AU2001256323B2 - Stamping tool, method for structuring a surface of a workpiece and use of an anodized surface layer - Google Patents

Stamping tool, method for structuring a surface of a workpiece and use of an anodized surface layer Download PDF

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Publication number
AU2001256323B2
AU2001256323B2 AU2001256323A AU2001256323A AU2001256323B2 AU 2001256323 B2 AU2001256323 B2 AU 2001256323B2 AU 2001256323 A AU2001256323 A AU 2001256323A AU 2001256323 A AU2001256323 A AU 2001256323A AU 2001256323 B2 AU2001256323 B2 AU 2001256323B2
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Prior art keywords
stamping
hollow chambers
stamping tool
structured
layer
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AU2001256323A1 (en
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Thomas Sawitowski
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Alcove Surfaces GmbH
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Alcove Surfaces GmbH
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/065—Press rams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Shaping Metal By Deep-Drawing, Or The Like (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention relates to a stamping tool, to a method for producing the same, to a method for structuring a surface of a workpiece and to a use for an anodized surface layer. A surface layer with cavities formed without a model, by anodic oxidation, is used as a die to enable simple, inexpensive stamping in the nanometer range.

Description

-1- Stamping Tool, Method for Structuring a Surface of a Work Piece and Use of an Anodized Surface Layer The present invention relates to a stamping tool having a structured stamping surface, a method for producing a stamping tool having a structured stamping surface, a method for structuring a surface of a work piece and use of a surface layer provided with open hollow chambers by anodic oxidation.
Stamping constitutes a non-cutting manufacturing method for producing a relief-like or structured surface on a work piece. A stamping tool with a profiled or structured stamping surface is used for this. The stamping surface is pressed with such a stamping force onto the surface to be structured of the work piece or rolled on this, so that the work piece becomes plastic and flows into depressions in the stamping tool or the stamping surface. Due to the considerable stamping forces employed, the stamping tool and the stamping surface are usually made of metal.
It is very expensive to manufacture a stamping tool with a very finely structured or profiled stamping surface. To create a so-called "moth eye structure"- evenly arranged, egg carton-like bumps or fine grooves in the nanometre range, it is known from practice to use a lighting pattern with periodic intensity modulation for illuminating photo-sensitive material via two interfering laser beams. After the illuminated material develops, a periodic surface structure results, which is moulded into other materials using various replication methods and finally into nickel, for example, by electroforming. This type of manufacturing is very expensive and is suited only for structuring even surfaces.
In the present invention nanometre range is understood to mean profiling or structuring with structural widths 1000 nm, especially 500 nm. The structural width designates the dimension by which individual structural elements, such as bumps, are repeated, that is, for example the average distance of adjacent bumps from one another or of depressions from one another.
In the nanometre range lithographic methods for structuring a stamping surface of a stamping tool can still only be used in a limited way. It should be noted here that the wavelength of the visible light alone is already 400 to 750 nm. In each case lithographic 09/07/04~j2961 spc,l -2methods are very costly.
DE 197 27 132 C2 discloses the manufacturing of a stamping tool by means of electrolytic machining. During electrolytic machining a metallic stamping surface of the s stamping tool is treated electrolytically, wherein, being an anode in a fast-flowing electrolyte, the metal of the stamping surface is located at a minimal distance opposite a cathode and is dissolved in surface terms. The metal or the stamping surface contains the structure determined by the form of the cathode, and the cathode thus forms a recipient vessel that is shaped electrochemically. DE 197 27 132 C2 also provides the use of a cylindrical rotation electrode, whose covering surface presents a negative form of the desired stamping structure. Here, too, there is considerable expense involved and structuring in the nanometre range is at least only partly possible.
