US3929594A - Electroplated anodized aluminum articles - Google Patents

Electroplated anodized aluminum articles Download PDF

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US3929594A
US3929594A US449162A US44916274A US3929594A US 3929594 A US3929594 A US 3929594A US 449162 A US449162 A US 449162A US 44916274 A US44916274 A US 44916274A US 3929594 A US3929594 A US 3929594A
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oxide layer
aluminum
cell
anodized
web
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US449162A
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Howard A Fromson
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Individual
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Individual
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Priority claimed from US361720A external-priority patent/US3865700A/en
Application filed by Individual filed Critical Individual
Priority to US449162A priority Critical patent/US3929594A/en
Priority to CA197,103A priority patent/CA1035722A/en
Priority to IT7450774A priority patent/IT1011370B/it
Priority to AU68783/74A priority patent/AU487059B2/en
Priority to DE2422918A priority patent/DE2422918C3/de
Priority to DE19742462449 priority patent/DE2462449A1/de
Priority to DE19742462450 priority patent/DE2462450A1/de
Priority to DE19742462448 priority patent/DE2462448A1/de
Priority to GB2134874A priority patent/GB1473347A/en
Priority to BR4050/74A priority patent/BR7404050D0/pt
Priority to JP5463874A priority patent/JPS5546320B2/ja
Priority to FR7417354A priority patent/FR2248332B1/fr
Priority to SE7413255A priority patent/SE411131B/xx
Priority to NL7414669A priority patent/NL165794C/xx
Priority to AT915574A priority patent/AT345311B/de
Priority to US05/622,544 priority patent/US4021592A/en
Publication of US3929594A publication Critical patent/US3929594A/en
Application granted granted Critical
Priority to CA286,564A priority patent/CA1053173A/en
Priority to JP14127478A priority patent/JPS54109038A/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/005—Apparatus specially adapted for electrolytic conversion coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/625—Discontinuous layers, e.g. microcracked layers

