can be a cast article, wherein the surface 19 is structured by casting or decanting or any molding of the mold 11.

In general, the present invention enables a simple, cost-effective stamping or molding in the nanometer range by a surface layer with hollow chambers formed by anodic oxidation being used as matrix or as casting mold.

TECHNICAL APPLICABILITY

The proposed solution very easily and cost-effectively enables very fine structuring of the surface. Accordingly, there is a very broad area of application. For example, such especially very fine structuring can be utilized in anti-reflex layers, for altering radiation emission of structured surfaces, in sensory analysis, in catalysis, in self-cleaning surfaces, in improving surface wettability and the like. In particular, the proposed solution also extends to the use of work pieces with structured surfaces that have been structured by use of the proposed stamping tool for the purposes mentioned hereinabove. Further, the proposed solution can be used for casting with practically any material, since aluminum oxide especially is highly resistant mechanically, thermally and/or chemically.

Claims (18)

What is claimed is:
1. Method for producing a stamping tool with a structured stamping surface, comprising the steps of:
oxidizing a surface or covering layer of the stamping tool for forming the stamping surface at least partially anodally and forming open hollow chambers that are at least essentially uniformly shaped and at least essentially evenly distributed over the surface or surface area of the stamping surface without the use of a model.
2. Method according to claim 1, wherein the surface or covering layer is oxidized potentiostatically.
3. Method according to claim 1, wherein the surface layer or covering layer is oxidized with varying voltage.
4. Method according to claim 3, wherein the surface or covering layer is oxidized galvanostatically.
5. Method according to claim 1, wherein the surface or covering layer that is oxidized is formed of a material selected from the group consisting of aluminum, silicon, iron, steel and titanium.
6. Method according to claim 1, comprising the additional step of modifying the stamping surface at least one of before and after said oxidizing step for producing a rough structure.
7. Method for structuring a surface of a work piece in a nanometer range by means of a stamping tool with a structured stamping surface, comprising at least one of pressing and rolling a stamping surface, formed of an anodally oxidized surface or covering layer with open hollow chambers which have diameters in a nanometer range that have been created model-free by anodic oxidation, onto the surface to be structured.
8. Method according to claim 7, wherein the surface is first roughly structured in a first step by means of a first stamping tool and then is finely structured by means of a second stamping tool in a second step.
9. Method according to claim 8, wherein the surface is finely structured by means of said second stamping tool in said second step with a stamping force that is reduced relative to that applied with said first stamping tool.
10. Method according to claim 8, wherein the surface is finely structured by means of said second stamping tool in said second step after hardening of the surface structured by said first step.
11. Method for at least partially structuring a surface of a cast work piece, comprising the steps of: casting the work piece using a casting mold with a structured molding face having an anodally oxidized surface or covering layer with open hollow chambers created model-free by anodic oxidation.
12. Method according to claim 11, wherein the surface or covering layer is formed at least substantially of a material selected from the group consisting of aluminum oxide, silicon oxide, iron oxide, oxidized steel, and titanium oxide.
13. Method for producing an anti-reflection surface having a moth-eye structure on a workpiece, comprising:
pressing or rolling a first tool onto a surface of the workpiece to form a rough structure on the surface of the workpiece, and then
pressing or rolling a second tool onto the surface of the workpiece to form the moth-eye structure having a plurality of fine protrusions.
14. The method of claim 13, wherein the rough structure has projections of an order ranging from 0.1 to 50 micrometers.
15. The method of claim 13, wherein the diameters of the plurality of fine protrusions is ranging from 10-500 nm.
16. The method of claim 15, wherein the diameters of the plurality of fine protrusions is ranging from 15-200 nm.
17. The method of claim 16, wherein the diameters of the plurality of fine protrusions is ranging from 20-100 nm.
18. The method of claim 13, wherein
the first tool is pressed or rolled onto the surface of the workpiece with a first stamping force, and
the second tool is pressed or rolled onto the surface of the workpiece with a second stamping force which is reduced relative to the first stamping force.
US12662683 2000-04-28 2010-04-28 Stamping tool, casting mold and methods for structuring a surface of a work piece Active USRE46606E1 (en)

Priority Applications (11)

Application Number Priority Date Filing Date Title
DE10020877 2000-04-28
DE2000120877 DE10020877C1 (en) 2000-04-28 2000-04-28 Stamping tool has a structured stamping surface with an anodically oxidized surface layer or a covering layer having open hollow chambers produced by anodic oxidation
PCT/EP2001/004650 WO2001083198A1 (en) 2000-04-28 2001-04-25 Stamping tool, method for structuring a surface of a workpiece and use of an anodized surface layer
DE10131513 2001-07-02
DE10131513 2001-07-02
DE10154756 2001-11-09
DE2001154756 DE10154756C1 (en) 2001-07-02 2001-11-09 Use of a surface layer or covering layer provided with open hollow chambers by anodic oxidation for structuring a surface of a cast part and/or workpiece
PCT/EP2002/007240 WO2003004253A1 (en) 2001-07-02 2002-07-01 Casting mould and usage of an anodically oxidized surface layer
US10281376 US7066234B2 (en) 2001-04-25 2002-10-28 Stamping tool, casting mold and methods for structuring a surface of a work piece
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Citations (159)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2331743A (en) 1942-05-23 1943-10-12 Marathon Paper Mills Co Roll spindle
US2849192A (en) 1955-10-20 1958-08-26 Us Shaft Company Core engaging shaft
DE1108536B (en) 1951-06-25 1961-06-08 Hard Aluminium Surfaces Ltd A method for forming ultra hard surfaces on aluminum and its alloys by anodic oxidation
US3386130A (en) 1966-03-09 1968-06-04 Dornbusch & Co Fa Embossing roll, in particular for the treatment of webs of thermoplastic material
US4085792A (en) * 1975-10-02 1978-04-25 General Battery Corporation Method of casting lead alloy automotive battery parts
JPS53103754A (en) 1977-02-18 1978-09-09 Minnesota Mining & Mfg Fine particle coating to improve reflection and percolation
US4114983A (en) 1977-02-18 1978-09-19 Minnesota Mining And Manufacturing Company Polymeric optical element having antireflecting surface
US4148204A (en) * 1971-05-07 1979-04-10 Siemens Aktiengesellschaft Process of mechanically shaping metal articles
US4240257A (en) 1973-02-22 1980-12-23 The Singer Company Heat pipe turbo generator
US4310586A (en) 1978-01-17 1982-01-12 Alcan Research And Development Limited Aluminium articles having anodic oxide coatings and methods of coloring them by means of optical interference effects
US4547275A (en) 1984-02-03 1985-10-15 Showa Aluminum Kabushiki Kaisha Process for treating surface of aluminum foil for use as electrode of electrolytic capacitors
JPS6144607A (en) 1984-08-10 1986-03-04 Toyoda Gosei Co Ltd Embossed product and manufacture thereof
