US7468610B2 - Electrical connecting apparatus - Google Patents

Electrical connecting apparatus Download PDF

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Publication number
US7468610B2
US7468610B2 US11/871,765 US87176507A US7468610B2 US 7468610 B2 US7468610 B2 US 7468610B2 US 87176507 A US87176507 A US 87176507A US 7468610 B2 US7468610 B2 US 7468610B2
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United States
Prior art keywords
probe
circuit board
board
spacer
plate
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Application number
US11/871,765
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English (en)
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US20080122466A1 (en
Inventor
Yuji Miyagi
Hidehiro Kiyofuji
Akihisa Akahira
Yoshinori Kikuchi
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Micronics Japan Co Ltd
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Micronics Japan Co Ltd
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Assigned to KABUSHIKI KAISHA NIHON MICRONICS reassignment KABUSHIKI KAISHA NIHON MICRONICS ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AKAHIRA, AKIHISA, KIKUCHI, YOSHINORI, KIYOFUJI, HIDEHIRO, MIYAGI, YUJI
Publication of US20080122466A1 publication Critical patent/US20080122466A1/en
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Publication of US7468610B2 publication Critical patent/US7468610B2/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

Definitions

  • the present invention relates to an electrical connecting apparatus such as a probe card for use in electrical connection of, for example, an integrated circuit which is a device under test and a tester which conducts electrical inspection for electrical test of an electric circuit.
  • a conventional electrical connecting apparatus of this type comprises: a circuit board having, for example, a printed circuit board (PCB); and a probe board disposed at a distance from the underside of the circuit board and provided with a plurality of probes on the underside opposing the surface which faces the circuit board (see, e.g., Patent Document 1). Between the circuit board and the probe board, there is placed an interposer including an elastic connector such as a pogo pin assembly, and through the interposer, each probe of the probe board is electrically connected to a socket provided on the circuit board. The electrical connecting apparatus is connected to a tester body by the socket. On the upside of the above-mentioned circuit board is provided a reinforcing plate for restraining warping of the circuit board. These reinforcing plate, circuit board, interposer and probe board are combined integrally by tightening screw members such as bolts to be inserted from the reinforcing plate side.
  • PCB printed circuit board
  • probe board disposed at a distance from the underside of the
  • the front end of a bolt inserted from the upside of the reinforcing plate is screwed into an anchor portion provided on the probe board and tightened.
  • a cylindrical spacer member is mounted on each bolt.
  • the spacer member has its one end brought into contact with the underside of the reinforcing plate and its lower end brought into contact with the top of the anchor portion.
  • the spacer member keeps the distance from the underside of the reinforcing plate to the tip of each probe approximately constant in cooperation with the anchor portion into which the front end of the bolt is screwed.
  • the probe tips can be held on an imaginary plane.
  • Patent Document 1 International Publication No. 2005/106504
  • An object of the present invention is, therefore, to provide an electrical connecting apparatus capable of keeping the general height position of the probe tips from a surface to dispose the circuit board to the probe card holder at a predetermined height position in spite of the dispersion in thickness dimension of the circuit board.
  • the present invention is characterized basically by inserting a spacer plate for compensating dispersion in thickness dimension of a circuit board between a reinforcing plate and a circuit board.
  • the electrical connecting apparatus is characterized by comprising: a circuit board on one surface of which a reinforcing plate is mounted and on the other surface of which a plurality of first electric connections are provided; a probe board, on one surface of which disposed at a distance from the other surface of the circuit board and opposing the circuit board, second electric connections corresponding to the first electric connections are provided and on the other surface of which a plurality of probes respectively electrically connected to the corresponding second electric connections are provided; an elastic connector disposed between the circuit board and the probe board and having plural pairs of both contact points capable of contacting the first and second electric connections corresponding to each other of both boards correspond wherein both contact points of each pair receive biasing force toward separating directions from each other; screw members for integrally combining the reinforcing plate, circuit board, elastic connector and probe board; and a spacer member for holding the probe tips substantially on an imaginary plane by tightening the screw members; and between the reinforcing plate and the circuit board, a spacer plate for adjusting
  • such a spacer plate is disposed between the circuit board and the card holder which receives the edge portion of the circuit board and between the circuit board and an interposer or between the interposer and the probe board, etc.
