US5125557A - Ceramics bonded product and method of producing the same - Google Patents

Ceramics bonded product and method of producing the same Download PDF

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US5125557A
US5125557A US07/726,714 US72671491A US5125557A US 5125557 A US5125557 A US 5125557A US 72671491 A US72671491 A US 72671491A US 5125557 A US5125557 A US 5125557A
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process according
titanium
copper
layer
ceramic
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Shun-ichiro Tanaka
Kazuo Ikeda
Akio Sayano
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Toshiba Corp
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Toshiba Corp
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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
    • C04B37/006—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C04B2235/6581—Total pressure below 1 atmosphere, e.g. vacuum
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/122—Metallic interlayers based on refractory metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/124—Metallic interlayers based on copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/368—Silicon nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/59—Aspects relating to the structure of the interlayer
    • C04B2237/592—Aspects relating to the structure of the interlayer whereby the interlayer is not continuous, e.g. not the whole surface of the smallest substrate is covered by the interlayer
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/64—Forming laminates or joined articles comprising grooves or cuts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Definitions

  • This invention relates to a novel ceramics bonded product having great bonded strength and suffering hardly from cracks or breaking in the vicinity of the bonded interface even when receiving heat shock, and also to a method of producing the same.
  • a ceramics bonded product having a great bonded strength and suffering hardly from generation of cracks at the bonded interface by heat shock can be obtained by allowing a ductile metal and a nitride of a group IVa transition metal to exist between a ceramics sintered body and another ceramics sintered body or a metal member to be bonded; more specifically, it can be obtained by heating, for instance, a nitride ceramics sintered body and another nitride ceramics sintered body or a metal member with a ductile metal and a transition metal of the group IVb interposed therebetween.
  • This invention has been accomplished on the basis of such a finding, and it is intended to provide a ceramics bonded product having a great bonded strength and also free from cracks or breaking even by abrupt heat shock.
  • the ceramics bonded product of this invention is characterized in that a ceramics sintered body is bonded to another ceramics sintered body or a metal member through a ductile metal and a group IVa transition metal nitride interposed therebetween.
  • FIGS. 1 through 3 are enlarged side sectional views for illustration of the structure of the ceramics bonded products according to Examples of this invention;
  • FIG. 4 is a perspective view of the same;
  • FIGS. 5 and 6 are enlarged perspective views of the pressurized powder to be used in Examples of this invention.
  • the ceramics bonded product can be prepared by allowing a ductile metal and a nitride of a group IVb transition metal to exist between a ceramics sintered body and another ceramics sintered body or a metal member to be bonded, for example, according to either of the following methods (A) to (D).
  • a ductile metal is provided between a nitride ceramics sintered body and another nitride ceramics sintered body or a metal member, and between the ductile metal and the nitride ceramics sintered body or the metal member is interposed a layer comprising a group IVb transition metal powder, a group IVb transition metal compound powder capable of reacting with nitrogen or a group IVb transition metal nitride powder, and heating is carried out in an inert or reducing atmosphere at a temperature not lower than the melting point of the intermediary materials.
  • a compact comprising a mixed powder of powder of a ductile metal with powder of a group IVb transition metal, a powder of a group IVb transition metal compound capable of reacting with nitrogen or a powder of a group IVb metal nitride is permitted to exist, and heating is carried out in an inert or reducing atmosphere at a temperature not lower than the melting point of the intermediary materials.
  • a ductile metal is provided, and between the ductile metal and the nitride ceramics sintered body or the metal member is interposed a group IVb transition metal, a group IVb transition metal compound capable of reacting with nitrogen or a group IVb metal nitride provided in a locally, nonuniformly or intermittently distributed fashion, and heating is carried out in an inert or reducing atmosphere at a temperature not lower than the melting point of the intermediary materials.
  • a compact comprising a powder of a ductile metal and containing a group IVb transition metal fibers embedded therein is interposed, and heating is carried out in an inert or reducing atmosphere at a temperature not lower than the melting point of the intermediary materials.
  • a slurry prepared by dispersing in an organic solvent a powder of a group IVb transition metal or a powder of a group IVb transition metal compound capable of reacting with nitrogen is applied by coating and heat-dried to form layers 3 of the group IVb transition metal powder or the group IVb transition metal compound powder capable of reacting with nitrogen, which IVb transition metal powder layers 3 are superposed face to face, followed by heating in an inert atmosphere at a temperature not lower than the melting point of the intermediary layers to effect integration.
  • the method (A) can be embodied as follows: As shown in FIG. 2, at the bonding face between a nitride ceramics sintered body 1 and a metal member 4, a slurry prepared by dispersing a ductile metal powder in an organic solvent, for example, is applied by coating and heat-dried to form a IVb transition metal powder layer 3. Thereafter, the IVb transition metal powder layer 3 and the ductile metal member 4 are superposed face to face, followed by heating in an inert atmosphere and at a temperature not lower than the melting point of the intermediary layer.
