USD1112117S1 - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
USD1112117S1
USD1112117S1 US29/928,780 US202429928780F USD1112117S US D1112117 S1 USD1112117 S1 US D1112117S1 US 202429928780 F US202429928780 F US 202429928780F US D1112117 S USD1112117 S US D1112117S
Authority
US
United States
Prior art keywords
semiconductor device
view
ornamental design
elevation view
side elevation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/928,780
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English (en)
Inventor
Masamichi Ikuta
Nao Ueda
Shingo Yamamoto
Shinsuke Taka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of USD1112117S1 publication Critical patent/USD1112117S1/en
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US29/928,780 2023-09-11 2024-02-15 Semiconductor device Active USD1112117S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023018528F JP1769848S (https=) 2023-09-11 2023-09-11
JP2023-018528D 2023-09-11

Publications (1)

Publication Number Publication Date
USD1112117S1 true USD1112117S1 (en) 2026-02-10

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ID=90926450

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/928,780 Active USD1112117S1 (en) 2023-09-11 2024-02-15 Semiconductor device

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US (1) USD1112117S1 (https=)
JP (1) JP1769848S (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1769849S (https=) * 2023-09-11 2024-05-08
JP1769931S (https=) * 2023-09-11 2024-05-08
JP1769848S (https=) * 2023-09-11 2024-05-08

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US5646443A (en) * 1993-10-15 1997-07-08 Nec Corporation Semiconductor package
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD421421S (en) * 1998-11-19 2000-03-07 Honda Tsushin Kogyo Co., Ltd. Connector receptacle for IC card
USD427977S (en) * 1999-06-18 2000-07-11 Fujikura Ltd. Piezoelectric conversion type semiconductor device
US6093957A (en) * 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
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USD475981S1 (en) * 2002-03-29 2003-06-17 Mitsubishi Denki Kabushiki Kaisha Integrated circuits substrate
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
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USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD558694S1 (en) * 2005-10-11 2008-01-01 Gem Services, Inc. Quad-28JW surface mount package
USD560623S1 (en) * 2005-10-11 2008-01-29 Gem Services, Inc. Quad-24JW surface mount package
US7361983B2 (en) * 2002-07-26 2008-04-22 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and semiconductor assembly module with a gap-controlling lead structure
US7683494B1 (en) * 2008-06-18 2010-03-23 Zilog, Inc. Press-fit integrated circuit package involving compressed spring contact beams
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
JP1603358S (https=) 2017-10-19 2018-05-07
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD877708S1 (en) * 2013-10-17 2020-03-10 Vlt, Inc. Electrical terminal
US10790245B2 (en) * 2016-06-27 2020-09-29 NGK Electronics Devices, Inc. High-frequency ceramic board and high-frequency semiconductor element package
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD913978S1 (en) * 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
JP1711418S (ja) 2021-10-13 2022-03-31 半導体素子
JP1711446S (ja) * 2021-10-13 2022-03-31 半導体素子
JP1711417S (ja) * 2021-10-13 2022-03-31 半導体素子
JP1724641S (ja) 2022-03-07 2022-09-13 半導体モジュール
JP1727399S (ja) 2022-01-28 2022-10-14 半導体素子
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
JP1769931S (https=) * 2023-09-11 2024-05-08
JP1769849S (https=) * 2023-09-11 2024-05-08
JP1769848S (https=) * 2023-09-11 2024-05-08
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module
USD1046801S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
US12224218B2 (en) * 2022-02-11 2025-02-11 Wolfspeed, Inc. Semiconductor packages with increased power handling

Patent Citations (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3602846A (en) * 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3825876A (en) * 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3846734A (en) * 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
US4391408A (en) * 1980-09-05 1983-07-05 Augat Inc. Low insertion force connector
US4987474A (en) * 1987-09-18 1991-01-22 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
US4979016A (en) * 1988-05-16 1990-12-18 Dallas Semiconductor Corporation Split lead package
US4916519A (en) * 1989-05-30 1990-04-10 International Business Machines Corporation Semiconductor package
US5172213A (en) * 1991-05-23 1992-12-15 At&T Bell Laboratories Molded circuit package having heat dissipating post
USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
US5557504A (en) * 1993-08-31 1996-09-17 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with detachable module
US5646443A (en) * 1993-10-15 1997-07-08 Nec Corporation Semiconductor package
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US6093957A (en) * 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
USD421421S (en) * 1998-11-19 2000-03-07 Honda Tsushin Kogyo Co., Ltd. Connector receptacle for IC card
US6238953B1 (en) * 1999-01-12 2001-05-29 Sony Corporation Lead frame, resin-encapsulated semiconductor device and fabrication process for the device
USD427977S (en) * 1999-06-18 2000-07-11 Fujikura Ltd. Piezoelectric conversion type semiconductor device
US6555899B1 (en) * 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD441727S1 (en) * 2000-10-04 2001-05-08 Sony Corporation Semiconductor element
USD459705S1 (en) * 2001-03-06 2002-07-02 Shindengen Electric Manufacturing Co., Ltd. Semiconductor package
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
US6716670B1 (en) * 2002-01-09 2004-04-06 Bridge Semiconductor Corporation Method of forming a three-dimensional stacked semiconductor package device
USD475981S1 (en) * 2002-03-29 2003-06-17 Mitsubishi Denki Kabushiki Kaisha Integrated circuits substrate
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
US7361983B2 (en) * 2002-07-26 2008-04-22 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and semiconductor assembly module with a gap-controlling lead structure
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD558694S1 (en) * 2005-10-11 2008-01-01 Gem Services, Inc. Quad-28JW surface mount package
USD560623S1 (en) * 2005-10-11 2008-01-29 Gem Services, Inc. Quad-24JW surface mount package
US7683494B1 (en) * 2008-06-18 2010-03-23 Zilog, Inc. Press-fit integrated circuit package involving compressed spring contact beams
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD877708S1 (en) * 2013-10-17 2020-03-10 Vlt, Inc. Electrical terminal
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
US10790245B2 (en) * 2016-06-27 2020-09-29 NGK Electronics Devices, Inc. High-frequency ceramic board and high-frequency semiconductor element package
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
JP1603358S (https=) 2017-10-19 2018-05-07
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD913978S1 (en) * 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
JP1711417S (ja) * 2021-10-13 2022-03-31 半導体素子
JP1711446S (ja) * 2021-10-13 2022-03-31 半導体素子
JP1711418S (ja) 2021-10-13 2022-03-31 半導体素子
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
JP1727399S (ja) 2022-01-28 2022-10-14 半導体素子
USD1017533S1 (en) * 2022-01-28 2024-03-12 Mitsubishi Electric Corporation Semiconductor device
USD1046801S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
US12224218B2 (en) * 2022-02-11 2025-02-11 Wolfspeed, Inc. Semiconductor packages with increased power handling
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module
JP1724641S (ja) 2022-03-07 2022-09-13 半導体モジュール
JP1769848S (https=) * 2023-09-11 2024-05-08
JP1769849S (https=) * 2023-09-11 2024-05-08
JP1769931S (https=) * 2023-09-11 2024-05-08

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TSV711ICT,https://estore.st.com/en/tsv711ict-cpn.html?srsltid=AfmBOoo3ZG0QKTgeEEPntFpYH3xRXCqS3tNiJa3xjrLHUFCWj_HbBBC-,2025. (Year: 2025). *
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TSV711ICT,https://estore.st.com/en/tsv711ict-cpn.html?srsltid=AfmBOoo3ZG0QKTgeEEPntFpYH3xRXCqS3tNiJa3xjrLHUFCWj_HbBBC-,2025. (Year: 2025). *

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