US5357193A - Semiconductor memory having a voltage stress applying circuit - Google Patents

Semiconductor memory having a voltage stress applying circuit Download PDF

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Publication number
US5357193A
US5357193A US07/813,523 US81352391A US5357193A US 5357193 A US5357193 A US 5357193A US 81352391 A US81352391 A US 81352391A US 5357193 A US5357193 A US 5357193A
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voltage
bit line
circuit
pad
switching circuit
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Hiroaki Tanaka
Masaru Koyanagi
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Toshiba Corp
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Toshiba Corp
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Assigned to KABUSHIKI KAISHA TOSHIBA A CORPORATION OF JAPAN reassignment KABUSHIKI KAISHA TOSHIBA A CORPORATION OF JAPAN ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: KOYANAGI, MASARU, TANAKA, HIROAKI
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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/316—Testing of analog circuits
    • G01R31/3161—Marginal testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/30—Marginal testing, e.g. by varying supply voltage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31712—Input or output aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31712—Input or output aspects
    • G01R31/31715—Testing of input or output circuits; test of circuitry between the I/C pins and the functional core, e.g. testing of input or output driver, receiver, buffer
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/409—Read-write [R-W] circuits 
    • G11C11/4094—Bit-line management or control circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/50—Marginal testing, e.g. race, voltage or current testing
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells

Definitions

  • This invention relates to a semiconductor device, and more particularly to a semiconductor device having voltage stress testing pads for effecting a screening test to eliminate defective elements by use of a probe card and a prober in a state (wafer state) in which the semiconductor wafer is not yet divided into chips.
  • non-defective elements are selected by the die sort test after completion of the wafer manufacturing process, defective elements are marked and then the non-defective elements are set into packages to make finished products.
  • the semiconductor device in the form of a finished product (after the packaging operation) is subjected to a burn-in process.
  • a semiconductor memory (which is suitable for a method of effecting the screening test to eliminate defective elements by use of a probe card and a prober in the wafer state before the die sorting operation is used) is proposed in U.S. patent application Ser. No. 07/544,614, now abandoned.
  • the screening test when the screening test is effected by use of the probe card and prober in the wafer state, the screening test for the individual memory chip areas can be efficiently effected in a short period of time.
  • the probes of the probe card are simultaneously set in contact with voltage stress testing pads on a plurality of chip areas of the wafer to apply the voltage stress in the screening operation in the wafer state, the following problems may occur if the number of voltage stress testing pads for each chip is large.
  • This invention has been made in view of the above problems and an object of this invention is to provide a semiconductor device in which the number of voltage stress testing pads (for each chip) which are formed on the chip and set into contact with probes of a probe card in the screening operation for eliminating defective elements in the wafer state can be reduced, an increase in the chip size can be prevented, damages on the pads and the probes of the probe card can be prevented, the durability of the probe of the probe card can be improved, the efficiency of the screening test for eliminating defective elements is enhanced, the production capacity can be increased and the manufacturing cost can be reduced.
  • a semiconductor device of this invention comprises an integrated circuit including first and second circuit sections formed on a semiconductor chip; at least one voltage stress testing pad formed on the semiconductor chip, for supplying a voltage stress testing voltage or signal to the first circuit section; and a control circuit formed on the semiconductor chip, for controlling and setting the second circuit section into a state corresponding to a voltage stress testing mode by using an input from the voltage stress testing pads.
  • the screening test for eliminating defective elements is effected in the wafer state by simultaneously setting the probes of the probe card in contact with the voltage stress testing pads of a plurality of chip areas of the wafer to apply a voltage stress to them, not only the first circuit section but also the second circuit section can be set into a voltage stress testing mode by use of an input from one voltage stress testing pad.
  • FIG. 1 is a circuit diagram showing part of a dynamic random access memory (DRAM) according to a first embodiment of this invention
  • FIG. 2 is a diagram showing the condition in which the probes of the probe card are set in contact with the voltage stress testing pads of the DRAM chip when the DRAM of FIG. 1 is subjected to the burn-in process in the wafer state;
  • FIG. 3 is a circuit diagram showing a portion of a memory cell array.
  • FIG. 1 shows selected portions of pads and selected portions of a DRAM circuit formed on a DRAM chip according to a first embodiment of a semiconductor device of this invention.
  • the DRAM chip area is so constructed as to improve the efficiency of application of the voltage stress and the construction thereof is explained below.
  • FIG. 1 denotes a power source potential V CC supplying pad and 32 denotes a ground potential V SS supplying pad.
  • One of word lines WL of the memory cell array, one of of bit line pairs (BL,/BL), one of one-transistor/one-capacitor type dynamic memory cells MC, one of bit line precharge circuits PR and one of bit line equalize circuits EQ connected to respective columns of the memory cell array are shown as representatives in FIG. 1.
  • FIG. 3 shows a portion of a memory cell array containing the dynamic memory cells conventionally organized in rows and columns.
  • RAS pad 33 denotes a RAS pad to which a row address strobe (/RAS) signal is supplied.
  • bit line precharge/equalize signal generation circuit for receiving a/RAS signal from the RAS pad 33 and supplying a bit line precharge/equalize signal V EQL to the bit line precharge circuit PR and the bit line equalize circuit EQ.
  • bit line precharge voltage generation circuit 35 denotes a bit line precharge voltage generation circuit for supplying a bit line precharge voltage (which is normally set at V CC /2) to the bit line precharge circuit PR via a bit line precharge power source line 36.
  • bit line precharge output switching circuit 37 denotes a bit line precharge output switching circuit (for example, CMOS transfer gate) which is connected between the output node of the bit line precharge voltage generation circuit 35 and the bit line precharge power source line 36.
  • a first pad 11, second pad 12 and control circuit 15 are provided.
  • a pull-down resistor R1 is connected between the first pad 11 and the ground potential (V SS ) node and a pull-down resistor R2 is connected between the second pad 12 and the V SS node.
  • the first pad 11 and the second pad 12 are connected to a first circuit section for applying a voltage stress to the DRAM circuit.
  • the first pad 11 is connected to a first side of the ends of the word lines WL via corresponding switching circuits (for example, NMOS transistors) N1 and is applied with a stress voltage V stress from the exterior in the voltage stress testing operation.
  • the second pad 12 is connected to the gate of the NMOS transistor N1 and is applied with a gate control voltage V gate from the exterior in the voltage stress testing operation.
  • the first pad 11 is commonly connected to first sides of the ends of all (or selected ones) of the NMOS switching circuits N1 and the second pads 12 is commonly connected to the gates of all (or selected ones) of the NMOS switching circuits N1.
  • the control circuit 15 is constructed to control and set the second circuit section of the DRAM circuit into a state corresponding to the voltage stress testing mode according to an input from a desired one (for example, first pad 11) of the voltage stress testing pads (in other words, it is constructed to control the output potential of the bit line precharge/equalize signal generation circuit 34, the switching state of the bit line precharge voltage output switching circuit 37 and the potential of the bit line precharge power source line 36).