  • a minute (for example, passing through 325 mesh) ductile metal powder together with a powder of a group IVb transition metal powder or a powder of a IVb transition metal compound capable of reacting with nitrogen are mixed in an organic solvent such as an alcohol, and the resultant slurry is dried and press molded to a desired shape to mold a compact 5 with a thickness of about 0.1 to 5 mm.
  • the compact 5 is sandwiched and heating is carried out at a temperature not lower than the melting point of the compact 5 to effect integration.
  • a group IVb transition metal is provided in a locally, nonuniformly or intermittently distributed fashion, for example, by weaving of group IVb transition metal wires, by bending thereof repeatedly on the same plane, by arrangement of a plural number of the wires in parallel, by provision of a large number of punches provided on a IVb transition metal foil, or by scattering the group IVb transition metal (in the drawing, there is shown a group IVb transition metal wire which is repeatedly bent), on which another ceramics sintered body or a metal member is superposed through a ductile metal (not necessary when a metal member comprising a group IVb metal is to be bonded), followed by heating at a temperature not lower than the melting points of the group IVb transition metal and the ductile metal to effect integration.
  • a compact prepared by press molding similarly as in the method of (B) of the ductile metal powder 7 having the group IVb transition metal fiber 8 mixed into the metal member powder is employed, or, as shown in FIG. 6, nets 9 comprising ductile metal fibers are arranged on both surfaces of a compact of the metal powder 7, followed again by pressurization to have a part of the nets embedded in the compact, and the resultant product is employed.
  • the compounding ratio of the ductile metal to the group IVb transition metal is made within the same range as the method of (B).
  • nitrides of the group IVb transition metal are formed through the reaction of the nitrogen in the nitride ceramics sintered body with the group IVb transition metal or the group IVb transition metal compound capable of reacting with nitrogen, or nitrides may be formed through the group IVb transition metal nitride itself.
  • the nitrides at the interface may be formed in various fashions, i.e., in a uniformly or evenly distributed fashion in the cases according to the method (A) and method (B), and in a locally distributed fashion such that they are distributed in a continuous or discontinuous linear fashion, in a net fashion or in a scattered fashion in the cases according to the method (C) and method (D).
  • the ductile metal is formed into alloy uniformly or locally with the group IVb transition metal to form alloy layers with various compositions.
  • the ceramics sintered body to be used in this invention may include nitride ceramics sintered bodies containing nitrides such as silicon nitrides, aluminum nitride, titanium nitride and complexes thereof, or oxynitrides such as sialon (Si-Al-O-N), etc.
  • the ceramics sintered body may be comprised of oxide type ceramics sintered bodies such as of alumina, magnesia, etc.
  • this invention is applicable to a dense product obtainable by pressureless sintering or hot pressed sintering.
  • the ductile metal which can be used in this invention may suitably be copper and its alloy. These (soft materials) have the following elongations:
  • brass is inexpensive and 60% or more elongation can be obtained with a zinc content within the range of from 20 to 40 wt. %, and therefore it is particularly suitable for this invention.
  • group IVb transition metal to be used in this invention may include titanium, zirconium, hafnium and others. Also, its compound capable of forming nitride by reaction with nitrogen, such as titanium dioxide (TiO 2 ) may also be used. As the group IVb transition metal, titanium is suitable from the standpoint of cost.
  • the ceramics bonded product thus obtained has a great bonded strength over 10 kg/mm 2 due to the presence interface layer of a group IVb transition metal nitride, and there is no fear of formation of crack or breaking in the vicinity of the bonded interface of the ceramics sintered body on account of relaxation of stress due to the presence of a ductile metal, even when an abrupt heat shock may be applied.
  • the method of applying a slurry on the bonded surface according to the method (A) and the method (B) is suitable when bonding surfaces are of complicated shapes. Also, in the case of bonding locally or intermittently the bonding surfaces according to the method (C) and the method (D), the stress relaxation effect can be further improved, whereby generation of cracks by heat shock can effectively be prevented.
  • a metallic titanium net with a wire diameter, of 300 ⁇ m ⁇ , and a mesh interval of 1.5 mm was sandwiched between a ceramics sintered body comprising pressureless sintered silicon nitride and a copper plate and bonded by heating in vacuum at about 1050° C. for 5 minutes.
  • the ceramics bonded product thus obtained had a strength of 25 kg/mm 2 by shear and the cracking occurred at the portion of the ceramics sintered body.
  • a slurry of titanium powder dispersed in ethyl alcohol was applied by coating in scattered dots of 400 ⁇ m in diameter and, after drying at about 400° C. for 5 minutes, the coated faces were superposed on each other through a copper plate with a thickness of about 300 ⁇ m, followed by heating in an argon gas atmosphere at about 1050° C. to effect bonding.
  • the ceramics bonded product thus obtained had a shear strength of about 12 kg/mm 2 .
  • a shear strength of about 12 kg/mm 2 .
  • no microcrack was observed at all.
  • formation of microcracks was observed at the bonded interface.
  • the product formerly unavailable due to formation of cracks became sufficiently useful by acquisition of sufficient strength.
  • Copper powder (passable through 325 mesh) and metallic titanium short fibers (fiber diameter: 300 ⁇ m ⁇ , fiber length: 2 mm) were mixed in ethyl alcohol and dried. Then, the mixture was molded by a press into a compact of 500 ⁇ m in thickness and 10 mm in both length and width.
  • the thus prepared ceramics bonded product had a shear strength of 20 kg/mm 2 , and fracture occurred at the portion of the ceramics sintered body.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Products (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
US07/726,714 1983-09-30 1991-07-01 Ceramics bonded product and method of producing the same Expired - Lifetime US5125557A (en)

