USD404374S - Fin for use in a semiconductor wafer heat processing apparatus - Google Patents
Fin for use in a semiconductor wafer heat processing apparatus Download PDFInfo
- Publication number
- USD404374S USD404374S US29/083,717 US8371798F USD404374S US D404374 S USD404374 S US D404374S US 8371798 F US8371798 F US 8371798F US D404374 S USD404374 S US D404374S
- Authority
- US
- United States
- Prior art keywords
- fin
- processing apparatus
- semiconductor wafer
- heat processing
- wafer heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 a perspective view of fin for use in a semiconductor wafer heat processing apparatus;
FIG. 2 a right side view thereof;
FIG. 3 a front elevational view thereof;
FIG. 4 a top plan view thereof;
FIG. 5 a bottom plan view thereof;
FIG. 6 a cross-sectional view taken along line VI--VI in FIG. 3;
FIG. 7 a cross-sectional view taken along line VII--VII in FIG. 3; and,
FIG. 8 a cross-sectional view taken along line VIII--VIII in FIG. 3.
Claims (1)
- I claim the ornamental design for a fin for use in a semiconductor wafer heat processing apparatus, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9-65104 | 1997-08-20 | ||
| JP6510497 | 1997-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD404374S true USD404374S (en) | 1999-01-19 |
Family
ID=71729424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/083,717 Expired - Lifetime USD404374S (en) | 1997-08-20 | 1998-02-12 | Fin for use in a semiconductor wafer heat processing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD404374S (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD600220S1 (en) * | 2008-03-28 | 2009-09-15 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| USD600660S1 (en) * | 2008-03-28 | 2009-09-22 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| USD615937S1 (en) * | 2009-03-06 | 2010-05-18 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| USD672451S1 (en) * | 2010-06-28 | 2012-12-11 | Dimplex North America Limited | Fin |
| USD924823S1 (en) * | 2018-07-19 | 2021-07-13 | Kokusai Electric Corporation | Adiabatic plate for substrate processing apparatus |
| USD1117068S1 (en) * | 2024-03-04 | 2026-03-10 | Vinatech Co., Ltd. | Rubber seal for capacitor sealing |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4857689A (en) | 1988-03-23 | 1989-08-15 | High Temperature Engineering Corporation | Rapid thermal furnace for semiconductor processing |
| US5314574A (en) | 1992-06-26 | 1994-05-24 | Tokyo Electron Kabushiki Kaisha | Surface treatment method and apparatus |
| US5320218A (en) | 1992-04-07 | 1994-06-14 | Shinko Electric Co., Ltd. | Closed container to be used in a clean room |
| US5752796A (en) | 1996-01-24 | 1998-05-19 | Muka; Richard S. | Vacuum integrated SMIF system |
-
1998
- 1998-02-12 US US29/083,717 patent/USD404374S/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4857689A (en) | 1988-03-23 | 1989-08-15 | High Temperature Engineering Corporation | Rapid thermal furnace for semiconductor processing |
| US5320218A (en) | 1992-04-07 | 1994-06-14 | Shinko Electric Co., Ltd. | Closed container to be used in a clean room |
| US5314574A (en) | 1992-06-26 | 1994-05-24 | Tokyo Electron Kabushiki Kaisha | Surface treatment method and apparatus |
| US5752796A (en) | 1996-01-24 | 1998-05-19 | Muka; Richard S. | Vacuum integrated SMIF system |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD600220S1 (en) * | 2008-03-28 | 2009-09-15 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| USD600660S1 (en) * | 2008-03-28 | 2009-09-22 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| USD615937S1 (en) * | 2009-03-06 | 2010-05-18 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| USD672451S1 (en) * | 2010-06-28 | 2012-12-11 | Dimplex North America Limited | Fin |
| USD924823S1 (en) * | 2018-07-19 | 2021-07-13 | Kokusai Electric Corporation | Adiabatic plate for substrate processing apparatus |
| USD1117068S1 (en) * | 2024-03-04 | 2026-03-10 | Vinatech Co., Ltd. | Rubber seal for capacitor sealing |
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