US4581913A (en) * 1983-07-27 1986-04-15 Luster Finish, Inc. Method for improving the release and finish characteristics of metal stamping dies
US4737447A (en) 1983-11-11 1988-04-12 Pioneer Electronic Corporation Process for producing micro Fresnel lens
JPS63303714A (en) 1987-06-05 1988-12-12 Fujikura Ltd Aluminum mold and injection molding
US4863880A (en) * 1987-03-30 1989-09-05 Agency Of Industrial Science & Technology, Ministry Of International Trade & Industry InSb device manufacturing by anodic oxidation
JPH02254192A (en) 1989-03-27 1990-10-12 Norinaga Baba Production of porous material
JPH03203773A (en) 1989-12-29 1991-09-05 Canon Inc Liquid crystal display device
EP0481753A2 (en) 1990-10-19 1992-04-22 Canon Kabushiki Kaisha Molding roll, method for manufacturing it, and apparatus for forming substrate sheet for optical recording medium
JPH04265729A (en) 1991-02-21 1992-09-21 Tsutsunaka Plast Ind Co Ltd Thermoforming method of polycarbonate resin sheet
US5150231A (en) 1989-12-29 1992-09-22 Canon Kabushiki Kaisha Impact resistant ferroelectric liquid crystal apparatus
JPH0516228A (en) 1991-04-15 1993-01-26 Dainippon Printing Co Ltd Gloss-mat type shaped film
JPH0516230A (en) 1990-10-19 1993-01-26 Canon Inc Forming roll, manufacture thereof and apparatus for manufacturing substrate sheet for optical recording medium
US5205210A (en) 1990-08-14 1993-04-27 Walter Mathis Method and apparatus for dry printing using a hot embossing foil
US5249949A (en) 1989-09-11 1993-10-05 Eastman Kodak Company Apparatus for texturizing toner image bearing receiving sheets
CN1078049A (en) 1992-04-30 1993-11-03 三星电管株式会社 Optical phase-retardation compensating film
JPH05323371A (en) 1992-05-20 1993-12-07 Sharp Corp Reflection type liquid crystal display device and its production
JPH0632675A (en) 1992-07-15 1994-02-08 N E Chemcat Corp Production of porous metal oxide
US5318091A (en) * 1991-11-22 1994-06-07 Borgo-Nova Spa Die coating
JPH075693A (en) 1993-03-16 1995-01-10 Philips Electron Nv Method of providing patterned relief of hardened photoresist on flat substrate surface and device therefor
JPH07104272A (en) 1993-09-29 1995-04-21 Okuno Chem Ind Co Ltd Reflection type liquid crystal display device
US5415219A (en) * 1992-07-21 1995-05-16 Hagen Batterie Ag Grid casting mold for the casting of lead grids for accumulators and methods for its manufacture
JPH07306408A (en) 1994-05-11 1995-11-21 Casio Comput Co Ltd The liquid crystal display device
JPH0825026A (en) 1994-07-11 1996-01-30 Nibetsukusu Kk Flow regulating material for aluminum casting and flow regulator using the same
JPH0885117A (en) 1994-09-16 1996-04-02 Ricoh Co Ltd Molding die and production thereof
EP0732426A1 (en) 1995-03-16 1996-09-18 Alusuisse-Lonza Services AG Process for continuously anodising aluminium strips or wires
JPH08321381A (en) 1995-05-26 1996-12-03 Chisso Corp Organic electroluminescent element
US5597984A (en) 1993-02-08 1997-01-28 Sowal Technologies International Inc. Capacitance weighing mat with substantially rigid separators
JPH0973072A (en) 1995-03-01 1997-03-18 Canon Inc Display device
DE19536194A1 (en) 1995-09-28 1997-04-03 Glasbau Gmbh As Aquarium or paludarium with fish etc and plants
JPH09155972A (en) 1995-12-12 1997-06-17 Ykk Corp Water repellant film and its manufacture
US5656147A (en) * 1994-07-12 1997-08-12 Sharp Kabushiki Kaisha Method for fabricating a switching device by anodization
EP0792951A1 (en) 1994-11-16 1997-09-03 Kabushiki Kaisha Kobe Seiko Sho Vacuum chamber made of aluminum or its alloy, and surface treatment and material for the vacuum chamber
US5693210A (en) 1995-08-31 1997-12-02 President Of Tohoku University Method of manufacturing porous alumina tube
US5694247A (en) 1994-05-02 1997-12-02 U.S. Philips Corporation Optical transmissive component with anti-reflection gratings
JPH09322674A (en) 1996-05-31 1997-12-16 Matsushita Electric Ind Co Ltd Film for lining interior of water tank, water tank using the same and coating material composition for coating inner surface of water tank containing antimicrobial agent therein and water tank using the same
JPH1016008A (en) 1996-07-02 1998-01-20 Sharp Corp Mold for molding plastics and injection molding device using this mold
JPH1046382A (en) 1996-07-26 1998-02-17 Mitsubishi Materials Corp Production of fine metallic fiber and conductive paint using the fiber
DE29722268U1 (en) 1997-12-17 1998-03-05 Unicor Rohrsysteme Gmbh Mold jaws of aluminum or aluminum alloy
JPH1068816A (en) 1996-08-29 1998-03-10 Sharp Corp Phase difference plate and circularly polarizing plate
JPH10121292A (en) 1996-08-26 1998-05-12 Nippon Telegr & Teleph Corp <Ntt> Formation of porous anodized alumina film
JPH10186136A (en) 1996-11-11 1998-07-14 Dowa Mining Co Ltd Optical filter
DE19701568C1 (en) 1997-01-17 1998-07-23 Karlsruhe Forschzent Structured layer formation for micro-engineered functional system
WO1998039673A1 (en) 1997-03-04 1998-09-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Anti-reflection coating and method for producing same
US5808707A (en) 1995-03-01 1998-09-15 Canon Kabushiki Kaisha Display apparatus
US5811137A (en) 1995-02-17 1998-09-22 Casa Herrera, Inc. Dough Sheeter having independant internally-driven self-powered rollers
WO1998048996A1 (en) 1997-04-30 1998-11-05 Guial Method for making a calender roll and thermoplastic sheets or films obtained by calendering with such a roll
DE19727132A1 (en) 1997-06-26 1999-01-07 Hueck Engraving Gmbh Method and device for producing an embossed structure on a surface of the molding of pressed laminates serving stamping tool
JPH11200090A (en) 1997-11-12 1999-07-27 Canon Inc Nanostructural body and its production
EP0931859A1 (en) 1996-08-26 1999-07-28 Nippon Telegraph And Telephone Corporation Method of manufacturing porous anodized alumina film
JP2000052421A (en) 1998-07-31 2000-02-22 Three M Innovative Properties Co Embossed optical polymer film and its manufacture
JP2000071290A (en) 1998-08-28 2000-03-07 Teijin Ltd Manufacture of antireflection article
EP1016621A2 (en) 1998-12-25 2000-07-05 Canon Kabushiki Kaisha Method for producing narrow pores and structure having the narrow pores, and narrow pores and structure produced by the method
US6090523A (en) * 1997-04-17 2000-07-18 Nec Corporation Multi-resin material for an antireflection film to be formed on a workpiece disposed on a semiconductor substrate
US6089848A (en) 1994-03-08 2000-07-18 Syfal S.R.L. Apparatus for producing rollers with elastic silicone-based material layers
JP2000199809A (en) 1998-11-06 2000-07-18 Kimoto & Co Ltd Forward scattering film
US6111699A (en) 1997-09-25 2000-08-29 Dai Nippon Printing Co. Ltd. Light diffusing film and its manufacture, a polarizing plate with a light diffusing layer, and a liquid crystal display apparatus
US6175442B1 (en) 1999-05-25 2001-01-16 Intel Corporation Anti-reflection layer in spatial light modulators
JP2001066626A (en) 1999-08-27 2001-03-16 Optrex Corp Liquid crystal display device
JP2001074919A (en) 1999-09-03 2001-03-23 Fuji Photo Film Co Ltd Light diffusing body and its production
EP1089114A2 (en) 1999-09-21 2001-04-04 Daicel Chemical Industries, Ltd. Anisothropic light-scattering film
US6266112B1 (en) 1995-06-13 2001-07-24 Nec Corporation Reflective liquid crystal display
JP2001264520A (en) 2000-03-16 2001-09-26 Dainippon Printing Co Ltd Reflection preventing film, polarizing element, display device and method for manufacturing reflection preventing film
DE10020877C1 (en) 2000-04-28 2001-10-25 Alcove Surfaces Gmbh Stamping tool has a structured stamping surface with an anodically oxidized surface layer or a covering layer having open hollow chambers produced by anodic oxidation
US6309580B1 (en) 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
