USD913978S1 - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
USD913978S1
USD913978S1 US29/673,188 US201829673188F USD913978S US D913978 S1 USD913978 S1 US D913978S1 US 201829673188 F US201829673188 F US 201829673188F US D913978 S USD913978 S US D913978S
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semiconductor module
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semiconductor
module
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Ryuichi Furutani
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Rohm Co Ltd
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Rohm Co Ltd
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JPJP2018-014083 2018-06-26
JPD2018-14083F JP1641098S (enrdf_load_stackoverflow) 2018-06-26 2018-06-26

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JP (1) JP1641098S (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD936025S1 (en) * 2018-12-26 2021-11-16 Lg Chem, Ltd. Flexible printed circuit board for battery module
USD937791S1 (en) * 2018-12-26 2021-12-07 Lg Chem, Ltd. Flexible printed circuit board for battery module
USD962182S1 (en) * 2019-03-27 2022-08-30 Gudeng Precision Industrial Co., Ltd. Reticle pod connecting frame
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD1046800S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1046801S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1073632S1 (en) * 2021-04-23 2025-05-06 Wolfspeed, Inc. Power module

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1021830S1 (en) 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1021829S1 (en) 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1022932S1 (en) 2021-03-16 2024-04-16 Rohm Co., Ltd. Semiconductor module

Citations (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3602846A (en) 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3762039A (en) 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3825876A (en) 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US3846734A (en) 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
US4391408A (en) * 1980-09-05 1983-07-05 Augat Inc. Low insertion force connector
US4663833A (en) 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
US4916519A (en) 1989-05-30 1990-04-10 International Business Machines Corporation Semiconductor package
US4987474A (en) * 1987-09-18 1991-01-22 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
USD357462S (en) 1993-09-16 1995-04-18 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD357901S (en) 1993-09-27 1995-05-02 Telefonaktiebolaget Lm Ericsson Power supply unit
USD358806S (en) 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD359028S (en) 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD360619S (en) * 1993-09-16 1995-07-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
US5557504A (en) 1993-08-31 1996-09-17 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with detachable module
USD394244S (en) 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US5757070A (en) * 1995-10-24 1998-05-26 Altera Corporation Integrated circuit package
USD396211S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD401912S (en) 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD448739S1 (en) 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US20010038143A1 (en) 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
USD470825S1 (en) * 2001-12-28 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US20030042584A1 (en) 2001-09-05 2003-03-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of manufacturing the same
USD505399S1 (en) 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505400S1 (en) 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD539761S1 (en) 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD548202S1 (en) 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
US7361983B2 (en) * 2002-07-26 2008-04-22 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and semiconductor assembly module with a gap-controlling lead structure
US20080142948A1 (en) 2006-12-15 2008-06-19 Mitsubishi Electric Corporation Semiconductor device
US20100149774A1 (en) 2008-12-17 2010-06-17 Mitsubishi Electric Corporation Semiconductor device
USD648682S1 (en) * 2011-03-31 2011-11-15 Cheng Uei Precision Industry Co., Ltd. Double-card connector
USD674760S1 (en) * 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device
USD705184S1 (en) 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
USD717254S1 (en) 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719537S1 (en) 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
JP1551590S (enrdf_load_stackoverflow) 2015-11-30 2016-06-13
US9418975B1 (en) 2015-03-24 2016-08-16 Mitsubishi Electric Corporation Semiconductor module, power conversion device, and method for manufacturing semiconductor module
USD766851S1 (en) 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD767516S1 (en) 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD770994S1 (en) 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
JP1565636S (enrdf_load_stackoverflow) 2016-03-11 2016-12-19
USD783549S1 (en) 2015-02-04 2017-04-11 Mitsubishi Electric Corporation Semiconductor device
JP1578687S (enrdf_load_stackoverflow) 2016-11-08 2017-06-12
USD805485S1 (en) 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
USD814431S1 (en) 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853342S1 (en) 2017-02-28 2019-07-09 Infineon Technologies Ag High-performance semiconductor module
USD859334S1 (en) 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD864884S1 (en) 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD873226S1 (en) 2018-04-13 2020-01-21 Rohm Co., Ltd. Semiconductor module
USD874411S1 (en) 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD874412S1 (en) 2018-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD877102S1 (en) 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD877708S1 (en) * 2013-10-17 2020-03-10 Vlt, Inc. Electrical terminal
USD884662S1 (en) 2018-06-01 2020-05-19 Fuji Electric Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module

