EP3830425A1 - Ventilateur avec refroidisseur en matière plastique thermoconductrice - Google Patents

Ventilateur avec refroidisseur en matière plastique thermoconductrice

Info

Publication number
EP3830425A1
EP3830425A1 EP19745595.9A EP19745595A EP3830425A1 EP 3830425 A1 EP3830425 A1 EP 3830425A1 EP 19745595 A EP19745595 A EP 19745595A EP 3830425 A1 EP3830425 A1 EP 3830425A1
Authority
EP
European Patent Office
Prior art keywords
cover
fan
electronics
area
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19745595.9A
Other languages
German (de)
English (en)
Inventor
Thomas Heli
Peter Riegler
Daniel Gebert
Valerius SCHAAF
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebm Papst Mulfingen GmbH and Co KG
Original Assignee
Ebm Papst Mulfingen GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebm Papst Mulfingen GmbH and Co KG filed Critical Ebm Papst Mulfingen GmbH and Co KG
Publication of EP3830425A1 publication Critical patent/EP3830425A1/fr
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F04D25/02—Units comprising pumps and their driving means
    • F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D25/068—Mechanical details of the pump control unit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/02—Selection of particular materials
    • F04D29/023—Selection of particular materials especially adapted for elastic fluid pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/40—Casings; Connections of working fluid
    • F04D29/42—Casings; Connections of working fluid for radial or helico-centrifugal pumps
    • F04D29/4206—Casings; Connections of working fluid for radial or helico-centrifugal pumps especially adapted for elastic fluid pumps
    • F04D29/4226—Fan casings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/5813—Cooling the control unit

