US20210231125A1 - Fan comprising a cooling body consisting of heat-conductive plastic - Google Patents
Fan comprising a cooling body consisting of heat-conductive plastic Download PDFInfo
- Publication number
- US20210231125A1 US20210231125A1 US15/734,809 US201915734809A US2021231125A1 US 20210231125 A1 US20210231125 A1 US 20210231125A1 US 201915734809 A US201915734809 A US 201915734809A US 2021231125 A1 US2021231125 A1 US 2021231125A1
- Authority
- US
- United States
- Prior art keywords
- cover
- fan
- cooling
- electronic system
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 51
- 239000004033 plastic Substances 0.000 title claims abstract description 11
- 229920003023 plastic Polymers 0.000 title claims abstract description 11
- 239000000463 material Substances 0.000 claims description 8
- 229920002635 polyurethane Polymers 0.000 claims description 5
- 239000004814 polyurethane Substances 0.000 claims description 5
- 239000004698 Polyethylene Substances 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 230000003247 decreasing effect Effects 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- -1 polyethylene Polymers 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims 2
- 229920002647 polyamide Polymers 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D25/068—Mechanical details of the pump control unit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/02—Selection of particular materials
- F04D29/023—Selection of particular materials especially adapted for elastic fluid pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/40—Casings; Connections of working fluid
- F04D29/42—Casings; Connections of working fluid for radial or helico-centrifugal pumps
- F04D29/4206—Casings; Connections of working fluid for radial or helico-centrifugal pumps especially adapted for elastic fluid pumps
- F04D29/4226—Fan casings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/5813—Cooling the control unit
Definitions
- the invention relates to a fan comprising a cooling body embodied as a plastic cover.
- a cooling body has the task of absorbing heat from an element to be cooled and releasing it again to a surrounding medium.
- a material of high thermal conductivity such as aluminum or copper, is typically used for the cooling body.
- Mass production of aluminum cooling bodies is typically done using the die casting process. For this purpose, heated aluminum in the liquid or sticky state is pressed, under high pressure, into a preheated steel mold which will later serve as a conductive cooling body.
- Cooling bodies are also used for motors.
- DE 19841583 A1 addresses a cooling body for cooling elements, in particular semiconductor components, motors and aggregates, in particular a cooling unit at least partially made of extruded aluminum or other light metal, consisting of at least two separate base profiles for mounting the electric components which are spaced apart from each other and interconnected by means of a plurality of separate cooling fins. Further, the assembly of at least one fan is provided between two adjacent base profiles.
- heat conduction also known as heat diffusion or thermal conduction—is understood to mean the flow of heat induced by a difference in temperature.
- heat conduction is a mechanism for transferring thermal energy without requiring a macroscopic flow of material as with the alternative mechanism of convection. Heat transfer through heat radiation is also considered as a separate mechanism.
- a measure of heat conduction in a particular substance is thermal conductivity.
- the object of the invention is therefore to provide cooling for the electronic system of a fan motor of a fan, which can be produced cost-effectively and works reliably.
- a basic idea of the present invention is to cool the electronic system of a fan using a plastic cooling body instead of a metal cooling body.
- This approach which is unknown in the prior art, can be realized by using the cooling body as a cover with a very thin wall thickness having a specific form and surface.
- a fan comprising an electronic system on a printed circuit board, wherein, above the electronic system, a cover is provided which works both as an active cooling body and a passive cooling body, wherein, for this purpose, the cover is designed substantially as a flat covering element consisting of a thin-walled plastic and has a form with a surface effective for the cooling of the electronic system arranged beneath the cover, said surface being larger than the projected base area of the cover by a factor of at least 2.
- the cover has a cooling fin structure with a plurality of cooling fins which increase the effective surface.
- the cover forms a plurality of recesses in which fastening holes are provided at which the cover is detachably fastened to the fan by releasable fastening means.
- the cover has, in the area of the cooling fin structure, a flat contact side for directly contacting heat-producing components.