US20010035929A1 (en) 2000-03-28 2001-11-01 Kazuhiro Nakamura Anti-glare and anti-reflection film, polarizing plate, and image display device
US20010051442A1 (en) 1998-03-03 2001-12-13 Dina Katsir Method for producing high surface area foil electrodes
JP2002031721A (en) 2001-05-25 2002-01-31 Sumitomo Chem Co Ltd Composite polarizing plate
US6348960B1 (en) 1998-11-06 2002-02-19 Kimotot Co., Ltd. Front scattering film
US6354358B1 (en) * 1999-11-26 2002-03-12 Nomura Plating Co., Ltd. Continuous casting mold with tungsten alloy plating and method of producing the same
JP2002079535A (en) 2000-06-28 2002-03-19 Ricoh Co Ltd Cylindrical molding mold, its production method, and method for producing cylindrical film
JP2002079523A (en) 2000-09-04 2002-03-19 Seiko Epson Corp Method for producing spectacle lens
JP2002107714A (en) 2000-10-02 2002-04-10 Sharp Corp Liquid crystal display device
US20020044351A1 (en) 2000-08-15 2002-04-18 Reflexite Corporation Light polarizer
JP2002169025A (en) 2000-07-21 2002-06-14 Sumitomo Chem Co Ltd Anisotropic scattering film and liquid crystal display device using the same
JP2002182199A (en) 2000-12-11 2002-06-26 Casio Comput Co Ltd Back light device
US20020089620A1 (en) 2000-07-21 2002-07-11 Kyoko Yamamoto Anisotropic scattering film and liquid crystal display
EP0805044B1 (en) 1996-04-30 2002-10-23 Automated Packaging Systems, Inc. Thermal imprinter and method
JP2002318383A (en) 2001-04-20 2002-10-31 Kyocera Corp Reflective liquid crystal display device
US6476409B2 (en) 1999-04-27 2002-11-05 Canon Kabushiki Kaisha Nano-structures, process for preparing nano-structures and devices
JP2003004904A (en) 2001-06-25 2003-01-08 Dainippon Printing Co Ltd Antireflection film having antidazzle layer with high refractive index and low reflective display device
JP2003043203A (en) 2001-08-01 2003-02-13 Hitachi Maxell Ltd Antireflection film, method for manufacturing the same, stamper for manufacture of antireflection film, method for manufacturing the stamper, casting mold for manufacture of stamper and method for manufacturing the casting mold
US20030067574A1 (en) 2001-10-03 2003-04-10 Nitto Denko Corporation Laminated quarter-wave plate or circularly polarizing plate, liquid-crystal display device using the same and method for producing the same
JP2003149413A (en) 2001-08-28 2003-05-21 Fuji Photo Film Co Ltd Light diffusing film, antidazzle film, polarizing plate and liquid crystal display device
US6568931B2 (en) 1996-06-26 2003-05-27 Idemitsu Petrochemical Co., Ltd. Emboss pattern processing apparatus
WO2003073410A1 (en) 2002-02-27 2003-09-04 Innovative Solutions & Support, Inc. Improved low reflectivity flat panel display
JP2003248122A (en) 2001-12-18 2003-09-05 Fuji Photo Film Co Ltd Elliptical polarizing plate and liquid crystal display using the same
JP2003302532A (en) 2002-04-12 2003-10-24 Mitsubishi Chemicals Corp Polarizing plate and method for manufacturing the same
US20030205475A1 (en) 2001-04-25 2003-11-06 Alcove Surfaces Gmbh Stamping tool, casting mold and methods for structuring a surface of a work piece
JP2003319733A (en) 2002-05-07 2003-11-11 Konica Minolta Holdings Inc Aquarium for appreciation
CN1455270A (en) 2002-04-30 2003-11-12 欧姆龙株式会社 Reflection board and method for making same, and reflection type liquid crystal displaying device
US6695987B2 (en) 2000-05-12 2004-02-24 Pioneer Corporation Production method for optical disc
US20040091642A1 (en) 2002-11-01 2004-05-13 Takashi Murakami Method for forming anti-glare layer and anti-glare film, and ink-jet apparatus for forming anti-glare layer
JP2004205990A (en) 2002-12-26 2004-07-22 Dainippon Printing Co Ltd Manufacturing method of fine rugged pattern having antireflection performance and antireflection article
JP2004223836A (en) 2003-01-22 2004-08-12 Fuji Photo Film Co Ltd Method and apparatus for manufacturing pattern roll and method for making optical sheet
JP2004223724A (en) 2003-01-20 2004-08-12 Dainippon Printing Co Ltd Embossing roll made of glass
US20040159977A1 (en) 2003-02-18 2004-08-19 Perfetto Robert S. Method and apparatus for applying a decorative pattern to a surface
JP2004272059A (en) 2003-03-11 2004-09-30 Ge Toshiba Silicones Co Ltd Liquid crystal display and portable electronic apparatus equipped with same
US20040188874A1 (en) 2003-03-26 2004-09-30 Fuji Photo Film Co., Ltd. Method and equipment for producing antiglare and antireflection film and antiglare and antireflection film
EP1473594A2 (en) 2003-04-29 2004-11-03 Hewlett-Packard Development Company, L.P. Apparatus for embossing a flexible substrate with a pattern carried by an optically transparent compliant media
US20040219249A1 (en) 2003-05-02 2004-11-04 Yong-Chen Chung Uniform pressing apparatus
US6837096B2 (en) 2003-01-23 2005-01-04 Midwest Research Institute, Inc. Low-power gas chromatograph
CN1591047A (en) 2003-09-01 2005-03-09 欧姆龙株式会社 Method for mfg optical element having resin film with micro concave-convex pattern
US6874262B2 (en) 1999-06-01 2005-04-05 Nikon Corporation Method for manufacturing master substrate used for manufacturing grooved molding substrate, method for manufacturing stamper for manufacturing grooved molding substrate, method for manufacturing grooved molding substrate, grooved molding substrate, memory medium, memory device, and computer
US20050074579A1 (en) 2002-02-20 2005-04-07 Dai Nippon Printing Co., Ltd. Antireflection structure
US6888676B2 (en) 2003-03-20 2005-05-03 Nokia Corporation Method of making polarizer and antireflection microstructure for mobile phone display and window
US20050093210A1 (en) 2003-10-29 2005-05-05 Matsushita Electric Industrial Co., Ltd. Method for producing optical element having antireflection structure, and optical element having antireflection structure produced by the method
US20050104253A1 (en) 2003-11-11 2005-05-19 Ryuichi Katsumoto Production method and production apparatus of pattern-indented sheet
JP2005132660A (en) 2003-10-29 2005-05-26 Matsushita Electric Ind Co Ltd Manufacturing method of optical element having non-reflective structure and optical element having non-reflective structure manufactured through the method
WO2005050627A2 (en) 2003-11-14 2005-06-02 Aprilis, Inc. Holographic data storage media with structure surfaces
JP2005144698A (en) 2003-11-11 2005-06-09 Fuji Photo Film Co Ltd Method and apparatus for manufacturing embossed sheet
JP2005156695A (en) 2003-11-21 2005-06-16 Kanagawa Acad Of Sci & Technol Anti-reflection coating and method for manufacturing the same, and stamper for preparing anti-reflection coating and method for manufacturing the same
JP2005161531A (en) 2003-11-28 2005-06-23 Fuji Photo Film Co Ltd Method and apparatus for manufacturing embossed sheet
JP2005181740A (en) 2003-12-19 2005-07-07 Matsushita Electric Ind Co Ltd Reflection prevention structure
US20050150643A1 (en) 2002-06-24 2005-07-14 Daniel Chartouni Heat exchanger
JP2005234554A (en) 2004-01-23 2005-09-02 Fuji Photo Film Co Ltd Antireflection film, polarizing plate and image display apparatus
US20050195486A1 (en) 2004-03-03 2005-09-08 Hiroshi Sasaki Anti-reflecting membrane, and display apparatus, optical storage medium and solar energy converting device having the same, and production method of the membrane
JP2005249982A (en) 2004-03-03 2005-09-15 Hitachi Ltd Antireflection film, image display device having the same, optical recording medium, solar power generation module, and method for forming antireflection film
JP2005338256A (en) 2004-05-25 2005-12-08 Hitachi Displays Ltd Liquid crystal display
JP2006039450A (en) 2004-07-30 2006-02-09 Seiko Epson Corp Method for forming antireflection film, apparatus for forming antireflection film, antireflection film and optical component
JP2006062240A (en) 2004-08-27 2006-03-09 Fuji Photo Film Co Ltd Manufacturing method of non-glare reflection-preventive film and non-glare reflection-preventive film