Definitions

  • the invention relates to a fan with a heat sink designed as a plastic cover.
  • a heat sink has the task of absorbing heat from an element to be cooled and releasing it again into a surrounding medium. This usually comes for the heat sink, a material with a high thermal conductivity such.
  • Heat sinks are also used for motors.
  • DE 19841583 A1 is concerned with a heat sink for cooling elements, in particular semiconductor components, motors and units, in particular a cooling unit made at least partly from extruded aluminum or other light metal, consisting of at least two separate base profiles for mounting the electrical components which are spaced apart and connected to one another by means of a plurality of separate cooling fins. At least one fan is also provided between two adjacent base profiles.
  • heat conduction also called heat diffusion or conduction - is understood in physics the heat flow due to a temperature difference. According to the second law of thermodynamics, heat flows only in the direction of a lower temperature, i.e. in the direction of the temperature.
  • Thermal conduction is a mechanism for transporting thermal energy without the need for a macroscopic flow of material as with the alternative mechanism of convection.
  • the heat transport by heat radiation is also considered as a separate mechanism.
  • a measure of the heat conduction in a certain substance is the thermal conductivity.
  • the object of the invention is therefore to provide cooling which can be produced cost-effectively and functions reliably for the electronics of a fan motor of a fan.
  • a basic idea of the present invention is to cool the electronics of a fan with the aid of a plastic heat sink instead of a metal heat sink.
  • This approach which is unknown in the prior art, can be realized by using the heat sink as a cover with a very thin wall thickness with a specific shape and surface.
  • several effects are used cumulatively, namely heat conduction, heat convection and the reduction of heat build-up by using a thin-walled plastic material with a large, efficient surface and a comparatively large proportion with a direct contact surface for heat-producing components.
  • a fan is provided with electronics on a printed circuit board, in which a cover is provided above the electronics, which acts both as an active and as a passive heat sink, the cover being designed essentially as a flat cover element made of a thin-walled plastic and has a shape which has a surface which is effective for cooling the electronics arranged under the cover and which is at least a factor of 2 larger than the projected base area of the cover.
  • the cover has a cooling fin structure with a plurality of cooling fins which enlarge the effective surface.
  • the cover forms a plurality of depressions, in which fastening openings are provided, on which the cover is detachably fastened to the fan via releasable fastening means.
  • the cover in the area of the cooling fin structure has a flat contact side for direct contacting of heat-producing components.
  • the cover has the cooling fin structure in one or more areas or forms several areas with such a cooling fin structure.
  • the cooling fins are attached or designed to run radially outward, as a result of which a structure which is open to the radially outward and upward can be realized, which has an advantageous effect on the production and the cooling effect.
  • cooling fins have a changing, in particular decreasing wall thickness.
  • Other shapes and configurations of the wall thickness are also conceivable to improve the heat dissipation effects.
  • an overall thin wall thickness is aimed for in order to achieve rapid heat dissipation and also to prevent heat build-up.
  • a further optimization is a solution in which the cover forms a flat contact surface on the underside facing the electronics and in the assembled state this contact surface bears against the electronic components at least in sections.
  • the cover is formed from an essentially round section, to which a projection (preferably with a linearly extending side edge) is integrally connected. It has also been shown to be advantageous if the material of the cover is a polyamide (PA), polyurethane (PUR), polycarbonate (PC) or polyethylene (PE). In a further advantageous embodiment it is provided that the thickness of the cover in that area which is parallel to the arrangement of the printed circuit board and / or the area of the flat contact surface is at least a factor of 2 lower than in an edge area or a area of the cover, which extends towards the electronics. As a result, the essential stabilizing properties can be placed in the edge area and the essential thermal properties in the flat area and the areas with the cooling fins.
  • PA polyamide
  • PUR polyurethane
  • PC polycarbonate
  • PE polyethylene
  • FIG. 1 is a schematic sectional view through a radial fan
  • FIG. 2 shows a perspective view of the radial fan from FIG. 1,
  • FIG. 3 shows a top view of the cover of the electronics of the radial fan from FIG. 1,
  • FIG. 4 shows a perspective view of the cover from FIG. 3,
  • FIG. 5 shows a sectional view through the cover from FIG. 3.
  • FIG. 1 shows a schematic sectional view through a fan 1, here a radial fan.
  • the fan 1 is formed with electronics on a circuit board 2.
  • a cover 10 according to the invention is shown above the electronics and is designed both as an active and as a passive heat sink.
  • the cover 10, as can be seen in FIGS. 3 to 5, is essentially designed as a flat cover element made of a thin-walled plastic and has a shape which has a surface 11 which is effective for cooling the electronics arranged under the cover 10 and which is opposite the projected base area of the cover 10 is larger by at least a factor of 2 due to the cooling fin structure with a plurality of cooling fins 12 shown in FIG. As can also be seen, the cooling fins run or extend radially outwards.
  • the projected base area results from the illustration in FIG. 3.
  • the effectively effective surface area is significantly increased by the rib structure.
  • the cover 10 is formed from an essentially central round section 17 to which a projection 18 with a straight side edge is integrally connected.
  • the cover 10 forms a plurality of recesses 13 in which fastening openings 14 are provided.
  • the cover 20 is releasably attached to the fan 1 in operative connection with the electronics via releasable fastening means 15 (e.g. screws).
  • the cover 10 forms a flat contact surface 19 on the underside facing the electronics, so that in the assembled state it bears against electronic components at least in sections. In the sectional view through the cover 10, as shown in FIG. 5, it has a flat contact side 16 in the region of the cooling fin structure for contacting heat-producing components of the electronics.
  • cooling fins 12 have a changing, have a slightly decreasing wall thickness, especially from bottom to top, and taper slightly, so to speak.
  • the embodiment of the invention is not limited to the preferred exemplary embodiments specified above. Rather, it is conceivable, the shape and design of the lid to the respective requirement accordingly and z. B. adapt the number of areas with rib structures to the specific cooling task.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un ventilateur (1) comprenant une électronique sur un circuit imprimé (2) et un capot (10) disposé au-dessus de l'électronique, lequel est réalisé sous la forme d'un refroidisseur à la fois actif et passif. Le capot (10) est sensiblement réalisé sous la forme d'un élément formant couvercle plat en une matière plastique à paroi mince et dispose d'une forme qui possède une surface (11) efficace pour le refroidissement de l'électronique disposée sous le capot (10), laquelle est au moins deux fois plus grande que la surface de base projetée du capot (10).
EP19745595.9A 2018-08-03 2019-07-25 Ventilateur avec refroidisseur en matière plastique thermoconductrice Pending EP3830425A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018118925.7A DE102018118925A1 (de) 2018-08-03 2018-08-03 Lüfter mit Kühlkörper
PCT/EP2019/070049 WO2020025443A1 (fr) 2018-08-03 2019-07-25 Ventilateur avec refroidisseur en matière plastique thermoconductrice

Publications (1)

Publication Number Publication Date
EP3830425A1 true EP3830425A1 (fr) 2021-06-09

Family

ID=67470397

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19745595.9A Pending EP3830425A1 (fr) 2018-08-03 2019-07-25 Ventilateur avec refroidisseur en matière plastique thermoconductrice

