USD720309S1 - Inner tube for process tube for manufacturing semiconductor wafers - Google Patents
Inner tube for process tube for manufacturing semiconductor wafers Download PDFInfo
- Publication number
- USD720309S1 USD720309S1 US29/420,537 US201229420537F USD720309S US D720309 S1 USD720309 S1 US D720309S1 US 201229420537 F US201229420537 F US 201229420537F US D720309 S USD720309 S US D720309S
- Authority
- US
- United States
- Prior art keywords
- tube
- semiconductor wafers
- manufacturing semiconductor
- inner tube
- process tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
The broken lines shown in the drawings represent portions of the inner tube for process tube for manufacturing semiconductor wafers that form no part of the claimed design.
Claims (1)
- The ornamental design for an inner tube for process tube for manufacturing semiconductor wafers, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011026686 | 2011-11-18 | ||
| JP2011-026686 | 2011-11-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD720309S1 true USD720309S1 (en) | 2014-12-30 |
Family
ID=52112857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/420,537 Active USD720309S1 (en) | 2011-11-18 | 2012-05-10 | Inner tube for process tube for manufacturing semiconductor wafers |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD720309S1 (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD742339S1 (en) * | 2014-03-12 | 2015-11-03 | Hitachi Kokusai Electric Inc. | Reaction tube |
| USD748594S1 (en) * | 2014-03-12 | 2016-02-02 | Hitachi Kokusai Electric Inc. | Reaction tube |
| USD778247S1 (en) * | 2015-04-16 | 2017-02-07 | Veeco Instruments Inc. | Wafer carrier with a multi-pocket configuration |
| USD784253S1 (en) * | 2016-02-16 | 2017-04-18 | Solaero Technologies Corp. | Solar cell |
| USD793972S1 (en) | 2015-03-27 | 2017-08-08 | Veeco Instruments Inc. | Wafer carrier with a 31-pocket configuration |
| USD793971S1 (en) | 2015-03-27 | 2017-08-08 | Veeco Instruments Inc. | Wafer carrier with a 14-pocket configuration |
| USD813181S1 (en) * | 2016-07-26 | 2018-03-20 | Hitachi Kokusai Electric Inc. | Cover of seal cap for reaction chamber of semiconductor |
| USD855027S1 (en) * | 2018-01-22 | 2019-07-30 | Kokusai Electric Corporation | Cover of seal cap for reaction chamber of semiconductor |
| USD924823S1 (en) * | 2018-07-19 | 2021-07-13 | Kokusai Electric Corporation | Adiabatic plate for substrate processing apparatus |
| USD1019581S1 (en) * | 2022-05-30 | 2024-03-26 | Kokusai Electric Corporation | Inner tube of reaction tube for semiconductor manufacturing equipment |
| USD1019582S1 (en) * | 2022-05-30 | 2024-03-26 | Kokusai Electric Corporation | Inner tube of reaction tube for semiconductor manufacturing equipment |
| USD1019583S1 (en) * | 2022-05-30 | 2024-03-26 | Kokusai Electric Corporation | Inner tube of reaction tube for semiconductor manufacturing equipment |
| USD1053156S1 (en) * | 2022-03-15 | 2024-12-03 | Kokusai Electric Corporation | Furnace for substrate processing apparatus |
| USD1070797S1 (en) * | 2022-03-15 | 2025-04-15 | Kokusai Electric Corporation | Furnace for substrate processing apparatus |
Citations (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4950870A (en) * | 1987-11-21 | 1990-08-21 | Tel Sagami Limited | Heat-treating apparatus |
| US5352293A (en) * | 1992-01-06 | 1994-10-04 | Samsung Electronics Co., Ltd. | Tube apparatus for manufacturing semiconductor device |
| US5618349A (en) * | 1993-07-24 | 1997-04-08 | Yamaha Corporation | Thermal treatment with enhanced intra-wafer, intra-and inter-batch uniformity |
| USD404368S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Outer tube for use in a semiconductor wafer heat processing apparatus |
| USD405062S (en) * | 1997-08-20 | 1999-02-02 | Tokyo Electron Ltd. | Processing tube for use in a semiconductor wafer heat processing apparatus |
| USD405429S (en) * | 1997-01-31 | 1999-02-09 | Tokyo Electron Limited | Processing tube for use in a semiconductor wafer heat processing apparatus |
| USD405431S (en) * | 1997-08-20 | 1999-02-09 | Tokyo Electron Ltd. | Tube for use in a semiconductor wafer heat processing apparatus |
| USD406113S (en) * | 1997-01-31 | 1999-02-23 | Tokyo Electron Limited | Processing tube for use in a semiconductor wafer heat processing apparatus |
| USD407696S (en) * | 1997-08-20 | 1999-04-06 | Tokyo Electron Limited | Inner tube for use in a semiconductor wafer heat processing apparatus |
| US5897311A (en) * | 1995-05-31 | 1999-04-27 | Tokyo Electron Limited | Support boat for objects to be processed |
| USD423463S (en) * | 1997-01-31 | 2000-04-25 | Tokyo Electron Limited | Quartz process tube |
| USD424024S (en) * | 1997-01-31 | 2000-05-02 | Tokyo Electron Limited | Quartz process tube |
| US6251189B1 (en) * | 1999-02-18 | 2001-06-26 | Kokusai Electric Co., Ltd. | Substrate processing apparatus and substrate processing method |
| US20030221779A1 (en) * | 2002-03-28 | 2003-12-04 | Kazuyuki Okuda | Substrate processing apparatus |
| US20080083372A1 (en) * | 2006-08-04 | 2008-04-10 | Hisashi Inoue | Heat processing apparatus for semiconductor process |
| USD586768S1 (en) * | 2006-10-12 | 2009-02-17 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
| USD600659S1 (en) * | 2006-09-12 | 2009-09-22 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
| USD606952S1 (en) * | 2009-01-16 | 2009-12-29 | Asm Genitech Korea Ltd. | Plasma inducing plate for semiconductor deposition apparatus |
| USD610559S1 (en) * | 2008-05-30 | 2010-02-23 | Hitachi Kokusai Electric, Inc. | Reaction tube |
| USD611013S1 (en) * | 2008-03-28 | 2010-03-02 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
| USD618638S1 (en) * | 2008-05-09 | 2010-06-29 | Hitachi Kokusai Electric, Inc. | Reaction tube |
| USD619630S1 (en) * | 2007-05-08 | 2010-07-13 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
| USD654884S1 (en) * | 2010-10-21 | 2012-02-28 | Tokyo Electron Limited | Top plate for reactor for manufacturing semiconductor |
| USD654883S1 (en) * | 2010-10-21 | 2012-02-28 | Tokyo Electron Limited | Top plate for reactor for manufacturing semiconductor |
| USD655259S1 (en) * | 2010-10-21 | 2012-03-06 | Tokyo Electron Limited | Top plate for reactor for manufacturing semiconductor |
| USD655257S1 (en) * | 2010-10-21 | 2012-03-06 | Tokyo Electron Limited | Top plate for reactor for manufacturing semiconductor |
| USD687791S1 (en) * | 2012-03-20 | 2013-08-13 | Veeco Instruments Inc. | Multi-keyed wafer carrier |
| USD687790S1 (en) * | 2012-03-20 | 2013-08-13 | Veeco Instruments Inc. | Keyed wafer carrier |
-
2012
- 2012-05-10 US US29/420,537 patent/USD720309S1/en active Active
Patent Citations (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4950870A (en) * | 1987-11-21 | 1990-08-21 | Tel Sagami Limited | Heat-treating apparatus |
| US5352293A (en) * | 1992-01-06 | 1994-10-04 | Samsung Electronics Co., Ltd. | Tube apparatus for manufacturing semiconductor device |
| US5618349A (en) * | 1993-07-24 | 1997-04-08 | Yamaha Corporation | Thermal treatment with enhanced intra-wafer, intra-and inter-batch uniformity |
| US5897311A (en) * | 1995-05-31 | 1999-04-27 | Tokyo Electron Limited | Support boat for objects to be processed |
| USD424024S (en) * | 1997-01-31 | 2000-05-02 | Tokyo Electron Limited | Quartz process tube |
| USD405429S (en) * | 1997-01-31 | 1999-02-09 | Tokyo Electron Limited | Processing tube for use in a semiconductor wafer heat processing apparatus |
| USD423463S (en) * | 1997-01-31 | 2000-04-25 | Tokyo Electron Limited | Quartz process tube |
| USD406113S (en) * | 1997-01-31 | 1999-02-23 | Tokyo Electron Limited | Processing tube for use in a semiconductor wafer heat processing apparatus |
| USD404368S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Outer tube for use in a semiconductor wafer heat processing apparatus |
| USD407696S (en) * | 1997-08-20 | 1999-04-06 | Tokyo Electron Limited | Inner tube for use in a semiconductor wafer heat processing apparatus |
| USD405431S (en) * | 1997-08-20 | 1999-02-09 | Tokyo Electron Ltd. | Tube for use in a semiconductor wafer heat processing apparatus |
| USD405062S (en) * | 1997-08-20 | 1999-02-02 | Tokyo Electron Ltd. | Processing tube for use in a semiconductor wafer heat processing apparatus |
| US6251189B1 (en) * | 1999-02-18 | 2001-06-26 | Kokusai Electric Co., Ltd. | Substrate processing apparatus and substrate processing method |
| US20030221779A1 (en) * | 2002-03-28 | 2003-12-04 | Kazuyuki Okuda | Substrate processing apparatus |
| US20080083372A1 (en) * | 2006-08-04 | 2008-04-10 | Hisashi Inoue | Heat processing apparatus for semiconductor process |
| USD600659S1 (en) * | 2006-09-12 | 2009-09-22 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
| USD586768S1 (en) * | 2006-10-12 | 2009-02-17 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
| USD619630S1 (en) * | 2007-05-08 | 2010-07-13 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
| USD611013S1 (en) * | 2008-03-28 | 2010-03-02 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
| USD618638S1 (en) * | 2008-05-09 | 2010-06-29 | Hitachi Kokusai Electric, Inc. | Reaction tube |
| USD610559S1 (en) * | 2008-05-30 | 2010-02-23 | Hitachi Kokusai Electric, Inc. | Reaction tube |
| USD606952S1 (en) * | 2009-01-16 | 2009-12-29 | Asm Genitech Korea Ltd. | Plasma inducing plate for semiconductor deposition apparatus |
| USD654884S1 (en) * | 2010-10-21 | 2012-02-28 | Tokyo Electron Limited | Top plate for reactor for manufacturing semiconductor |
| USD654883S1 (en) * | 2010-10-21 | 2012-02-28 | Tokyo Electron Limited | Top plate for reactor for manufacturing semiconductor |
| USD655259S1 (en) * | 2010-10-21 | 2012-03-06 | Tokyo Electron Limited | Top plate for reactor for manufacturing semiconductor |
| USD655257S1 (en) * | 2010-10-21 | 2012-03-06 | Tokyo Electron Limited | Top plate for reactor for manufacturing semiconductor |
| USD687791S1 (en) * | 2012-03-20 | 2013-08-13 | Veeco Instruments Inc. | Multi-keyed wafer carrier |
| USD687790S1 (en) * | 2012-03-20 | 2013-08-13 | Veeco Instruments Inc. | Keyed wafer carrier |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD742339S1 (en) * | 2014-03-12 | 2015-11-03 | Hitachi Kokusai Electric Inc. | Reaction tube |
| USD748594S1 (en) * | 2014-03-12 | 2016-02-02 | Hitachi Kokusai Electric Inc. | Reaction tube |
| USD852762S1 (en) | 2015-03-27 | 2019-07-02 | Veeco Instruments Inc. | Wafer carrier with a 14-pocket configuration |
| USD793972S1 (en) | 2015-03-27 | 2017-08-08 | Veeco Instruments Inc. | Wafer carrier with a 31-pocket configuration |
| USD793971S1 (en) | 2015-03-27 | 2017-08-08 | Veeco Instruments Inc. | Wafer carrier with a 14-pocket configuration |
| USD806046S1 (en) | 2015-04-16 | 2017-12-26 | Veeco Instruments Inc. | Wafer carrier with a multi-pocket configuration |
| USD778247S1 (en) * | 2015-04-16 | 2017-02-07 | Veeco Instruments Inc. | Wafer carrier with a multi-pocket configuration |
| USD784253S1 (en) * | 2016-02-16 | 2017-04-18 | Solaero Technologies Corp. | Solar cell |
| USD813181S1 (en) * | 2016-07-26 | 2018-03-20 | Hitachi Kokusai Electric Inc. | Cover of seal cap for reaction chamber of semiconductor |
| USD855027S1 (en) * | 2018-01-22 | 2019-07-30 | Kokusai Electric Corporation | Cover of seal cap for reaction chamber of semiconductor |
| USD924823S1 (en) * | 2018-07-19 | 2021-07-13 | Kokusai Electric Corporation | Adiabatic plate for substrate processing apparatus |
| USD1053156S1 (en) * | 2022-03-15 | 2024-12-03 | Kokusai Electric Corporation | Furnace for substrate processing apparatus |
| USD1070797S1 (en) * | 2022-03-15 | 2025-04-15 | Kokusai Electric Corporation | Furnace for substrate processing apparatus |
| USD1019581S1 (en) * | 2022-05-30 | 2024-03-26 | Kokusai Electric Corporation | Inner tube of reaction tube for semiconductor manufacturing equipment |
| USD1019582S1 (en) * | 2022-05-30 | 2024-03-26 | Kokusai Electric Corporation | Inner tube of reaction tube for semiconductor manufacturing equipment |
| USD1019583S1 (en) * | 2022-05-30 | 2024-03-26 | Kokusai Electric Corporation | Inner tube of reaction tube for semiconductor manufacturing equipment |
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