- the cover has the cooling fin structure in one or more areas or forms a plurality of areas with such a cooling fin structure.
- cooling fins are attached or formed to extend radially outwards, thereby implementing a structure open radially outwards and upwards which has an advantageous effect on production and the cooling effect.
- cooling fins have a changing, in particular outwardly decreasing, wall thickness.
- Other forms and configurations of the wall thickness are also conceivable to improve heat dissipation effects.
- an overall smaller wall thickness is aimed for in order to achieve rapid heat dissipation and also to prevent heat build-up.
- a further optimization is a solution in which the cover forms a flat contact surface on the bottom facing the electronic system and in which, in the assembled state, this contact surface at least partially abuts electronic components.
- the cover is formed from a substantially round section integrally joined to a projection (preferably with a linearly extending lateral edge).
- the material of the cover is a polyimide (PA), polyurethane (PUR), polycarbonate (PC) or polyethylene (PE).
- PA polyimide
- PUR polyurethane
- PC polycarbonate
- PE polyethylene
- the thickness of the cover is smaller in the area parallel to the arrangement of the printed circuit board and/or the area of the flat contact surface than in a periphery or in the area of the cover extending towards the electronic system by a factor of at least 2.
- the essential stabilizing properties can be placed in the periphery and the essential thermal properties in the flat area and the areas with the cooling fins.
- FIG. 1 shows a schematic sectional view through a radial fan
- FIG. 2 shows a perspective view of the radial fan of FIG. 1 ,
- FIG. 3 shows a top view of the cover of the electronic system of the radial fan of FIG. 1 ,
- FIG. 4 shows a perspective view of the cover of FIG. 3 .
- FIG. 5 shows a sectional view of the cover of FIG. 3 .
- FIG. 1 shows a schematic sectional view through a fan 1 , here a radial fan.
- Fan 1 is embodied with an electronic system on a printed circuit board 2 .
- a cover 10 according to the invention is shown which is embodied both as an active cooling body and a passive cooling body.
- cover 10 is designed as a substantially flat covering element consisting of a thin-walled plastic and has a form with a surface 11 which is effective for the cooling of the electronic system arranged beneath cover 10 , said surface being larger than the projected base area of cover 10 by a factor of at least 2 due to the cooling fin structure with a plurality of cooling fins 12 as can be seen in FIG. 2 .
- the cooling fins run or extend radially outwards.
- Cover 10 is formed from a substantially central round section 17 integrally joined to a projection 18 with a straight lateral edge.
- cover 10 forms a plurality of recesses 13 in which fastening holes 14 are provided.
- cover 20 is detachably fastened to fan 1 by releasable fastening means 15 (e.g., screws).
- cover 10 forms a flat contact surface 19 by which it at least partially abuts electronic components in the assembled state.
- cooling fins 12 have a changing wall thickness, in particular slightly decreasing from bottom to top, and taper slightly, so to speak.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102018118925.7 | 2018-08-03 | ||
DE102018118925.7A DE102018118925A1 (de) | 2018-08-03 | 2018-08-03 | Lüfter mit Kühlkörper |