Country Status (5)

Country Link
US (1) US20210231125A1 (fr)
EP (1) EP3830425A1 (fr)
CN (2) CN209398636U (fr)
DE (1) DE102018118925A1 (fr)
WO (1) WO2020025443A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230070319A1 (en) * 2021-09-08 2023-03-09 Dell Products L.P. Fan covering with high recycle content and high thermal conductivity

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160087511A1 (en) * 2013-05-29 2016-03-24 Spal Automotive S.R.L Electrical machine
DE102015121166A1 (de) * 2015-12-04 2017-06-08 Ebm-Papst Mulfingen Gmbh & Co. Kg Abdeckvorrichtung für ein Elektronikgehäuse eines Elektromotors

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DE3916791C3 (de) * 1988-10-28 1998-09-17 Valeo Sistemi Termici S P A Gebläse-Einbausatz einer Kraftwagenheizung
DE19841583A1 (de) 1998-09-11 2000-03-16 Glueck Joachim Kühlkörper mit mindestens zwei separaten Basisplatten
US6176299B1 (en) * 1999-02-22 2001-01-23 Agilent Technologies, Inc. Cooling apparatus for electronic devices
ATE295014T1 (de) * 2002-08-01 2005-05-15 Ebm Papst Mulfingen Gmbh & Co Elektromotor mit hoher ip-schutzart
US6828700B2 (en) * 2002-09-03 2004-12-07 Lasko Holdings, Inc. Apparatus and method for cooling an electric motor
DE10321732B4 (de) * 2003-05-14 2013-08-01 Robert Bosch Gmbh Kühlung der Ansteuerung von Kühlgebläsen für Kraftfahrzeugmotoren
JP2005168133A (ja) * 2003-12-01 2005-06-23 Mitsuba Corp 電動モータ
ITBO20070791A1 (it) * 2007-11-30 2009-06-01 Spal Automotive Srl Macchina elettrica rotante e metodo di assemblaggio della stessa.
IT1394272B1 (it) * 2009-05-25 2012-06-06 Spal Automotive Srl Metodo per la realizzazione di una macchina elettrica.
DE102009045063C5 (de) * 2009-09-28 2017-06-01 Infineon Technologies Ag Leistungshalbleitermodul mit angespritztem Kühlkörper, Leistungshalbleitermodulsystem und Verfahren zur Herstellung eines Leistungshalbleitermoduls
WO2012042971A1 (fr) * 2010-09-29 2012-04-05 アイシン精機株式会社 Pompe électrique
DE102012010483A1 (de) * 2012-05-26 2013-11-28 Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg Bürstensystem für einen Elektromotor
DE102012107109A1 (de) * 2012-08-02 2014-02-06 Ebm-Papst Mulfingen Gmbh & Co. Kg "Aktive Kühlung eines Motors mit integriertem Kühlkanal"
US10033242B2 (en) * 2013-02-01 2018-07-24 Regal Beloit America, Inc. Electrical machines and methods of assembling the same
KR101345703B1 (ko) * 2013-03-11 2013-12-30 주식회사 원진일렉트로닉스 차량의 블로어 모터 구동기용 히트싱크
DE102014112821A1 (de) * 2014-09-05 2016-03-10 Ebm-Papst Mulfingen Gmbh & Co. Kg Lüfter mit Leiterplattenkühlkreislauf
US10230290B2 (en) * 2014-09-08 2019-03-12 Regal Beloit America, Inc. Electrical machine and methods of assembling the same
DE202015105910U1 (de) * 2015-11-05 2015-11-19 Ebm-Papst Mulfingen Gmbh & Co. Kg Elektronikeinheit
KR102524601B1 (ko) * 2016-07-15 2023-04-24 한온시스템 주식회사 고전압 클링팬 모터유닛

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160087511A1 (en) * 2013-05-29 2016-03-24 Spal Automotive S.R.L Electrical machine
DE102015121166A1 (de) * 2015-12-04 2017-06-08 Ebm-Papst Mulfingen Gmbh & Co. Kg Abdeckvorrichtung für ein Elektronikgehäuse eines Elektromotors

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2020025443A1 *

Also Published As

Publication number Publication date
DE102018118925A1 (de) 2020-02-06
WO2020025443A1 (fr) 2020-02-06
CN209398636U (zh) 2019-09-17
CN112334668A (zh) 2021-02-05
US20210231125A1 (en) 2021-07-29

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