An object of the present invention is to provide a stamping tool, a method for manufacturing a stamping tool, a method for structuring a surface of a work piece and a use of a surface layer provided with open hollow chambers, wherein structuring in the nanometre range is enabled in a simple and cost-effective manner.
According to the present invention there is provided a stamping tool with a structured stamping surface, wherein the stamping surface is formed by an anodically oxidised surface layer or covering layer with open hollow chambers created by the anodic oxidation, wherein the hollow chambers have opening areas with an average diameter of 10 to 500 nm and/or the structural width of the stamping surface is 30 to 600 nm.
According to a further aspect of the present invention there is provided a method of producing a stamping tool with a structured stamping surface, wherein a surface layer or covering layer of the stamping tool forming the stamping surface is oxidised at least partially anodically for generating model-free open hollow chambers, so that hollow chambers uniformly shaped and/or at least essentially evenly distributed over the surface or surface area of the stamping surface are formed.
An idea of the present invention is to use a porous oxide layer and especially a surface layer, formed via anodic oxidation and provided with open hollow chambers, as stamping surface of a stamping tool. This leads to several advantages.
09107/04jf12961 spc,2 2a- First, an oxide layer, especially the preferably provided aluminium oxide, is relatively hard. With respect to the often very high stamping forces this is an advantage for being able to stamp work pieces of various materials and for achieving a long tool life of the stamping tool.
09/07/04Jfl2961 epc,2 -3- Second, model-free oxidation is very easy and cost-effective to carry out. In particular, producing hollow chambers is (quasi) independent of the form and configuration of the cathodes employed, so a model or negative form is not required, as in electrolytic machining.
Third, the provided model-free forming of open hollow chambers via anodic oxidation enables structures to be manufactured in the nanometre range very easily and cost-effectively. In particular, structural widths of 500 nm and less, even 100 1O nm and less are possible.
Fourth, depending on choice of procedural conditions the configuration regular or irregular and the surface density of the hollow chambers can be varied as required.
Fifth, by likewise simply varying the procedural conditions especially by variation of the voltage during anodising the form of the hollow chambers and thus the structure of the stamping surface can be adjusted and varied.
Sixth, the anodically oxidised surface layer can be used directly, thus without further moulding, as the stamping surface of a stamping tool.
Further advantages, properties, features and goals of the present invention will emerge from the following description of a preferred embodiment with reference to the drawing. The sole figure shows a very schematic sectional elevation of a proposed stamping tool and a work piece structured therewith.
In a highly simplified sectional elevation, the figure shows a proposed stamping tool 1 with a structured, i.e. profiled or relief-like stamping surface 2. The stamping surface 2 is formed by a flat side of a surface layer 3, which is provided with open hollow chambers 4 produced by anodic oxidation.
-4- In the illustrative example, the surface layer is applied to a support 5 of the stamping tool 1. For example, the surface layer 3 is applied to the support 5 by plasma coating. But the surface layer 3 can also be formed directly by the support and thus be a surface area of the support It is understood that the surface layer 3 can also be deposited on the support using other methods.
In the illustrative example the surface layer 3 preferably consists of aluminium which is applied to the support 5 especially via plasma coating and adheres well to the support 5 preferably made of metal, especially iron or steel.
The surface layer 3 is oxidised anodically at least partially in the illustrative example to the depth of a covering layer 6, whereby the hollow chambers 4 are formed in the surface layer 3. The hollow chambers 4 are formed immediately and/or without any model or pattern, i.e. the arrangement, distribution, form and the like of the hollow chambers 4 as opposed to electrolytic machining is, thus, at least essentially independent of the surface shape and the proximity of the cathode (not shown) used in oxidation. Moreover, according to the invention, the "valve effect", namely the occurring, independent formation of hollow chambers 4 during oxidation or anodisation of the surface layer 3, at least in particular in the so-called valve metals is used. This immediate or undefined formation of the hollow chambers 4 does not preclude an additional (before or after) formation or structuring of the stamping surface 2 or the hollow chambers 4 by means of a negative form.