PCT/EP2019/070049 WO2020025443A1 (fr) | 2018-08-03 | 2019-07-25 | Ventilateur avec refroidisseur en matière plastique thermoconductrice |
Publications (1)
Publication Number | Publication Date |
---|---|
US20210231125A1 true US20210231125A1 (en) | 2021-07-29 |
Family
ID=67470397
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/734,809 Abandoned US20210231125A1 (en) | 2018-08-03 | 2019-07-25 | Fan comprising a cooling body consisting of heat-conductive plastic |
Country Status (5)
Country | Link |
---|---|
US (1) | US20210231125A1 (fr) |
EP (1) | EP3830425A1 (fr) |
CN (2) | CN209398636U (fr) |
DE (1) | DE102018118925A1 (fr) |
WO (1) | WO2020025443A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230070319A1 (en) * | 2021-09-08 | 2023-03-09 | Dell Products L.P. | Fan covering with high recycle content and high thermal conductivity |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040041475A1 (en) * | 2002-09-03 | 2004-03-04 | Cichetti Michael D. | Apparatus and method for cooling an electric motor |
US20140217844A1 (en) * | 2013-02-01 | 2014-08-07 | Regal Beloit America, Inc. | Electrical machines and methods of assembling the same |
US20150263591A1 (en) * | 2012-08-02 | 2015-09-17 | Ebm-Papst Mulfingen Gmbh & Co. Kg | Active cooling of a motor having an integrated cooling channel |
US20160087511A1 (en) * | 2013-05-29 | 2016-03-24 | Spal Automotive S.R.L | Electrical machine |
US20170163122A1 (en) * | 2015-12-04 | 2017-06-08 | Ebm-Papst Mulfingen Gmbh & Co. Kg | Cover device for an electronics housing of an electric motor |
US20190145302A1 (en) * | 2016-07-15 | 2019-05-16 | Hanon Systems | High voltage cooling fan motor unit |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3916791C3 (de) * | 1988-10-28 | 1998-09-17 | Valeo Sistemi Termici S P A | Gebläse-Einbausatz einer Kraftwagenheizung |
DE19841583A1 (de) | 1998-09-11 | 2000-03-16 | Glueck Joachim | Kühlkörper mit mindestens zwei separaten Basisplatten |
US6176299B1 (en) * | 1999-02-22 | 2001-01-23 | Agilent Technologies, Inc. | Cooling apparatus for electronic devices |
EP1419568B1 (fr) * | 2002-08-01 | 2005-05-04 | ebm-papst Mulfingen GmbH & Co.KG | Moteur electrique a protection ip elevee |
DE10321732B4 (de) * | 2003-05-14 | 2013-08-01 | Robert Bosch Gmbh | Kühlung der Ansteuerung von Kühlgebläsen für Kraftfahrzeugmotoren |
JP2005168133A (ja) * | 2003-12-01 | 2005-06-23 | Mitsuba Corp | 電動モータ |
ITBO20070791A1 (it) * | 2007-11-30 | 2009-06-01 | Spal Automotive Srl | Macchina elettrica rotante e metodo di assemblaggio della stessa. |
IT1394272B1 (it) * | 2009-05-25 | 2012-06-06 | Spal Automotive Srl | Metodo per la realizzazione di una macchina elettrica. |
DE102009045063C5 (de) * | 2009-09-28 | 2017-06-01 | Infineon Technologies Ag | Leistungshalbleitermodul mit angespritztem Kühlkörper, Leistungshalbleitermodulsystem und Verfahren zur Herstellung eines Leistungshalbleitermoduls |
WO2012042971A1 (fr) * | 2010-09-29 | 2012-04-05 | アイシン精機株式会社 | Pompe électrique |
DE102012010483A1 (de) * | 2012-05-26 | 2013-11-28 | Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg | Bürstensystem für einen Elektromotor |
KR101345703B1 (ko) * | 2013-03-11 | 2013-12-30 | 주식회사 원진일렉트로닉스 | 차량의 블로어 모터 구동기용 히트싱크 |
DE102014112821A1 (de) * | 2014-09-05 | 2016-03-10 | Ebm-Papst Mulfingen Gmbh & Co. Kg | Lüfter mit Leiterplattenkühlkreislauf |
US10230290B2 (en) * | 2014-09-08 | 2019-03-12 | Regal Beloit America, Inc. | Electrical machine and methods of assembling the same |