JP2006098623A (en) 2004-09-29 2006-04-13 Hitachi Displays Ltd Liquid crystal display device
WO2006043244A1 (en) 2004-10-22 2006-04-27 Koninklijke Philips Electronics N.V. Roller micro-contact printer with pressure control
WO2006059586A1 (en) 2004-11-30 2006-06-08 Shin-Etsu Handotai Co., Ltd. Method for manufacturing direct bond wafer, and direct bond wafer
WO2006059686A1 (en) 2004-12-03 2006-06-08 Sharp Kabushiki Kaisha Reflection preventing material, optical element, display device, stamper manufacturing method, and reflection preventing material manufacturing method using the stamper
JP2006208726A (en) 2005-01-27 2006-08-10 Dainippon Printing Co Ltd Optical functional sheet
US20060256263A1 (en) 2003-05-22 2006-11-16 Koninklijke Philips Electronics N.V. Liquid crystal display device having form birefringent compensator
US20070014886A1 (en) 2005-02-02 2007-01-18 Michael Hennessey Method and apparatus for forming microstructures on polymeric substrates
US20070018345A1 (en) 2005-07-25 2007-01-25 Bing-Huan Lee Nanoimprint lithograph for fabricating nanoadhesive
JP2007073696A (en) 2005-09-06 2007-03-22 Hyogo Prefecture Pattern forming method, pattern forming apparatus and pattern-formed film
JP2007086283A (en) 2005-09-21 2007-04-05 Kanagawa Acad Of Sci & Technol Antireflection film and method for manufacturing same, and stamper for preparing antireflection film and method for manufacturing same
WO2007040023A1 (en) 2005-10-03 2007-04-12 Konica Minolta Opto, Inc. Process for producing film with rugged pattern and production apparatus therefor
JP2007098742A (en) 2005-10-04 2007-04-19 Konica Minolta Opto Inc Manufacturing method of uneven pattern film
EP1785748A1 (en) 2005-11-10 2007-05-16 C.R.F. Societa' Consortile per Azioni Anti-reflection nano-metric structure based on anodised porous alumina and method for production thereof
JP2007156145A (en) 2005-12-06 2007-06-21 Konica Minolta Opto Inc Antireflection film, method of manufacturing same and image display device
JP2007199522A (en) 2006-01-27 2007-08-09 Nippon Zeon Co Ltd Method of manufacturing optical laminated body
JP2007203576A (en) 2006-02-01 2007-08-16 Oji Paper Co Ltd Manufacturing process of double width nanoimprint roll for roll type imprint apparatus
JP2007281099A (en) 2006-04-04 2007-10-25 Shinji Matsui Nano-imprint apparatus and nano-imprint method
US20080129933A1 (en) 2006-12-05 2008-06-05 Semiconductor Energy Laboratory Co., Ltd. Anti-reflection film and display device
WO2008082421A1 (en) 2007-01-05 2008-07-10 Sabic Innovative Plastics Ip B.V. Antireflective surfaces, methods of manufacture thereof and articles comprising the same
DE102007009512A1 (en) 2007-02-27 2008-08-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Optical element with anti-fogging polymer layer, for use e.g. as spectacle lenses or display covers, has a reflection-reducing nano-structure formed on the surface of the polymer layer
JP2008209867A (en) 2007-02-28 2008-09-11 Mitsubishi Rayon Co Ltd Stamper, glare-proof antireflection article, and its manufacturing method
EP1972997A2 (en) 2007-03-19 2008-09-24 Obducat AB Nano-imprinting apparatus and method
WO2009107294A1 (en) 2008-02-27 2009-09-03 シャープ株式会社 Roller type nano-imprint device, mold roll for the roller type nano-imprint device, fixed roll for the roller type nano-imprint device, and nano-imprint sheet manufacturing method
US20090256997A1 (en) 2005-11-04 2009-10-15 Kenji Misono Liquid Crystal Display Device
US20090296021A1 (en) 2008-05-28 2009-12-03 Junghoon Lee Optical sheet, backlight unit, and liquid crystal display
WO2009147858A1 (en) 2008-06-06 2009-12-10 シャープ株式会社 Antireflection film, optical element comprising antireflection film, stamper, process for producing stamper, and process for producing antireflection film
JP4565816B2 (en) 2003-06-30 2010-10-20 三洋電機株式会社 Display device
JP6032675B2 (en) 2013-02-08 2016-11-30 国立研究開発法人産業技術総合研究所 Reversibly changeable optical diffusing varying device light diffusing state

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53103754U (en) 1977-01-26 1978-08-21
JPS6144607Y2 (en) 1985-02-01 1986-12-16
JPH0516228Y2 (en) 1987-09-12 1993-04-28
JPH0516230Y2 (en) 1987-10-30 1993-04-28
JPH07104272B2 (en) 1989-12-26 1995-11-13 株式会社フジクラ Optical fiber sensor
JPH075693Y2 (en) 1990-04-07 1995-02-08 ティーディーケイ株式会社 Circularly polarized wave antenna device
JPH0825026B2 (en) 1990-11-22 1996-03-13 ミサワホーム株式会社 Tack method of reinforcing member
US6380997B1 (en) 1995-04-07 2002-04-30 Colorlink, Inc. Achromatic polarization inverters for displaying inverse frames in DC balanced liquid crystal displays
WO2003069396A3 (en) 2002-02-15 2003-12-24 Elop Electrooptics Ind Ltd Device and method for varying the reflectance or transmittance of light

Patent Citations (192)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2331743A (en) 1942-05-23 1943-10-12 Marathon Paper Mills Co Roll spindle
DE1108536B (en) 1951-06-25 1961-06-08 Hard Aluminium Surfaces Ltd A method for forming ultra hard surfaces on aluminum and its alloys by anodic oxidation
US2849192A (en) 1955-10-20 1958-08-26 Us Shaft Company Core engaging shaft
US3386130A (en) 1966-03-09 1968-06-04 Dornbusch & Co Fa Embossing roll, in particular for the treatment of webs of thermoplastic material
US4148204A (en) * 1971-05-07 1979-04-10 Siemens Aktiengesellschaft Process of mechanically shaping metal articles
US4240257A (en) 1973-02-22 1980-12-23 The Singer Company Heat pipe turbo generator
US4085792A (en) * 1975-10-02 1978-04-25 General Battery Corporation Method of casting lead alloy automotive battery parts
US4114983A (en) 1977-02-18 1978-09-19 Minnesota Mining And Manufacturing Company Polymeric optical element having antireflecting surface
US4190321A (en) 1977-02-18 1980-02-26 Minnesota Mining And Manufacturing Company Microstructured transmission and reflectance modifying coating
JPS53103754A (en) 1977-02-18 1978-09-09 Minnesota Mining & Mfg Fine particle coating to improve reflection and percolation
US4310586A (en) 1978-01-17 1982-01-12 Alcan Research And Development Limited Aluminium articles having anodic oxide coatings and methods of coloring them by means of optical interference effects
US4581913A (en) * 1983-07-27 1986-04-15 Luster Finish, Inc. Method for improving the release and finish characteristics of metal stamping dies
US4737447A (en) 1983-11-11 1988-04-12 Pioneer Electronic Corporation Process for producing micro Fresnel lens
US4547275A (en) 1984-02-03 1985-10-15 Showa Aluminum Kabushiki Kaisha Process for treating surface of aluminum foil for use as electrode of electrolytic capacitors
JPS6144607A (en) 1984-08-10 1986-03-04 Toyoda Gosei Co Ltd Embossed product and manufacture thereof
US4863880A (en) * 1987-03-30 1989-09-05 Agency Of Industrial Science & Technology, Ministry Of International Trade & Industry InSb device manufacturing by anodic oxidation
JPS63303714A (en) 1987-06-05 1988-12-12 Fujikura Ltd Aluminum mold and injection molding
JPH02254192A (en) 1989-03-27 1990-10-12 Norinaga Baba Production of porous material
US5249949A (en) 1989-09-11 1993-10-05 Eastman Kodak Company Apparatus for texturizing toner image bearing receiving sheets
JPH03203773A (en) 1989-12-29 1991-09-05 Canon Inc Liquid crystal display device
US5150231A (en) 1989-12-29 1992-09-22 Canon Kabushiki Kaisha Impact resistant ferroelectric liquid crystal apparatus
US5205210A (en) 1990-08-14 1993-04-27 Walter Mathis Method and apparatus for dry printing using a hot embossing foil
JPH0516230A (en) 1990-10-19 1993-01-26 Canon Inc Forming roll, manufacture thereof and apparatus for manufacturing substrate sheet for optical recording medium
