USD633452S1 - Elastic membrane for semiconductor wafer polishing apparatus - Google Patents

Elastic membrane for semiconductor wafer polishing apparatus Download PDF

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Publication number
USD633452S1
USD633452S1 US29/356,456 US35645610F USD633452S US D633452 S1 USD633452 S1 US D633452S1 US 35645610 F US35645610 F US 35645610F US D633452 S USD633452 S US D633452S
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United States
Prior art keywords
semiconductor wafer
polishing apparatus
elastic membrane
wafer polishing
view
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Expired - Lifetime
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US29/356,456
Inventor
Keisuke Namiki
Hozumi Yasuda
Osamu Nabeya
Makoto Fukushima
Shingo Togashi
Satoru Yamaki
Katsuhide Watanabe
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Ebara Corp
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Ebara Corp
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Assigned to EBARA CORPORATION reassignment EBARA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUKUSHIMA, MAKOTO, TOGASHI, SHINGO, YAMAKI, SATORU, NABEYA, OSAMU, NAMIKI, KEISUKE, WATANABE, KATSUHIDE, YASUDA, HOZUMI
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FIG. 1 is a bottom view of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;
FIG. 2 is a top view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a perspective view, observed from below thereof,
FIG. 8 is a perspective view, observed from above thereof;
FIG. 9 is a cross-section view taken along the line 99 of FIG. 1 thereof; and,
FIG. 10 is a enlarged view of part 10 of FIG. 9 thereof.

Claims (1)

  1. The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.
US29/356,456 2009-08-27 2010-02-25 Elastic membrane for semiconductor wafer polishing apparatus Expired - Lifetime USD633452S1 (en)

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JP2009019715 2009-08-27
JP2009-19715 2009-08-27

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USD633452S1 true USD633452S1 (en) 2011-03-01

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