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JP58-182093 1983-09-30
JP58182093A JPS6077178A (ja) 1983-09-30 1983-09-30 窒化物セラミックス接合体およびその製造方法

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EP (1) EP0142673B1 (enrdf_load_html_response)
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Cited By (20)

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US5248079A (en) * 1988-11-29 1993-09-28 Li Chou H Ceramic bonding method
US6286206B1 (en) 1997-02-25 2001-09-11 Chou H. Li Heat-resistant electronic systems and circuit boards
US6384342B1 (en) 1997-02-25 2002-05-07 Chou H. Li Heat-resistant electronic systems and circuit boards with heat resistant reinforcement dispersed in liquid metal
US6413589B1 (en) 1988-11-29 2002-07-02 Chou H. Li Ceramic coating method
US6458017B1 (en) 1998-12-15 2002-10-01 Chou H. Li Planarizing method
US20030077995A1 (en) * 1998-07-09 2003-04-24 Li Chou H. Chemical mechanical polishing slurry
US6586704B1 (en) 2001-05-15 2003-07-01 The United States Of America As Represented By The United States Department Of Energy Joining of materials using laser heating
US6676492B2 (en) 1998-12-15 2004-01-13 Chou H. Li Chemical mechanical polishing
US20040195294A1 (en) * 2001-09-27 2004-10-07 Tsugio Masuda Joining agent for metal or ceramic, and method for joining metal articles or ceramic articles using the same
EP1529950A1 (en) * 2003-11-07 2005-05-11 General Electric Company Method and apparatus for arresting a crack within an exhaust nozzle flap seal body
EP1529949A1 (en) * 2003-11-07 2005-05-11 General Electric Company Method and apparatus for increasing a durability of an exhaust nozzle flap seal
US20080190552A1 (en) * 2004-06-24 2008-08-14 Eric Bouillon Method For Soldering Composite Material Parts
US20080274362A1 (en) * 2007-05-01 2008-11-06 Kramer Daniel P Method of joining metals to ceramic matrix composites
US20090186242A1 (en) * 2008-01-23 2009-07-23 Seiko Epson Corporation Method of forming bonded body and bonded body
US20090183825A1 (en) * 2008-01-23 2009-07-23 Seiko Epson Corporation Method of forming bonded body and bonded body
US20090186215A1 (en) * 2008-01-23 2009-07-23 Seiko Epson Corporation Method of forming bonded body and bonded body
US20090239007A1 (en) * 2004-09-16 2009-09-24 Esk Ceramics Gmbh & Co., Kg Process for the low-deformation diffusion welding of ceramic components
US20120037688A1 (en) * 2009-02-13 2012-02-16 Danfoss Silicon Power Gmbh Method for producing a high-temperature and temperature-change resistant connection between a semiconductor module and a connection partner
US10406774B2 (en) 2016-10-17 2019-09-10 U.S. Department Of Energy Diffusion bonding of silicon carbide using iridium and hermetic silicon carbide-iridium bonds
CN114956850A (zh) * 2022-04-14 2022-08-30 天诺光电材料股份有限公司 一种利用金属线纳米薄膜制备覆铜氮化物陶瓷板的方法