EP0481753A2 (en) 1990-10-19 1992-04-22 Canon Kabushiki Kaisha Molding roll, method for manufacturing it, and apparatus for forming substrate sheet for optical recording medium
JPH04265729A (en) 1991-02-21 1992-09-21 Tsutsunaka Plast Ind Co Ltd Thermoforming method of polycarbonate resin sheet
JPH0516228A (en) 1991-04-15 1993-01-26 Dainippon Printing Co Ltd Gloss-mat type shaped film
US5318091A (en) * 1991-11-22 1994-06-07 Borgo-Nova Spa Die coating
GB2266599A (en) 1992-04-30 1993-11-03 Samsung Electronic Devices Optical phase-retardation compensating film
CN1078049A (en) 1992-04-30 1993-11-03 三星电管株式会社 Optical phase-retardation compensating film
JPH05323371A (en) 1992-05-20 1993-12-07 Sharp Corp Reflection type liquid crystal display device and its production
JPH0632675A (en) 1992-07-15 1994-02-08 N E Chemcat Corp Production of porous metal oxide
US5415219A (en) * 1992-07-21 1995-05-16 Hagen Batterie Ag Grid casting mold for the casting of lead grids for accumulators and methods for its manufacture
US5597984A (en) 1993-02-08 1997-01-28 Sowal Technologies International Inc. Capacitance weighing mat with substantially rigid separators
JPH075693A (en) 1993-03-16 1995-01-10 Philips Electron Nv Method of providing patterned relief of hardened photoresist on flat substrate surface and device therefor
US5425848A (en) 1993-03-16 1995-06-20 U.S. Philips Corporation Method of providing a patterned relief of cured photoresist on a flat substrate surface and device for carrying out such a method
JPH07104272A (en) 1993-09-29 1995-04-21 Okuno Chem Ind Co Ltd Reflection type liquid crystal display device
US6089848A (en) 1994-03-08 2000-07-18 Syfal S.R.L. Apparatus for producing rollers with elastic silicone-based material layers
US5694247A (en) 1994-05-02 1997-12-02 U.S. Philips Corporation Optical transmissive component with anti-reflection gratings
JPH07306408A (en) 1994-05-11 1995-11-21 Casio Comput Co Ltd The liquid crystal display device
JPH0825026A (en) 1994-07-11 1996-01-30 Nibetsukusu Kk Flow regulating material for aluminum casting and flow regulator using the same
US5656147A (en) * 1994-07-12 1997-08-12 Sharp Kabushiki Kaisha Method for fabricating a switching device by anodization
JPH0885117A (en) 1994-09-16 1996-04-02 Ricoh Co Ltd Molding die and production thereof
EP0792951A1 (en) 1994-11-16 1997-09-03 Kabushiki Kaisha Kobe Seiko Sho Vacuum chamber made of aluminum or its alloy, and surface treatment and material for the vacuum chamber
US5811137A (en) 1995-02-17 1998-09-22 Casa Herrera, Inc. Dough Sheeter having independant internally-driven self-powered rollers
US5808707A (en) 1995-03-01 1998-09-15 Canon Kabushiki Kaisha Display apparatus
JPH0973072A (en) 1995-03-01 1997-03-18 Canon Inc Display device
EP0732426A1 (en) 1995-03-16 1996-09-18 Alusuisse-Lonza Services AG Process for continuously anodising aluminium strips or wires
US5693208A (en) 1995-03-16 1997-12-02 Alusuisse Technology & Management Ltd. Process for continuously anodizing strips or wires of aluminum
JPH08321381A (en) 1995-05-26 1996-12-03 Chisso Corp Organic electroluminescent element
US6266112B1 (en) 1995-06-13 2001-07-24 Nec Corporation Reflective liquid crystal display
US5693210A (en) 1995-08-31 1997-12-02 President Of Tohoku University Method of manufacturing porous alumina tube
DE19536194A1 (en) 1995-09-28 1997-04-03 Glasbau Gmbh As Aquarium or paludarium with fish etc and plants
US6309580B1 (en) 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
JPH09155972A (en) 1995-12-12 1997-06-17 Ykk Corp Water repellant film and its manufacture
EP0805044B1 (en) 1996-04-30 2002-10-23 Automated Packaging Systems, Inc. Thermal imprinter and method
JPH09322674A (en) 1996-05-31 1997-12-16 Matsushita Electric Ind Co Ltd Film for lining interior of water tank, water tank using the same and coating material composition for coating inner surface of water tank containing antimicrobial agent therein and water tank using the same
US6568931B2 (en) 1996-06-26 2003-05-27 Idemitsu Petrochemical Co., Ltd. Emboss pattern processing apparatus
JPH1016008A (en) 1996-07-02 1998-01-20 Sharp Corp Mold for molding plastics and injection molding device using this mold
JPH1046382A (en) 1996-07-26 1998-02-17 Mitsubishi Materials Corp Production of fine metallic fiber and conductive paint using the fiber
US6139713A (en) * 1996-08-26 2000-10-31 Nippon Telegraph And Telephone Corporation Method of manufacturing porous anodized alumina film
EP0931859A1 (en) 1996-08-26 1999-07-28 Nippon Telegraph And Telephone Corporation Method of manufacturing porous anodized alumina film
JPH10121292A (en) 1996-08-26 1998-05-12 Nippon Telegr & Teleph Corp <Ntt> Formation of porous anodized alumina film
JPH1068816A (en) 1996-08-29 1998-03-10 Sharp Corp Phase difference plate and circularly polarizing plate
JPH10186136A (en) 1996-11-11 1998-07-14 Dowa Mining Co Ltd Optical filter
US6020945A (en) 1996-11-11 2000-02-01 Dowa Mining Co., Ltd. Display device with a transparent optical filter
DE19701568C1 (en) 1997-01-17 1998-07-23 Karlsruhe Forschzent Structured layer formation for micro-engineered functional system
WO1998039673A1 (en) 1997-03-04 1998-09-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Anti-reflection coating and method for producing same
JP2001517319A (en) 1997-03-04 2001-10-02 フラウンホファー.ゲゼルシャフト.ツール.フォルデンウング.デール.アンゲヴァンドテン.フォルシュング.エー.ファウ. The anti-reflection film and its manufacturing method
US6359735B1 (en) 1997-03-04 2002-03-19 Fraunhofer Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Antireflective coating and method of manufacturing same
US6090523A (en) * 1997-04-17 2000-07-18 Nec Corporation Multi-resin material for an antireflection film to be formed on a workpiece disposed on a semiconductor substrate
WO1998048996A1 (en) 1997-04-30 1998-11-05 Guial Method for making a calender roll and thermoplastic sheets or films obtained by calendering with such a roll
FR2762862A1 (en) 1997-04-30 1998-11-06 Guial Method of manufacturing a calender roll and leaves of thermoplastic films obtained by laminating a thermoplastic resin by means of such a cylinder
DE19727132A1 (en) 1997-06-26 1999-01-07 Hueck Engraving Gmbh Method and device for producing an embossed structure on a surface of the molding of pressed laminates serving stamping tool
US6111699A (en) 1997-09-25 2000-08-29 Dai Nippon Printing Co. Ltd. Light diffusing film and its manufacture, a polarizing plate with a light diffusing layer, and a liquid crystal display apparatus
JPH11200090A (en) 1997-11-12 1999-07-27 Canon Inc Nanostructural body and its production
DE29722268U1 (en) 1997-12-17 1998-03-05 Unicor Rohrsysteme Gmbh Mold jaws of aluminum or aluminum alloy
US20010051442A1 (en) 1998-03-03 2001-12-13 Dina Katsir Method for producing high surface area foil electrodes
JP2000052421A (en) 1998-07-31 2000-02-22 Three M Innovative Properties Co Embossed optical polymer film and its manufacture
US6096247A (en) 1998-07-31 2000-08-01 3M Innovative Properties Company Embossed optical polymer films
JP2000071290A (en) 1998-08-28 2000-03-07 Teijin Ltd Manufacture of antireflection article
US6348960B1 (en) 1998-11-06 2002-02-19 Kimotot Co., Ltd. Front scattering film
JP2000199809A (en) 1998-11-06 2000-07-18 Kimoto & Co Ltd Forward scattering film
EP1016621A2 (en) 1998-12-25 2000-07-05 Canon Kabushiki Kaisha Method for producing narrow pores and structure having the narrow pores, and narrow pores and structure produced by the method
US6476409B2 (en) 1999-04-27 2002-11-05 Canon Kabushiki Kaisha Nano-structures, process for preparing nano-structures and devices
US6175442B1 (en) 1999-05-25 2001-01-16 Intel Corporation Anti-reflection layer in spatial light modulators
US6874262B2 (en) 1999-06-01 2005-04-05 Nikon Corporation Method for manufacturing master substrate used for manufacturing grooved molding substrate, method for manufacturing stamper for manufacturing grooved molding substrate, method for manufacturing grooved molding substrate, grooved molding substrate, memory medium, memory device, and computer