Definitions

  • An article having an aluminum substrate, an unsealed, porous anodic oxide layer thereon and electrolytically deposited, randomly distributed discrete metal islands having a root portion anchored in one or more pores of the oxide layer.
  • the metal islands extend from the root portion above the surface of the oxide layer in a bulbous, undercut configuration.
  • a process for treating aluminum includes the steps of electrolytically anodizing aluminum surfaced articles to form an unsealed, porous anodic oxide layer thereon followed by electrolytically depositing randomly distributed discrete metal islands in the pores of the oxide layer and extending above the surface thereof in the bulbous, undercut configuration.
  • This invention relates to a process for treating aluminum batchwise or continuously to form an unsealed, porous anodic oxide layer thereon with discrete metal islands electrolytically deposited in the pores of the oxide layer and extending above the surface thereof in a bulbous, undercut configuration.
  • This invention also relates to an article having an aluminum substrate,'an unsealed, porous anodic oxide layer and randomly distributed discrete metal islands anchored in the pores of the oxide layer.
  • discontinuous electroplated metal surface can be applied to anodized aluminum in an efficient and economical manner.
  • This discontinuous electroplated surface provides articles useful per se, for example as composite catalyst bodies, and because the discontinuous electroplated surfaces tenaciously adheres and interlocks with the anodic oxide layer on the aluminum, it is now possible to directly apply coatings and laminates to the aluminum article thereby forming a tenacious, mechanically inter-v locked bond to the coating.
  • SUMMARY Articles have an aluminum substrate, an unsealed porous anodic oxide layer on the substrate and electrolytically deposited, randomly distributed discrete metal islands having a root portion anchored in one or more pores of the oxide layer, said islands extending from the root portion above the surface of the oxide layer in a bulbous, undercut configuration.
  • the process of the invention for treating aluminum, batchwise or continuously includes the steps of: electrolytically anodizing aluminum surfaced articles on web to form an unsealed, porous anodic oxide layer thereon and thereafter electrolytically depositing randomly distributed discrete metal islands having a root portion anchored in one or more pores of the oxide layer, said islands extending from the root portion above the surface of the oxide layer in a bulbous, undercut configuration.
  • aluminum or aluminum surfaced webs are continuously electrolytically anodized and plated by continuously passing the web through an anodizing cell having therein a cathode connected to a source of direct current, continuously passing the web from the anodizing cell into a cathodic contact cell having therein a platable metal anode connected to the source of direct, introducing anodizing direct current into the web in the contact cell, the web having an anodized oxide coating formed thereon in the anodizing cell before entering the contact cell, and depositing the platable metal on or in the oxide coating in the contact cell.
  • Apparatus for carrying out this preferred process includes anodizing cell means containing a cathode connected to a source of direct current, cathodic contact cell means containing an anode connected to the samesource of direct current, and means for continuously passing an aluminum web, first through the anodizing cell means and then through the contact cell means, the anodizing direct current entering the web in the contact cell means with an anodized oxide coating formed thereon, the anode of the contact cell means being of a platablemetal and the contact cell means being adapted to deposit the platable metal on or in said oxide coating.
  • FIGS. 1-6 are photomicrographs showing chromium electrolytically deposited in the pores of an unsealed anodized aluminum surface in the form of metal islands having a bulbous, undercut configuration
  • FIGS. 7-12 are photomicrographs showing copper electrolytically deposited in the pores of an unsealed anodized aluminum surface in the form of metal islands having a bulbous, undercut configuration
  • FIG. 13 is an enlarged cross-sectional view depicting a metal island anchored in a pore of the anodic oxide layer and extending above the surface thereof in a bulbous, undercut configuration;
  • FIGS. l4ae are diagrammatic representations showing several ways in which aluminum web can be continuously anodized and plated according to the present invention.
  • the aluminum article of the invention is shown to include an aluminum substrate 18 with an unsealed, porous anodic oxide layer 16 thereon. Electrolytically deposited metal islands have a root portion 12 anchored in one or more pores 14 of the oxide layer 16. The islands extend from the root portion 12 above the surface of the oxide layer 16 in a bulbous, undercut configuration 10.
  • FIGS. 1-12 are photomicrographs obtained using an electron microscope at magnifications of 300, 1,000 and 3,000. Chromium was electrolytically deposited in these examples over a period of time of 30 seconds (FIGS. 1-3) and seconds (FIGS.. 4-6).
  • Copper 1 was electrolytically deposited over a period of time of 30 seconds (FIGS. 7-9) and 60 seconds (FIGS. 10-15). In each instance the chromium and the copper is deposited in a randomly distributed fashion in the form of discrete metal islands each of which is anchored in one or more pores of the anodic oxide layer and extends above the surface thereof in a bulbous, undercut configuration.
