USD720309S1 - Inner tube for process tube for manufacturing semiconductor wafers - Google Patents

Inner tube for process tube for manufacturing semiconductor wafers Download PDF

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Publication number
USD720309S1
USD720309S1 US29/420,537 US201229420537F USD720309S US D720309 S1 USD720309 S1 US D720309S1 US 201229420537 F US201229420537 F US 201229420537F US D720309 S USD720309 S US D720309S
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US
United States
Prior art keywords
tube
semiconductor wafers
manufacturing semiconductor
inner tube
process tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/420,537
Inventor
Hirofumi Kaneko
Atsushi Endo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KANEKO, HIROFUMI, ENDO, ATSUSHI
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Publication of USD720309S1 publication Critical patent/USD720309S1/en
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FIG. 1 is perspective view of an inner tube for process tube for manufacturing semiconductor wafers showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a right side thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 6;
FIG. 9 is an enlarged view of portion 9 encircled in FIG. 8;
FIG. 10 is another front view thereof, shown in a used condition; and,
FIG. 11 is an enlarged view of portion 11 encircled in FIG. 5.
The broken lines shown in the drawings represent portions of the inner tube for process tube for manufacturing semiconductor wafers that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an inner tube for process tube for manufacturing semiconductor wafers, as shown and described.
US29/420,537 2011-11-18 2012-05-10 Inner tube for process tube for manufacturing semiconductor wafers Active USD720309S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011026686 2011-11-18
JP2011-026686 2011-11-18

Publications (1)

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USD720309S1 true USD720309S1 (en) 2014-12-30

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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD742339S1 (en) * 2014-03-12 2015-11-03 Hitachi Kokusai Electric Inc. Reaction tube
USD748594S1 (en) * 2014-03-12 2016-02-02 Hitachi Kokusai Electric Inc. Reaction tube
USD778247S1 (en) * 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD784253S1 (en) * 2016-02-16 2017-04-18 Solaero Technologies Corp. Solar cell
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
USD855027S1 (en) * 2018-01-22 2019-07-30 Kokusai Electric Corporation Cover of seal cap for reaction chamber of semiconductor
USD924823S1 (en) * 2018-07-19 2021-07-13 Kokusai Electric Corporation Adiabatic plate for substrate processing apparatus
USD1019581S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1019582S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1019583S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1053156S1 (en) * 2022-03-15 2024-12-03 Kokusai Electric Corporation Furnace for substrate processing apparatus
USD1070797S1 (en) * 2022-03-15 2025-04-15 Kokusai Electric Corporation Furnace for substrate processing apparatus

Citations (28)

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US4950870A (en) * 1987-11-21 1990-08-21 Tel Sagami Limited Heat-treating apparatus
US5352293A (en) * 1992-01-06 1994-10-04 Samsung Electronics Co., Ltd. Tube apparatus for manufacturing semiconductor device
US5618349A (en) * 1993-07-24 1997-04-08 Yamaha Corporation Thermal treatment with enhanced intra-wafer, intra-and inter-batch uniformity
USD404368S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Outer tube for use in a semiconductor wafer heat processing apparatus
USD405062S (en) * 1997-08-20 1999-02-02 Tokyo Electron Ltd. Processing tube for use in a semiconductor wafer heat processing apparatus
USD405429S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
USD405431S (en) * 1997-08-20 1999-02-09 Tokyo Electron Ltd. Tube for use in a semiconductor wafer heat processing apparatus
USD406113S (en) * 1997-01-31 1999-02-23 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
USD407696S (en) * 1997-08-20 1999-04-06 Tokyo Electron Limited Inner tube for use in a semiconductor wafer heat processing apparatus
US5897311A (en) * 1995-05-31 1999-04-27 Tokyo Electron Limited Support boat for objects to be processed
USD423463S (en) * 1997-01-31 2000-04-25 Tokyo Electron Limited Quartz process tube
USD424024S (en) * 1997-01-31 2000-05-02 Tokyo Electron Limited Quartz process tube
US6251189B1 (en) * 1999-02-18 2001-06-26 Kokusai Electric Co., Ltd. Substrate processing apparatus and substrate processing method
US20030221779A1 (en) * 2002-03-28 2003-12-04 Kazuyuki Okuda Substrate processing apparatus
US20080083372A1 (en) * 2006-08-04 2008-04-10 Hisashi Inoue Heat processing apparatus for semiconductor process
USD586768S1 (en) * 2006-10-12 2009-02-17 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD600659S1 (en) * 2006-09-12 2009-09-22 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD606952S1 (en) * 2009-01-16 2009-12-29 Asm Genitech Korea Ltd. Plasma inducing plate for semiconductor deposition apparatus
USD610559S1 (en) * 2008-05-30 2010-02-23 Hitachi Kokusai Electric, Inc. Reaction tube
USD611013S1 (en) * 2008-03-28 2010-03-02 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD618638S1 (en) * 2008-05-09 2010-06-29 Hitachi Kokusai Electric, Inc. Reaction tube
USD619630S1 (en) * 2007-05-08 2010-07-13 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD655259S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD655257S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD687791S1 (en) * 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
USD687790S1 (en) * 2012-03-20 2013-08-13 Veeco Instruments Inc. Keyed wafer carrier