JP2001066626A (en) 1999-08-27 2001-03-16 Optrex Corp Liquid crystal display device
JP2001074919A (en) 1999-09-03 2001-03-23 Fuji Photo Film Co Ltd Light diffusing body and its production
EP1089114A2 (en) 1999-09-21 2001-04-04 Daicel Chemical Industries, Ltd. Anisothropic light-scattering film
US6354358B1 (en) * 1999-11-26 2002-03-12 Nomura Plating Co., Ltd. Continuous casting mold with tungsten alloy plating and method of producing the same
US20060050387A1 (en) 2000-03-16 2006-03-09 Dai Nippon Printing Co., Ltd. Antireflection film
US20080032058A1 (en) 2000-03-16 2008-02-07 Dai Nippon Printing Co., Ltd. Antireflection film
JP2001264520A (en) 2000-03-16 2001-09-26 Dainippon Printing Co Ltd Reflection preventing film, polarizing element, display device and method for manufacturing reflection preventing film
US20020044356A1 (en) 2000-03-16 2002-04-18 Fumihiro Arakawa Antireflection film
US20010035929A1 (en) 2000-03-28 2001-11-01 Kazuhiro Nakamura Anti-glare and anti-reflection film, polarizing plate, and image display device
JP2003531962A (en) 2000-04-28 2003-10-28 アルコーブ サーフィシーズ ゲーエムベーハー Embossing tool, a method of producing the same, a method of constructing a surface of the workpiece, and use of anodized surface layer
US20040163441A1 (en) 2000-04-28 2004-08-26 Alcove Surfaces Gmbh Stamping tool, casting mold and methods for structuring a surface of a work piece
DE10020877C1 (en) 2000-04-28 2001-10-25 Alcove Surfaces Gmbh Stamping tool has a structured stamping surface with an anodically oxidized surface layer or a covering layer having open hollow chambers produced by anodic oxidation
JP4265729B2 (en) 2000-04-28 2009-05-20 シャープ株式会社 Embossing tool, a method of constructing a surface of the workpiece, and use as well as anti-reflection film of the anodized surface layer
CA2407209A1 (en) 2000-04-28 2002-10-23 Alcove Surfaces Gmbh Stamping tool, method for structuring a surface of a workpiece and use of an anodized surface layer
JP2009052147A (en) 2000-04-28 2009-03-12 Sharp Corp Stamping tool and method for structuring surface of workpiece
US6695987B2 (en) 2000-05-12 2004-02-24 Pioneer Corporation Production method for optical disc
JP2002079535A (en) 2000-06-28 2002-03-19 Ricoh Co Ltd Cylindrical molding mold, its production method, and method for producing cylindrical film
US20020089620A1 (en) 2000-07-21 2002-07-11 Kyoko Yamamoto Anisotropic scattering film and liquid crystal display
JP2002169025A (en) 2000-07-21 2002-06-14 Sumitomo Chem Co Ltd Anisotropic scattering film and liquid crystal display device using the same
US20020044351A1 (en) 2000-08-15 2002-04-18 Reflexite Corporation Light polarizer
JP2002079523A (en) 2000-09-04 2002-03-19 Seiko Epson Corp Method for producing spectacle lens
JP2002107714A (en) 2000-10-02 2002-04-10 Sharp Corp Liquid crystal display device
JP2002182199A (en) 2000-12-11 2002-06-26 Casio Comput Co Ltd Back light device
JP2002318383A (en) 2001-04-20 2002-10-31 Kyocera Corp Reflective liquid crystal display device
US7066234B2 (en) 2001-04-25 2006-06-27 Alcove Surfaces Gmbh Stamping tool, casting mold and methods for structuring a surface of a work piece
US20030205475A1 (en) 2001-04-25 2003-11-06 Alcove Surfaces Gmbh Stamping tool, casting mold and methods for structuring a surface of a work piece
JP2002031721A (en) 2001-05-25 2002-01-31 Sumitomo Chem Co Ltd Composite polarizing plate
JP2003004904A (en) 2001-06-25 2003-01-08 Dainippon Printing Co Ltd Antireflection film having antidazzle layer with high refractive index and low reflective display device
JP2003043203A (en) 2001-08-01 2003-02-13 Hitachi Maxell Ltd Antireflection film, method for manufacturing the same, stamper for manufacture of antireflection film, method for manufacturing the stamper, casting mold for manufacture of stamper and method for manufacturing the casting mold
JP2003149413A (en) 2001-08-28 2003-05-21 Fuji Photo Film Co Ltd Light diffusing film, antidazzle film, polarizing plate and liquid crystal display device
US20030067574A1 (en) 2001-10-03 2003-04-10 Nitto Denko Corporation Laminated quarter-wave plate or circularly polarizing plate, liquid-crystal display device using the same and method for producing the same
JP2003248122A (en) 2001-12-18 2003-09-05 Fuji Photo Film Co Ltd Elliptical polarizing plate and liquid crystal display using the same
US20050074579A1 (en) 2002-02-20 2005-04-07 Dai Nippon Printing Co., Ltd. Antireflection structure
WO2003073410A1 (en) 2002-02-27 2003-09-04 Innovative Solutions & Support, Inc. Improved low reflectivity flat panel display
JP2003302532A (en) 2002-04-12 2003-10-24 Mitsubishi Chemicals Corp Polarizing plate and method for manufacturing the same
CN1455270A (en) 2002-04-30 2003-11-12 欧姆龙株式会社 Reflection board and method for making same, and reflection type liquid crystal displaying device
US20030214739A1 (en) 2002-04-30 2003-11-20 Akihiro Funamoto Reflective plate, method of making same, and reflective type liquid crystal display using the reflective plate
JP2003319733A (en) 2002-05-07 2003-11-11 Konica Minolta Holdings Inc Aquarium for appreciation
US20050150643A1 (en) 2002-06-24 2005-07-14 Daniel Chartouni Heat exchanger
CN1501100A (en) 2002-11-01 2004-06-02 柯尼卡美能达控股株式会社 Method for forming anti-glare layer and anti-glare film, and ink-jet apparatus for forming anti-glare layer
US20040091642A1 (en) 2002-11-01 2004-05-13 Takashi Murakami Method for forming anti-glare layer and anti-glare film, and ink-jet apparatus for forming anti-glare layer
JP2004205990A (en) 2002-12-26 2004-07-22 Dainippon Printing Co Ltd Manufacturing method of fine rugged pattern having antireflection performance and antireflection article
JP2004223724A (en) 2003-01-20 2004-08-12 Dainippon Printing Co Ltd Embossing roll made of glass
JP2004223836A (en) 2003-01-22 2004-08-12 Fuji Photo Film Co Ltd Method and apparatus for manufacturing pattern roll and method for making optical sheet
US6837096B2 (en) 2003-01-23 2005-01-04 Midwest Research Institute, Inc. Low-power gas chromatograph
US20040159977A1 (en) 2003-02-18 2004-08-19 Perfetto Robert S. Method and apparatus for applying a decorative pattern to a surface
JP2004272059A (en) 2003-03-11 2004-09-30 Ge Toshiba Silicones Co Ltd Liquid crystal display and portable electronic apparatus equipped with same
US6888676B2 (en) 2003-03-20 2005-05-03 Nokia Corporation Method of making polarizer and antireflection microstructure for mobile phone display and window
CN1534314A (en) 2003-03-26 2004-10-06 富士胶片株式会社 Dazzle reflection preventing film mfg. method and its device, and dazzle reflection preventing film
US20040188874A1 (en) 2003-03-26 2004-09-30 Fuji Photo Film Co., Ltd. Method and equipment for producing antiglare and antireflection film and antiglare and antireflection film
EP1473594A2 (en) 2003-04-29 2004-11-03 Hewlett-Packard Development Company, L.P. Apparatus for embossing a flexible substrate with a pattern carried by an optically transparent compliant media
US20040219249A1 (en) 2003-05-02 2004-11-04 Yong-Chen Chung Uniform pressing apparatus
US20060256263A1 (en) 2003-05-22 2006-11-16 Koninklijke Philips Electronics N.V. Liquid crystal display device having form birefringent compensator
JP4565816B2 (en) 2003-06-30 2010-10-20 三洋電機株式会社 Display device
CN1591047A (en) 2003-09-01 2005-03-09 欧姆龙株式会社 Method for mfg optical element having resin film with micro concave-convex pattern
US20050079331A1 (en) 2003-09-01 2005-04-14 Omron Corporation Manufacturing method of optical device provided with resin thin film having micro-asperity pattern