  • a unique feature of the present invention is the electrolytic deposition of metal islands which are discrete one from the other and each of which has a bulbous, undercut configuration.
  • the present invention takes advantage of this phenomenon by recognizing that the discrete metal islands are firmly anchored in the pores of the anodic oxide layer and the portion extending aobve the surface thereof generally has a diameter larger than the anchoring root portion in the pores of the oxide layer.
  • any platable metal can be applied to an anodized aluminum article to form a discontinuous electroplated surface according to the present invention.
  • suitable metals include copper, tin, zinc, silver, nickel, gold, rhodium, chromium, alloys and mixtures of the foregoing and the like.
  • the aluminum article of the invention having an anodized surface and a discontinuous electroplated surface can be made using conventional anodizing and plating techniques but is preferably made using the continuous process of the invention.
  • a key factor in the plating operation is the plating time which should be selected depending on the use of the aluminum article (i.e., the desired density of discrete metal articles). However, the plating time should not be so long as to cause bridging or contact between adjacent metal islands.
  • the aluminum article of the invention is preferably anodized and plated in a continuous fashion utilizing the process of the invention and/or the process disclosed in co-pending application Ser. No. 361,720 filed May 18, 1973.
  • aluminum is continuously electrolytically anodized and plated by introducing anodizing direct current into the aluminum in a cathodic contact cell containing a platable metal, the aluminum having an anodized oxide coating formed thereon before entering the cell by the action of the direct current introduced in the contact cell itself. While in the contact cell the platable metal is deposited in the pores of the preformed oxide coating in theform of metal islandsas described herein.
  • aluminum web is continuously electrolytically anodized and plated by continuously passing the web through an anodizing cell having therein a cathode connected to a source of direct current, continuously passing the web from the anodizing cell into a cathodic contact cell having therein a plotable metal anode connected to the same source of direct current.
  • Anodizing direct current is introduced into the web in the contact cell and the web has an anodized oxide coating formed thereon in tha anodizing cell before entering the contact cell. While in the contact cell platable metal is deposited in the pores of the oxide coating in the form of discrete metal islands as described herein.
  • the aluminum web entering a cathodic contact cell already has an anodized oxide coating formed thereon before entering the cell.
  • a platable metal for the anode ofthe contact cell such as a copper, nickel, zinc or the like anode.
  • direct current introduced into the aluminum web in the contact cell for forming an anodized oxide coating thereon before the web enters the cell can alsobe used to deposit platable metals from the anode in the pores of the anodized oxide coating formed on the aluminum web before it enters the contact cell.
  • direct current from one source is utilized for carrying out two operations, namely forming an oxide coating on the aluminum web before it'enters the contact cell and depositing platable metals on the preformed oxide coating while the aluminum web passes through the contact cell.
  • the process in the contact cell deposits a discontinuous plated surface in the form of metal islands as described herein,'it becomes possible to use conventional continuous electroplating techniques to enlarge the size and- /or density of the discrete metal articles forming the discontinuous electroplated surface.
  • FIG. 14 of the drawing shows several embodiments of the process of the invention for continuously anodizing and plating aluminum web.
  • FIG. 14a illustrates process and apparatus described in co-pending application Ser. No. 361,720.
  • l-Iere,-an anodizing cell is followed by a contact cell and each is provided with suitable rollers to guide an aluminum web therethrough in the direction indicated by the arrows.
  • Each cell includes a tank which contains an electrolyte.
  • the anodizing cell has a cathode connected to a source of direct current as shown.
  • the contact cell has an anode which is connected to the same source of direct current.
  • the aluminum web continually passes through the anodizing cell and then the contact cell as illustrated. Anodizing direct current is introduced into the web in the contact cell.
  • the web thus has an anodized oxide coating formed thereon in the anodizing cell before entering the contact cell through the action of the direct current introduced into the web in the contact cell.
  • This same current also causes platable metal from the anode in the contact cell to be deposited in the pores of the preformed oxide coating in the form of discontinuous discrete metal islands having a bulbous undercut configuration as described herein.
  • an aluminum web can be cleaned, de-greased or otherwise pretreated (chemically and/or mechanically) using conventional techniques before it is anodized and after being plated it can be sealed, dyed or otherwise post-treated using conventional aluminum surface finishing techniques.
  • the web is generally passed through a continuous treating operation according to the invention utilizing conventional winding and feeding equipment.
  • an aluminum web is anodized by introducing anodizing direct current into the aluminum in the cathodic contact cell which causes the formation of an anodized oxide coating on the web before it enters the contact cell.