  • the spacer plate is disposed between the circuit board and the card holder, however, it is necessary to replace the spacer plate with an adequate one in each electrical connecting apparatus every time the electrical connecting apparatus is replaced, which complicates an attachment work of the electrical connecting apparatus to the card holder.
  • the spacer plate when the spacer plate is disposed between the circuit board and the interposer or between the interposer and the probe board, the distance between the circuit board where the interposer is to be disposed and the probe board, namely, the distance between the opposing electric connections of each board changes. Therefore, if an elastic connector such as a pogo pin assembly is used as the interposer, contact pressure of the elastic connector to be pressed against mutually opposing electric connections of both boards will change.
  • the pogo pin assembly for example, includes pogo pins each having a pair of pogo pin contacts and a spring member between the pogo pin contacts.
  • Each pogo pin is accommodated in a pogo pin block, and both ends of each pogo pin, namely, the front ends of a pair of pogo pin contacts are accommodated so as to be able to project from the pogo pin block at a predetermined stroke.
  • Each pair of pogo pin contacts are pressed against the electric connections opposite to each other of the circuit board and the probe board by the biasing force of the spring member. The distance between both boards increases when the spacer plate is inserted between the circuit board and the pogo pin block of the pogo pin assembly or between the pogo pin block and the probe board.
  • the spacer plate since there is no relation in electrical connection between the reinforcing plate where the spacer plate is disposed and the circuit board, there is no influence. Further, the spacer plate does not cause any change in the distance between the circuit board and the probe board, so that no damage is caused to the stable electrical connecting feature by the elastic connector due to the insertion of the spacer plate.
  • the distance from the other surface of the circuit board to each probe tip from the other surface can be adequately set in spite of dispersion in thickness dimension of each circuit board due to error in production of the circuit board, without damaging the feature of the stable electrical connection of the elastic connector. Accordingly, it becomes possible to prevent change in general needle pressure of the probes due to dispersion in thickness dimension of the circuit board to ensure an electrical inspection.
  • the spacer member can be disposed so as to penetrate at least the reinforcing plate and the circuit board in the thickness direction with its end portion in contact with the one surface of the probe board and to provide an anchor portion into which the front end portion of the screw member is screwed.
  • the tip of each probe to be provided on the probe board can be formed to be located on an imaginary plane in a state that deformation in the thickness direction of the probe board is introduced.
  • the probe board can be assembled without correcting warping or wave-like deformation of the probe board and with such deformation kept as it is, whereby the height positions of the probes can be aligned on the imaginary plane.
  • circuit board with the edge portion of the other surface of the circuit board mounted on the upside of the edge portion of an annular card holder of the test head, and to select the spacer plate so as to adjust the distance from the upside of the card holder to the imaginary plane where the probe tip is located.
  • the spacer plate can be made by overlapping a plurality of spacer plates of the same thickness dimension, and the number of the spacer plates to be used can be selected according to the thickness dimension of the circuit board.
  • Each spacer plate can be made of a metal plate or an insulating plate.
  • the elastic connector can be used a well-known pogo pin connector which is provided with a pair of contacts disposed in pairs so as to make the respective axes coincide, the pogo pins receiving an elastic biasing force in a direction to be separated from each other and electrically connected to each other, and a pogo pin block which holds the pogo pins.
  • a well-known wire connector which is provided with a plurality of elastic wires disposed between respectively corresponding electric connections of the circuit board and the probe board can be used as the elastic connector.
  • both ends of each elastic wire are adapted to be both contact points thereof.