  • two NMOS transistors N2 and N3 whose drains and gates are respectively connected to each other are serially connected between the first pad 11 and the input node of the bit line precharge/equalize signal generation circuit 34.
  • the first pad 11 is connected to a first input terminal of a 2-input NOR circuit 16 and a pull-down resistor R3 is connected between the second input terminal of the NOR circuit 16 and the V SS node.
  • the output terminal of the NOR circuit 16 is connected to two stages of inverters 17 and 18 and outputs (complementary signals) of the two inverter stages are used to control the bit line precharge output switching circuit 37.
  • An NMOS transistor N4 is connected between the bit line precharge power source line 36 and the V SS node and the gate thereof is connected to the first pad 11.
  • the second circuit section controlled by the control circuit 15 may be connected to a pad which is used at the time of die sort if necessary.
  • a third pad 13 is connected to the second input terminal of the NOR circuit 16 and the resistor R3, and a fourth pad 14 is connected to the bit line precharge power source line 36.
  • V stress for example, a normal word line voltage raising potential
  • V gate equal to or higher than (V stress +V th1 )
  • V th1 is the threshold voltage of the NMOS transistor N1
  • V th1 is the threshold voltage of the NMOS transistor N1
  • the bit line equalize/precharge signal generation circuit 34 is supplied with a potential ("H" level) of (V stress -V th2 -V th3 ) (V th2 is the threshold voltage of the NMOS transistor N2 and V th3 is the threshold voltage of the NMOS transistor N3) from the first pad 11.
  • This state is the same as the state which is set when a/RAS signal of the RAS pad 33 is set in the non-active state ("H" level), and the circuit 34 is activated to generate the bit line precharge/equalize signal V EQL .
  • the bit line precharge circuit PR and the bit line equalize circuit EQ are both set in the ON state, thereby applying the potential of the bit line precharge power source line 36 to all of the bit line pairs (BL, /BL).
  • the DRAM circuit is set into the standby state and word line driving transistors (not shown) are set in the non-selected state for all of the word lines WL.
  • the NOR circuit 16 supplies an output of "L" level when receiving the stress voltage V stress ("H" level) applied to the first pad 11, and the bit line precharge output switching circuit 37 is set into the OFF state by the outputs of the inverters 17 and 18.
  • the NMOS transistor N4 is set into the ON state by the stress voltage V stress ("H" level) applied to the first pad 11 and the potentials of all of the bit line pairs (BL,/BL) are set to the ground potential V SS .
  • V stress a voltage stress of (V stress -0 V) can be applied to the gate insulation film of the transfer gate NMOS transistor T of the memory cell MC.
  • the reason why the voltage stress is applied to the gate insulation film of the transfer gate NMOS transistor T of the memory cell MC is that it is particularly desirable to effect the screening test for eliminating defective elements in this circuit part since the word line WL selected at the time of normal operation has applied to it a word line voltage having a higher potential resulting in a more intense electric field being applied to a gate insulation film of this circuit than that applied to other circuits.
  • the first pad 11 and the second pad 12 are pulled down to the ground potential V SS via the pull-down resistors R1 and R2.
  • the NMOS transistor N1 is turned off.
  • the NMOS transistors N2 and N3 are not turned on if a voltage in an operative voltage range (or negative voltage) is applied to the RAS pad 33, the first pad 11 and the RAS pad 33 are electrically disconnected.
  • the two inputs of the NOR circuit 16 are both set at the "L” level, the output of the NOR circuit 16 is set to the "H” level, and the bit line precharge output switching circuit 37 is set into the ON state by the outputs of the inverters 17 and 18.
  • the NMOS transistor N4 is set into the OFF state by the "L" level from the first pad 11.
  • the power source pad 31, ground pad 32 and RAS pad 33 are also used to effect the function test for evaluating the characteristic of the DRAM circuit in the die sorting process and are electrically connected to external pins via bonding wires, for example, when the semiconductor device held in the wafer state is divided into DRAM chips which are in turn set into packages and formed as finished products (DRAM devices).
  • the third pad 13 and fourth pad 14 can be used when the function test for evaluating the characteristic of the DRAM circuit is effected in the die sorting process. That is, it is possible to set the bit line precharge output switching circuit 37 into the OFF state by applying the "H" level potential to the third pad 13 from the exterior and change the precharge voltage of the bit line by applying a desired bit line voltage to the fourth pad 14 from the exterior.
  • the two NMOS transistors N2 and N3 are serially connected between the first pad 11 and the input node of the bit line precharge/equalize signal generation circuit 34, but the control circuit 15 may be modified so as to connect the first pad 11 directly to the bit line precharge/equalize signal generation circuit 34.
  • the control circuit 15 effects the control operation such that the output of the bit line precharge/equalize signal generation circuit 34 may be activated when the stress voltage V stress is applied to the first pad 11 and the bit line precharge/equalize signal generation circuit 34 may effect the normal operation when the first pad 11 is set at the "L" level.
  • control circuit 15 sets the output switch 37 of the bit line precharge voltage generation circuit 35 by use of the input from the first pad 11 and controls and sets the potential of the bit line precharge power source line 36 to the ground potential V SS , but when the bit line precharge voltage generation circuit 35 includes an output potential switching circuit, the control circuit 15 may be designed to control the output potential switching circuit by use of the input from the first pad 11.
  • the control circuit 15 may be connected to indirectly receive the input of the pad 11 via an element.
  • control circuit 15 may effect the control operation for the output switch 37b (or output potential) of a memory cell capacitor plate voltage generation circuit 35b by use of the input from the first pad 11. In this case, it becomes possible to apply a voltage, for example, V CC voltage which is different from that in the normal operation to the memory cell capacitor plate in the burn-in operation in the wafer state.