  • the anodized web then passes through the plating bath and the plating current is introduced into the web via a contact roll positioned to contact the web after it leaves the plating cell.
  • the process is preferably started up by first threading bare aluminum web through the three treatment cells and is placed in contact with the contact roll at the exit of the plating cell.
  • the plating current is first switched on which results in some plating on the bare aluminum web.
  • the web entering the plating bath is'anodized and is plated therein with a discontinuous surface in the form of the discrete metal islands as described herein.
  • This start up procedure is, required when plating contact is made via a contact roll and plating is done in a separate plating cell, e.g. in the process of FIGS. 14c
  • FIGS. 14b and d It is preferred of FIGS. 14b and d.
  • the, aluminum web' is anodized in an anodizing cell and the web is in contact with an electrically conductive roll prior to entering the anodizing cell.
  • the anodized web then passes into a plating cell where the web is in contact with an electrically conductive roll after leaving the plating cell.
  • the contact roll preceding the anodizing cell introduces the anodizing current and the contact roll following the plating cell introduces the plating current to the web.
  • FIG. 1411 is similar to FIG. 14b wherein the contact cell and the plating cell are combined into the same cell.
  • the aluminum web is anodized by passing first through a contact cell and then through an anodizing cell.
  • the anodized web is then passed through a plating cell and plating current is introduced to the web via an electrically conductive contact roll in contact with the web after it leaves the plating cell.
  • the process illustrated by FIG. 142 is initiated with bare aluminum in the same manner as described for the embodiment shown in FIG. 14b.
  • the present invention makes it possible to prepare coated articles by applying a coating to the oxide layer which adheres thereto and surrounds the undercut metal islands extending above the surface of the oxide layer.
  • lithographic printing plates are prepared by applying a photosensitive layer to the oxide layer which surrounds the undercut metal islands.
  • Suitable photosensitive or radiation sensitive material that can be used in preparing lithographic printing plates according to the invention include dichromated colloids, photopolymers, such as diazo resins and the like. These and other photochemical materials are described in detail in a text offered by Kosar entitled Light-sensitive Systems, John Wiley and Sons, Inc., New York (1965).
  • Suitable coating material for forming a coated article according to the invention include organic and inorganic materials.
  • Suitable organic materials include polymers and rubbers such as polyethylene, polypropylene, Teflon, Latex and the like. These materials can be applied to the discontinuously electroplated surface using conventional film coating techniques such as extrusion coating, dispersion and emulsion coating and the like.
  • coating materials can be spray coated onto the discontinuously electroplated surface in particulate form and then fused in place at temperatures lower than the softening or melting temperature of the electroplated substrate itself.
  • Materials that can be applied in this fashion include nylon, Teflon and other sinterable organic materials and inorganic materials such as glasses, oxides and ceramic frits.
  • a coated article by electric plating a different metal onto the discontinuously electroplated surface (for example lead or tin can be electroplated onto a discontinuously electroplated chrome surface according to the invention) to fill the areas between the discrete metal islands forming a continuous metal surface.
  • a different metal onto the discontinuously electroplated surface for example lead or tin can be electroplated onto a discontinuously electroplated chrome surface according to the invention
  • the electroplated metal applied to the discontinuously electroplated surface of the invention can be fused or melted in place in a finishing operation.
  • the article of the invention can also serve as a composite catalyst body by utilizing catalytically active metals in theelectro deposition step.
  • S'uch catalytically activemetals include iron, cobalt, nickel, palladium, platinum, ruthenium, rhodium, manganese, chromium, copper, molybdenum, tungsten, the rare earth and noble metals and the like.
  • the aluminum substrate can be preformed into rolled or honeycomb configurations and the oxide layer and discontinuous electroplated layer can be formed subsequently.
  • Such catalyst bodies can be used in a host of catalytic applications for example, in automotive air pollution devices and the like. It is particularly advantageous to prepare an aluminum substrate with gamma aluminum oxide as the anodic oxide layer. This form of alumina is catalytically active by itself in automotive anti-pollution devices and contributes to the catalytic action of a composite catalyst body incorporating metal islands of a catalytically active metal as described above.
  • the present invention can also be used to advantage in the field of electroless plating whereby metallic finishes are applied to non-conducting substrates such as plastics.
  • the improvement in electroless plating accordingto the present invention involves laminating or otherwise adherring a non-conductive layer such as a phenolic resin, an epoxy resin, ABS, polyethylene, polypropylene, nylon, and the like to an aluminum article produced according to the invention such that the non-conductive meterial surrounds the undercut metal islands extending above the surface of the oxide layer.