Patent Citations (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3602846A (en) 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3825876A (en) 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US3762039A (en) 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3846734A (en) 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
US4391408A (en) * 1980-09-05 1983-07-05 Augat Inc. Low insertion force connector
US4663833A (en) 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
US4987474A (en) * 1987-09-18 1991-01-22 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
US4916519A (en) 1989-05-30 1990-04-10 International Business Machines Corporation Semiconductor package
US5557504A (en) 1993-08-31 1996-09-17 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with detachable module
USD359028S (en) 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD357462S (en) 1993-09-16 1995-04-18 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD360619S (en) * 1993-09-16 1995-07-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD358806S (en) 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD357901S (en) 1993-09-27 1995-05-02 Telefonaktiebolaget Lm Ericsson Power supply unit
US5757070A (en) * 1995-10-24 1998-05-26 Altera Corporation Integrated circuit package
USD394244S (en) 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD401912S (en) 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD396211S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
US20010038143A1 (en) 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
USD448739S1 (en) 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
US20030042584A1 (en) 2001-09-05 2003-03-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of manufacturing the same
USD470825S1 (en) * 2001-12-28 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US7361983B2 (en) * 2002-07-26 2008-04-22 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and semiconductor assembly module with a gap-controlling lead structure
USD505399S1 (en) 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505400S1 (en) 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD548202S1 (en) 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD539761S1 (en) 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
US20080142948A1 (en) 2006-12-15 2008-06-19 Mitsubishi Electric Corporation Semiconductor device
USD874411S1 (en) 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
US20100149774A1 (en) 2008-12-17 2010-06-17 Mitsubishi Electric Corporation Semiconductor device
USD648682S1 (en) * 2011-03-31 2011-11-15 Cheng Uei Precision Industry Co., Ltd. Double-card connector
USD674760S1 (en) * 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device
USD719113S1 (en) 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD769834S1 (en) * 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD719537S1 (en) 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
USD705184S1 (en) 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
USD805485S1 (en) 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
USD877708S1 (en) * 2013-10-17 2020-03-10 Vlt, Inc. Electrical terminal
USD770994S1 (en) 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD773412S1 (en) 2015-02-04 2016-12-06 Mitsubishi Electric Corporation Semiconductor device
USD773413S1 (en) 2015-02-04 2016-12-06 Mitsubishi Electric Corporation Semiconductor device
USD783549S1 (en) 2015-02-04 2017-04-11 Mitsubishi Electric Corporation Semiconductor device
USD766851S1 (en) 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD767516S1 (en) 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
US9418975B1 (en) 2015-03-24 2016-08-16 Mitsubishi Electric Corporation Semiconductor module, power conversion device, and method for manufacturing semiconductor module
USD814431S1 (en) 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
JP1551590S (enrdf_load_stackoverflow) 2015-11-30 2016-06-13
JP1565636S (enrdf_load_stackoverflow) 2016-03-11 2016-12-19
USD810036S1 (en) 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module
JP1578687S (enrdf_load_stackoverflow) 2016-11-08 2017-06-12
USD853342S1 (en) 2017-02-28 2019-07-09 Infineon Technologies Ag High-performance semiconductor module
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD864884S1 (en) 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD873227S1 (en) 2017-10-23 2020-01-21 Mitsubishi Electric Corporation Semiconductor device
USD864135S1 (en) 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD859334S1 (en) 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD877102S1 (en) 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD873226S1 (en) 2018-04-13 2020-01-21 Rohm Co., Ltd. Semiconductor module
USD874412S1 (en) 2018-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD884662S1 (en) 2018-06-01 2020-05-19 Fuji Electric Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
"Rohm Semiconductor". Found online Aug. 11, 2020 at electropages.com. Reference dated Nov. 25, 2016. Retrieved from https://www.electropages.com/2016/11/rohm-semiconductor-arduino-shield-easier-faster-stepper-motor-driver-designs. (Year: 2016). *
"Semiconductor Chips". Found online Aug. 11, 2020 at alamy.com. Reference dated 2006. Retrieved from https://www.alamy.com/stock-photo-various-semiconductor-chips-leds-and-crystals-on-a-blue-background-17367441.html. (Year: 2006). *
"Semiconductor Devices". Found online Aug. 11, 2020 at byjus.com. Reference dated Jan. 5, 2017. Retrieved from https://web.archive.org/web/20170105213522/https://byjus.com/physics/semiconductor-devices/. (Year: 2017). *

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD936025S1 (en) * 2018-12-26 2021-11-16 Lg Chem, Ltd. Flexible printed circuit board for battery module
USD937791S1 (en) * 2018-12-26 2021-12-07 Lg Chem, Ltd. Flexible printed circuit board for battery module
USD962182S1 (en) * 2019-03-27 2022-08-30 Gudeng Precision Industrial Co., Ltd. Reticle pod connecting frame
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD1073632S1 (en) * 2021-04-23 2025-05-06 Wolfspeed, Inc. Power module
USD1046800S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1046801S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device

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