US20050093210A1 (en) 2003-10-29 2005-05-05 Matsushita Electric Industrial Co., Ltd. Method for producing optical element having antireflection structure, and optical element having antireflection structure produced by the method
JP2005132660A (en) 2003-10-29 2005-05-26 Matsushita Electric Ind Co Ltd Manufacturing method of optical element having non-reflective structure and optical element having non-reflective structure manufactured through the method
US20050104253A1 (en) 2003-11-11 2005-05-19 Ryuichi Katsumoto Production method and production apparatus of pattern-indented sheet
JP2005144698A (en) 2003-11-11 2005-06-09 Fuji Photo Film Co Ltd Method and apparatus for manufacturing embossed sheet
WO2005050627A2 (en) 2003-11-14 2005-06-02 Aprilis, Inc. Holographic data storage media with structure surfaces
JP2005156695A (en) 2003-11-21 2005-06-16 Kanagawa Acad Of Sci & Technol Anti-reflection coating and method for manufacturing the same, and stamper for preparing anti-reflection coating and method for manufacturing the same
JP2005161531A (en) 2003-11-28 2005-06-23 Fuji Photo Film Co Ltd Method and apparatus for manufacturing embossed sheet
JP2005181740A (en) 2003-12-19 2005-07-07 Matsushita Electric Ind Co Ltd Reflection prevention structure
JP2005234554A (en) 2004-01-23 2005-09-02 Fuji Photo Film Co Ltd Antireflection film, polarizing plate and image display apparatus
US20050195486A1 (en) 2004-03-03 2005-09-08 Hiroshi Sasaki Anti-reflecting membrane, and display apparatus, optical storage medium and solar energy converting device having the same, and production method of the membrane
JP2005249982A (en) 2004-03-03 2005-09-15 Hitachi Ltd Antireflection film, image display device having the same, optical recording medium, solar power generation module, and method for forming antireflection film
JP2005338256A (en) 2004-05-25 2005-12-08 Hitachi Displays Ltd Liquid crystal display
US7088409B2 (en) 2004-05-25 2006-08-08 Hitachi Displays, Ltd. Liquid crystal display apparatus
JP2006039450A (en) 2004-07-30 2006-02-09 Seiko Epson Corp Method for forming antireflection film, apparatus for forming antireflection film, antireflection film and optical component
JP2006062240A (en) 2004-08-27 2006-03-09 Fuji Photo Film Co Ltd Manufacturing method of non-glare reflection-preventive film and non-glare reflection-preventive film
US7425395B2 (en) 2004-09-29 2008-09-16 Hitachi Displays, Ltd. Liquid crystal display device
JP2006098623A (en) 2004-09-29 2006-04-13 Hitachi Displays Ltd Liquid crystal display device
WO2006043244A1 (en) 2004-10-22 2006-04-27 Koninklijke Philips Electronics N.V. Roller micro-contact printer with pressure control
US20080102603A1 (en) 2004-11-30 2008-05-01 Shin-Etsu Handotai Co., Ltd. Method for Producing Direct Bonded Wafer and Direct Bonded Wafer
WO2006059586A1 (en) 2004-11-30 2006-06-08 Shin-Etsu Handotai Co., Ltd. Method for manufacturing direct bond wafer, and direct bond wafer
JP4368384B2 (en) 2004-12-03 2009-11-18 シャープ株式会社 Antireflective member, the optical element, and a display device and manufacturing method and manufacturing method of the anti-reflective material using the stamper stamper
US20090211912A1 (en) 2004-12-03 2009-08-27 Sharp Kabushiki Kaisha Antireflective member, optical element, display device, method of making stamper and method of making antireflective member using the stamper
WO2006059686A1 (en) 2004-12-03 2006-06-08 Sharp Kabushiki Kaisha Reflection preventing material, optical element, display device, stamper manufacturing method, and reflection preventing material manufacturing method using the stamper
JP2009217278A (en) 2004-12-03 2009-09-24 Sharp Corp Antireflective member, optical element, and display
US20070159698A1 (en) 2004-12-03 2007-07-12 Sharp Kabushiki Kaisha Antireflective member, optical element, display device, method of making stamper and method of making antireflective member using the stamper
US20090252825A1 (en) 2004-12-03 2009-10-08 Sharp Kabushiki Kaisha Antireflective member, optical element, display device, method of making stamper and method of making antireflective member using the stamper
US7835080B2 (en) 2004-12-03 2010-11-16 Sharp Kabushiki Kaisha Antireflective member, optical element, display device, method of making stamper and method of making antireflective member using the stamper
JP2006208726A (en) 2005-01-27 2006-08-10 Dainippon Printing Co Ltd Optical functional sheet
US20070014886A1 (en) 2005-02-02 2007-01-18 Michael Hennessey Method and apparatus for forming microstructures on polymeric substrates
US20070018345A1 (en) 2005-07-25 2007-01-25 Bing-Huan Lee Nanoimprint lithograph for fabricating nanoadhesive
JP2007073696A (en) 2005-09-06 2007-03-22 Hyogo Prefecture Pattern forming method, pattern forming apparatus and pattern-formed film
JP2007086283A (en) 2005-09-21 2007-04-05 Kanagawa Acad Of Sci & Technol Antireflection film and method for manufacturing same, and stamper for preparing antireflection film and method for manufacturing same
WO2007040023A1 (en) 2005-10-03 2007-04-12 Konica Minolta Opto, Inc. Process for producing film with rugged pattern and production apparatus therefor
JP2007098742A (en) 2005-10-04 2007-04-19 Konica Minolta Opto Inc Manufacturing method of uneven pattern film
US20090256997A1 (en) 2005-11-04 2009-10-15 Kenji Misono Liquid Crystal Display Device
EP1785748A1 (en) 2005-11-10 2007-05-16 C.R.F. Societa' Consortile per Azioni Anti-reflection nano-metric structure based on anodised porous alumina and method for production thereof
JP2007156145A (en) 2005-12-06 2007-06-21 Konica Minolta Opto Inc Antireflection film, method of manufacturing same and image display device
JP2007199522A (en) 2006-01-27 2007-08-09 Nippon Zeon Co Ltd Method of manufacturing optical laminated body
JP2007203576A (en) 2006-02-01 2007-08-16 Oji Paper Co Ltd Manufacturing process of double width nanoimprint roll for roll type imprint apparatus
JP2007281099A (en) 2006-04-04 2007-10-25 Shinji Matsui Nano-imprint apparatus and nano-imprint method
US20080129933A1 (en) 2006-12-05 2008-06-05 Semiconductor Energy Laboratory Co., Ltd. Anti-reflection film and display device
WO2008082421A1 (en) 2007-01-05 2008-07-10 Sabic Innovative Plastics Ip B.V. Antireflective surfaces, methods of manufacture thereof and articles comprising the same
DE102007009512A1 (en) 2007-02-27 2008-08-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Optical element with anti-fogging polymer layer, for use e.g. as spectacle lenses or display covers, has a reflection-reducing nano-structure formed on the surface of the polymer layer
US20100033819A1 (en) 2007-02-27 2010-02-11 Ulrike Schulz Optical Element with an Anti-Fog Layer and Method for its Production
JP2008209867A (en) 2007-02-28 2008-09-11 Mitsubishi Rayon Co Ltd Stamper, glare-proof antireflection article, and its manufacturing method
EP1972997A2 (en) 2007-03-19 2008-09-24 Obducat AB Nano-imprinting apparatus and method
WO2009107294A1 (en) 2008-02-27 2009-09-03 シャープ株式会社 Roller type nano-imprint device, mold roll for the roller type nano-imprint device, fixed roll for the roller type nano-imprint device, and nano-imprint sheet manufacturing method
US20090296021A1 (en) 2008-05-28 2009-12-03 Junghoon Lee Optical sheet, backlight unit, and liquid crystal display
WO2009147858A1 (en) 2008-06-06 2009-12-10 シャープ株式会社 Antireflection film, optical element comprising antireflection film, stamper, process for producing stamper, and process for producing antireflection film
JP6032675B2 (en) 2013-02-08 2016-11-30 国立研究開発法人産業技術総合研究所 Reversibly changeable optical diffusing varying device light diffusing state

Non-Patent Citations (53)

* Cited by examiner, † Cited by third party
Title
"Electrodeposited nanporous TiO2 film by a two-step replication process from anodic porous alumina" by P. Hoyer et al., Journal of Materials Science Letters 15 (1996) 1228-1230.