  • the aluminum substrate and the anodic oxide layer are then removed, for example, by chemical etching, leaving behind the discrete individual metal islands imbedded in the surface portion of the non-conductive material. These imbedded islands can then serve as nucleating sites for subsequent electroless depositions of metal coatings using conventional electroless plating techniques. Once an electroless metal finish is applied it is possible to apply further metal finishes using conventional electroplating techniques.
  • the foregoing would be in lieu of current practices in electroless plating involving etching the plastic surface to provide anchoring site for nucleating agents or pressing a plastic surface against an unsealed anodized aluminum surface followed by etching the aluminum away, leaving a mirror image of the anodized surface in the surface of the plastic, again providing a roughened surface for anchoring nucleating agents.
  • the metal islands imbedded in the surface of the non-conductive material can also be removed leaving undercut pores or openings in the nonconductive layer which can then be used as sites for depositing nucleating agents for depositing an electroless metal layer.
  • the undercut pore remaining after the imbedded islands are removed provides an improved anchoring site for nucleating agents and subsequent deposited electroless metal coatings.
  • Chromium and copper was electroplated onto an anodized aluminum surface forming a discontinuous electroplated surface thereon composed of discrete metal islands having a bulbous undercut configuration as illustrated in FIGS. 1 l2.
  • Cleaned aluminum plaques were anodized in an electrolyte containing 280 grams of sulfuric acid per liter of water. Anodizing was carried out at a temperature of 40C with a current density of 30 amps per square foot for a period of approximately 54 seconds.
  • chromium plating wascarried out in ran electrolyte containing 250 grams of chromic acidper literof water and 2.5 grams of sulfuric acid per liter of water. Plating was carried out at a temperature of 4OT45C for plating times between 60 and 120 seconds at a current density of 125 amps persquare foot. The results are shown in FIGS. l-6'of the drawing.
  • the presentinvention makes it possible to continuously anodize and plate aluminum web with either a discontinuousplated metal surface as described herein or, if desired, with a continuous electroplated coating.
  • the process for accomplishing this- -.preceding the anodizing cell connected to the same involves continuously electrolytically anodizing aluminum web in an anodizing cell having therein a cathode connected to a source of direct current and a contact roll connected to the same source of current which precedes the anodizing; cell. and makes electrical contact with the aluminum web before it enters the anodizing cell proper.
  • the anodized web is plated by electrolytically depositing a platable metal in a plating cell having therein a platablemetal anode connected to a second source of direct currentand'a contact roll connected to the same'second source of current and following the plating cell so as to contact the plated aluminum web after it leaves the platingcell.
  • This embodiment is illustrated in FIG. 140 of the drawing and as noted previously, it is necessary to start up the process byfirst threading bare aluminum web through the anodizing and plating cells so as to contact the contact roll preceding the anodizing cell and the contact roll following the plating cell.
  • Plating current is switched on in the'plating'cell which results in some plating on the bare aluminum web.
  • As'anodizing in the anodizing cell proceeds, the web entering the plating bath is already anodized'and is then plated with a discontinuous or continuous platedmetal surface.
  • Apparatus for continuously treating aluminum web via the embodiment illustrated-in FIG. 14c includes-an anodizing cell means for continuously electrolytically anodizing aluminum web having therein a cathode connected to a source of current and'a contact roll source of current, and plating cell means for continuously electrolyticallydepositing a platable metal onto the anodized aluminum web having therein a platable vmetal anode connected to a second source of current anda contact roll following the plating 'cell means connected to the second source of current.”
  • Lithographic printing plate having an aluminum substrate, a porous anodic oxide layer on the substrate, electrolytically deposited, randomly distributed discrete metal islandshaving a root portion anchored in one or more pores, of the oxide layer, said islands extending from theroot portion above the surface of the oxide layer thereby forming a' composite anodized and discontinuously electroplated surface, and a layer of photosensitive material adhered to said anodized and electroplated surface.
  • Coated article having an aluminum substrate, a porous anodic oxide layer on the substrate, electrolytically desp'oited, randomly distributed discrete metal islands having a root portion anchored in one or more pores of the oxide layer, said islands extending from the root portion above the surface of the oxide layer thereby forming a composite anodized and discontinuously electroplated surface and a coating layer applied to said anodized and electroplated surface.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrochemical Coating By Surface Reaction (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Catalysts (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
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US449162A 1973-05-18 1974-03-07 Electroplated anodized aluminum articles Expired - Lifetime US3929594A (en)