  • the present invention can provide an electrical connecting apparatus capable of keeping the whole height positions of probe tips at a predetermined height position in a state of being attached to the probe card holder, despite dispersion in the thickness dimension of a circuit board. Therefore, despite the dispersion in the thickness dimension due to the error in production of a circuit board, the probe tips can contact the corresponding electrodes by a predetermined pressing force, thereby increasing reliability of an electrical inspection.
  • FIG. 1 is a plan view of the electrical connecting apparatus according to the present invention.
  • FIG. 2 is a section obtained along the line II-II shown in FIG. 1 .
  • FIG. 3 is a partly enlarged section of the elastic connector shown in FIG. 2 .
  • the electrical connecting apparatus 10 is shown in FIGS. 1 and 2 .
  • the electrical connecting apparatus 10 is used, for instance, for an electrical inspection of a semiconductor wafer 14 on a well-known vacuum chuck 12 which constitutes a sample table of a tester.
  • a semiconductor wafer 14 In the semiconductor wafer 14 , a plurality of IC circuits (not shown) are incorporated, and for an electrical inspection of those IC circuits, the electrical connecting apparatus is used to connect each connection pad to an electric circuit of a tester body (not shown).
  • the electrical connecting apparatus 10 comprises, as shown in FIG. 2 : a circular flat plate-like circuit board 18 having an underside 18 a as an attaching surface to an annular card holder 16 to be provided at a tester head of the tester; a circular flat plate-like reinforcing plate 20 to be mounted on the upside 18 b of the circuit board; a probe board 22 to be disposed at a distance from the underside 18 a of the circuit board 18 ; and an elastic connector 24 disposed between the underside 18 a of the circuit board 18 and the upside 22 a of the probe board opposing the underside.
  • the circuit board 18 includes a printed circuit board (PCB) such as the conventional one, and as shown in FIG. 1 , at an edge portion exposed from the reinforcing plate 20 of its upside 18 b , a plurality of sockets 26 for electric connections to the tester are annularly arranged. In FIG. 2 , the sockets 26 are omitted to simplify the view.
  • PCB printed circuit board
  • each electric connection 28 is connected to one of the contact points, to which each socket 26 corresponds, through a well-known electrically conducting path (not shown).
  • a probe board 22 has a ceramic plate 30 disposed to oppose to the circuit board 18 and a flexible wiring plate 32 joined to the ceramic plate.
  • the upside 30 a of the ceramic plate 30 is disposed to oppose the underside 18 a of the circuit board 18 , thereby forming the upside of the probe board 22 which opposes to the circuit board 18 .
  • On this upside 30 a is formed a second electric connection 34 corresponding to the electric connection 28 of the circuit board 18 .
  • the upside 32 a of a wiring plate 32 is joined to the underside 30 b of the ceramic plate 30 , so that the underside 32 b constitutes the underside of the probe board 22 .
  • each probe 36 is connected to the corresponding second electric connection 34 through the electrically conducting path.
  • the elastic connector 24 disposed between the circuit board 18 and the probe board 22 is, in the example shown in FIG. 2 , a well-known pogo pin assembly.
  • This pogo pin assembly 24 is provided with a pogo pin block 24 a to be inserted between the circuit board 18 and the probe board 22 , and a plurality of pogo pins 24 b to be assembled into the pogo pin block.
  • FIG. 3 shows region A which is enclosed with an oval in FIG. 2 partially enlarged.
  • holes 38 penetrating in the thickness direction at the positions corresponding to the electric connections 28 and 34 of the circuit board 18 and the probe board 22 .
  • the pogo pins 24 b are held, making their axis directions coincident.
  • Each pogo pin 24 b is provided, as is well known, with a cylindrical member 42 to be received into the hole 38 , a pair of rod-like contacts 44 to be aligned in the axial direction spaced apart from each other in the axial direction of the cylindrical member within the cylindrical member, with their longitudinal directions aligned; and a cylindrical compression coil spring 46 to be disposed within the cylindrical member 42 .