Depending on how completely or how deeply the surface layer 3 is oxidised, or whether the surface layer 3 is formed directly by the support 5, the surface layer 3 can correspond to the oxidised covering layer 6. In this case, for example, the intermediate layer 7, which is comprised of aluminium in the illustrative example and which promotes very good adhesion between the covering layer 6 and the support 5, can be omitted.
For example, according to an alternative embodiment, the uncoated support 5 can be oxidised anodically on its surface forming the stamping surface 2 by formation of a porous oxide layer or hollow chambers 4. This is possible for example for a support 5 made of iron or steel, especially stainless steel. In this case the surface layer 3 then corresponds to the covering layer 6, i.e. the oxidised layer.
Aluminium and iron or steel, especially stainless steel, have already been named as particularly preferred material, used at least substantially for forming the anodically oxidised surface layer 3 or the covering layer 6. However, silicon and titanium as well as other valve metals for example can also be used.
In the illustrative example the proportions in size are not presented true to scale.
The stamping tool 1 or its stamping surface 2 preferably has a structural width S in the nanometre range, especially from 30 to 600 nm and preferably from 50 to 200 nm.
The hollow chambers 4 or their openings have an average diameter D of essentially 10 to 500 nm, preferably 15 to 200 nm and especially 20 to 100 nm.
In the illustrative example the hollow chambers 4 are designed essentially lengthwise, wherein their depth T is preferably at least approximately 0.5 times the above-mentioned, average diameter D and especially approximately 1.0 to times the diameter D.
The hollow chambers 4 are designed here at least substantially similarly in shape.
In particular, the hollow chambers 4 are designed substantially cylindrically. But the hollow chambers 4 can also present a form deviating therefrom, for example they can be designed substantially conically.
In general, the hollow chambers 4 can also have a cross-section varying in its 3o depth T in form and/or diameter. In addition to this, the hollow chambers 4 can be designed substantially conically as a rough structure for example, and provided along their walls with many fine depressions (small hollow chambers) to form a fine structure in each case.
-6- The hollow chambers 4 are preferably distributed at least substantially uniformly over the surface of the surface layer 3 or over the stamping surface 2. However, uneven distribution is also feasible.
The hollow chambers or their openings are preferably distributed over the stamping surface 2 with a surface density of 109 to 10"/cm 2 In the illustrative example the surface density is substantially constant over the stamping surface 2.
But the surface density can also vary partially on the stamping surface 2 as required.
SThe area of the openings of the hollow chambers 4 is, at the most, preferably of the extension area of the stamping surface 2. A sufficiently high stability or carrying capacity of the stamping surface 2 or the surface layer 3/covering layer 6 is hereby achieved with respect to the high stresses arising during the stamping.
In general, the form, configuration, surface density and the like of the hollow chambers 4 can be controlled by corresponding choice of the procedural conditions during anodic oxidation. For example, with oxidation of aluminium under potentiostatic conditions with at least substantially constant voltage an at least substantially even cross-section of the hollow chambers 4 is achieved over their depth T, i.e. an at least substantially cylindrical form. Accordingly, the form of the hollow chambers 4 can be influenced by varying the voltage. For example, galvanostatic oxidation i.e. at an at least substantially constant current leads to a somewhat conical or hill-like form of the hollow chambers 4, so that a type of "moth eye structure" or the like can be formed in this way. The surface density of the hollow chambers 4, i.e. the number of hollow chambers 4 per surface unit the stamping surface 2, depends inter alia on the voltage and the current during anodising.
As required, the hollow chambers 4 can vary in their form, depth and/or surface density over the stamping surface 2, especially partially, and/or be designed only partly on the stamping surface 2.
And, if required, the stamping surface 2 can also be modified before and/or after oxidation creation of the hollow chambers 4 for example via a lithographic process, etching and/or other, preferably material-stripping methods, for example to create a rough structure in the form of paths, ridges, areas with or without hollow chambers 4, large-surface bumps or depressions and the like on the stamping surface 2.