Priority Applications (18)

Application Number Priority Date Filing Date Title
US449162A US3929594A (en) 1973-05-18 1974-03-07 Electroplated anodized aluminum articles
CA197,103A CA1035722A (en) 1973-05-18 1974-04-08 Electroplated anodized aluminum articles and process therefor
IT7450774A IT1011370B (it) 1973-05-18 1974-05-03 Procedimento per la placcatura elettrolitica di oggetti di allumi nio anodizzato e prodotto ottenuto
AU68783/74A AU487059B2 (en) 1974-05-09 Anodizing and plating of aluminum
DE2422918A DE2422918C3 (de) 1973-05-18 1974-05-11 Flachdruckplatte und Verfahren zu ihrer Herstellung
DE19742462449 DE2462449A1 (de) 1973-05-18 1974-05-11 Verfahren zum kontinuierlichen elektrolytischen eloxieren und galvanisieren von aluminium sowie vorrichtung zur durchfuehrung dieses verfahrens
DE19742462450 DE2462450A1 (de) 1973-05-18 1974-05-11 Verfahren zum stromlosen plattieren oder galvanisieren von metallen sowie mit diesem verfahren hergestellter gegenstand
DE19742462448 DE2462448A1 (de) 1973-05-18 1974-05-11 Flaechiger metallgegenstand, verfahren zu seiner herstellung sowie katalysator aus diesem metallgegenstand
GB2134874A GB1473347A (en) 1973-05-18 1974-05-14 Electroplated anodized aluminium articles and process therefor
JP5463874A JPS5546320B2 (de) 1973-05-18 1974-05-17
BR4050/74A BR7404050D0 (pt) 1973-05-18 1974-05-17 Artigo com substrato de aluminio e placa de impressao litografica, processos e aparelhos de tratamento de aluminio e artigos revestidos de aluminio, e processo e aparelhos de galvanizar e anodizar
FR7417354A FR2248332B1 (de) 1973-05-18 1974-05-17
SE7413255A SE411131B (sv) 1974-03-07 1974-10-21 Litografisk tryckplat med aluminiumunderlag och ett porost anodoxidskikt pa underlaget samt forfarande for dess framstellning
NL7414669A NL165794C (nl) 1974-03-07 1974-11-11 Bekleed voorwerp met een substraat van aluminium.
AT915574A AT345311B (de) 1974-03-07 1974-11-15 Lichtempflindliches material zur herstellung einer druckplatte
US05/622,544 US4021592A (en) 1974-03-07 1975-10-15 Process of making electroplated anodized aluminum articles and electroless plating
CA286,564A CA1053173A (en) 1973-05-18 1977-09-12 Electroplated anodized aluminum articles and process therefor
JP14127478A JPS54109038A (en) 1973-05-18 1978-11-17 Continuous aluminum anodizing* electroplating* and apparatus therefor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US361720A US3865700A (en) 1973-05-18 1973-05-18 Process and apparatus for continuously anodizing aluminum
US449162A US3929594A (en) 1973-05-18 1974-03-07 Electroplated anodized aluminum articles

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US361720A Continuation-In-Part US3865700A (en) 1973-05-18 1973-05-18 Process and apparatus for continuously anodizing aluminum

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US05/622,544 Continuation US4021592A (en) 1974-03-07 1975-10-15 Process of making electroplated anodized aluminum articles and electroless plating

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US (1) US3929594A (de)
JP (2) JPS5546320B2 (de)
BR (1) BR7404050D0 (de)
CA (1) CA1035722A (de)
DE (4) DE2462448A1 (de)
FR (1) FR2248332B1 (de)
GB (1) GB1473347A (de)
IT (1) IT1011370B (de)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4014756A (en) * 1976-01-21 1977-03-29 Fromson H A Process for making metal powders
US4021592A (en) * 1974-03-07 1977-05-03 Fromson H A Process of making electroplated anodized aluminum articles and electroless plating
US4371430A (en) * 1979-04-27 1983-02-01 Printing Developments, Inc. Electrodeposition of chromium on metal base lithographic sheet
DE3311473A1 (de) * 1982-03-29 1983-10-06 Polychrome Corp Verfahren zur anodischen oxidation eines aluminium-traegermaterials fuer die herstellung lithografischer druckplatten
US4526671A (en) * 1982-09-24 1985-07-02 Pilot Man-Nen-Hitsu Kabushiki Kaisha Surface treatment of aluminum or aluminum alloys
US4846065A (en) * 1986-10-23 1989-07-11 Man Technologie Gmbh Printing image carrier with ceramic surface
US4862799A (en) * 1987-11-13 1989-09-05 Rockwell International Corporation Copper coated anodized aluminum ink metering roller
US5693207A (en) * 1995-07-13 1997-12-02 Howard A. Fromson Catalyst preparation
WO2000058006A1 (en) * 1999-03-30 2000-10-05 Fromson H A Catalyst structure and method of manufacture
US6214765B1 (en) 1999-11-02 2001-04-10 Howard A. Fromson Catalyst product and method of manufacture
US6479430B1 (en) * 1995-07-13 2002-11-12 Howard A. Fromson Catalyst preparation
WO2014130453A1 (en) * 2013-02-19 2014-08-28 Alumiplate, Inc. Methods for improving adhesion of aluminum films
EP3138939A3 (de) * 2015-06-15 2017-04-19 Palo Alto Research Center, Incorporated Herstellung passiver radiativer kühlplatten und module
US9871298B2 (en) 2014-12-23 2018-01-16 Palo Alto Research Center Incorporated Rectifying circuit for multiband radio frequency (RF) energy harvesting
US9927188B2 (en) 2015-06-15 2018-03-27 Palo Alto Research Center Incorporated Metamaterials-enhanced passive radiative cooling panel
US9935370B2 (en) 2014-12-23 2018-04-03 Palo Alto Research Center Incorporated Multiband radio frequency (RF) energy harvesting with scalable antenna
US9972877B2 (en) 2014-07-14 2018-05-15 Palo Alto Research Center Incorporated Metamaterial-based phase shifting element and phased array
US10060686B2 (en) 2015-06-15 2018-08-28 Palo Alto Research Center Incorporated Passive radiative dry cooling module/system using metamaterials
US10355356B2 (en) 2014-07-14 2019-07-16 Palo Alto Research Center Incorporated Metamaterial-based phase shifting element and phased array

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2616662C2 (de) * 1976-04-15 1984-02-02 Dornier System Gmbh, 7990 Friedrichshafen Verfahren zur herstellung einer selektiven solarabsorberschicht auf aluminium
JPS53100508A (en) * 1977-02-16 1978-09-02 Hitachi Cable Ltd Rigid trolley
JPS55176624U (de) * 1979-06-01 1980-12-18
CN112941514A (zh) * 2021-02-05 2021-06-11 南昌航空大学 一种铜/镍反应性纳米多层膜的制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1947981A (en) * 1930-11-07 1934-02-20 Siemens Ag Plating aluminum
US2798037A (en) * 1953-05-13 1957-07-02 Sprague Electric Co Aluminum oxide films
US2898490A (en) * 1957-12-23 1959-08-04 Gen Electric Target plate
US2930951A (en) * 1957-07-08 1960-03-29 Gen Electric Electrical capacitor
US3099609A (en) * 1961-09-11 1963-07-30 Katayose Kimiyoshi Method of electroplating aluminum or its alloy with porous hard chromium