DE202015105910U1 (de) * | 2015-11-05 | 2015-11-19 | Ebm-Papst Mulfingen Gmbh & Co. Kg | Elektronikeinheit |
-
2018
- 2018-08-03 DE DE102018118925.7A patent/DE102018118925A1/de active Pending
- 2018-12-10 CN CN201822062898.1U patent/CN209398636U/zh active Active
-
2019
- 2019-07-25 EP EP19745595.9A patent/EP3830425A1/fr active Pending
- 2019-07-25 WO PCT/EP2019/070049 patent/WO2020025443A1/fr unknown
- 2019-07-25 CN CN201980042028.2A patent/CN112334668A/zh active Pending
- 2019-07-25 US US15/734,809 patent/US20210231125A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040041475A1 (en) * | 2002-09-03 | 2004-03-04 | Cichetti Michael D. | Apparatus and method for cooling an electric motor |
US20150263591A1 (en) * | 2012-08-02 | 2015-09-17 | Ebm-Papst Mulfingen Gmbh & Co. Kg | Active cooling of a motor having an integrated cooling channel |
US20140217844A1 (en) * | 2013-02-01 | 2014-08-07 | Regal Beloit America, Inc. | Electrical machines and methods of assembling the same |
US20160087511A1 (en) * | 2013-05-29 | 2016-03-24 | Spal Automotive S.R.L | Electrical machine |
US20170163122A1 (en) * | 2015-12-04 | 2017-06-08 | Ebm-Papst Mulfingen Gmbh & Co. Kg | Cover device for an electronics housing of an electric motor |
US20190145302A1 (en) * | 2016-07-15 | 2019-05-16 | Hanon Systems | High voltage cooling fan motor unit |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230070319A1 (en) * | 2021-09-08 | 2023-03-09 | Dell Products L.P. | Fan covering with high recycle content and high thermal conductivity |
Also Published As
Publication number | Publication date |
---|---|
DE102018118925A1 (de) | 2020-02-06 |
WO2020025443A1 (fr) | 2020-02-06 |
CN112334668A (zh) | 2021-02-05 |
EP3830425A1 (fr) | 2021-06-09 |
CN209398636U (zh) | 2019-09-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101443904B (zh) | 功率模块用基体 | |
US6371200B1 (en) | Perforated heat sink | |
JP4929325B2 (ja) | 電力変換装置 | |
JP5537777B2 (ja) | ヒートシンク、冷却モジュールおよび冷却可能な電子基板 | |
WO2011096218A1 (fr) | Dispositif de rayonnement de chaleur et équipement électronique l'utilisant | |
EP3542605B1 (fr) | Dissipateur thermique à caloduc intégré | |
KR101610044B1 (ko) | 히트 싱크 | |
US9318410B2 (en) | Cooling assembly using heatspreader | |
JP4402602B2 (ja) | キャパシタの冷却構造及び電力変換装置 | |
AU2011370980B2 (en) | A liquid coolant heat transfer device | |
US20210231125A1 (en) | Fan comprising a cooling body consisting of heat-conductive plastic | |
JP2005294760A5 (fr) | ||
JP2012256750A (ja) | 発熱部品の固定方法、及び発熱部品の固定構造 | |
JP2003100974A (ja) | 空冷式半導体ヒートシンク | |
JP2012146828A (ja) | 放熱構造及び放熱部材 | |
KR20160023517A (ko) | 열전도성 코어를 갖는 히트싱크 및 이를 포함하는 엘이디 광원 장치 | |
JP3186711B2 (ja) | 電気機器の冷却構造 | |
JP2015216143A (ja) | 発熱素子の放熱構造 | |
KR20010107096A (ko) | 전자기기용 방열판의 냉각방법 및 그 장치 | |
KR200404792Y1 (ko) | 방열장치 | |
WO2022270024A1 (fr) | Dispositif électronique | |
JP2011044507A (ja) | 放熱器 | |
JP5773976B2 (ja) | 冷蔵庫 | |
JP2005259787A (ja) | 半導体装置 | |
TWI308682B (en) | Heat dissipation device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: EBM-PAPST MULFINGEN GMBH & CO. KG, GERMANY Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HELI, THOMAS;RIEGLER, PETER;GEBERT, DANIEL;AND OTHERS;REEL/FRAME:054556/0839 Effective date: 20200101 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: APPLICATION DISPATCHED FROM PREEXAM, NOT YET DOCKETED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE AFTER FINAL ACTION FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: ADVISORY ACTION MAILED |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |