JP1581911S - - Google Patents

Info

Publication number
JP1581911S
JP1581911S JPD2016-23182F JP2016023182F JP1581911S JP 1581911 S JP1581911 S JP 1581911S JP 2016023182 F JP2016023182 F JP 2016023182F JP 1581911 S JP1581911 S JP 1581911S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2016-23182F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2016-23182F priority Critical patent/JP1581911S/ja
Priority to TW106301911F priority patent/TWD189312S/zh
Priority to US29/601,165 priority patent/USD862404S1/en
Application granted granted Critical
Publication of JP1581911S publication Critical patent/JP1581911S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2016-23182F 2016-10-25 2016-10-25 Active JP1581911S (enrdf_load_stackoverflow)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2016-23182F JP1581911S (enrdf_load_stackoverflow) 2016-10-25 2016-10-25
TW106301911F TWD189312S (zh) 2016-10-25 2017-04-13 Sealing material for semiconductor manufacturing equipment
US29/601,165 USD862404S1 (en) 2016-10-25 2017-04-19 Sealing material ring for a semiconductor manufacturing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2016-23182F JP1581911S (enrdf_load_stackoverflow) 2016-10-25 2016-10-25

Publications (1)

Publication Number Publication Date
JP1581911S true JP1581911S (enrdf_load_stackoverflow) 2017-07-24

Family

ID=59351533

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2016-23182F Active JP1581911S (enrdf_load_stackoverflow) 2016-10-25 2016-10-25

Country Status (3)

Country Link
US (1) USD862404S1 (enrdf_load_stackoverflow)
JP (1) JP1581911S (enrdf_load_stackoverflow)
TW (1) TWD189312S (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1036632S1 (en) 2021-12-23 2024-07-23 Daikin Finetech, Ltd. Seal member

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US10741519B2 (en) 2016-07-11 2020-08-11 Laird Technologies, Inc. Systems of applying materials to components
USD999405S1 (en) * 2017-10-06 2023-09-19 Laird Technologies, Inc. Material having edging
USD881822S1 (en) * 2017-10-06 2020-04-21 Laird Technologies, Inc. Material having an edge shape
USD879046S1 (en) * 2017-10-06 2020-03-24 Laird Technologies, Inc. Material having edging
US12293902B2 (en) 2018-01-19 2025-05-06 Applied Materials, Inc. Process kit for a substrate support
TWD193792S (zh) 2018-02-01 2018-11-01 億川鐵工所股份有限公司 Seal ring
USD909323S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD909322S1 (en) 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
JP1646505S (enrdf_load_stackoverflow) * 2018-12-07 2019-11-25
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD949116S1 (en) * 2019-05-03 2022-04-19 Lumileds Holding B.V. Flexible circuit board with connectors
USD976242S1 (en) 2019-06-03 2023-01-24 Space Exploration Technologies Corp. Antenna apparatus
USD971192S1 (en) 2019-06-03 2022-11-29 Space Exploration Technologies Corp. Antenna apparatus
USD971900S1 (en) * 2019-06-03 2022-12-06 Space Exploration Technologies Corp. Antenna apparatus
USD1031951S1 (en) * 2020-07-30 2024-06-18 Valqua, Ltd. Composite seal
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
JP1711120S (ja) * 2021-10-22 2022-03-29 サセプタカバー
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) * 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1049067S1 (en) * 2022-04-04 2024-10-29 Applied Materials, Inc. Ring for an anti-rotation process kit for a substrate processing chamber
USD1066275S1 (en) 2022-04-04 2025-03-11 Applied Materials, Inc. Baffle for anti-rotation process kit for substrate processing chamber
JP1746769S (ja) * 2023-01-31 2023-06-20 複合シール材

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US135712A (en) * 1873-02-11 Improvement in key-rings
US4225162A (en) * 1978-09-20 1980-09-30 Amp Incorporated Liquid tight connector
US4447749A (en) * 1981-07-29 1984-05-08 Black & Decker Inc. Cordless electric device having contact increasing means
US5302980A (en) * 1989-04-14 1994-04-12 Barrett Graham D Lens useful as a keratoscope
US6879023B1 (en) * 2000-03-22 2005-04-12 Broadcom Corporation Seal ring for integrated circuits
TWM270879U (en) 2005-01-28 2005-07-21 Ching-Wen Hung Push/pull constant force enhancing vise with two needle rollers
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US8242586B2 (en) * 2008-09-09 2012-08-14 Mediatek Inc. Integrated circuit chip with seal ring structure
JP1546800S (enrdf_load_stackoverflow) * 2015-06-12 2016-03-28
JP1545407S (enrdf_load_stackoverflow) * 2015-06-16 2016-03-14
JP1545406S (enrdf_load_stackoverflow) * 2015-06-16 2016-03-14
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
JP1584241S (enrdf_load_stackoverflow) * 2017-01-31 2017-08-21
JP1584906S (enrdf_load_stackoverflow) * 2017-01-31 2017-08-28

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1036632S1 (en) 2021-12-23 2024-07-23 Daikin Finetech, Ltd. Seal member

Also Published As

Publication number Publication date
USD862404S1 (en) 2019-10-08
TWD189312S (zh) 2018-03-21

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