  • a voltage stress of (V CC -V SS ) can be applied to the capacitor insulation film by selecting all of the word lines WL and writing "0" data into all of the memory cells so as to set the storage nodes of the capacitors C of the memory cells to substantially the ground potential V SS and set the memory cell capacitor plates to substantially the V CC voltage or by writing "1" data into all of the memory cells so as to set the storage electrodes of the capacitors C to substantially the V CC potential and set the memory cell capacitor plates to substantially the V SS voltage.
  • the voltage stress testing pad can be used to perform additional functions without increasing the chip size.
  • the number of probes can be reduced with a decrease in the number of pads and the contact portion between the probes and the pads can be easily made flat.
  • the contact portion between the probes of the probe card and the pads is made sufficiently flat, the pads and the probes of the probe card are less likely to become damaged and the durability of the probes are less likely to become deteriorated.
  • the number of probes can be reduced with a decrease in the number of pads and the number of chips which can be simultaneously set in contact with the probes can be increased within a range corresponding to the maximum number of probes of the probe card determined by the voltage supplying ability of the tester so that the test time can be shortened and the burn-in efficiency can be enhanced.
  • the distance between the pads is set to be larger than the minimum pitch of the probes of the probe card and the number of chips which can be simultaneously set in contact with the probes of the probe card is increased so that the test time can be shortened and the burn-in efficiency can be enhanced.
  • the pads can be arranged in such a pattern that a large number of chips can be simultaneously subjected to the burn-in process in the wafer state and the burn-in efficiency can be enhanced. An example of this is explained with reference to FIG. 2.
  • FIG. 2 shows the probes 23 of the probe card, and the voltage stress testing pads 11a, 12a, 11b, and 12b formed in each of the DRAM chip areas 10 of a DRAM according to a second embodiment of the invention. More precisely, this figure shows the probes 23 put in contact with the pads 11a, 12a, 11b, 12b while the DRAM is undergoing burn-in process.
  • the chip areas 10, which are rectangular, are on a semiconductor wafer and arranged in rows and columns.
  • a DRAM circuit of, for example, the type shown in FIG. 1 is formed in each chip area 10.
  • a first set of testing pads 11a and 11b, and a second set of testing pads 12a and 12b are used to achieve a voltage stress test, whereas the four pads 11, 12, 31, and 32 are used to accomplish the voltage stress test of the DRAM circuit shown in FIG. 1.
  • the pads 11a and 11b of the first set are connected by a wire (not shown) to perform the same function.
  • the pads 12a and 12b of the second set are connected by a wire (not shown) to perform the same function.
  • the pads 11a and 12a are arranged on one shorter edge of the chip area 10, whereas the pads 11b and 12b are arranged on the opposite shorter edge of the chip area 10.
  • the pads 11a and 11b of the first set are located in a line extending parallel to the longer edge of the chip area 10.
  • the pads 12a and 12b of the second set are located in a line parallel to the longer edge of the chip area 10.
  • the voltage stress testing pads are located densely at the shorter edges of any two adjacent chip area 10 of the same column.
  • 24 denotes an area in which the probes 23 of the probe card may project.
  • those of the probes 23 which project in the same direction from one of the two opposite side portions of the probe card are simultaneously set in contact with the voltage stress testing pads 11a, 12a, 11b, 12b which are collectively disposed on one shorter edge of a plurality of (for example, four) chip areas 10 in each of the two adjacent lines of chip area groups.
  • those of the probes 23 which project in the same direction from the other-side portion of the probe card are simultaneously set in contact with the voltage stress testing pads 11a, 12a, 11b, 12b which are collectively disposed on one shorter edge of four chip areas 10 in each of different two adjacent lines of chip area groups which are adjacent to the above two lines of chip area groups.
  • the probes 23 of the probe card can be simultaneously set in contact with the voltage stress testing pads 11a, 12a, 11b, 12b of the four chip areas in each of the adjacent four lines of chip area groups (16 chip areas in total) on the wafer and the voltage stress can be applied to the chip areas.
  • the probes of the probe card are set in contact with the voltage stress testing pads collectively disposed on the adjacent side portions of the adjacent chip areas, a difference in the length of the probes 23 which are set in contact with the adjacent chip areas can be reduced and the design of the probe card can be simplified.
  • the probes of the probe card can be simultaneously set in contact with the voltage stress testing pads on a maximum permissible number of chip areas on the wafer to enhance the burn-in efficiency and improve the production capacity so that the time required for the burn-in can be reduced and the manufacturing cost can be lowered.
  • a plurality of pads having the same function are provided as the voltage stress testing pads on the chip and the pads are separately disposed on one side portion and the other portion of the chip.
  • the same pad as the bonding pad may be formed as the stress testing pad, but this is not limited thereto and the stress testing pad may be any type of pad if it can be set in contact with a contact pad (formed of conductive rubber, for example) of the probe card of a tester used in the burn-in process in the wafer state and it may be a bump used in the TAB (Tape Automated Bonding) technique.
  • a contact pad formed of conductive rubber, for example
  • TAB Pe Automated Bonding
  • the DRAM is explained as an example, but this is not limited thereto, and this invention can be applied to any type of semiconductor device having an integrated circuit formed on the chip.
  • the voltage stress test in the burn-in process in the wafer state is explained, but this invention is also effective in a case where the voltage stress test is effected irrespective of temperature acceleration.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Dram (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
US07/813,523 1990-12-27 1991-12-26 Semiconductor memory having a voltage stress applying circuit Expired - Lifetime US5357193A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2-418764 1990-12-27
JP41876490A JP3381929B2 (ja) 1990-12-27 1990-12-27 半導体装置