"Fabrication of a Nanostructured Diamond Honeycomb Film" by Hideki Masuda et al., Adv. Matter. 2000, 12, No. 6.
"Fabrication of Gold Nanodot Array Using Anodic Porous Alumina as an Evaporation Mask" by Hideka Masuda et al., Jpn. J. Appl. Phys. vol. 35 (1996) pp. L126-L129, Part 2, No. 1B, Jan. 15, 1996.
"Fabrication of Porous TiO2Films Using Two-Step Replication of Microstructure of Anodic Alumina" by Hideki Masuda et al., Jpn. J. Appl. Phys. vol. 31 (1992) pp. L17775-L17777, Part 2, No. 12B, Dec. 15, 1992.
"Highly ordered nanochannel-array architecture in anodic alumina" by Hideki Masuda et al., Appl. Phys. Lett, 71 (19), Nov. 10, 1997.
"Impedance measurements of a Platinum Cylindrical Porous Electrode Replicated from Anodic Porous Alumia", by Takashi Ohmori et al., J. Electrochem, Soc., vol. 144, No. 4, Apr. 1997.
"Ordered Metal Nanohole Arrays Made by a Two-Step Replication of Honeycomb Structures of Anodic Alumina" by Hideki Masuda et al., Science, vol. 268, Jun. 9, 1995.
"Preparation of microporous metal membranes by two-step replication of the microstructure of anodic alumina" by Hideki Masuda et al., Thin Solid Films, 223 (1993).
"Standard electrode potential (data page)," from Wikipedia, the free encyclopedia, Anonymous, Feb. 10, 2011.
"Highly ordered nanochannel—array architecture in anodic alumina" by Hideki Masuda et al., Appl. Phys. Lett, 71 (19), Nov. 10, 1997.
Armin Plichta et al. "Flexible Glass Substrates," Flexible Flat Panel Displays, Edited by G.P. Crawford, John Wiley & Sons, Ltd., XP002631694, 2005, pp. v-xvii, 35-45, and 48-55.
CRAWFORD G.P.: "Flexible Flat Panel Displays", 1 January 2005, JOHN WILEY & SONS, LTD., Chichester [u.a.], ISBN: 0-470-87048-6, article PLICHTA A., HABECK A., KNOCHE S., ET AL: "Chapter 3: Flexible Glass Substrates", pages: V - XVII + 35-45, 48-55, XP002631694
Decision on Grant for corresponding Russian patent application No. 2010147914 issued on Jul. 12, 2012 (in English).
English translation of the International Preliminary Report on Patentability (Chapter I) for international patent aapplication No. PCT/JP2009/007140 dated Aug. 25, 2011.
F. A. Lowenheim, Electroplating, McGraw-Hill Book Company, New York, 1978, pp. 452-459. *
H. Silman et al, Protective and Decorative Coatings for Metals, Finishing Publication Ltd, Teddington, Middlesex, England, 1978, pp. 456-464. *
Hideki Masuda et al. "Fabrication of a Nanostructured Diamond Honeycomb Film." Adv. Mater. 2000, 12, No. 6.
Hideki Masuda et al. "Fabrication of Gold Nanodot Array Using Anodic Porous Alumina as an Evaporation Mask." Jpn. J. Appl. Phys. vol. 35 (1996) pp. L126-L129, Part 2, No. 1B, Jan. 15, 1996.
Hideki Masuda et al. "Fabrication of Porous TiO2Films Using Two-Step Replication of Microstructure of Anodic Alumina." Jpn. J. Appl. Phys. vol. 31 (1992) pp. L17775-L17777, Part 2, No. 12B, Dec. 15, 1992.
Hideki Masuda et al. "Highly ordered metallic nanochannel-array architecture in anodic alumina." Solid State Physics (1996) vol. 31 No. 5, pp. 493-499, and partial English translation thereof.
Hideki Masuda et al. "Highly ordered nanochannel-array architecture in anodic alumina." Appl. Phys. Lett, 71 (19) Nov. 10, 1997.
Hideki Masuda et al. "Ordered Metal Nanohole Arrays Made by a Two-Step Replication of Honeycomb Structures of Anodic Alumina." Science, vol. 268, Jun. 9, 1995.
Hideki Masuda et al. "Preparation of microporous metal membranes by two-step replication of the microstructure of anodic alumina." Thin Solid Films, 223 (1993).
International Preliminary Report on Patentability and Written Opinion for international patent application No. PCT/JP2009/002530 dated Jan. 20, 2011.
International Preliminary Report on Patentability for PCT/JP2008/002078 dated Feb. 24, 2010.
International Preliminary Report on Patentability for PCT/JP2009/000739 dated Oct. 5, 2010.
International Search Report for PCT/JP2008/070307 mailed Jan. 27, 2009.
International Search Report for PCT/JP2009/000739 mailed May 19, 2009.
International Search Report for PCT/JP2009/007140.
International Search Report for PCT/JP2009/070555 mailed Mar. 16, 2010.
Japanese Notice of Allowance for corresponding JP application 2001-580058.
Japanese Notice of Allowance for corresponding JP application 2008-303126.
Kumao Ebihara, Kinzoku Binran (or "Metal Handbook"), Dec. 20, 1982, pp. 1311-1313, and Partial English translation thereof.
Machine English translation of JP H9-155,972 (Kajiki). *
Masuda et al., Proceedings (Lecture Notes) of the 52nd joint lecture meeting of applied physics related societies (2005 spring in Saitama University) 30p-ZR-9, p. 112.
Notice of Allowance for corresponding U.S. Appl. No. 12/213,990 dated May 9, 2012.
O. Schwartz et al., "Pererabotka plastmass," Saint Petersburg, 2005, pp. 47-48, 300-304.
Office Action for co-pending U.S. Appl. No. 12/662,682 dated May 30, 2013.
Office Action for corresponding U.S. Appl. No. 12/662,682 dated Oct. 17, 2012.
Office Action for corresponding U.S. Appl. No. 12/735,297 dated Oct. 26, 2012.
Office Action for corresponding U.S. Appl. No. 12/805,189 dated May 17, 2012.
Office Action for corresponding U.S. Appl. No. 12/921,285 dated May 4, 2012.
Office Action for corresponding U.S. Appl. No. 12/921,285 dated Oct. 25, 2012.
Office Action for corresponding U.S. Appl. No. 13/064,157 dated May 4, 2012.
P. Hoyer et al. "Electrodeposited nanoporous TiO2 Film by a two-step replication process from anodic porous alumina." Journal of Materials Science Letters 15 (1996) 1228-1230.
R.B.C. Cayless, "Alloy and Temper Designation Systems for Aluminum and Aluminum Toys," AMS Handbook, vol. 2, ASM International, 1990, pp. 15-20
S.J. Wilson, et al., "The optical properties of 'moth eye' antireflection surface," Optica Acta, 1982, vol. 29, No. 7, pp. 993-1009.
S.J. Wilson, et al., "The optical properties of ‘moth eye’ antireflection surface," Optica Acta, 1982, vol. 29, No. 7, pp. 993-1009.
Takashi Ohmori et al. "Impedance measurements of a Platinum Cylindrical Porous Electrode Replicated from Anodic Porous Alumina." J. Elecrochem, Soc. vol. 144, No. 4, Apr. 1997.
Tatsuo Uchida et al., "Reflective Liquid-Crystal Displays," MRS Bulletin, vol. 27, No. 11, Nov. 1, 2002, pp. 876-879, XP55017950.
TATSUO UCHIDA, TAKAHIRO ISHINABE: "Reflective Liquid-Crystal Displays", MRS BULLETIN, vol. 27, no. 11, 1 November 2002 (2002-11-01), pages 876 - 879, XP055017950, ISSN: 08837694, DOI: 10.1557/mrs2002.276
Y. Kanamori et al., "100 nm period silicon antireflection structures fabricated using a porous alumina membrane mask," Applied Physics Letters, vol. 78, No. 2, Jan. 8, 2001, pp. 142-143.
Y.F. Chu et al., "Design of Pores in Alumina," Journal of Catalysis 41, 1976, pp. 384-396.

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