USD862404S1 - Sealing material ring for a semiconductor manufacturing apparatus - Google Patents

Sealing material ring for a semiconductor manufacturing apparatus Download PDF

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Publication number
USD862404S1
USD862404S1 US29/601,165 US201729601165F USD862404S US D862404 S1 USD862404 S1 US D862404S1 US 201729601165 F US201729601165 F US 201729601165F US D862404 S USD862404 S US D862404S
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US
United States
Prior art keywords
sealing material
manufacturing apparatus
semiconductor manufacturing
material ring
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/601,165
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English (en)
Inventor
Satoru Murata
Shinya Morita
Masashi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daikin Finetech Ltd
Kokusai Electric Corp
Original Assignee
Toho Kasei Co Ltd
Kokusai Electric Corp
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Publication date
Application filed by Toho Kasei Co Ltd, Kokusai Electric Corp filed Critical Toho Kasei Co Ltd
Assigned to HITACHI KOKUSAI ELECTRIC INC., TOHO KASEI CO., LTD. reassignment HITACHI KOKUSAI ELECTRIC INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MORITA, SHINYA, MURATA, SATORU, SUZUKI, MASASHI
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI KOKUSAI ELECTRIC INC.
Application granted granted Critical
Publication of USD862404S1 publication Critical patent/USD862404S1/en
Assigned to DAIKIN FINETECH, LTD. reassignment DAIKIN FINETECH, LTD. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: TOHO KASEI CO., LTD.
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US29/601,165 2016-10-25 2017-04-19 Sealing material ring for a semiconductor manufacturing apparatus Active USD862404S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2016-23182F JP1581911S (enrdf_load_stackoverflow) 2016-10-25 2016-10-25
JP2016-023182 2016-10-25

Publications (1)

Publication Number Publication Date
USD862404S1 true USD862404S1 (en) 2019-10-08

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US29/601,165 Active USD862404S1 (en) 2016-10-25 2017-04-19 Sealing material ring for a semiconductor manufacturing apparatus

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US (1) USD862404S1 (enrdf_load_stackoverflow)
JP (1) JP1581911S (enrdf_load_stackoverflow)
TW (1) TWD189312S (enrdf_load_stackoverflow)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD879046S1 (en) * 2017-10-06 2020-03-24 Laird Technologies, Inc. Material having edging
USD881822S1 (en) * 2017-10-06 2020-04-21 Laird Technologies, Inc. Material having an edge shape
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD909323S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD949116S1 (en) * 2019-05-03 2022-04-19 Lumileds Holding B.V. Flexible circuit board with connectors
USD971192S1 (en) 2019-06-03 2022-11-29 Space Exploration Technologies Corp. Antenna apparatus
USD971900S1 (en) * 2019-06-03 2022-12-06 Space Exploration Technologies Corp. Antenna apparatus
USD976242S1 (en) 2019-06-03 2023-01-24 Space Exploration Technologies Corp. Antenna apparatus
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD992615S1 (en) * 2018-12-07 2023-07-18 Tokyo Electron Limited Focus ring
USD999405S1 (en) * 2017-10-06 2023-09-19 Laird Technologies, Inc. Material having edging
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1031951S1 (en) * 2020-07-30 2024-06-18 Valqua, Ltd. Composite seal
US12040306B2 (en) 2016-07-11 2024-07-16 Laird Technologies, Inc. Systems of applying materials to components
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1047884S1 (en) * 2021-10-22 2024-10-22 Nuflare Technology, Inc. Susceptor cover
USD1049067S1 (en) * 2022-04-04 2024-10-29 Applied Materials, Inc. Ring for an anti-rotation process kit for a substrate processing chamber
USD1055006S1 (en) * 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1066275S1 (en) 2022-04-04 2025-03-11 Applied Materials, Inc. Baffle for anti-rotation process kit for substrate processing chamber
USD1071887S1 (en) * 2023-01-31 2025-04-22 Valqua, Ltd. Composite seal for semiconductor manufacturing device
US12293902B2 (en) 2018-01-19 2025-05-06 Applied Materials, Inc. Process kit for a substrate support

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD193792S (zh) 2018-02-01 2018-11-01 億川鐵工所股份有限公司 Seal ring
JP1721756S (ja) 2021-12-23 2022-08-05 シール材

Citations (15)

