USD971167S1 - Lower shield for a substrate processing chamber - Google Patents

Lower shield for a substrate processing chamber Download PDF

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Publication number
USD971167S1
USD971167S1 US29/778,108 US202129778108F USD971167S US D971167 S1 USD971167 S1 US D971167S1 US 202129778108 F US202129778108 F US 202129778108F US D971167 S USD971167 S US D971167S
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United States
Prior art keywords
processing chamber
substrate processing
lower shield
view
shield
Prior art date
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US29/778,108
Inventor
Sarath Babu
Ananthkrishna Jupudi
Yueh Sheng Ow
Junqi Wei
Kelvin Boh
Yuichi Wada
Kang Zhang
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Applied Materials Inc
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Applied Materials Inc
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Priority to US29/778,108 priority Critical patent/USD971167S1/en
Assigned to APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD. reassignment APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OW, Yueh Sheng, BOH, Kelvin, JUPUDI, ANANTHKRISHNA, WEI, JUNQI, BABU, Sarath, KANG, ZHANG
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WADA, YUICHI
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
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FIG. 1 is a top isometric view of a lower shield for a substrate processing chamber, according to the novel design.
FIG. 2 is a top plan view thereof.
FIG. 3 is a bottom plan view thereof.
FIG. 4 is a front elevation view thereof.
FIG. 5 is a back elevation view thereof.
FIG. 6 is a right side elevation view thereof.
FIG. 7 is a left side elevation view thereof; and,
FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 2.
The broken lines show portions of a lower shield for a substrate processing chamber that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a lower shield for a substrate processing chamber, as shown and described.
US29/778,108 2019-08-28 2021-04-10 Lower shield for a substrate processing chamber Active USD971167S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/778,108 USD971167S1 (en) 2019-08-28 2021-04-10 Lower shield for a substrate processing chamber

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/703,658 USD931241S1 (en) 2019-08-28 2019-08-28 Lower shield for a substrate processing chamber
US29/778,108 USD971167S1 (en) 2019-08-28 2021-04-10 Lower shield for a substrate processing chamber

Related Parent Applications (1)

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US29/703,658 Division USD931241S1 (en) 2019-08-28 2019-08-28 Lower shield for a substrate processing chamber

Publications (1)

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USD971167S1 true USD971167S1 (en) 2022-11-29

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US29/703,658 Active USD931241S1 (en) 2019-08-28 2019-08-28 Lower shield for a substrate processing chamber
US29/778,108 Active USD971167S1 (en) 2019-08-28 2021-04-10 Lower shield for a substrate processing chamber

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US29/703,658 Active USD931241S1 (en) 2019-08-28 2019-08-28 Lower shield for a substrate processing chamber

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US (2) USD931241S1 (en)
JP (2) JP1683052S (en)
TW (2) TWD211584S (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11387134B2 (en) * 2018-01-19 2022-07-12 Applied Materials, Inc. Process kit for a substrate support
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber

Citations (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020170881A1 (en) 2001-05-16 2002-11-21 Lam Research Hollow anode plasma reactor and method
USD467648S1 (en) * 2002-01-23 2002-12-24 Delva O'neil In-line drain trap
US6733620B1 (en) 1998-03-06 2004-05-11 Tokyo Electron Limited Process apparatus
US20040149216A1 (en) 2002-11-13 2004-08-05 Anelva Corporation Plasma processing apparatus
USD494551S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
JP2006060073A (en) 2004-08-20 2006-03-02 Tokyo Electron Ltd Plasma processing equipment
US20060213438A1 (en) 2005-03-28 2006-09-28 Tokyo Electron Limited Plasma enhanced atomic layer deposition system
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US20090188625A1 (en) 2008-01-28 2009-07-30 Carducci James D Etching chamber having flow equalizer and lower liner
US20100291319A1 (en) 2007-09-29 2010-11-18 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
US20110108524A1 (en) 2009-08-31 2011-05-12 Rajinder Dhindsa Local plasma confinement and pressure control arrangement and methods thereof
US7988815B2 (en) 2007-07-26 2011-08-02 Applied Materials, Inc. Plasma reactor with reduced electrical skew using electrical bypass elements
US20110207332A1 (en) 2010-02-25 2011-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. Thin film coated process kits for semiconductor manufacturing tools
US20120305185A1 (en) 2011-05-31 2012-12-06 Applied Materials, Inc. Apparatus and methods for dry etch with edge, side and back protection
WO2014014566A1 (en) 2012-07-20 2014-01-23 Applied Materials, Inc. Symmetrical inductively coupled plasma source with symmetrical flow chamber
USD720051S1 (en) * 2011-01-20 2014-12-23 Victaulic Company Pipe element
TWD167109S (en) 2013-05-15 2015-04-11 荏原製作所股份有限公司 Substrate retaining ring
USD741449S1 (en) * 2014-08-19 2015-10-20 Nuvo Residential, Llc Chemical release cartridge
USD741823S1 (en) * 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
USD749702S1 (en) * 2014-02-06 2016-02-16 David M. Rohn Drain pipe discharge connector
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
TWD179672S (en) 2015-10-06 2016-11-21 荏原製作所股份有限公司 Part of the substrate retaining ring
USD784901S1 (en) * 2015-05-29 2017-04-25 Marine Town Inc. Motorwell drain
USD791090S1 (en) * 2015-09-04 2017-07-04 Hitachi Kokusai Electric Inc. Reaction tube
USD795664S1 (en) * 2012-11-07 2017-08-29 Albion Engineering Sleeve for loading bulk viscous material from a container into a dispensing device
USD798423S1 (en) * 2015-12-21 2017-09-26 Ipex Technologies Inc. Pipe with extended bell portion
USD799690S1 (en) * 2014-12-22 2017-10-10 Ebara Corporation Inner cylinder for exhaust gas treatment apparatus
US9865437B2 (en) 2014-12-30 2018-01-09 Applied Materials, Inc. High conductance process kit
US20180061618A1 (en) 2016-08-26 2018-03-01 Applied Materials, Inc. Plasma screen for plasma processing chamber
USD815516S1 (en) * 2014-09-02 2018-04-17 General Electric Company Connector joint
USD816191S1 (en) * 2016-06-13 2018-04-24 5132887 Manitoba Ltd. Plumbing fitting
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD836573S1 (en) * 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD841782S1 (en) * 2017-02-28 2019-02-26 Nitto Kohki Co., Ltd. Plug for a pipe coupling
USD849442S1 (en) * 2017-02-13 2019-05-28 Steven D. Mathison Paper towel roll core
USD852136S1 (en) * 2014-10-17 2019-06-25 Ebara Corporation Rotor for rotary electrical machine
USD861758S1 (en) * 2017-07-10 2019-10-01 Lincoln Global, Inc. Vented plasma cutting electrode
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070113783A1 (en) * 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
USD642605S1 (en) * 2010-04-02 2011-08-02 Applied Materials, Inc. Lid assembly for a substrate processing chamber
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
JP1551512S (en) * 2015-06-12 2016-06-13
JP1546799S (en) * 2015-06-12 2016-03-28
JP1564934S (en) * 2016-02-26 2016-12-05
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
JP1598442S (en) * 2017-08-09 2018-02-26
JP1620194S (en) * 2018-01-22 2018-12-10
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD893441S1 (en) * 2019-06-28 2020-08-18 Applied Materials, Inc. Base plate for a processing chamber substrate support