Patent Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4950870A (en) * 1987-11-21 1990-08-21 Tel Sagami Limited Heat-treating apparatus
US5352293A (en) * 1992-01-06 1994-10-04 Samsung Electronics Co., Ltd. Tube apparatus for manufacturing semiconductor device
US5618349A (en) * 1993-07-24 1997-04-08 Yamaha Corporation Thermal treatment with enhanced intra-wafer, intra-and inter-batch uniformity
US5897311A (en) * 1995-05-31 1999-04-27 Tokyo Electron Limited Support boat for objects to be processed
USD424024S (en) * 1997-01-31 2000-05-02 Tokyo Electron Limited Quartz process tube
USD405429S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
USD423463S (en) * 1997-01-31 2000-04-25 Tokyo Electron Limited Quartz process tube
USD406113S (en) * 1997-01-31 1999-02-23 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
USD404368S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Outer tube for use in a semiconductor wafer heat processing apparatus
USD407696S (en) * 1997-08-20 1999-04-06 Tokyo Electron Limited Inner tube for use in a semiconductor wafer heat processing apparatus
USD405431S (en) * 1997-08-20 1999-02-09 Tokyo Electron Ltd. Tube for use in a semiconductor wafer heat processing apparatus
USD405062S (en) * 1997-08-20 1999-02-02 Tokyo Electron Ltd. Processing tube for use in a semiconductor wafer heat processing apparatus
US6251189B1 (en) * 1999-02-18 2001-06-26 Kokusai Electric Co., Ltd. Substrate processing apparatus and substrate processing method
US20030221779A1 (en) * 2002-03-28 2003-12-04 Kazuyuki Okuda Substrate processing apparatus
US20080083372A1 (en) * 2006-08-04 2008-04-10 Hisashi Inoue Heat processing apparatus for semiconductor process
USD600659S1 (en) * 2006-09-12 2009-09-22 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD586768S1 (en) * 2006-10-12 2009-02-17 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD619630S1 (en) * 2007-05-08 2010-07-13 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD611013S1 (en) * 2008-03-28 2010-03-02 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD618638S1 (en) * 2008-05-09 2010-06-29 Hitachi Kokusai Electric, Inc. Reaction tube
USD610559S1 (en) * 2008-05-30 2010-02-23 Hitachi Kokusai Electric, Inc. Reaction tube
USD606952S1 (en) * 2009-01-16 2009-12-29 Asm Genitech Korea Ltd. Plasma inducing plate for semiconductor deposition apparatus
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD655259S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD655257S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD687791S1 (en) * 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
USD687790S1 (en) * 2012-03-20 2013-08-13 Veeco Instruments Inc. Keyed wafer carrier

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD742339S1 (en) * 2014-03-12 2015-11-03 Hitachi Kokusai Electric Inc. Reaction tube
USD748594S1 (en) * 2014-03-12 2016-02-02 Hitachi Kokusai Electric Inc. Reaction tube
USD852762S1 (en) 2015-03-27 2019-07-02 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD806046S1 (en) 2015-04-16 2017-12-26 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD778247S1 (en) * 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD784253S1 (en) * 2016-02-16 2017-04-18 Solaero Technologies Corp. Solar cell
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
USD855027S1 (en) * 2018-01-22 2019-07-30 Kokusai Electric Corporation Cover of seal cap for reaction chamber of semiconductor
USD924823S1 (en) * 2018-07-19 2021-07-13 Kokusai Electric Corporation Adiabatic plate for substrate processing apparatus
USD1053156S1 (en) * 2022-03-15 2024-12-03 Kokusai Electric Corporation Furnace for substrate processing apparatus
USD1070797S1 (en) * 2022-03-15 2025-04-15 Kokusai Electric Corporation Furnace for substrate processing apparatus
USD1019581S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1019582S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1019583S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment

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