  • engaging portions 44 a for preventing falling of each contact 44 from the cylindrical member 42 are provided and disposed between the engaging portions 44 a with the end portions brought into contact with the respective engaging portions 44 a .
  • the coil spring 46 electrically connects the contacts 44 and gives the biasing force to the contacts 44 in a direction for its outer ends to be apart from each other so that the outer ends of both contacts 44 may project from the end portion of the cylindrical member 42 .
  • Each outer end of both contacts 44 becomes a contact of the pogo pin 24 b .
  • the pogo pin 24 b of each pogo pin assembly 24 presses both contacts which are the outer ends of the contact 44 against the corresponding electric connections 28 and 34 by the biasing force of the coil spring 46 .
  • the pogo pin assembly 24 of this type is set such that each contact 44 contacts the corresponding electric connection 28 , 34 by the adequate biasing force so far as, for example, the amount of displacement by the extension and contraction between both outer ends of both contacts 44 is within about 300 ⁇ m.
  • the elastic connector 24 formed by this pogo pin assembly 24 is, as mentioned above, disposed between the ceramic plate 30 defining the upside 30 a of the probe board 22 and the under side 18 a of the circuit board 18 opposing thereto, thereby electrically connecting the opposite second electric connection 34 of the probe board 22 .
  • each probe 36 is connected to the corresponding each contact of the socket 26 , and to the tester body.
  • a spacer plate 48 made of a plate member having a uniform thickness dimension is inserted between the upside 18 b of the circuit board 18 and the reinforcing plate 20 .
  • this spacer plate 48 can be used alone or with plural plate members of equal thickness layered according to the difference in thickness of the circuit board 18 due to error in production of the circuit board 18 .
  • an electrically conducting plate member like a stainless plate having a thickness, for example, of 100 ⁇ m, or like a polyimide film.
  • a layer with plural spacer plates 48 of different thicknesses combined can be used.
  • the reinforcing plate 20 , spacer plate 48 , circuit board 18 , elastic connector 24 and probe board 22 are integrally combined by screw members 50 such as bolts.
  • the screw members 50 are inserted from the upside 20 a of the reinforcing plate 20 into the reinforcing plate 20 , spacer plate 48 , circuit board 18 and elastic connector 24 .
  • an anchor portion 52 having a female screw hole 52 a into which the end for insertion of the screw member 50 is screwed is formed on a surface opposing the circuit board 18 of the probe board 22 , namely, the upside 30 a of the ceramic plate 30 .
  • the female screw hole 52 a opens on the top surface of each anchor portion 52 .
  • a generally cylindrical spacer member 54 is mounted on the screw member 50 whose front end portion is screwed into the female screw hole 52 a.
  • a flange portion 54 a is formed at the upper end portion of each spacer member 54 to stretch radially outward.
  • holes 56 are formed to allow a part excluding the flange 54 a of the spacer member 54 to be inserted in the plate thickness direction.
  • an increased diameter portion 56 a is formed at the upper end of the hole 56 , so that the flange portion 54 a is received in the increased diameter portion 56 a such that an end surface of the hole 56 which is the upper end of the spacer member 54 coincides with the upper surface 20 a of the reinforcing plate 20 .
  • the lower end of each spacer member 54 is disposed to abut the upper surface of the corresponding anchor portion 52 .
  • the sum of the length dimension L 1 of each spacer member 54 and the height L 2 of the corresponding anchor portion 52 is set for each spacer member 54 , basically to retain the warping or wavelike deformation of the probe board 22 with the underside 20 b of the reinforcing plate 20 as a reference plane.
  • this spacer member 54 and anchor portion 52 it is desirable to make the top surfaces of the anchor portions 52 align on the same plane in spite of the deformation of the base plate 22 .
  • the top surfaces of the anchor portions 52 can be aligned on the same plane in spite of the deformation of the probe board 22 , it is possible to combine the probe board 22 with the circuit board 18 , reinforcing plate 20 and the like by using the spacer members 54 having the same length dimension L 1 with the deformation of the probe board 22 kept.