Patent Citations (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6733620B1 (en) 1998-03-06 2004-05-11 Tokyo Electron Limited Process apparatus
US20020170881A1 (en) 2001-05-16 2002-11-21 Lam Research Hollow anode plasma reactor and method
USD467648S1 (en) * 2002-01-23 2002-12-24 Delva O'neil In-line drain trap
US20040149216A1 (en) 2002-11-13 2004-08-05 Anelva Corporation Plasma processing apparatus
USD494551S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
JP2006060073A (en) 2004-08-20 2006-03-02 Tokyo Electron Ltd Plasma processing equipment
US20060213438A1 (en) 2005-03-28 2006-09-28 Tokyo Electron Limited Plasma enhanced atomic layer deposition system
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US7988815B2 (en) 2007-07-26 2011-08-02 Applied Materials, Inc. Plasma reactor with reduced electrical skew using electrical bypass elements
US20100291319A1 (en) 2007-09-29 2010-11-18 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
US20090188625A1 (en) 2008-01-28 2009-07-30 Carducci James D Etching chamber having flow equalizer and lower liner
US20110108524A1 (en) 2009-08-31 2011-05-12 Rajinder Dhindsa Local plasma confinement and pressure control arrangement and methods thereof
US20110207332A1 (en) 2010-02-25 2011-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. Thin film coated process kits for semiconductor manufacturing tools
USD720051S1 (en) * 2011-01-20 2014-12-23 Victaulic Company Pipe element
US20120305185A1 (en) 2011-05-31 2012-12-06 Applied Materials, Inc. Apparatus and methods for dry etch with edge, side and back protection
WO2014014566A1 (en) 2012-07-20 2014-01-23 Applied Materials, Inc. Symmetrical inductively coupled plasma source with symmetrical flow chamber
USD795664S1 (en) * 2012-11-07 2017-08-29 Albion Engineering Sleeve for loading bulk viscous material from a container into a dispensing device
TWD167109S (en) 2013-05-15 2015-04-11 荏原製作所股份有限公司 Substrate retaining ring
USD741823S1 (en) * 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
USD749702S1 (en) * 2014-02-06 2016-02-16 David M. Rohn Drain pipe discharge connector
USD741449S1 (en) * 2014-08-19 2015-10-20 Nuvo Residential, Llc Chemical release cartridge
USD815516S1 (en) * 2014-09-02 2018-04-17 General Electric Company Connector joint
USD852136S1 (en) * 2014-10-17 2019-06-25 Ebara Corporation Rotor for rotary electrical machine
USD799690S1 (en) * 2014-12-22 2017-10-10 Ebara Corporation Inner cylinder for exhaust gas treatment apparatus
US9865437B2 (en) 2014-12-30 2018-01-09 Applied Materials, Inc. High conductance process kit
USD784901S1 (en) * 2015-05-29 2017-04-25 Marine Town Inc. Motorwell drain
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD791090S1 (en) * 2015-09-04 2017-07-04 Hitachi Kokusai Electric Inc. Reaction tube
TWD179672S (en) 2015-10-06 2016-11-21 荏原製作所股份有限公司 Part of the substrate retaining ring
USD798423S1 (en) * 2015-12-21 2017-09-26 Ipex Technologies Inc. Pipe with extended bell portion
USD816191S1 (en) * 2016-06-13 2018-04-24 5132887 Manitoba Ltd. Plumbing fitting
US20180061618A1 (en) 2016-08-26 2018-03-01 Applied Materials, Inc. Plasma screen for plasma processing chamber
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD836573S1 (en) * 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD849442S1 (en) * 2017-02-13 2019-05-28 Steven D. Mathison Paper towel roll core
USD841782S1 (en) * 2017-02-28 2019-02-26 Nitto Kohki Co., Ltd. Plug for a pipe coupling
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD861758S1 (en) * 2017-07-10 2019-10-01 Lincoln Global, Inc. Vented plasma cutting electrode

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
International Search Report and Written Opinion for PCT/US2020/048303 dated Dec. 4, 2020.
Search Report for Taiwan Design Application No. 109300802, dated Aug. 5, 2020.

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Publication number Publication date
JP1684624S (en) 2021-05-10
TWD211584S (en) 2021-05-11
JP1683052S (en) 2021-04-12
USD931241S1 (en) 2021-09-21
TWD211387S (en) 2021-05-11

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