Chemical sizing, especially by partial etching of oxide material, can also be carried out to modify the stamping surface 2 or the hollow chambers 4. In this way the surface ratio of the opening surfaces of the hollow chambers 4 to the extension area of the stamping surface 2 can be varied or increased. It is understood that other modifications of the stamping surface 2 or of the hollow chambers 4 0can also be made, depending on reaction time and intensity.
A particular advantage of the proposed solution is that the stamping surface 2 can also be designed in a curved manner for example cylindrically or bulged for example lenticular or hemispherical. In particular the stamping surface 2 can have practically any shape at all. Compared to the prior art it is thus not necessary that the stamping surface 2 or the surface of the surface layer 3/covering layer 6 is at least substantially even.
The figure also shows a work piece 8, likewise in a highly simplified, not true-toscale sectional diagram, in the already stamped state, i.e. with a surface 9 already structured by the stamping tool 1. Stamping takes places especially by the stamping tool 1 being pressed with a corresponding stamping force onto the surface 9 of the work piece 8 to be structured, so that the material of the work piece 8 flows at least partially into the hollow chambers 4. Here it is not necessary that the work piece 8, as illustrated diagrammatically in the figure, is designed in a monobloc manner. Instead, the work piece 8 can also present another type of surface layer or surface coating or the like, not illustrated here, which forms the surface 9 and is structured or designed in a relief-like manner by means of the stamping tool 1.
Instead of the stamp-like embossing the stamping tool 1 can be unrolled with corresponding shaping/form of the stamping surface 2 and/or the surface 9 to be structured. By way of example the stamping surface 2 and/or the surface 9 to be structured can be designed in a curved manner for example cylindrically or in a bulged manner to enable reciprocal unrolling for structuring the surface 9.
Both a die stamping process and also a rolling stamp process can be realised with the proposed solution.
Furthermnnore, the proposed solution can be used for embossing as well as closeddie coining or coining. A corresponding abutment for the work piece 8 or a corresponding countertool is not illustrated for clarification purposes.
0 The proposed stamping tool 1 allows very fine structuring of the work piece 8 or its surface 9. If needed the work piece 8 or the surface 9 can also be profiled or structured repeatedly, first with a rough structured stamping tool optionally manufactured also in customary fashion and then with the finer structured proposed stamping tool 1. A lower stamping force is employed, especially during the second stamping procedure using the finer stamping tool 1 and/or, in an intermediate step, the surface 9 is hardened in order not to fully neutralise the rough structure produced at first stamping, but to achieve superposition from the rough structure and the fine structure of both stamping tools. Thus, it is possible, for example, to create on the surface 9 relatively large bumps of the order of 0.1 to 50 jLm each with several, relatively small protrusions, for example of the order of 10 to 400 nm, on the surface 9 of the work piece 8.
The proposed solution very easily and cost-effectively enables very fine structuring of the surface 9. Accordingly, there is a very broad area of application. For example, such especially very fine structuring can be utilised in anti-reflex layers, for altering radiation emission of structured surfaces, in sensory analysis, in catalysis, in self-cleaning surfaces, in improving surface wetability and the like.
In particular, the proposed solution also extends to the use of work pieces 8 with structured surfaces 9 that have been structured by use of the proposed stamping tool 1 for the purposes mentioned hereinabove.
In particular the proposed solution is suited for stamping synthetic materials for example PMMA (polymethyl methacrylates), Teflon or the like, metals for example gold, silver, platinum, lead, idium, cadmium, zinc or the like, polymer coatings for example paints, dyes or the like, and inorganic coating systems etc.
Expressed in general terms, an essential aspect of the present invention is using a surface layer with hollow chambers formed by anodic oxidation as bottom die or upper die, to enable surface structuring in the nanometre range.
0 9a- Where the terms "comprise", "comprises", "comprised" or "comprising" are used in this specification, they are to be interpreted as specifying the presence of the stated features, integers, steps or components referred to, but not to preclude the presence or addition of one or more other feature, integer, step, component or group thereof.

