FR2248332B1 - - Google Patents

Info

Publication number
FR2248332B1
FR2248332B1 FR7417354A FR7417354A FR2248332B1 FR 2248332 B1 FR2248332 B1 FR 2248332B1 FR 7417354 A FR7417354 A FR 7417354A FR 7417354 A FR7417354 A FR 7417354A FR 2248332 B1 FR2248332 B1 FR 2248332B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7417354A
Other versions
FR2248332A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fromson H A
Original Assignee
Fromson H A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US361720A external-priority patent/US3865700A/en
Application filed by Fromson H A filed Critical Fromson H A
Publication of FR2248332A1 publication Critical patent/FR2248332A1/fr
Application granted granted Critical
Publication of FR2248332B1 publication Critical patent/FR2248332B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/005—Apparatus specially adapted for electrolytic conversion coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/625—Discontinuous layers, e.g. microcracked layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrochemical Coating By Surface Reaction (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Catalysts (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Chemically Coating (AREA)
FR7417354A 1973-05-18 1974-05-17 Expired FR2248332B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US361720A US3865700A (en) 1973-05-18 1973-05-18 Process and apparatus for continuously anodizing aluminum
US449162A US3929594A (en) 1973-05-18 1974-03-07 Electroplated anodized aluminum articles

Publications (2)

Publication Number Publication Date
FR2248332A1 FR2248332A1 (fr) 1975-05-16
FR2248332B1 true FR2248332B1 (fr) 1979-07-27

Family

ID=27001395

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7417354A Expired FR2248332B1 (fr) 1973-05-18 1974-05-17

Country Status (8)

Country Link
US (1) US3929594A (fr)
JP (2) JPS5546320B2 (fr)
BR (1) BR7404050D0 (fr)
CA (1) CA1035722A (fr)
DE (4) DE2462448A1 (fr)
FR (1) FR2248332B1 (fr)
GB (1) GB1473347A (fr)
IT (1) IT1011370B (fr)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4021592A (en) * 1974-03-07 1977-05-03 Fromson H A Process of making electroplated anodized aluminum articles and electroless plating
US4014756A (en) * 1976-01-21 1977-03-29 Fromson H A Process for making metal powders
DE2616662C2 (de) * 1976-04-15 1984-02-02 Dornier System Gmbh, 7990 Friedrichshafen Verfahren zur herstellung einer selektiven solarabsorberschicht auf aluminium
JPS53100508A (en) * 1977-02-16 1978-09-02 Hitachi Cable Ltd Rigid trolley
US4371430A (en) * 1979-04-27 1983-02-01 Printing Developments, Inc. Electrodeposition of chromium on metal base lithographic sheet
JPS55176624U (fr) * 1979-06-01 1980-12-18
US4406757A (en) * 1982-03-29 1983-09-27 Polychrome Corporation Anodization method
US4526671A (en) * 1982-09-24 1985-07-02 Pilot Man-Nen-Hitsu Kabushiki Kaisha Surface treatment of aluminum or aluminum alloys
DE3636129A1 (de) * 1986-10-23 1988-05-05 Man Technologie Gmbh Druckform fuer den flachdruck
US4862799A (en) * 1987-11-13 1989-09-05 Rockwell International Corporation Copper coated anodized aluminum ink metering roller
US5693207A (en) * 1995-07-13 1997-12-02 Howard A. Fromson Catalyst preparation
US6479430B1 (en) * 1995-07-13 2002-11-12 Howard A. Fromson Catalyst preparation
US6083871A (en) * 1999-03-30 2000-07-04 Howard A. Fromson Catalyst structure and method of manufacture
US6214765B1 (en) 1999-11-02 2001-04-10 Howard A. Fromson Catalyst product and method of manufacture
WO2014130453A1 (fr) * 2013-02-19 2014-08-28 Alumiplate, Inc. Procédés pour améliorer l'adhérence de films d'aluminium
US9972877B2 (en) 2014-07-14 2018-05-15 Palo Alto Research Center Incorporated Metamaterial-based phase shifting element and phased array
US10355356B2 (en) 2014-07-14 2019-07-16 Palo Alto Research Center Incorporated Metamaterial-based phase shifting element and phased array
US9871298B2 (en) 2014-12-23 2018-01-16 Palo Alto Research Center Incorporated Rectifying circuit for multiband radio frequency (RF) energy harvesting
US9935370B2 (en) 2014-12-23 2018-04-03 Palo Alto Research Center Incorporated Multiband radio frequency (RF) energy harvesting with scalable antenna
US9927188B2 (en) 2015-06-15 2018-03-27 Palo Alto Research Center Incorporated Metamaterials-enhanced passive radiative cooling panel
US10060686B2 (en) 2015-06-15 2018-08-28 Palo Alto Research Center Incorporated Passive radiative dry cooling module/system using metamaterials
US20160362807A1 (en) * 2015-06-15 2016-12-15 Palo Alto Research Center Incorporated Producing Passive Radiative Cooling Panels And Modules
CN112941514A (zh) * 2021-02-05 2021-06-11 南昌航空大学 一种铜/镍反应性纳米多层膜的制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE606850C (de) * 1930-11-07 1934-12-12 Siemens Ag Verfahren zur Erzeugung festhaftender galvanischer Niederschlaege auf Aluminium und dessen Legierungen
US2798037A (en) * 1953-05-13 1957-07-02 Sprague Electric Co Aluminum oxide films
US2930951A (en) * 1957-07-08 1960-03-29 Gen Electric Electrical capacitor
US2898490A (en) * 1957-12-23 1959-08-04 Gen Electric Target plate
US3099609A (en) * 1961-09-11 1963-07-30 Katayose Kimiyoshi Method of electroplating aluminum or its alloy with porous hard chromium

Also Published As

Publication number Publication date
DE2422918A1 (de) 1974-12-05
JPS5041729A (fr) 1975-04-16
JPS5636879B2 (fr) 1981-08-27
CA1035722A (fr) 1978-08-01
DE2462448A1 (de) 1977-03-31
BR7404050D0 (pt) 1974-12-03
AU6878374A (en) 1975-11-13
DE2422918B2 (de) 1977-12-08
DE2422918C3 (de) 1978-08-17
JPS54109038A (en) 1979-08-27
GB1473347A (en) 1977-05-11
DE2462450A1 (de) 1977-03-31
FR2248332A1 (fr) 1975-05-16
US3929594A (en) 1975-12-30
DE2462449A1 (de) 1977-03-31
JPS5546320B2 (fr) 1980-11-22
IT1011370B (it) 1977-01-20

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Legal Events

Date Code Title Description
ST Notification of lapse