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1947981A (en) * 1930-11-07 1934-02-20 Siemens Ag Plating aluminum
US2036962A (en) * 1930-11-07 1936-04-07 Siemens Ag Method for production of firmly adhering galvanic coatings on aluminum and aluminum alloys
US2798037A (en) * 1953-05-13 1957-07-02 Sprague Electric Co Aluminum oxide films
US2930951A (en) * 1957-07-08 1960-03-29 Gen Electric Electrical capacitor
US2898490A (en) * 1957-12-23 1959-08-04 Gen Electric Target plate
US3099609A (en) * 1961-09-11 1963-07-30 Katayose Kimiyoshi Method of electroplating aluminum or its alloy with porous hard chromium

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4021592A (en) * 1974-03-07 1977-05-03 Fromson H A Process of making electroplated anodized aluminum articles and electroless plating
US4014756A (en) * 1976-01-21 1977-03-29 Fromson H A Process for making metal powders
US4371430A (en) * 1979-04-27 1983-02-01 Printing Developments, Inc. Electrodeposition of chromium on metal base lithographic sheet
DE3311473A1 (de) * 1982-03-29 1983-10-06 Polychrome Corp Verfahren zur anodischen oxidation eines aluminium-traegermaterials fuer die herstellung lithografischer druckplatten
US4526671A (en) * 1982-09-24 1985-07-02 Pilot Man-Nen-Hitsu Kabushiki Kaisha Surface treatment of aluminum or aluminum alloys
US4846065A (en) * 1986-10-23 1989-07-11 Man Technologie Gmbh Printing image carrier with ceramic surface
US4862799A (en) * 1987-11-13 1989-09-05 Rockwell International Corporation Copper coated anodized aluminum ink metering roller
US6479430B1 (en) * 1995-07-13 2002-11-12 Howard A. Fromson Catalyst preparation
US5693207A (en) * 1995-07-13 1997-12-02 Howard A. Fromson Catalyst preparation
WO2000058006A1 (en) * 1999-03-30 2000-10-05 Fromson H A Catalyst structure and method of manufacture
US6214765B1 (en) 1999-11-02 2001-04-10 Howard A. Fromson Catalyst product and method of manufacture
WO2014130453A1 (en) * 2013-02-19 2014-08-28 Alumiplate, Inc. Methods for improving adhesion of aluminum films
US9972877B2 (en) 2014-07-14 2018-05-15 Palo Alto Research Center Incorporated Metamaterial-based phase shifting element and phased array
US10355356B2 (en) 2014-07-14 2019-07-16 Palo Alto Research Center Incorporated Metamaterial-based phase shifting element and phased array
US9871298B2 (en) 2014-12-23 2018-01-16 Palo Alto Research Center Incorporated Rectifying circuit for multiband radio frequency (RF) energy harvesting
US9935370B2 (en) 2014-12-23 2018-04-03 Palo Alto Research Center Incorporated Multiband radio frequency (RF) energy harvesting with scalable antenna
EP3138939A3 (de) * 2015-06-15 2017-04-19 Palo Alto Research Center, Incorporated Herstellung passiver radiativer kühlplatten und module
US9927188B2 (en) 2015-06-15 2018-03-27 Palo Alto Research Center Incorporated Metamaterials-enhanced passive radiative cooling panel
US10060686B2 (en) 2015-06-15 2018-08-28 Palo Alto Research Center Incorporated Passive radiative dry cooling module/system using metamaterials

Also Published As

Publication number Publication date
DE2422918A1 (de) 1974-12-05
JPS5041729A (de) 1975-04-16
JPS5636879B2 (de) 1981-08-27
CA1035722A (en) 1978-08-01
DE2462448A1 (de) 1977-03-31
BR7404050D0 (pt) 1974-12-03
AU6878374A (en) 1975-11-13
DE2422918B2 (de) 1977-12-08
DE2422918C3 (de) 1978-08-17
JPS54109038A (en) 1979-08-27
GB1473347A (en) 1977-05-11
DE2462450A1 (de) 1977-03-31
FR2248332A1 (de) 1975-05-16
DE2462449A1 (de) 1977-03-31
FR2248332B1 (de) 1979-07-27
JPS5546320B2 (de) 1980-11-22
IT1011370B (it) 1977-01-20

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