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US5357193A true US5357193A (en) 1994-10-18

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US (1) US5357193A (fr)
EP (1) EP0492609B1 (fr)
JP (1) JP3381929B2 (fr)
KR (1) KR950014558B1 (fr)
DE (1) DE69129060T2 (fr)

Cited By (16)

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US5500588A (en) * 1991-11-01 1996-03-19 Sgs-Thomson Microelectronics, Inc. Method and apparatus for testing integrated circuit devices
US5568436A (en) * 1990-05-11 1996-10-22 Kabushiki Kaisha Toshiba Semiconductor device and method of screening the same
US5627787A (en) * 1995-01-03 1997-05-06 Sgs-Thomson Microelectronics, Inc. Periphery stress test for synchronous RAMs
US5648730A (en) * 1994-11-30 1997-07-15 Texas Instruments Incorporated Large integrated circuit with modular probe structures
US5898706A (en) * 1997-04-30 1999-04-27 International Business Machines Corporation Structure and method for reliability stressing of dielectrics
US5926423A (en) * 1996-11-06 1999-07-20 Hyundai Electronics Industries Co., Ltd. Wafer burn-in circuit for a semiconductor memory device
US5999466A (en) * 1998-01-13 1999-12-07 Micron Technology, Inc. Method, apparatus and system for voltage screening of integrated circuits
US6021502A (en) * 1997-03-19 2000-02-01 Mitsubishi Denki Kabushiki Kaisha System for monitoring power consumption of semiconductor devices
US6037795A (en) * 1997-09-26 2000-03-14 International Business Machines Corporation Multiple device test layout
US6055199A (en) * 1998-10-21 2000-04-25 Mitsubishi Denki Kabushiki Kaisha Test circuit for a semiconductor memory device and method for burn-in test
US6327682B1 (en) 1999-03-22 2001-12-04 Taiwan Semiconductor Manufacturing Company Wafer burn-in design for DRAM and FeRAM devices
US6551846B1 (en) * 1999-08-30 2003-04-22 Mitsubishi Denki Kabushiki Kaisha Semiconductor memory device capable of correctly and surely effecting voltage stress acceleration
US20040151033A1 (en) * 2003-01-24 2004-08-05 Renesas Technology Corp Semiconductor integrated circuit and IC card
US20050138502A1 (en) * 2003-11-13 2005-06-23 Hynix Semiconductor Inc. Test mode circuit of semiconductor device
US20120187977A1 (en) * 2009-05-20 2012-07-26 Hee-Il Hong Semiconductor device capable of being tested after packaging
CN112447698A (zh) * 2019-08-30 2021-03-05 爱思开海力士有限公司 具有芯片到芯片接合结构的半导体存储器装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100375177B1 (ko) * 1995-05-19 2003-05-09 마츠시타 덴끼 산교 가부시키가이샤 반도체 장치의 검사방법
JP4783487B2 (ja) * 2000-02-22 2011-09-28 株式会社カネカ 太陽電池モジュールの逆バイアス処理装置

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US20120187977A1 (en) * 2009-05-20 2012-07-26 Hee-Il Hong Semiconductor device capable of being tested after packaging
US8675432B2 (en) * 2009-05-20 2014-03-18 Samsung Electronics Co., Ltd. Semiconductor device capable of being tested after packaging
CN112447698A (zh) * 2019-08-30 2021-03-05 爱思开海力士有限公司 具有芯片到芯片接合结构的半导体存储器装置
CN112447698B (zh) * 2019-08-30 2024-03-26 爱思开海力士有限公司 具有芯片到芯片接合结构的半导体存储器装置

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JPH04230049A (ja) 1992-08-19
DE69129060D1 (de) 1998-04-16
EP0492609A2 (fr) 1992-07-01
EP0492609B1 (fr) 1998-03-11
KR950014558B1 (ko) 1995-12-05
DE69129060T2 (de) 1998-07-30
EP0492609A3 (en) 1993-04-21
KR920013455A (ko) 1992-07-29

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