Claims (27)

1. A stamping tool with a structured stamping surface, wherein the stamping surface is formed by an anodically oxidised surface layer or covering layer with open hollow chambers created by the anodic oxidation, wherein the hollow chambers have opening areas with an average diameter of 10 to 500 nm and/or the structural width of the stamping surface is 30 to 600 nm.
2. The stamping tool according to claim 1, wherein the hollow chambers have opening areas with an average, at least essentially uniform diameter of 15 to 200 am-
3. The stamping tool according to claim 1 or claim 2, wherein the hollow chambers have opening areas with an average, at least essentially uniform diameter of to 100 nm.
4. The stamping tool according to any one of the preceding claims, wherein the structural width of the stamping surface is 50 to 200 nm.
The stamping tool according to any one of the preceding claims, wherein the hollow chambers have a depth which is at least 0.5 times the average diameter of the hollow chambers.
6. The stamping tool according to any one of the preceding claims, wherein the hollow chambers have a depth which is greater than the average diameter of the hollow chambers.
7. The stamping tool according to any one of the preceding claims, wherein the hollow chambers are conical.
8. The stamping tool according to any one of the preceding claims, wherein the hollow chambers vary at least in one of form, depth and surface density, over the stamping surface. 09/07/04.jf12961 -11-
9. The stamping tool according to claim 8, wherein the hollow chambers vary partially, and/or are designed only partially on the stamping surface.
The stamping tool according to any one of the preceding claims, wherein the stamping surface includes both fine and rough structures.
11. The stamping tool according to any one of the preceding claims, wherein the stamping surface is curved.
12. The stamping tool according to any one of the preceding claims, wherein the stamping surface is bulged.
13. The stamping tool according to any one of the preceding claims, wherein the surface layer or the covering layer with the hollow chambers consists at least substantially of aluminium oxide, silicon oxide, iron oxide, oxidised steel and/or titanium oxide.
14. A method of producing a stamping tool with a structured stamping surface, wherein a surface layer or covering layer of the stamping tool forming the stamping surface is oxidised at least partially anodically for generating model-free open hollow chambers, so that hollow chambers uniformly shaped and/or at least essentially evenly distributed over the surface or surface area of the stamping surface are formed.
The method according to claim 14, wherein the surface layer or covering layer is oxidised potentiostatically.
16. The method according to claim 14, wherein the surface layer or covering layer is oxidised with varying voltage.
17. The method according to claim 14, wherein the surface layer or covering layer is oxidised galvanostatically.
18. The method according to any one of claims 14 to 17, wherein aluminium, silicon, iron, steel and/or titanium is/are oxidised. 09/07/04jf12961 spc,11 12-
19. The method according to any one of claims 14 to 18, wherein the stamping surface is modified before and/or after oxidising, for producing a rough structure.
The method according to claim 19, wherein the stamping surface is modified by a lithographic method, an etching method and/or a material stripping method.
21. A method of structuring a surface of a work piece by means of a stamping tool with a structured stamping surface, wherein the surface to be structured is structured by means of a stamping tool according to any one of claims 1 to 13, wherein the stamping surface of the stamping tool is pressed onto the surface to be structured and/or rolled thereon.
22. The method according to claim 21, wherein the stamping surface of the stamping tool is pressed and/or rolled on the surface to be structured with a predetermined stamping force and/or the surface is first roughly structured in a first step by means of a first stamping tool and is then finely structured by means of a second stamping tool in a second step.
23. The method according to claim 22, wherein the surface is finely structured by means of said second stamping tool in said second step with a stamping force that is reduced relative to that applied with said first stamping tool.
24. The method according to claim 22 or claim 23, wherein the surface is finely structured by means of said second stamping tool in said second step after hardening of the surface structured by said first step.
Use of a surface layer or covering layer provided with open hollow chambers by anodic oxidation, and thus structured in the nanometer range, of a stamping tool according to any one of claims 1 to 13, wherein the surface layer or covering layer with the hollow chambers is used as stamping surface for structuring a surface of a work piece.
26. Use according to claim 25, wherein the surface layer or covering layer is formed at least substantially of aluminium oxide, silicon oxide, iron oxide, oxidised steel and/or titanium oxide. 09/7/04jf12961 spc,12 13-
27. A stamping tool, substantially as hereinbefore described with reference to the accompanying drawings. Dated this 9 h day of July, 2004 ALCOVE SURFACES GMBH By Their Patent Attorneys CALLINAN LAWRIE 09/07/0412961 8pc,13
AU2001256323A 2000-04-28 2001-04-25 Stamping tool, method for structuring a surface of a workpiece and use of an anodized surface layer Ceased AU2001256323B2 (en)

Applications Claiming Priority (3)

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DE10020877.0 2000-04-28
DE10020877A DE10020877C1 (en) 2000-04-28 2000-04-28 Stamping tool has a structured stamping surface with an anodically oxidized surface layer or a covering layer having open hollow chambers produced by anodic oxidation
PCT/EP2001/004650 WO2001083198A1 (en) 2000-04-28 2001-04-25 Stamping tool, method for structuring a surface of a workpiece and use of an anodized surface layer

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AU2001256323B2 true AU2001256323B2 (en) 2004-08-05

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AT (1) ATE270954T1 (en)
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CA (1) CA2407209A1 (en)
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