  • the probe board can be assembled with the deformation of the probe board 22 kept as it is, thereby aligning the tips 36 a of the probes 36 on an imaginary plane P parallel to the underside 20 b of the reinforcing plate 20 .
  • the electrical connecting apparatus 10 is, however, attached to the card holder 16 such that the underside 18 a of the circuit board 18 is mounted on the upside 16 a of the annular edge portion of the card holder 16 , so that dispersion is caused according to production error in the thickness dimension L 4 of the reinforcing plate 20 to the distance L 3 from the upside 16 a which is to be an attachment plane of the card holder 16 to the imaginary plane P where the tips 36 a of the probes 36 are positioned, as shown in FIG. 2 .
  • dispersion in the distance L 3 causes difference in needle pressure when the tips 36 a of the probes 36 are pressed against the corresponding electrodes.
  • the circuit board 18 when formed with an allowable error of 6.2 mm ⁇ 0.3 mm in thickness dimension, causes dispersion between 5.9 mm and 6.5 mm. Without using the spacer plate 48 , therefore, there are caused differences to the pressing force of the tips 36 a of the probes 36 , i.e., the needle pressures of the probes 36 of the electrical connecting apparatus 10 , in correspondence to differences of 0.6 mm at a maximum.
  • the number of the spacer plates 48 selected to correspond to the plate thickness of the reinforcing plate 20 is selected so that the distance L 3 from the mounting surface 16 a of the card holder 16 to imaginary plate P where the tips of the probes 36 may be aligned can be kept at a proper value.
  • each spacer plate 48 has a thickness dimension, for example, of 100 ⁇ m
  • six spacer plates 48 at a maximum are laminated between the reinforcing plate 20 and the circuit board 18 , and by selecting the number of proper spacer plates 48 to be inserted, thereby enabling to conduct an electrical inspection of the semiconductor wafer 14 with substantial difference in needle pressure kept almost at zero.
  • the distance between the reinforcing plate 20 and the circuit board 18 is increased by the total thickness dimension corresponding to the number of the spacer plates 48 .
  • spacer members 54 for example can be replaced with those having the proper length dimension L 1 .
  • the spacer plates 48 selected to compensate the dispersion in the thickness dimension of the circuit board 18 are inserted between the reinforcing plate 20 and the circuit board 28 . Since the spacer plate 48 is united with the reinforcing plate 20 , circuit board 18 , elastic connector 24 and probe board 22 by the screw member 50 , there is no need to replace the spacer plate 48 every time the electrical connecting apparatus 10 is replaced.
  • the distance L 3 from the underside 18 a of the circuit board to the tips 36 a of the probes 36 can be properly set.
  • any change in general contact pressure of the probes 36 due to the dispersion in thickness dimension of the circuit boards 18 can be prevented, and an electrical inspection of the device under test 14 such as a semiconductor wafer is ensured.
  • the probes 36 are formed to align on the same imaginary plane P with the deformation introduced to the probe board 22 to make the tips 36 a of the probes 36 align on the same imaginary plane P, and that the probe board is combined with the circuit board 18 and the reinforcing plate 20 and the like by the anchor portion 52 and the spacer member 54 so that the probe board 22 may maintain the deformation.
  • the present invention can be applied to an electrical connecting apparatus using, in place of this, a flat probe board without deformation and the probe tips 36 a formed to align on the same imaginary plane with deformation introduced to the probe board.
  • spacer members and anchor portions having the same length dimensions (L 1 , L 2 ) are adopted as spacer members 54 and anchor portions 52 .
  • the elastic connector 24 provided as an interposer, another elastic connector such as a well-known wire connector provided with an elastic wire can be used in place of the pogo pin assembly.
