USD705184S1 - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
USD705184S1
USD705184S1 US29/467,820 US201329467820F USD705184S US D705184 S1 USD705184 S1 US D705184S1 US 201329467820 F US201329467820 F US 201329467820F US D705184 S USD705184 S US D705184S
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United States
Prior art keywords
semiconductor module
view
semiconductor
module
ornamental design
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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US29/467,820
Inventor
Hideaki Takahashi
Kenshi Terashima
Satoru Motohashi
Masahiro Taoka
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Fuji Electric Co Ltd
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Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Assigned to FUJI ELECTRIC CO., LTD. reassignment FUJI ELECTRIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MOTOHASHI, SATORU, TAKAHASHI, HIDEAKI, TAOKA, MASAHIRO, TERASHIMA, KENSHI
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FIG. 1 is a front view of a semiconductor module according to our new design;
FIG. 2 is a rear view of the semiconductor module of FIG. 1;
FIG. 3 is a left side view of the semiconductor module of FIG. 1;
FIG. 4 is a right side view of the semiconductor module of FIG. 1;
FIG. 5 is a top view of the semiconductor module of FIG. 1;
FIG. 6 is a bottom view of the semiconductor module of FIG. 1; and,
FIG. 7 is a top, front, right side perspective view of the semiconductor module of FIG. 1.
The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor module, as shown and described.
US29/467,820 2013-07-11 2013-09-24 Semiconductor module Active USD705184S1 (en)

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Application Number Priority Date Filing Date Title
JPD2013-015885 2013-07-11
JP2013015885 2013-07-11

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USD705184S1 true USD705184S1 (en) 2014-05-20

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US29/467,820 Active USD705184S1 (en) 2013-07-11 2013-09-24 Semiconductor module

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Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD721707S1 (en) * 2013-08-06 2015-01-27 Bedrock Automation Platforms Inc. Communications control module for an industrial control system
USD721706S1 (en) * 2013-08-06 2015-01-27 Bedrock Automation Platforms Inc. Input output module for an industrial control system
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD742842S1 (en) * 2014-03-24 2015-11-10 Lem Intellectual Property Sa Electrical current transducer
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD755742S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD755741S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD759604S1 (en) * 2015-06-17 2016-06-21 Mitsubishi Electric Corporation Semiconductor device
USD761746S1 (en) * 2014-11-04 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor module for power conversion
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD762597S1 (en) 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD769834S1 (en) 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD772184S1 (en) 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD774479S1 (en) 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD776630S1 (en) 2013-08-06 2017-01-17 Bedrock Automation Platforms Inc. Backplane for an industrial control system (ICS)
USD783549S1 (en) * 2015-02-04 2017-04-11 Mitsubishi Electric Corporation Semiconductor device
USD787450S1 (en) * 2014-12-04 2017-05-23 Omron Corporation Electric relay
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module
USD814431S1 (en) * 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
USD858467S1 (en) * 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD864132S1 (en) * 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD873226S1 (en) * 2018-04-13 2020-01-21 Rohm Co., Ltd. Semiconductor module
USD874411S1 (en) * 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD874412S1 (en) * 2018-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD906271S1 (en) 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module

Non-Patent Citations (10)

* Cited by examiner, † Cited by third party
Title
"General Catalog of Fuji Semiconductors," Cover page, index, p. 75 and notices (5 pages total), Fuji Electric Co., Ltd., JP (Dec. 2012).
U.S. Appl. No. 29/458,663, filed Jun. 21, 2013.
U.S. Appl. No. 29/458,665, filed Jun. 21, 2013.
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Cited By (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD874411S1 (en) * 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD769834S1 (en) 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD721707S1 (en) * 2013-08-06 2015-01-27 Bedrock Automation Platforms Inc. Communications control module for an industrial control system
USD721706S1 (en) * 2013-08-06 2015-01-27 Bedrock Automation Platforms Inc. Input output module for an industrial control system
USD776630S1 (en) 2013-08-06 2017-01-17 Bedrock Automation Platforms Inc. Backplane for an industrial control system (ICS)
USD785577S1 (en) 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD805485S1 (en) 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD742842S1 (en) * 2014-03-24 2015-11-10 Lem Intellectual Property Sa Electrical current transducer
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD777124S1 (en) * 2014-04-02 2017-01-24 Mitsubishi Electric Corporation Power semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD762597S1 (en) 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD761746S1 (en) * 2014-11-04 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor module for power conversion
USD814433S1 (en) 2014-11-28 2018-04-03 Fuji Electric Co., Ltd Semiconductor module
USD827593S1 (en) 2014-11-28 2018-09-04 Fuji Electric Co., Ltd Semiconductor module
USD774479S1 (en) 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD787450S1 (en) * 2014-12-04 2017-05-23 Omron Corporation Electric relay
USD772184S1 (en) 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD810706S1 (en) 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD773412S1 (en) * 2015-02-04 2016-12-06 Mitsubishi Electric Corporation Semiconductor device
USD773413S1 (en) * 2015-02-04 2016-12-06 Mitsubishi Electric Corporation Semiconductor device
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD783549S1 (en) * 2015-02-04 2017-04-11 Mitsubishi Electric Corporation Semiconductor device
USD755742S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD755741S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD814431S1 (en) * 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
USD759604S1 (en) * 2015-06-17 2016-06-21 Mitsubishi Electric Corporation Semiconductor device
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module
USD875058S1 (en) 2017-01-05 2020-02-11 Rohm Co., Ltd. Power semiconductor module
USD858467S1 (en) * 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD864132S1 (en) * 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD873227S1 (en) 2017-10-23 2020-01-21 Mitsubishi Electric Corporation Semiconductor device
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD874412S1 (en) * 2018-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD873226S1 (en) * 2018-04-13 2020-01-21 Rohm Co., Ltd. Semiconductor module
USD906271S1 (en) 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD978809S1 (en) 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD903613S1 (en) 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module

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