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Publication number Priority date Publication date Assignee Title
EP0208842A3 (de) * 1985-06-12 1988-07-20 Kernforschungszentrum Karlsruhe Gmbh Verfahren zum Herstellen einer festen Bindung zweier Teile
EP0221262B1 (de) * 1985-08-14 1988-11-02 Buchtal Gesellschaft mit beschränkter Haftung Grossformatige keramische Platte mit auf ihrer der Sichtseite abgewendeten Seite vorgesehenen Halterungselementen
FR2599896B1 (fr) * 1986-06-06 1988-10-21 Comp Generale Electricite Procede pour solidariser par thermocompression un tube en alumine beta ou beta seconde et un support en ceramique isolante dans un generateur electrochimique sodium-soufre et generateurs electrochimiques en faisant application
JPH0680873B2 (ja) * 1986-07-11 1994-10-12 株式会社東芝 回路基板
JPH0739236Y2 (ja) * 1986-10-30 1995-09-06 日本特殊陶業株式会社 アルミナ質基板と窒化アルミニウム基板の接合部
JPH0710645A (ja) * 1993-10-08 1995-01-13 Toshiba Corp 窒化アルミニウム接合体およびその製造方法
AT400909B (de) * 1994-01-17 1996-04-25 Plansee Ag Verfahren zur herstellung einer kühleinrichtung
JPH07101784A (ja) * 1994-06-06 1995-04-18 Toshiba Corp 窒化アルミニウム接合体およびその製造方法

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US7963435B2 (en) 2008-01-23 2011-06-21 Seiko Epson Corporation Method of forming bonded body and bonded body
US20090186242A1 (en) * 2008-01-23 2009-07-23 Seiko Epson Corporation Method of forming bonded body and bonded body
US7980448B2 (en) * 2008-01-23 2011-07-19 Seiko Epson Corporation Method of forming bonded body and bonded body
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US20120037688A1 (en) * 2009-02-13 2012-02-16 Danfoss Silicon Power Gmbh Method for producing a high-temperature and temperature-change resistant connection between a semiconductor module and a connection partner
US9287232B2 (en) * 2009-02-13 2016-03-15 Danfoss Silicon Power Gmbh Method for producing a high-temperature and temperature-change resistant connection between a semiconductor module and a connection partner
US10406774B2 (en) 2016-10-17 2019-09-10 U.S. Department Of Energy Diffusion bonding of silicon carbide using iridium and hermetic silicon carbide-iridium bonds
CN114956850A (zh) * 2022-04-14 2022-08-30 天诺光电材料股份有限公司 一种利用金属线纳米薄膜制备覆铜氮化物陶瓷板的方法
CN114956850B (zh) * 2022-04-14 2023-05-02 天诺光电材料股份有限公司 一种利用金属线纳米薄膜制备覆铜氮化物陶瓷板的方法

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