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US135712A (en) * 1873-02-11 Improvement in key-rings
US4225162A (en) * 1978-09-20 1980-09-30 Amp Incorporated Liquid tight connector
US4447749A (en) * 1981-07-29 1984-05-08 Black & Decker Inc. Cordless electric device having contact increasing means
US5302980A (en) * 1989-04-14 1994-04-12 Barrett Graham D Lens useful as a keratoscope
US6879023B1 (en) * 2000-03-22 2005-04-12 Broadcom Corporation Seal ring for integrated circuits
TWM270879U (en) 2005-01-28 2005-07-21 Ching-Wen Hung Push/pull constant force enhancing vise with two needle rollers
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US8242586B2 (en) * 2008-09-09 2012-08-14 Mediatek Inc. Integrated circuit chip with seal ring structure
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD803917S1 (en) * 2015-06-16 2017-11-28 Hitachi Kokusai Electric, Inc. Heat reflector for substrate processing apparatus
USD804556S1 (en) * 2015-06-16 2017-12-05 Hitachi Kokusai Electric Inc. Heat reflector for substrate processing apparatus
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US135712A (en) * 1873-02-11 Improvement in key-rings
US4225162A (en) * 1978-09-20 1980-09-30 Amp Incorporated Liquid tight connector
US4447749A (en) * 1981-07-29 1984-05-08 Black & Decker Inc. Cordless electric device having contact increasing means
US5302980A (en) * 1989-04-14 1994-04-12 Barrett Graham D Lens useful as a keratoscope
US6879023B1 (en) * 2000-03-22 2005-04-12 Broadcom Corporation Seal ring for integrated circuits
TWM270879U (en) 2005-01-28 2005-07-21 Ching-Wen Hung Push/pull constant force enhancing vise with two needle rollers
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US8242586B2 (en) * 2008-09-09 2012-08-14 Mediatek Inc. Integrated circuit chip with seal ring structure
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD803917S1 (en) * 2015-06-16 2017-11-28 Hitachi Kokusai Electric, Inc. Heat reflector for substrate processing apparatus
USD804556S1 (en) * 2015-06-16 2017-12-05 Hitachi Kokusai Electric Inc. Heat reflector for substrate processing apparatus
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
Assortment Tray A/C Green Universal O-Rings, 18 Styles-110 PCS, https://henrysautowarehouse.com/product/assortment-tray-ac-green-universal-o-rings-18-styles-110-pcs/,copyright 2019 Henry's Automotive Warehouse. (Year: 2019). *
DANCO#18 O-Rings (10-Pack), https://www.homedepot.com/p/DANCO-18-O-Rings-10-Pack-96735/100299374, copyright 2000, Home Depot Product Authority, LLC. (Year: 2000). *
Office Action of TW Appln. No. 106301911 dated Sep. 6, 2017, with English translation.
O-Ring, Item #23CJ16, Mfr Model # PP60076G, https://www.grainger.com/product/DAYTON-O-Ring-for-4ZA35A-23CJ16, Grainger, copyright 1994. (Year: 1994). *
O-Rings-Freudenberg Innovating Together, Sealing Technologies, https://www.fst.com/products/static-seals/o-rings, by Freudenberg Sealing Technologies, May 24, 2018. (Year: 2018). *

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12040306B2 (en) 2016-07-11 2024-07-16 Laird Technologies, Inc. Systems of applying materials to components
USD879046S1 (en) * 2017-10-06 2020-03-24 Laird Technologies, Inc. Material having edging
USD881822S1 (en) * 2017-10-06 2020-04-21 Laird Technologies, Inc. Material having an edge shape
USD999405S1 (en) * 2017-10-06 2023-09-19 Laird Technologies, Inc. Material having edging
USD998827S1 (en) * 2017-10-06 2023-09-12 Laird Technologies, Inc. Material having edge shape
US12293902B2 (en) 2018-01-19 2025-05-06 Applied Materials, Inc. Process kit for a substrate support
USD933032S1 (en) 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933033S1 (en) 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933619S1 (en) 2018-10-12 2021-10-19 Valqua, Ltd. Seal member for semiconductor production apparatus
USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD933031S1 (en) 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD909323S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD992615S1 (en) * 2018-12-07 2023-07-18 Tokyo Electron Limited Focus ring
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD949116S1 (en) * 2019-05-03 2022-04-19 Lumileds Holding B.V. Flexible circuit board with connectors
USD971192S1 (en) 2019-06-03 2022-11-29 Space Exploration Technologies Corp. Antenna apparatus
USD976242S1 (en) 2019-06-03 2023-01-24 Space Exploration Technologies Corp. Antenna apparatus
USD1012070S1 (en) 2019-06-03 2024-01-23 Space Exploration Technologies Corp. Antenna apparatus
USD971900S1 (en) * 2019-06-03 2022-12-06 Space Exploration Technologies Corp. Antenna apparatus
USD1031951S1 (en) * 2020-07-30 2024-06-18 Valqua, Ltd. Composite seal
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1021832S1 (en) * 2020-09-17 2024-04-09 Ebara Corporation Elastic membrane
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1047884S1 (en) * 2021-10-22 2024-10-22 Nuflare Technology, Inc. Susceptor cover
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) * 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1049067S1 (en) * 2022-04-04 2024-10-29 Applied Materials, Inc. Ring for an anti-rotation process kit for a substrate processing chamber
USD1066275S1 (en) 2022-04-04 2025-03-11 Applied Materials, Inc. Baffle for anti-rotation process kit for substrate processing chamber
USD1071887S1 (en) * 2023-01-31 2025-04-22 Valqua, Ltd. Composite seal for semiconductor manufacturing device

Also Published As

Publication number Publication date
JP1581911S (enrdf_load_stackoverflow) 2017-07-24
TWD189312S (zh) 2018-03-21

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