US11/871,765 2006-11-29 2007-10-12 Electrical connecting apparatus Active US7468610B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006321204A JP5190195B2 (ja) 2006-11-29 2006-11-29 電気的接続装置
JP2006-321204 2006-11-29

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US20080122466A1 US20080122466A1 (en) 2008-05-29
US7468610B2 true US7468610B2 (en) 2008-12-23

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KR (1) KR100942166B1 (ja)

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US20090058440A1 (en) * 2005-05-23 2009-03-05 Kabushiki Kaisha Nihon Micronics Probe assembly, method of producing it and electrical connecting apparatus
US20120038383A1 (en) * 2010-08-13 2012-02-16 Chien-Chou Wu Direct-docking probing device
US20120212247A1 (en) * 2009-02-27 2012-08-23 Advantest Corporation Test apparatus and test method
US20140077833A1 (en) * 2012-09-19 2014-03-20 Mpi Corporation Probe card and manufacturing method thereof
US20150168456A1 (en) * 2013-12-17 2015-06-18 Infineon Technologies Ag Probe card and method for producing a probe card

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JP2008216060A (ja) * 2007-03-05 2008-09-18 Micronics Japan Co Ltd 電気的接続装置
JP2009281886A (ja) * 2008-05-22 2009-12-03 Toshiba Corp プローブカード
KR101081901B1 (ko) 2008-08-22 2011-11-09 (주) 미코티엔 프로브 카드
KR100954451B1 (ko) * 2009-06-19 2010-04-27 박영주 반도체 웨이퍼 테스트용 프로브 카드의 평탄화 장치 및 평탄화 장치의 평탄 조절체 인서트 적층방법
JP5320309B2 (ja) * 2010-01-15 2013-10-23 日本電子材料株式会社 プローブカード
JP5499303B2 (ja) * 2011-02-04 2014-05-21 株式会社日本マイクロニクス プローブカードの配線基板調整治具及び配線基板修正方法並びに配線基板調整治具を用いて調整されたプローブカードを用いた検査方法及び検査システム
JP5991823B2 (ja) * 2012-02-14 2016-09-14 株式会社日本マイクロニクス 電気的接続装置及びその組立方法
JP5941713B2 (ja) * 2012-03-14 2016-06-29 東京エレクトロン株式会社 ウエハ検査用インターフェース及びウエハ検査装置
KR101358788B1 (ko) 2012-09-27 2014-02-24 (주)티에스이 고밀도 프로브 카드 및 그 제조방법
JP6374642B2 (ja) * 2012-11-28 2018-08-15 株式会社日本マイクロニクス プローブカード及び検査装置
JP6084882B2 (ja) 2013-04-04 2017-02-22 株式会社日本マイクロニクス プローブ組立体及びプローブ基板
FR3010909B1 (fr) * 2013-09-25 2015-09-18 Commissariat Energie Atomique Dispositif destine a subir des chocs et comprenant des moyens internes piezoelectriques de recuperation d'energie
JP6393542B2 (ja) * 2014-07-18 2018-09-19 株式会社日本マイクロニクス 接触検査装置
WO2016062637A1 (fr) * 2014-10-23 2016-04-28 Chambre De Commerce Et D'industrie De Region Paris Ile De France (Esiee Paris) Micro-électrodes démontables
KR101587774B1 (ko) * 2015-12-14 2016-01-22 주식회사 케이엔케이 Ito 필름 검사를 위한 포고 핀 및 포고 핀 가이드 블록
JP7075725B2 (ja) * 2017-05-30 2022-05-26 株式会社日本マイクロニクス 電気的接続装置
JP7138004B2 (ja) * 2018-09-28 2022-09-15 株式会社日本マイクロニクス プローブカード保持具
KR102388033B1 (ko) * 2020-07-15 2022-04-20 (주)엠투엔 프로브 카드

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JP5190195B2 (ja) 2013-04-24
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US20080122466A1 (en) 2008-05-29
KR100942166B1 (ko) 2010-02-12

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